JPH10233400A - Plated parts fixing jig and plating method using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply fix a wafer to a wafer fixing jig with no breakage at the time of performing plating on a wafer using a wafer fixing jig by a dipping method. SOLUTION: In a wafer fixing jig, while sandwiching a wafer 13 from both sides for exposing the surface central part of the wafer 13, the jig body 1 covering the back of the wafer 13 and a jig cover 6 are provided. Then, holding a screw 23 in a loosend state, a space 25 between the jig body and a jig cover 6 is made into a vacuum state followed by tightening the screw 23 and later restoring the vacuum tank inside to an atmospheric pressure state. Thereby, the jig body 1 and the jig cover 6 are integrated so as to sandwich the wafer 13 for being fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixture for fixing a component to be plated and a plating method using the same.

[0002]

2. Description of the Related Art For example, when bump electrodes are formed on a wafer (component to be plated) in the semiconductor technology, a plating resist layer is formed on a bump electrode formation surface (surface) of the wafer.
By etching the plating resist layer to form an opening, the pad portion provided on the bump electrode forming surface of the wafer is exposed through the opening, and the exposed pad portion is made of gold or the like using an electrolytic method. The bump electrode is formed by plating.

[0003] One of the plating methods in such a case is a so-called dip method. In this dipping method, since the wafer is entirely immersed in the plating solution, the quality of the bump electrode is deteriorated due to the plating solution adhering to the back surface of the wafer, that is, the surface opposite to the surface on which the bump electrode is formed. In order to prevent this, a wafer fixing jig (plated component fixing jig) is used.

FIGS. 4 and 5 show a conventional wafer fixing jig used in such a case. This wafer fixing jig includes a jig main body 1, a packing 2, a guide ring 3, a cushion material 4, an O-ring 5, and a jig cover 6. The jig body 1 is made of a rectangular plate material, a handle 7 is provided at an upper end portion, a ring-shaped flange portion 8 is provided on a left side of a central portion, and an opening 9 is provided in the flange portion 8. Are provided, and a plurality of screw holes 10 are provided around the opening 9. The packing 2 is formed in a ring shape by rubber or the like. The guide ring 3 is formed of a resin or the like in a ring shape and has a trapezoidal cross section.
The cushion material 4 is formed in a disk shape by rubber or the like. The jig cover 6 is made of an octagonal plate, has a plurality of screw insertion holes 11 on the peripheral edge thereof, and has a structure in which a ring-shaped groove 12 is provided at a predetermined position on a surface facing the jig main body 1. Has become. The O-ring 5 is fitted in the groove 12 of the jig cover 6.

Next, a description will be given of a case where the wafer 13 is fixed to the thus configured wafer fixing jig. In this case, first, the packing 2 is arranged on the right surface of the flange portion 8 of the jig body 1, and the guide ring 3 is mounted on the right surface of the packing 2.
The wafer 13 is disposed on the right side of the packing 2 inside the guide ring 3, the cushion 4 is disposed on the right side of the wafer 13, and the jig cover 6 is disposed on the right side of the cushion 4 and the jig main body 1. Place. Next, the screw 14 inserted into the screw insertion hole 11 of the jig cover 6 is screwed into the screw hole 10 of the jig main body 1. Then, the jig body 1 and the jig cover 6 are integrated, and the wafer 1
Numeral 3 is fixed by being clamped from both sides. In this state, the periphery of the surface of the wafer 13 (the left surface in FIG. 5) is in close contact with the right surface of the packing 2, and the center of the surface of the wafer 13 is exposed through the opening 9 of the jig body 1. The back surface of the wafer 13 is in contact with the left surface of the jig cover 6 via the cushion member 4. In this case, the space between the jig body 1 and the jig cover 6 around the wafer 13 is sealed by the sealing action of the packing 2 and the O-ring 5. Therefore, the wafer 13
Is covered with the jig cover 6 in a sealed state. Further, in this case, the cushion member 4 reduces the tightening force of the screw 14 to prevent the wafer 13 from being damaged.

