JPH0835077A - Holder for masking - Google Patents

Abstract

PURPOSE:To fix various kinds of metallic plates of this holder for forming circuits on electronic parts in a flat state and to enable finishing with high dimensional accuracy by fixing the metallic plates constituting a spacer and masks by diffusion joining. CONSTITUTION:The spacer 4 is composed of a positioning plate of the thin metallic plate formed with many pieces of positioning holes (H) for the electronic parts of the high dimensional accuracy by etching and an auxiliary spacer plate 4 formed with the electronic parts housing holes 3 larger than the size of the holes H in the positions corresponding to the holes H by one side or both side etching of >=1 sheets of the thick metallic plates which are fixed to the front side of the positioning plate described above or both surfaces thereof by diffusion joining of metal and have the thickness approximately the same as the thickness of the electronic parts over the entire part. Further, the upper and lower masks 6, 7 are composed of the mask plates of the thin metallic plates formed with circuit forming holes 5 of the high dimensional accuracy respectively by etching and the auxiliary mask plates formed with the through holes larger than the size of the holes 5 in the positions corresponding to the holes 5 by one side or both side etching of >=1 sheets of the metallic plates which are fixed by diffusion joining of metal on front surface or the rear surface of the mask plates described above.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a masking holder used when a circuit is formed on an electronic component such as a crystal oscillator or a ceramic element by screen printing or sputtering.

[0002]

2. Description of the Related Art Conventionally, a masking holder of this type is fixed by spot welding or the like to a plurality of stainless steel plates having a large number of electronic component storage holes for storing electronic components such as a crystal oscillator and a ceramic element. And a plurality of stainless steel sheets having a circuit forming hole for forming a circuit in the electronic component, which can support the electronic component accommodated in the electronic component storing hole of the spacer so as to cover the upper and lower portions. It is composed of an upper and lower mask to which a plate is fixed by spot welding or the like, and a plurality of bolts and nuts for detachably attaching the upper and lower mask and the spacer.

[0003]

Since the conventional masking holder uses the spacer and the upper and lower masks, which are fixed by spot welding using a plurality of stainless steel plates, respectively, distortion is caused by the spot welding. However, there is a problem in that a wave is generated and a gap is generated, which causes a problem in forming a film for forming a circuit and that it cannot be finished with high dimensional accuracy.

In view of the above-mentioned conventional drawbacks, the present invention has been made.
It is possible to fix spacers composed of multiple metal plates and various metal plates of the upper and lower masks in a state where they are surely prevented from being distorted and causing waves, and with high dimensional accuracy. The purpose is to provide a masking holder that can be finished.

The above and other objects and novel characteristics of the present invention will become more fully apparent when the following description is read in view of the accompanying drawings. However, the drawings are for explanation only and do not limit the scope of the present invention.

[0006]

In order to achieve the above object, the present invention provides a spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element. This spacer covers the upper and lower surfaces of the spacer in which a large number of circuit-forming holes are formed so that the electronic components stored in the large number of electronic component storage holes do not fall off and the electronic components can be masked. In the masking holder consisting of the upper and lower masks detachably attached, the spacers are etched to position a large number of electronic parts by etching using a thin metal plate capable of forming holes with high dimensional accuracy. A positioning plate having holes formed therein and a thickness dimension of the electronic component as a whole fixed to the upper surface or the upper and lower surfaces of the positioning plate by metal diffusion bonding. An auxiliary spacer in which at least one thick metal plate having almost the same thickness dimension is used to form an electronic component storage hole larger than the positioning hole in a portion corresponding to the positioning hole by single-sided etching or double-sided etching. And a mask plate in which circuit formation holes are formed by etching using a thin metal plate capable of forming circuit formation holes of high dimensional accuracy by etching the upper and lower masks respectively, and a mask plate Auxiliary structure in which at least one thick metal plate fixed to the upper or lower surface by metal diffusion bonding is used to form a through hole larger than the circuit forming hole at a portion corresponding to the circuit forming hole by one-side etching or both-side etching. The mask plate and the mask plate form a holder for masking.

