CN114752985A - Novel vacuum electroplating hanger - Google Patents
Novel vacuum electroplating hanger Download PDFInfo
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- CN114752985A CN114752985A CN202210488036.3A CN202210488036A CN114752985A CN 114752985 A CN114752985 A CN 114752985A CN 202210488036 A CN202210488036 A CN 202210488036A CN 114752985 A CN114752985 A CN 114752985A
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- hanger
- copper
- main board
- conductive
- ring
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a novel vacuum plating hanger, which structurally comprises a hanger main board assembly and a hanger cover plate assembly which are connected with each other through a magnetic connecting piece and are connected in a vacuumizing mode, wherein a wafer is pressed between the hanger main board assembly and the hanger cover plate assembly. The invention has the advantages that: the wafer electroplating device has the advantages that the structural design is reasonable, the wafer is placed on the second conducting ring, the two hanger cover plates are arranged, single-sided or double-sided wafer electroplating can be carried out as required, the main board and the hanger cover plates are connected through the magnetic structures and are connected in an auxiliary mode through the limiting mechanisms, then vacuumizing is carried out, effective fixing of the two panels can be achieved, wafers with various thicknesses can be compatible, and cracking is prevented, the breakage rate of the wafer with the minimum thickness of 200 micrometers can reach one ten thousandth, loosening and leakage cannot occur, the medicament is not polluted, the wafer electroplating quality can be effectively improved, the opening and closing efficiency is improved, the production efficiency can be effectively improved, and the product quality is improved.
Description
Technical Field
The invention relates to a novel vacuum plating hanger, in particular to a novel vacuum plating hanger for wafer production.
Background
In semiconductor wafer production, it is necessary to perform a plating process by immersing a wafer in a chemical using a plating jig.
In the prior art, two panels of an electroplating hanger are generally fixedly connected by screws, and are easy to loosen after being used for a period of time, so that liquid leakage is caused, and chemicals can be polluted; the risk of wafer cracking exists, the breakage rate reaches 40%, and the electroplating quality of the wafer is influenced; the opening and closing efficiency is low, and the production efficiency is influenced; the thickness of the wafer is limited, a common hanger can only be adapted to the wafer with one thickness, and different locking cover plates are required to be matched with different thicknesses; the production requirements cannot be effectively met.
Disclosure of Invention
The invention provides a novel vacuum electroplating hanger, which aims to overcome the defects in the prior art, realize vacuum opening and closing of the electroplating hanger and improve the production efficiency and the production quality.
The technical scheme of the invention is as follows: the novel vacuum plating hanger structurally comprises a hanger main board assembly and a hanger cover plate assembly which are connected through a magnetic connecting piece and connected in a vacuumizing mode, and a wafer is pressed between the hanger main board assembly and the hanger cover plate assembly.
Preferably, the hanger mainboard assembly comprises a hanger mainboard and a first copper mainboard which are connected with each other through screws, the outer side surface of the hanger mainboard, which is far away from the first copper mainboard, is provided with a vacuumizing tube of an external vacuumizing device with a vacuumizing hand valve through a quick-screwing air pipe joint communicated with the inner side surface, and the outer side surface of the hanger mainboard, which is far away from the first copper mainboard, is also provided with a conductive screw and a conductive hook or a slot.
Preferably, when the hanger main board corresponds to the wafer opening, the hanger main board further comprises a first sealing ring and a first conductive copper ring, the first sealing ring is pressed between the hanger main board and the first copper main board and corresponds to the opening, the first conductive copper ring is movably mounted on the first copper main board, and the first conductive copper ring is provided with a limiting step matched with the wafer in shape.
Preferably, the first conductive copper ring is connected with the first conductive copper ring through a conductive spring screw which penetrates through the first copper main board on the hanger main board.
Preferably, the hanger cover plate assembly comprises a hanger cover plate, a second copper main plate and a conducting ring which are connected with each other through screws, a second sealing ring is pressed between the hanger cover plate and the second copper main plate, the second conducting ring is arranged on the second copper main plate, a limiting screw is connected to the first copper main plate, and a limiting hole corresponding to the limiting screw is formed in the second copper main plate.
Preferably, the second conducting ring is a beryllium copper conducting ring, a plurality of fixing screw holes are formed in the circumferential direction of the second conducting ring close to the outer edge, and a plurality of claw structures which are arranged at intervals and are centrosymmetric with the center of the second conducting ring as a central symmetric point are uniformly and integrally formed in the circumferential direction of the second conducting ring towards the inner edge.