Next, a case where plating is performed on the wafer 13 thus fixed to the wafer fixing jig will be described.
In this case, first, the wafer 13 is immersed together with the wafer fixing jig to the lower side of the handle 7 in the plating solution 15 indicated by a dashed line in FIGS. Then, plating is performed on the surface of the wafer 13, and bump electrodes are formed by the applied plating. On the other hand, since the back surface of the wafer 13 is covered by the jig cover 6 by the sealing action of the packing 2 and the O-ring 5, the plating solution 15 is prevented from adhering to the back surface of the wafer 13.

[0007]

However, in such a conventional wafer fixing jig, when the wafer 13 is clamped and fixed between the jig body 1 and the jig cover 6, the screw 14 is used.
It is difficult to grasp the degree of tightening, so that the screw 14 may be overtightened. In such a case, the tightening force of the screws 14 cannot be alleviated by the cushion material 4, and an excessive force is applied to the wafer 13, and the wafer 13 may be damaged. In order to avoid this, it is necessary to pay considerable attention to the degree of tightening of the screws 14, and since a plurality of screws 14 are used, the work of tightening the screws 14 takes a considerable amount of time and the workability is extremely poor. There was a problem. Further, if the packing 2 or the O-ring 5 is damaged, it is difficult to find it before the plating process, and after the plating process, it is found that the plating solution has adhered to the back surface of the wafer 13. 2 or O-ring 5 is damaged. An object of the present invention is to improve workability and to easily find damage to a seal member such as a packing or an O-ring before plating.

[0008]

According to a first aspect of the present invention, there is provided a jig for fixing a component to be plated, wherein the component to be plated is sandwiched from both front and back surfaces to expose a central portion of the surface of the component to be plated, and In the fixture for fixing a component to be plated, which covers the back surface of the component to be plated, a space formed in the fixture for fixing a component to be plated is set to a negative pressure to fix the component to be plated. The plating method according to the invention described in claim 2 is:
With the plated component fixing jig, the plated component is sandwiched from both front and back surfaces so as to have a space in at least a part, and the central portion of the surface of the plated component is exposed, and the back surface of the plated component is covered. The space is made negative pressure by the decompression means, the plated component fixing jig is integrated, at least the plated component of the plated component fixing jig is immersed in an electrolytic solution, and exposed to the exposed portion of the plated component. It is intended to be plated.

According to the present invention, the plating component fixing jig is integrated by reducing the pressure in the space formed in the plating component fixing jig by the pressure reducing means. It is easy to set the negative pressure to the extent that the parts to be plated are not damaged, and it is easy to set the pressure so that it is not necessary to pay attention to the negative pressure after that, and to improve the workability. Can be.
In addition, when the seal member is damaged, the space formed in the plated component fixing jig cannot be set to a predetermined negative pressure, and thus the plated component fixing jig cannot be integrated, As a result, damage to the seal member can be easily found before plating.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) FIG. 1 shows a main part of a wafer fixing jig according to a first embodiment of the present invention. In this figure, parts having the same names as those in FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In this wafer fixing jig, the surface of the jig cover 6 facing the jig body 1 and the wafer 13
A concave portion 21 is provided in a portion corresponding to the outer peripheral portion of.
An opening 22 is provided at a predetermined position of the jig cover 6 so as to communicate with the recess 21. The opening 22 has a large diameter portion 22a on the right side, a small diameter screw groove portion 22b on the left side, and a step 22c therebetween. A screw 23 is screwed into the screw groove 22b of the opening 22. In this case, an O-ring 24 is provided between the head of the screw 23 and the step 22c of the opening 22.

Next, a case where the wafer 13 is fixed to the wafer fixing jig thus configured will be described. In this case, first, the packing 2 and the guide ring 3 are arranged in this order on the right surface of the flange portion 8 of the jig body 1, and the outer peripheral surface of the guide ring 3 is fitted into the jig body 1. Also, the O-ring 5 is fitted into the groove 12 of the jig cover 6. Further, the screw 23 is loosened.