[0007]

The masking holder constructed as described above is provided with a positioning plate having a positioning hole of high dimensional accuracy formed by using a thin metal plate and at least one auxiliary member formed by using a thick metal plate. Since the spacer plate and the spacer plate are fixed to each other by diffusion bonding, the spacer is securely fixed in a flat state without being distorted and causing a wave. Further, since the mask plates of the upper and lower masks and at least one or more auxiliary mask plates are fixed by metal diffusion bonding, they are securely fixed in a flat state without being distorted and causing a wave. Becomes

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the embodiments shown in the drawings.

In the first embodiment of the present invention shown in FIGS. 1 to 10, 1 is a masking holder of the present invention, and the masking holder 1 is for accommodating an electronic component 2 such as a crystal oscillator or a ceramic element. And a spacer 4 having a large number of electronic component storage holes 3 formed therein, and the spacer 4
On the spacer 4 in which a large number of circuit forming holes 5 that can be masked on the electronic parts 2 respectively without the electronic parts 2 stored in the large number of electronic part storing holes 3 Upper and lower masks 6, 7 detachably attached to cover the lower surface, and the upper and lower masks 6, 7
And fixtures 8, 8 for removably fixing the spacer 4 interposed between the upper and lower masks 6, 7 in a positioned state.
It consists of and.

The spacer 4 is, as shown in FIGS. 3 to 6, a positioning plate 9 made of a metal plate such as a thin stainless steel plate which can be hole-formed with high dimensional accuracy by etching. The auxiliary spacer plates 10 and 10 using a thick metal plate such as a stainless plate having a thickness substantially the same as the thickness of the electronic component 2 fixed by diffusion bonding of metal. As shown in FIG. 5, the positioning plate 9 includes a large number of positioning holes 11 capable of accommodating the electronic component 2 in a positioned state, engaging holes 12 and 12 at substantially central upper and lower end portions, and substantially central left and right portions. Mounting holes 13 and 13 are formed by etching in a portion near the ends, and the auxiliary spacer plates 10 and 10 are positioned in the positioning holes 11 of the positioning plate 9 as shown in FIG.
The electronic component storage hole 3, the engagement holes 12, 12 and the mounting holes 13, 13 are formed by single-sided etching so as to be located at the positions corresponding to the engagement holes 12, 12 and the mounting holes 13, 13.
Are formed.

The positioning hole 9 and the auxiliary spacer plates 10 and 10 for covering the upper and lower surfaces of the positioning hole 9 are fixed by metal diffusion bonding. The metal diffusion bonding is 5
1010 to 1150 in a vacuum of 10-4 Torr or less
The positioning plate 9 is heated to 90 ° C., vacuum-heated for a predetermined time of several minutes to several tens of minutes, and then cooled in a vacuum furnace.
The oxide film on the surface of the auxiliary spacer plates 10 and 10 are diffusion-bonded to each other.

The upper and lower masks 6 and 7 are shown in FIGS.
As shown in FIG. 0, a mask plate 14 using a metal plate such as a thin stainless plate that can be holed with high dimensional accuracy by etching.
And an auxiliary mask plate 15 using a thick metal plate such as a thick stainless plate fixed to the upper surface or the lower surface of the mask plate 14 by diffusion bonding of metal. The mask plate 14 is, as shown in FIG. The electronic component 2 positioned by the positioning hole 11 of the spacer 4 is prevented from falling off, and the spacer 4 is attached to the circuit forming hole 5 for forming a circuit in the electronic component 2 and the portions near the center left and right ends. Mounting holes 13, 1 communicating with the holes 13, 13
3 is formed by etching, and engagement pins 16 and 16 that engage with the engagement holes 12 and 12 of the spacer 4 are formed at portions near the upper and lower portions of the center, and the auxiliary mask plate 15 is As shown in FIG. 10, the through hole 17 and the mounting holes 13 and 13 larger than the circuit forming hole 5 are formed by single-sided etching so that the mask plate 14 is located at a position corresponding to the circuit forming hole 5 and the mounting holes 13 and 13. Are formed.

In the masking holder 1 having the above-described structure, the lower mask 7 is placed on the lower surface of the spacer 4 in a positioned state by engaging the engaging pins 16 and 16 with the engaging holes 12 and 12. After that, the electronic components 2 are housed in the electronic component housing holes 3 of the spacer 4, respectively, and are positioned by the positioning holes 11. Next, the upper mask 6 is attached to the upper surface of the spacer 4, and the engaging pin 1
6 and 16 and the engaging holes 12 and 12 are engaged with each other to establish a positioning state, and the bolts 1 as fixing members 8 are attached to the mounting holes 13 and 13 of the upper and lower masks 6 and 7 and the spacer 4.
8 and 18 are inserted, and the nuts 19 and
19 are screwed together and tightened and fixed.