Preferably, the diameter of the claw structure and the circumcircle of the second conducting ring form an included angle of 15-45 degrees, the claw structure and the second conducting ring form a warping included angle of 5-30 degrees and the height is 2mm, and the shape of the internal structure formed by the surrounding of all the claw structures is matched with the shape of the wafer.
Preferably, the hanger mainboard on still be equipped with a plurality of A location strong magnetism and the locating pin that passes first copper mainboard, be equipped with a plurality of B location strong magnetism that pass the second copper mainboard and correspond with A location strong magnetism position on the hanger apron, still open the location slot that corresponds with the locating pin position on hanger apron and the second copper mainboard.
The invention has the advantages that: the wafer electroplating device is reasonable in structural design, wafers are placed on the second conducting rings, two hanger cover plates are arranged, single-side or double-side wafer electroplating can be carried out as required, the main board and the hanger cover plates are connected through magnetic structures and are in auxiliary connection through limiting mechanisms, then vacuumizing is carried out, effective fixing of the two panels can be achieved, wafers with various thicknesses (200 micrometers, 300 micrometers, 600 micrometers, 750 micrometers, 1000 micrometers, 1300 micrometers and the like) can be compatible, cracking is prevented, the wafer breakage rate of the wafers with the minimum thickness of 200 micrometers can reach one in ten thousandth, loosening and leakage cannot occur, chemicals cannot be polluted, the wafer electroplating quality can be effectively improved, the opening and closing efficiency is improved, the production efficiency can be effectively improved, and the product quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the novel vacuum plating hanger of the invention.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is an exploded schematic view of fig. 2.
Fig. 4 is an exploded schematic view of fig. 3.
Fig. 5 is a schematic structural diagram of another embodiment of the novel vacuum plating hanger of the invention.
Fig. 6 is an exploded schematic view of fig. 5.
Fig. 7 is an exploded view of fig. 6.
Fig. 8 is an exploded view of fig. 7.
FIG. 9 is a diagram illustrating a second conductive ring.
Fig. 10 is a schematic view along the line C-C of fig. 9.
In the figure, 1 is a rack main board assembly, 11 is a rack main board, 12 is a first copper main board, 13 is a first seal ring, 14 is a first conductive copper ring, 15 is a quick-screwing gas pipe joint, 16 is a vacuum-pumping hand valve, 17 is a conductive screw, 18 is a conductive hook or slot, 19 is an a-positioning strong magnet, 110 is a positioning pin, 111 is a conductive spring screw, 112 is a limit screw, 2 is a wafer, 3 is a rack cover board assembly (also called main board when double-sided), 31 is a rack cover board, 32 is a second copper main board, 33 is a second seal ring, 34 is a second conductive ring, 341 is a fixing screw hole, 342 is a claw structure, 35 is a B-positioning strong magnet, and 36 is a positioning slot.
Detailed Description
The present invention will be described in further detail with reference to examples and specific embodiments.
As shown in fig. 1 and 5, the novel vacuum plating rack structurally comprises a rack main board assembly 1 and a rack cover plate assembly 3 which are connected with each other through a magnetic connecting piece and are connected in a vacuum pumping manner, and a wafer 2 is pressed between the rack main board assembly 1 and the rack cover plate assembly 3.
The hanger main board assembly 1 comprises a hanger main board 11 and a first copper main board 12 which are connected with each other through screws, a vacuumizing tube of an external vacuumizing device with a vacuumizing hand valve 16 is externally connected to the outer side face, far away from the first copper main board 12, of the hanger main board 11 through a quick-screwing air pipe connector 15 communicated with the inner side face, and a conductive screw 17 and a conductive hook or a slot 18 are further installed on the outer side face, far away from the first copper main board 12, of the hanger main board 11.
As shown in fig. 1-4, when the hanger is a single-sided plating structure, the hanger main plate 11 is not opened.
As shown in fig. 5-8, when the hanger is a double-sided plating structure, that is, when the hanger main board 11 corresponds to the opening of the wafer 2, the hanger further includes a first sealing ring 13 and a first conductive copper ring 14, the first sealing ring 13 is pressed between the hanger main board 11 and the first copper main board 12 at a position corresponding to the opening, the first conductive copper ring 14 is movably mounted on the first copper main board 12, and the first conductive copper ring 14 is provided with a limit step that is matched with the wafer 2 in shape.