A wafer 13 is provided on the right side of the packing 2 inside the guide ring 3 fitted in the jig body 1.
Are arranged, the cushion material 4 is arranged on the right surface of the wafer 13, and the jig cover 6 is arranged on the cushion material 4 and the right surface of the jig body 1. Actually, the jig body 1, the wafer 13, the cushion material 4, and the jig cover 6 are superimposed in this order while being positioned on a table (not shown). Next, the superposed products are placed in a vacuum chamber (not shown), and the vacuum chamber is evacuated. Then, since the screw 23 is loosened, the sealing action of the O-ring 24 does not work, and the jig main body 1 is opened through the opening 22.
The space 25 including the concave portion 21 formed between the jig cover 6 and the jig cover 6 is in a vacuum state. Next, the screw 22 is tightened to seal the opening 22 with the O-ring 24. Next, the inside of the vacuum chamber is returned to the atmospheric pressure state. Then, the space 25 formed between the jig main body 1 and the jig cover 6 by the sealing action of the packing 2 and the two O-rings 5 and 24 is evacuated (negative pressure).
In this state, the jig body 1 and the jig cover 6 are integrated. Then, the wafer 13 is clamped and fixed from both front and back surfaces by this integrated one.

Next, the case where plating is performed on the wafer 13 fixed to the wafer fixing jig as described above will be described.
In this case, similarly to the conventional case, the surface of the wafer 13 is plated by immersing the wafer 13 together with the wafer fixing jig in the plating solution 15 indicated by the one-dot chain line in FIG. A bump electrode is formed by the applied plating. On the other hand, since the back surface of the wafer 13 is covered in a sealed state by the jig cover 6 by the sealing action of the packing 2 and the two O-rings 5 and 24, the plating solution 15 adheres to the back surface of the wafer 13. Is prevented.

Next, a case where the wafer 13 is removed from the wafer fixing jig after the plating process will be described. In this case, when the screw 23 is loosened, the sealing action of the O-ring 24 does not work. As a result, the space 25 formed between the jig body 1 and the jig cover 6 through the opening 22 is brought into the atmospheric pressure state, and the integration of the jig body 1 and the jig cover 6 is released, The wafer 13 can be taken out.

By the way, as described above, the jig body 1 and the jig cover 6 are integrated by making the space between the jig body 1 and the jig cover 6 a vacuum state. And the jig cover 6 are surely integrated, and it is easy to set the degree of vacuum so that the wafer 13 is not damaged. Further, once set, it is not necessary to pay attention to the degree of vacuum thereafter. Can be improved. When either the packing 2 or the two O-rings 5 and 24 are damaged, the space 25 formed between the jig body 1 and the jig cover 6 can be set to a predetermined degree of vacuum. Therefore, the jig body 1 and the jig cover 6 cannot be integrated, and as a result, the packing 2
Damage to either of the O-rings 5, 24 can be easily found.

In the above description, the jig main body 1 is set in the atmosphere.
And the jig cover 6 with the screws 23 loosened are put on each other, then put into a vacuum chamber, and the inside of the vacuum chamber is evacuated so that the jig body 1 and the jig cover 6 The space 25 formed therebetween is evacuated, and then the screw 23 is tightened to seal the opening 22 with the O-ring 24. However, the present invention is not limited to this.
For example, the jig body 1 and the jig cover 6 with the screw 23 tightened are overlapped in a vacuum chamber in a vacuum state, and the space 25 formed between the jig body 1 and the jig cover 6 is evacuated. In such a state, the inside of the vacuum chamber may be returned to the atmospheric pressure state.

(Second Embodiment) Next, FIG. 2 shows a main part of a wafer fixing jig according to a second embodiment of the present invention. In this figure, the same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In this wafer fixing jig, one end of a tube 31 is connected to the opening 22. The other end of the tube 31 is connected to a first branch pipe of a T-shaped tube 32. A first valve 33 is interposed in the second branch pipe of the T-shaped tube 32, and a vacuum pump 34 is connected to a tip of the second branch pipe. A second valve 35 is interposed in the third branch pipe of the T-shaped tube 32, and the tip of the third branch pipe is open to the atmosphere.