In this state, in the sputtering chamber of the sputtering apparatus, using Au, Si, other metal compounds, metal oxides, etc., one is sputtered, then the other is inverted and the other is sputtered. When the double-sided sputtering process is completed, it is taken out from the sputtering chamber.
The nuts 19 and 19 as the fixtures 8 and 8 are bolts 18,
It is possible to remove the electronic component 2A on which the circuit is formed by removing the electronic component 2A from 18 and removing the upper mask 6.

[0015]

Different Embodiments of the Present Invention Next, different embodiments of the present invention shown in FIGS. 11 to 46 will be described. In the description of these different embodiments of the present invention, the same components as those of the first embodiment of the present invention will be designated by the same reference numerals and redundant description will be omitted.

The second embodiment of the present invention shown in FIGS. 11 to 14 is mainly different from the first embodiment of the present invention in that the upper and lower surfaces of the positioning plate 9 are each subjected to single-sided etching to store the electronic parts. While using the spacer 4A in which the two auxiliary spacer plates 10, 10A, 10, 10A having the layers 3 and 3 are positioned and fixed by metal diffusion bonding, the upper surface or the lower surface of the mask plate 14 is through-hole 17 by single-sided etching. Two auxiliary mask plates 15 formed with 17,
Since the upper and lower masks 6A and 7A in which 15A is positioned and fixed by metal diffusion bonding are used, the masking holder 1A configured by using the spacer 4A and the upper and lower masks 6A and 7A thus formed is also used. The same effect as the first embodiment of the present invention can be obtained.

The third embodiment of the present invention shown in FIGS. 15 to 18 is mainly different from the second embodiment of the present invention in that the auxiliary spacer having the electronic component storage holes 3 and 3 formed by double-sided etching. The spacers 4B are formed using the plates 10B, 10C, 10B, and 10C, and the upper and lower masks 6B and 7B are formed using the two auxiliary mask plates 15C and 15C in which the through holes 17 and 17 are formed by double-sided etching. In this respect, even with the masking holder 1B configured by using the spacer 4B and the upper and lower masks 6B and 7B thus formed, the same operational effect as the second embodiment of the present invention can be obtained.

The fourth embodiment of the present invention shown in FIGS. 19 to 22 is mainly different from the first embodiment of the present invention in that the lower surface of the spacer 4 has a positioning hole 11 for the spacer 4.
A plurality of, for example, three metal plates 21, 21, in the present embodiment, a plurality of air vent holes 20 capable of sucking and fixing the electronic components 2 housed therein by vacuuming are formed by etching. In this way, the support plate 22 fixed to the support plate 21 by diffusion bonding of metal is used.
The masking holder 1C composed of 2, the spacer 4 and the upper mask 6 is used when a circuit is formed only on one surface of the electronic component 2.

23 to 25, the fifth embodiment of the present invention is different from the fourth embodiment of the present invention mainly in the support plate 22 and the second embodiment of the present invention. Since the masking holder 1D is configured by using the spacer 4B and the upper mask 6A, the same operational effect as the fourth embodiment of the present invention can be obtained even with this configuration.

26 to 28, the sixth embodiment of the present invention is different from the fourth embodiment of the present invention mainly in the support plate 22 and the third embodiment of the present invention. Since the masking holder 1E is configured by using the spacer 4B and the upper mask 6B described above, the same operational effect as that of the fourth embodiment of the present invention can be obtained even with this configuration.

The seventh embodiment of the present invention shown in FIGS. 29 to 33 is mainly different from the fourth embodiment of the present invention in that the support plate 22 and the spacer 4 are used to mount the masking holder 1F. In terms of the structure, the masking holder 1 </ b> F having the above-described structure allows the electronic component 2 housed in the positioning hole 11 of the spacer 4 to receive the air vent hole 20 of the support plate 22.
More air is taken out to be adsorbed and fixed to the support plate 22, and in this state, a screen printing plate 23 for forming a circuit is positioned on the upper surface of the spacer 4 to perform screen printing. After that, the screen printing plate 23 is removed, and after baking and drying using a baking oven, the electronic component on which the circuit is printed is taken out from the masking holder 1F.

