JP2000261266A - Film forming mask device for piezoelectric element and storing jig for piezoelectric element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a film forming mask device for piezoelectric element and a storing jig for piezoelectric element which improve productivity and production yield. SOLUTION: The film forming mask device consists of a first mask unit M1 and a second mask unit M2. The first mask unit M1 is constituted by diffused junction of a first mask main body 5 and a first retaining plate 6 arranged on it. The second mask unit M2 is constituted by diffused junction of a spacer 4, a second mask main body 3 arranged closely under the spacer 4, and a second retaining plate 1 arranged closely under the second mask main body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming mask apparatus for forming an electrode material on a piezoelectric element such as a quartz plate or a ceramic plate, and a storage jig used in manufacturing the piezoelectric element.

[0002]

2. Description of the Related Art For example, in the step of forming an electrode of a crystal unit, when a metal material for an electrode is formed by physical vapor deposition, a required portion of a crystal plate is formed by a vacuum vapor deposition method or a sputtering method using a mechanical mask device. An electrode was formed. In the vapor deposition method using this mechanical mask device, a plate body such as a plurality of masks such as a spacer for accommodating a quartz plate, upper and lower mask plates, and other auxiliary jigs is overlapped and integrated by screwing or magnetic force. The configuration was common. As an example of a method of integrating a mask plate and the like by magnetic force, there is, for example, Japanese Patent Application Laid-Open No. 4-13858.

[0003] The reason why the mask plate or the like is used in such a dividable state is that it is necessary to perform an operation of peeling and removing the deposition electrode material (silver, gold, aluminum, or the like) attached to the mask plate or the like. This peeling removal operation is performed by dipping in a specific cleaning liquid. The screwing and magnetic integration method has the advantage that the peeling and removing operation can be easily performed and the cleaning liquid or the rinsing liquid to be used after the cleaning can be completely removed. There is a problem in manufacturing operations such as

[0004] Further, a gap may be formed at the end of each superposed constituent member, and there has been a problem of displacement of the piezoelectric element into such a gap. In particular, in response to the recent increase in frequency, the size and thickness of piezoelectric elements have been remarkably reduced. For example, in the case of AT-cut quartz plates, those having a fundamental frequency of about 100 MHz have been put to practical use.
In this case, the thickness of the quartz plate is extremely thin, about 16 μm, and solving the above-mentioned problem of the displacement has been an important issue.

In order to solve the above-mentioned problem, a configuration has been put to practical use in which necessary mask components are integrated by spot welding and two or more integrated components are assembled by screwing or the like. However, when the cleaning liquid and the rinsing liquid used in the peeling and removing operation of the deposition electrode material adhered to the mask plate and the like remain between the mask and the mask pressing plate, when the film forming mask device is used for the vacuum deposition operation in this state. There is a problem that this residue is vaporized and released as a harmful impurity for film formation, which may cause deterioration of film formation quality.

Further, as disclosed in Japanese Patent Application Laid-Open No. 8-325705, there has been proposed a configuration in which the openings of the mask are joined by laser welding so as to minimize the generation of the above-mentioned gap. However, since the mask and the spacers themselves are also ultra-thin due to the ultra-thin piezoelectric element described above, warpage is likely to occur at the free end, and the thin piezoelectric element is placed in the minute gap formed here. , And displacement occurred.

In the manufacturing process of the piezoelectric element, the piezoelectric element is sometimes aligned with a jig such as a pallet. Conventionally, such a jig uses a resin such as bakelite for ease of processing. There were many. However, resin dust often occurs because the resin is cut or the like, and it is not preferable to apply to a minute piezoelectric element.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is difficult for each of the constituent members to be warped or the like. One object of the present invention is to provide a film forming mask device for a piezoelectric element that improves productivity and manufacturing yield by improving the productivity and manufacturing yield without generating foreign matter such as dust. It is another object to provide a storage jig.

[0009]

In order to solve the above-mentioned problems, the present invention is characterized in that the constituent members such as a vapor deposition mask device are joined together in a solid state by diffusion joining. Specifically, the following features are characterized.