The first conductive copper ring 14 is connected to the first conductive copper ring 14 through a conductive spring screw 111 on the hanger main board 11 passing through the first copper main board 12. The first conductive copper ring 14 and the first copper main board 12 can be movably mounted, and thus the first conductive copper ring can move towards the first copper main board 12 or away from the first copper main board 12.
The hanger cover plate assembly 3 comprises a hanger cover plate 31, a second copper main plate 32 and a conducting ring 34 which are connected with each other through screws, a second sealing ring 33 is arranged between the hanger cover plate 31 and the second copper main plate 32 in a compression joint mode, the second conducting ring 34 is arranged on the second copper main plate 32, a limiting screw 112 is connected onto the first copper main plate 12, and a limiting hole corresponding to the limiting screw 112 is formed in the second copper main plate 32. The setscrew 112 and the setscrew bore may be positioned when the two are connected.
The second conducting ring 34 is a beryllium copper conducting ring (preferably C17200 beryllium copper), so as to ensure the conducting performance, a plurality of fixing screw holes 341 are formed at the edge of the second conducting ring 34 close to the outer side in the circumferential direction, and a plurality of claw structures 342 which are arranged at intervals and are symmetrical around the center of the second conducting ring 34 are uniformly and integrally formed at the edge of the second conducting ring 34 towards the inner side. The claw structure 342 is elastic due to its material. The second conductive ring 34 is configured to accommodate wafers of various thicknesses.
The claw structures 342 and the circumscribed circle of the second conductive ring 34 form an included angle of 15-45 degrees, the claw structures 342 and the second conductive ring 34 form a warping included angle of 5-30 degrees and have a height of 2mm, and the shape of the internal structure surrounded by all the claw structures 342 is matched with the shape of the wafer 2. That is, the claw structure 342 is designed to have a certain height, so that the wafer 2 can be limited, multi-point conduction can be realized, and the conduction performance can be improved.
The rack main board 11 is further provided with a plurality of A positioning strong magnets 19 and positioning pins 110 penetrating through the first copper main board 12, the rack cover plate 31 is provided with a plurality of B positioning strong magnets 35 penetrating through the second copper main board 32 and corresponding to the A positioning strong magnets 19, and the rack cover plate 31 and the second copper main board 32 are further provided with positioning slots 36 corresponding to the positioning pins 110.
The wafer 2 may be one or more than one, and may be circular or square, and the number and shape of the openings on the corresponding hanger main board assembly 1 and hanger cover board assembly 3 match with those of the wafer 2, which all belong to the protection scope of this patent.
According to the structure, during installation, the hanger main board assembly 1 and the hanger cover plate assembly 3 are combined according to the connection relation, then the wafer 2 is placed on the second conducting ring 34, the main board assembly 1 and the hanger cover plate assembly 3 are connected through the magnetic structure and are in auxiliary connection through the limiting mechanisms, then vacuumizing is performed, the main board assembly and the hanger cover plate assembly are placed in electroplating equipment for electroplating, and single-side or double-side electroplating can be performed by matching the corresponding structures respectively.
All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (8)
1. The novel vacuum electroplating hanger is characterized by comprising a hanger main board assembly and a hanger cover plate assembly which are mutually connected through a magnetic connecting piece and connected in a vacuumizing mode, and a wafer is pressed between the hanger main board assembly and the hanger cover plate assembly.
2. The novel vacuum plating hanger as claimed in claim 1, wherein the hanger main board assembly comprises a hanger main board and a first copper main board which are connected with each other through screws, a vacuum tube of an external vacuum device with a vacuum hand valve is externally connected to the outer side surface of the hanger main board far away from the first copper main board through a quick-screwing air pipe joint communicated with the inner side surface, and a conductive screw and a conductive hook or a slot are further mounted on the outer side surface of the hanger main board far away from the first copper main board.
3. The novel vacuum plating hanger as claimed in claim 2, wherein the hanger main plate further comprises a first sealing ring and a first conductive copper ring when corresponding to the wafer opening, the first sealing ring is pressed between the hanger main plate and the first copper main plate and corresponds to the opening, the first conductive copper ring is movably mounted on the first copper main plate, and the first conductive copper ring is provided with a limiting step matched with the wafer in shape.