The eighth embodiment of the present invention shown in FIGS. 34 to 36 is mainly different from the fourth embodiment of the present invention in that the support plate 22 and the spacer 4A of the second embodiment are provided. Since the masking holder 1G is constructed by using the masking holder 1G, the same effects as those of the fourth embodiment of the present invention can be obtained even with such a construction.

37 to 39, the ninth embodiment of the present invention is different from the fourth embodiment of the present invention mainly in the support plate 22 and the spacer of the third embodiment of the present invention. Since the masking holder 1H is constructed by using 4B and 4B, the same effects as those of the seventh embodiment of the present invention can be obtained even with such a construction.

The tenth embodiment of the present invention shown in FIGS. 40 to 43 is mainly different from the first embodiment of the present invention in that the engaging holes 24, 24 are formed in the portions near both ends of the center. Spacer 4C and locking hole 2 of this spacer 4C
Upper and lower masks 6C and 7C in which engaging grooves 26 and 26 having through holes 25 and 25 are formed in portions corresponding to 4 and 24;
The upper and lower masks 6C and 7C are engaged with the engaging grooves 26 and 26, and the tips are engaged with the through holes 25 and 25 of the engaging grooves 26 and 26 and the engaging holes 24 and 24 of the spacer 4C. In this respect, the masking holder 1 </ b> I configured as described above uses the fasteners 27, 27 made of spring-shaped lip grooved steel, and the spacers 4 </ b> C are formed by the fasteners 27, 27.
Since the upper and lower masks 6C and 7C can be detachably fixed to each other, they can be easily attached and detached.

The eleventh embodiment of the present invention shown in FIGS. 44 to 46 is mainly different from the first embodiment of the present invention in the upper and lower masks 6D and 7D.
D and 7D each have a concave portion 17 formed by half etching from one side surface in a circuit forming hole portion, and a circuit forming hole 5 is formed in the portion where the concave portion 17 is located from the other side surface by etching. The masking holder 1J using the upper and lower masks 6D and 7D thus formed may be used.

In each of the above-mentioned embodiments of the present invention, the electronic component storage hole formed in the auxiliary spacer plate of the spacer is formed by etching. However, the electronic component storage hole formed by machining or laser processing is used. However, the same effect can be obtained. Further, in each of the embodiments of the present invention, the through hole formed in the auxiliary mask plate of the upper and lower masks is formed by etching. However, since this through hole does not need to be processed with high dimensional accuracy, mechanical processing or laser processing is performed. The same operation and effect can be obtained by using the one formed by the above.

[0027]

As is apparent from the above description, the following effects can be obtained in the present invention.

(1) A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element, and a plurality of electronic component storage holes of the spacer. Without the electronic parts falling off,
In addition, in the masking holder consisting of the upper and lower masks detachably attached so as to cover the upper and lower surfaces of the spacer in which a large number of circuit-forming holes which can be respectively masked in the electronic component, A positioning plate with a large number of electronic component positioning holes formed by etching using a thin metal plate that can form holes with high dimensional accuracy by etching, and metal diffusion bonding on the top or bottom surfaces of this positioning plate. Using a thick metal plate of at least one having a thickness that is approximately the same as the thickness of the electronic component as a whole fixed by the single-sided etching or the double-sided etching to the portion corresponding to the positioning hole, The auxiliary mask plate is formed with an electronic component storage hole larger than the positioning hole, and the upper and lower masks are respectively formed. And a mask plate having a circuit-forming hole formed by etching using a thin metal plate capable of forming a circuit-forming hole with high dimensional accuracy by etching, and at least fixed to the upper surface or the lower surface of the mask plate by metal diffusion bonding. Since one or more thick metal plates are used for single-sided etching or double-sided etching to form an auxiliary mask plate in which a through hole larger than the circuit forming hole is formed at a portion corresponding to the circuit forming hole, It is possible to securely fix the spacers and the upper and lower masks on which the metal plates are overlapped, without any distortion or gap. Therefore, the circuit can be surely formed on the electronic component by sputtering or the like.