According to a first aspect of the present invention, there is provided a film forming mask apparatus for a piezoelectric element, wherein a first vapor deposition mask body on which a plurality of predetermined mask patterns are formed, and an upper surface of the first vapor deposition mask; A first mask unit obtained by diffusion bonding a first holding plate having an opening for exposing a portion, a spacer having a plurality of piezoelectric element storage holes formed therein, and a piezoelectric element disposed on a lower surface thereof; A second vapor deposition mask body in which a predetermined mask pattern is formed at a position corresponding to the storage hole, and disposed on the lower surface thereof, while holding the second vapor deposition mask body and exposing each of the mask pattern portions; Second with opening to allow
A second mask unit obtained by diffusion bonding with the holding plate, wherein each of the constituent members is made of the same metal, and a piezoelectric element is stored in each of the piezoelectric element storing holes of the spacer. Are tightly contacted by a fastener or a magnetic force and are integrally fixed.

As a specific example of each component, any one of stainless steel, kovar, and copper can be mentioned.

According to the first aspect, since the two mask units have a structure in which respective components of the same metal are surface-bonded by diffusion bonding and are integrated, warpage of each component occurs in each mask unit. Therefore, even if the piezoelectric element is made ultra-thin, the piezoelectric element will not be displaced from a predetermined position and fixed as in the related art. In addition, since no gap is formed in the joint portion in each mask unit, there is no generation of residue during the execution of vapor deposition and cleaning as in the case of conventional spot welding.

According to a third aspect of the present invention, the present invention is also applicable to a storage jig for a piezoelectric element, wherein the flat metal substrate and the same metal as the flat metal substrate are formed, and a plurality of piezoelectric element storage holes are formed. The present invention is characterized in that a perforated flat metal substrate is integrated by diffusion bonding.

As a specific example of each component, any one of stainless steel, kovar, and copper can be mentioned.

According to the third aspect, no resin dust is generated unlike the prior art, and since the same metal is diffused and bonded, no gap is formed between the two substrates. There is no occurrence of the problem that the workability is impaired.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings, taking as an example the formation of electrodes of a monolithic quartz crystal filter. FIG. 1 is a partially exploded perspective view showing a film forming mask apparatus according to a first embodiment of the present invention, and FIG.
FIG. 3 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 4 is a cross-sectional view of a state where the mask units shown in FIG. 3 are joined.

The film forming mask apparatus is a first mask unit M
1 and a second mask unit M2. The first mask unit M1 includes a first mask main body 5 and a first holding plate 6 arranged on the first mask main body 5. First mask body 5
Have a thickness of, for example, 0.05 mm, and a plurality of upper mask patterns 51,... Corresponding to predetermined positions of a crystal plate B described later are formed corresponding to each of the crystal plates. The first
A first holding plate 6 is arranged in close contact with the upper portion of the mask main body 5. The first holding plate 6 has a thickness of, for example, 1.0
mm, the opening 6 that presses the first mask body and exposes the upper mask patterns 51,.
Are formed in plural numbers. Each component is made of the same material of stainless steel such as SUS304, for example.
Adhesion bonding is integrally performed by diffusion bonding.

The second mask unit M2 includes a spacer 4
And a second mask main body 3 closely disposed below the spacer 4 and a second holding plate 1 closely disposed below the second mask main body. The spacer 4 has a thickness of, for example, 0.05 mm, and is provided with piezoelectric element housing holes 41 for positioning and housing a plurality of quartz plates B at predetermined intervals. The second mask body 3 has a thickness of, for example, 0.05 mm, and a plurality of lower mask patterns 31,... Corresponding to the positions of the piezoelectric element housing holes of the spacers 4 are formed for each quartz plate. The second holding plate 1 has a thickness of, for example, 1.0
In order to expose the upper mask patterns 51,..., a plurality of openings 61,. Each component is
The same SUS30 as the material used in the first mask unit
4 and the like, and are integrally bonded to each other by diffusion bonding.

Diffusion bonding is a method in which each component is bonded in a solid state in a high-temperature vacuum atmosphere, and the contact surface of each component can be firmly and closely bonded. In addition, as a specific example of joining, by temporarily fixing each constituent member by spot resistance welding and then performing diffusion joining, positioning at the time of joining can be reliably performed. In addition, Kovar, copper, or the like can be used for each component in addition to stainless steel.