Next, a case in which the wafer 13 is fixed to the wafer fixing jig configured as described above will be described. In this case, first, similarly to the case of the first embodiment, the jig body 1, the wafer 13, the cushion material 4, and the jig cover 6 are aligned on a table (not shown) in this order. Overlap. In this case, one end of the tube 31 is connected to the opening 22 of the jig cover 6.
Next, the vacuum pump 34 is driven with the first valve 33 opened and the second valve 35 closed. Then, the space 25 formed between the jig main body 1 and the jig cover 6 is brought into a vacuum (negative pressure) state, whereby the jig main body 1 and the jig cover 6 are integrated, and this integration is performed. The wafer 13 is sandwiched and fixed from both front and back surfaces. When plating is performed, a predetermined part of the tube 31 is immersed together with the wafer fixing jig in a plating solution indicated by a dashed line in FIG. On the other hand, when removing the wafer 13 from the wafer fixing jig after the plating process, the second valve 35 may be opened with the vacuum pump 34 stopped.

In the second embodiment, as described above, the jig body 1, the wafer 13, the cushion material 4, and the jig cover 6 are overlapped while being positioned on the table in this order. Such an operation can be easily performed automatically using a suction head, a positioning camera, or the like. Further, the first and second valves 3
Opening / closing control of 3, 35 and drive control of vacuum pump 34 can be easily performed automatically. Further, wafer 1
It is possible to easily immerse the wafer fixing jig holding and fixing 3 in the plating solution 15 together with a part of the tube 31 or to automatically perform it by using a suction head or the like. Therefore, in the case of the second embodiment, it is possible to perform full automation. On the other hand, in the case of the first embodiment, semi-automatic operation is possible by using a table movable between the atmosphere and the vacuum chamber as the table.

(Modification) In the first and second embodiments, the O-ring 5 is provided between the jig body 1 and the jig cover 6.
, But is not limited thereto. For example, as shown in FIG. 3, a packing 41 may be interposed between the jig main body 1 and the jig cover 6. In this case, the packing 41 is made of a material having good adhesion to the jig body 1 and the jig cover 6. The packing 41 is adhered to the jig cover 6.

[0021]

As described above, according to the present invention, the fixture to be plated is integrated by reducing the space formed in the fixture to be plated to a negative pressure by the pressure reducing means. In addition, it is easy to integrate the fixture to fix the parts to be plated, and it is easy to set the negative pressure to the extent that the parts to be plated are not damaged. And workability can be improved. In addition, when the seal member is damaged, the space formed in the plated component fixing jig cannot be set to a predetermined negative pressure, and thus the plated component fixing jig cannot be integrated, As a result, damage to the seal member can be easily found before plating.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a wafer fixing jig according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a main part of a wafer fixing jig according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a modification of the first and second embodiments.

FIG. 4 is an exploded perspective view showing a conventional wafer fixing jig.

FIG. 5 is a sectional view showing a main part of a conventional wafer fixing jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Jig main body 6 Jig cover 13 Wafer 22 Opening 23 Screw 24 O-ring 34 Vacuum pump

Claims (2)

[Claims] 1. A part to be plated is sandwiched from both sides.
While exposing the center of the surface of the component to be plated,
In the jig for fixing a to-be-plated component that covers the back surface of the to-be-plated component, a space formed in the jig for fixing a to-be-plated component is set to a negative pressure to fix the to-be-plated component. jig. 2. A component to be plated is clamped from both front and rear sides by a jig for fixing a component to be plated so as to have a space in at least a part thereof, and a central portion of the surface of the component to be plated is exposed. And the space is made negative pressure by a decompression means, and the plated component fixing jig is integrated, and at least the plated component of the plated component fixing jig is immersed in an electrolytic solution, and the plating is performed. A plating method comprising plating an exposed part of a component.