(2) According to the above (1), since the plurality of metal plates are fixed by using the metal diffusion bonding to form the spacers and the upper and lower masks, the positioning holes for positioning the electronic parts of the spacers and It is possible to reliably prevent the dimensions of the circuit forming holes of the mask plate of the upper and lower masks from changing when fixing a plurality of metal plates. Therefore, it is possible to reliably position the electronic component and form the circuit by sputtering or the like. Therefore, it is possible to manufacture an electronic component having a uniform circuit.

(3) According to the above (1), the spacer and the upper and lower masks can be manufactured relatively easily.

(4) Claims 2, 3, 4, 5, 6, and 7 can also obtain the same effects as the above (1) to (3).

[Brief description of drawings]

FIG. 1 is a partially cutaway plan view showing a first embodiment of the present invention.

FIG. 2 is a sectional view of the first embodiment of the present invention.

FIG. 3 is a plan view of the spacer according to the first embodiment of this invention.

FIG. 4 is a sectional view of the spacer according to the first embodiment of the present invention.

FIG. 5 is a plan view of a positioning plate of the spacer according to the first embodiment of the present invention.

FIG. 6 is a plan view of an auxiliary spacer plate of the spacer according to the first embodiment of the present invention.

FIG. 7 is a plan view of the upper mask according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view of the upper mask according to the first embodiment of the present invention.

FIG. 9 is a plan view of the mask plate according to the first embodiment of the present invention.

FIG. 10 is a plan view of the auxiliary mask plate according to the first embodiment of the present invention.

FIG. 11 is a partially cutaway plan view showing a second embodiment of the present invention.

FIG. 12 is a sectional view of a second embodiment of the present invention.

FIG. 13 is a sectional view of a spacer according to a second embodiment of the present invention.

FIG. 14 is a sectional view of an upper mask according to a second embodiment of the present invention.

FIG. 15 is a partially cutaway plan view showing a third embodiment of the present invention.

FIG. 16 is a sectional view of the third embodiment of the present invention.

FIG. 17 is a sectional view of a spacer according to a third embodiment of the present invention.

FIG. 18 is a sectional view of an upper mask according to a third embodiment of the present invention.

FIG. 19 is a partially cutaway plan view showing a fourth embodiment of the present invention.

FIG. 20 is a sectional view of the fourth embodiment of the present invention.

FIG. 21 is a plan view of a support plate according to a fourth embodiment of the present invention.

FIG. 22 is a sectional view of a support plate according to a fourth embodiment of the present invention.

FIG. 23 is a partially cutaway plan view showing a fifth embodiment of the present invention.

FIG. 24 is a sectional view of the fifth embodiment of the present invention.

FIG. 25 is an enlarged cross-sectional view of the essential parts of the fifth embodiment of the present invention.

FIG. 26 is a partially cutaway plan view showing a sixth embodiment of the present invention.

FIG. 27 is a sectional view of a sixth embodiment of the present invention.

FIG. 28 is an enlarged cross-sectional view of the essential parts of the sixth embodiment of the present invention.

FIG. 29 is a plan view of the seventh embodiment of the present invention.

FIG. 30 is a sectional view of a seventh embodiment of the present invention.

FIG. 31 is an enlarged cross-sectional view of the essential parts of the seventh embodiment of the present invention.

FIG. 32 is an explanatory diagram of a screen printing plate when the seventh embodiment of the present invention is used.

FIG. 33 is an explanatory view of a usage state of the seventh embodiment of the present invention.

FIG. 34 is a partially cutaway plan view showing an eighth embodiment of the present invention.

FIG. 35 is a sectional view of an eighth embodiment of the present invention.

FIG. 36 is an enlarged cross-sectional view of the essential parts of the eighth embodiment of the present invention.

FIG. 37 is a partially cutaway plan view showing the ninth embodiment of the present invention.

FIG. 38 is a sectional view of the ninth embodiment of the present invention.

FIG. 39 is an enlarged sectional view of the essential parts of the ninth embodiment of the present invention.

FIG. 40 is a partially cutaway plan view showing a tenth embodiment of the present invention.

FIG. 41 is a sectional view of the tenth embodiment of the present invention.

FIG. 42 is an explanatory view showing a mounted state of the tenth embodiment of the present invention.