4. The novel vacuum plating hanger of claim 3 wherein the first conductive copper ring is connected to the first conductive copper ring by a conductive spring screw on the hanger main plate passing through the first copper main plate.
5. The novel vacuum plating hanger as claimed in any one of claims 2 to 4, wherein the hanger cover plate assembly comprises a hanger cover plate, a second copper main plate and a conductive ring which are connected with each other through screws, a second sealing ring is pressed between the hanger cover plate and the second copper main plate, the second conductive ring is mounted on the second copper main plate, the first copper main plate is connected with a limiting screw, and the second copper main plate is provided with a limiting hole corresponding to the limiting screw.
6. The novel vacuum plating hanger as claimed in claim 5, wherein the second conductive ring is a beryllium copper conductive ring, a plurality of fixing screw holes are formed on the second conductive ring at the circumferential direction close to the outer edge, and a plurality of claw structures which are arranged at intervals and are centrosymmetric with the center of the second conductive ring as a central symmetric point are uniformly and integrally formed on the second conductive ring at the circumferential direction towards the inner edge.
7. The novel vacuum plating hanger of claim 6, wherein the diameter of the claw structure forms an included angle of 15-45 degrees with the circumcircle of the second conductive ring, the claw structure forms a warpage included angle of 5-30 degrees with the second conductive ring and has a height of 2mm, and the shape of the inner structure surrounded by all the claw structures is matched with the shape of the wafer.
8. The novel vacuum plating hanger as claimed in claim 5, wherein the hanger main board is further provided with a plurality of A positioning magnets and positioning pins penetrating through the first copper main board, the hanger cover board is provided with a plurality of B positioning magnets penetrating through the second copper main board and corresponding to the A positioning magnets, and the hanger cover board and the second copper main board are further provided with positioning slots corresponding to the positioning pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210488036.3A CN114752985A (en) | 2022-05-06 | 2022-05-06 | Novel vacuum electroplating hanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210488036.3A CN114752985A (en) | 2022-05-06 | 2022-05-06 | Novel vacuum electroplating hanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114752985A true CN114752985A (en) | 2022-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210488036.3A Pending CN114752985A (en) | 2022-05-06 | 2022-05-06 | Novel vacuum electroplating hanger |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233400A (en) * | 1997-02-18 | 1998-09-02 | Casio Comput Co Ltd | Plated parts fixing jig and plating method using it |
| CN108048887A (en) * | 2018-01-16 | 2018-05-18 | 昆山成功环保科技有限公司 | A kind of wafer electroplate jig |
| CN110629276A (en) * | 2018-06-25 | 2019-12-31 | 株式会社荏原制作所 | Substrate holder and plating apparatus |
| CN111809222A (en) * | 2020-08-11 | 2020-10-23 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer fixing device and wafer fixing method |
| CN113846363A (en) * | 2021-10-27 | 2021-12-28 | 上海戴丰科技有限公司 | Wafer electroplating hanger |
| CN114075685A (en) * | 2021-12-24 | 2022-02-22 | 甬矽半导体(宁波)有限公司 | Wafer electroplating jig and wafer electroplating device |
| CN216006068U (en) * | 2020-11-30 | 2022-03-11 | 昆山成功环保科技有限公司 | Wafer electroplating hanger |
-
2022
- 2022-05-06 CN CN202210488036.3A patent/CN114752985A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233400A (en) * | 1997-02-18 | 1998-09-02 | Casio Comput Co Ltd | Plated parts fixing jig and plating method using it |
| CN108048887A (en) * | 2018-01-16 | 2018-05-18 | 昆山成功环保科技有限公司 | A kind of wafer electroplate jig |
| CN110629276A (en) * | 2018-06-25 | 2019-12-31 | 株式会社荏原制作所 | Substrate holder and plating apparatus |
| CN111809222A (en) * | 2020-08-11 | 2020-10-23 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer fixing device and wafer fixing method |
| CN216006068U (en) * | 2020-11-30 | 2022-03-11 | 昆山成功环保科技有限公司 | Wafer electroplating hanger |
| CN113846363A (en) * | 2021-10-27 | 2021-12-28 | 上海戴丰科技有限公司 | Wafer electroplating hanger |
| CN114075685A (en) * | 2021-12-24 | 2022-02-22 | 甬矽半导体(宁波)有限公司 | Wafer electroplating jig and wafer electroplating device |
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