As shown in FIGS. 1 and 3, monolithic crystal filter elements (piezoelectric elements) B are respectively accommodated in piezoelectric element accommodation holes 41,... Formed in the spacers 4 of the second mask unit M2. As shown in FIGS. 1 and 4,
The first mask unit M1 is brought into close contact, and the male screws 2 and 2 are passed through the screw through holes 34, 44, 54 and 64, and tightened and fixed. Thereby, masking of a predetermined pattern can be performed on the piezoelectric element. The fixing of both may be performed by magnetic force. In this case, a device such as using a magnetized magnetic metal plate may be used. By performing physical vapor deposition using the above-described film forming mask apparatus by a vacuum vapor deposition method, a sputtering method, or the like, a monolithic crystal filter element (piezoelectric element) B having a desired film pattern can be obtained.

In the above description, a quartz filter element has been described as an example of the piezoelectric element, but another piezoelectric diaphragm may be used. This is similarly applied to the following embodiment.

A second embodiment according to the present invention will be described with reference to FIG. The present invention can be applied to a film forming mask apparatus as described above, and can be applied to, for example, a jig used in a processing step of a piezoelectric element. FIG. 5 is a cross-sectional view showing a storage jig for a piezoelectric element. The storage jig includes a flat metal substrate 7 and a perforated flat substrate 8 bonded to the upper surface thereof. A plurality of piezoelectric element storage holes corresponding to the outer shape of the piezoelectric element to be stored are formed in the perforated flat substrate 8. Both metal substrates are made of SUS304 and are integrated by diffusion bonding. Such a storage jig is used when it is necessary to align the piezoelectric elements, for example, in a pre-deposition step or during cleaning. As described above, by forming the storage jig for the piezoelectric element with a metal material adhered thereto, the generation of resin dust, which has conventionally occurred, is eliminated, and the characteristics of the piezoelectric element are not adversely affected. Further, there is no gap between the two substrates, and it is possible to eliminate the problem that the piezoelectric element enters the gap and hinders workability.

[0023]

According to the first or second aspect of the present invention, the two mask units are each formed by integrally joining the constituent members of the same metal by diffusion bonding and integrating them. Warpage of the constituent members is suppressed, and no gap is formed between the members. Therefore, even if the piezoelectric element is made ultra-thin, the piezoelectric element does not shift from a predetermined position and is fixed unlike the related art. Accordingly, it is possible to obtain a film forming mask device for a piezoelectric element that improves productivity and production yield.

According to the third or fourth aspect, no resin dust is generated unlike the prior art, and since the same metal is diffused and bonded, no gap is formed between the two substrates. It is possible to eliminate the problem that the piezoelectric element enters the gap and hinders workability. Therefore, it is possible to obtain a piezoelectric element storage jig which improves productivity and production yield.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment.

FIG. 2 is a first partially enlarged perspective view.

FIG. 3 is a cross-sectional view showing the first embodiment.

FIG. 4 is a cross-sectional view showing the first embodiment.

FIG. 5 is a cross-sectional view illustrating a second embodiment.

[Explanation of symbols]

 1 Second holding plate 2 Male screw 3 Second mask body 4 Spacer 5 First mask body 6 Second holding plate 7 7. flat metal substrate Perforated flat substrate

Claims (4)

[Claims] 1. A first deposition mask main body on which a plurality of predetermined mask patterns are formed, and a first holding plate disposed on an upper surface of the first deposition mask and having an opening exposing each of the mask pattern portions. A first mask unit obtained by diffusion-bonding the first and second spacers; a spacer having a plurality of piezoelectric element housing holes formed therein; a spacer disposed on a lower surface of the spacer; The second where the mask patterns are formed
And a second holding plate disposed on the lower surface of the second evaporation mask and holding the second evaporation mask body and having openings for exposing the respective mask pattern portions. The respective components are made of the same metal, the piezoelectric elements are stored in the respective piezoelectric element storing holes of the spacer, and both mask units are tightened with a fastener or magnetic force. A film forming mask device for a piezoelectric element, which is closely contacted. 2. The film forming mask apparatus for a piezoelectric element according to claim 1, wherein each of the constituent members is made of any one of stainless steel, Kovar, and copper. 3. A flat metal substrate and a perforated flat metal substrate made of the same metal as the flat metal substrate and having a plurality of holes for accommodating piezoelectric elements are integrated by diffusion bonding. Storage jig for piezoelectric element. 4. The storage jig for a piezoelectric element according to claim 3, wherein each substrate is made of any one metal of stainless steel, Kovar, and copper.