FIG. 43 is an explanatory view of a mounting portion according to the tenth embodiment of the present invention.

FIG. 44 is a partially cutaway plan view showing the eleventh embodiment of the present invention.

FIG. 45 is a sectional view of an eleventh embodiment of the present invention.

FIG. 46 is an explanatory view showing the manufacturing process of the upper and lower masks according to the eleventh embodiment of the present invention.

[Explanation of symbols]

 1, 1A to 1J: Holder for masking, 2: Electronic component, 3: Electronic component storing hole, 4, 4A to 4D: Spacer, 5: Circuit forming hole, 6, 6A to 6D: Upper mask, 7, 7A to 7D : Lower mask, 8: Fixing device, 9: Positioning plate, 10A to 10C: Auxiliary spacer plate, 11: Positioning hole, 12: Engaging hole, 13: Mounting hole, 14: Mask plate, 15, 15A to 15C : Auxiliary mask plate, 16: Engagement pin, 17: Through hole, 18: Bolt, 19: Nut, 20: Air vent hole, 21: Metal plate, 22: Support plate, 23: Screen printing plate, 24: Locking Hole, 25: through hole, 26: engaging groove, 27: fastener.

Claims (7)

[Claims] 1. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal oscillator and a ceramic element, and electrons stored in the large number of electronic component storage holes of the spacer. Masking consisting of upper and lower masks detachably attached so as to cover the upper and lower surfaces of the spacer in which a large number of circuit forming holes are formed so that the electronic parts can be masked without dropping the parts. In the holder for use, a positioning plate having a plurality of positioning holes for electronic parts formed by etching using a thin metal plate capable of forming holes with high dimensional accuracy by etching the spacer, and an upper surface of the positioning plate or At least one or more of the thicknesses that are fixed to the upper and lower surfaces by diffusion bonding of metal and have substantially the same thickness dimension as that of the electronic component as a whole. A single metal plate is used for single-sided etching or double-sided etching to form an auxiliary spacer plate in which the electronic component housing hole larger than the positioning hole is formed at a position corresponding to the positioning hole, and the upper and lower masks are etched respectively. A mask plate in which a circuit forming hole is formed by etching using a thin metal plate capable of forming a circuit forming hole with high dimensional accuracy, and at least one fixed to the upper or lower surface of the mask plate by metal diffusion bonding.
A masking holder characterized by comprising an auxiliary mask plate in which a through hole larger than the circuit forming hole is formed in a portion corresponding to the circuit forming hole by single-sided etching or double-sided etching using one or more thick metal plates. . 2. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element, and electrons stored in the large number of electronic component storage holes of the spacer. Masking consisting of upper and lower masks detachably attached so as to cover the upper and lower surfaces of the spacer in which a large number of circuit-forming holes are formed so that the electronic parts can be masked without dropping the parts. In the holder for use, a positioning plate having a plurality of positioning holes for electronic parts formed by etching using a thin metal plate capable of forming holes with high dimensional accuracy by etching the spacer, and an upper surface of the positioning plate or At least one thickness that is fixed to the upper and lower surfaces by metal diffusion bonding and has a thickness that is approximately the same as the thickness of the electronic component as a whole. A metal plate is used to form an auxiliary spacer plate in which the electronic component storage hole larger than the positioning hole is formed in a portion corresponding to the positioning hole by machining or laser processing, and the upper and lower masks are each etched. A mask plate having circuit forming holes formed by etching using a thin metal plate capable of forming circuit forming holes with high dimensional accuracy, and at least one sheet fixed to the upper or lower surface of the mask plate by metal diffusion bonding. A masking holder comprising the above thick metal plate and an auxiliary mask plate in which a through hole larger than the circuit forming hole is formed in a portion corresponding to the circuit forming hole by machining or laser processing. 3. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal oscillator and a ceramic element, and detachably or fixedly so as to cover the lower surface of the spacer. In a masking holder comprising a support plate having a large number of air vent holes capable of vacuum-adsorbing and fixing the electronic components housed in the electronic component housing holes of the attached spacers, the spacers are highly etched. A positioning plate in which positioning holes for a large number of electronic components are formed by etching using a thin metal plate capable of forming holes with dimensional accuracy,
One-sided etching is performed by using at least one thick metal plate having a thickness which is fixed to the upper surface or the upper and lower surfaces of the positioning plate by metal diffusion bonding and has a thickness substantially the same as the thickness of the electronic component. Alternatively, the masking holder is characterized in that the masking holder is formed by double-sided etching, and an auxiliary spacer plate having an electronic component housing hole larger than the positioning hole at a position corresponding to the positioning hole. 4. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal oscillator and a ceramic element, and detachably or fixedly so as to cover the lower surface of the spacer. In a masking holder comprising a support plate having a large number of air vent holes capable of vacuum-adsorbing and fixing the electronic components housed in the electronic component housing holes of the attached spacers, the spacers are highly etched. A positioning plate in which positioning holes for a large number of electronic components are formed by etching using a thin metal plate capable of forming holes with dimensional accuracy,
Machined using at least one thick metal plate having a thickness that is fixed to the upper surface or the upper and lower surfaces of the positioning plate by metal diffusion bonding, and has a thickness that is substantially the same as the thickness of the electronic component as a whole. A masking holder characterized by comprising an auxiliary spacer plate in which an electronic component housing hole larger than the positioning hole is formed in a portion corresponding to the positioning hole by laser processing. 5. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element, and electrons stored in the large number of electronic component storage holes of the spacer. Masking consisting of upper and lower masks detachably attached so as to cover the upper and lower surfaces of the spacer in which a large number of circuit-forming holes are formed so that the electronic parts can be masked without dropping the parts. In the holder for use, in order to position the spacer and the upper and lower masks, engaging holes are formed in portions of the spacer and the upper and lower masks near both sides, and engaging pieces that engage with the engaging holes are formed. As a mounting tool for removably mounting the spacer and the upper and lower masks, a locking hole formed in a substantially central portion near both ends of the spacer, and a portion corresponding to the locking hole. A lip groove shape made of a spring material having an engaging groove formed in the upper and lower masks and an engaging piece engaging with the engaging groove of the upper and lower masks and engaging with the engaging hole of the spacer A holder for masking, which is composed of a steel-shaped fastener. 6. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element, and electrons stored in the large number of electronic component storage holes of the spacer. Masking consisting of upper and lower masks detachably attached so as to cover the upper and lower surfaces of the spacer in which a large number of circuit-forming holes are formed so that the electronic parts can be masked without dropping the parts. In the holder for use, a positioning plate having a plurality of positioning holes for electronic parts formed by etching using a thin metal plate capable of forming holes with high dimensional accuracy by etching the spacer, and an upper surface of the positioning plate or At least one or more of the thicknesses that are fixed to the upper and lower surfaces by diffusion bonding of metal and have substantially the same thickness dimension as the electronic component. A metal plate is used to form an auxiliary spacer plate in which electronic component storage holes larger than the positioning holes are formed in a portion corresponding to the positioning holes by single-sided etching or double-sided etching. A masking holder characterized in that a recess is formed by half etching in a circuit formation hole portion, and a circuit formation hole is formed by etching from the other side surface in a portion where the recess is located. 7. A spacer having a large number of electronic component storage holes capable of storing electronic components such as a crystal unit and a ceramic element, and detachably or fixedly so as to cover the lower surface of the spacer. A support plate having a large number of air vent holes capable of sucking and fixing the electronic parts housed in the electronic part housing holes of the attached spacers by vacuum, and housed in a large number of electronic part housing holes of the spacer And an upper mask detachably attached so as to cover the upper surface of the spacer in which a large number of circuit-forming holes are formed so that the electronic parts can be masked without falling off. In the masking holder, the spacer is etched by using a thin metal plate capable of forming holes with high dimensional accuracy. A positioning plate having positioning holes for several electronic components is fixed to the upper surface or upper and lower surfaces of the positioning plate by metal diffusion bonding, and the overall thickness is approximately the same as the thickness of the electronic component. A thick metal plate having a thickness of at least one, and an auxiliary spacer plate in which an electronic component storage hole larger than the positioning hole is formed in a portion corresponding to the positioning hole by machining or laser processing, A masking holder characterized in that a recess is formed by half-etching an upper mask in one side surface at a circuit forming hole portion, and a circuit forming hole is formed in the portion where the recess portion is located by etching from the other side surface.