JPH0644108Y2 - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH0644108Y2 JPH0644108Y2 JP8048587U JP8048587U JPH0644108Y2 JP H0644108 Y2 JPH0644108 Y2 JP H0644108Y2 JP 8048587 U JP8048587 U JP 8048587U JP 8048587 U JP8048587 U JP 8048587U JP H0644108 Y2 JPH0644108 Y2 JP H0644108Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- lead terminals
- view
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、電子部品に関し、更に詳しくは、リード端子
の構造を改良して自動装着不良率を低減させた電子部品
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an electronic component, and more particularly, to an electronic component in which a structure of lead terminals is improved to reduce an automatic mounting failure rate.
従来の電子部品について、第５図〜第８図を参照して説
明する。A conventional electronic component will be described with reference to FIGS.
第５図に示すように、電子部品のリード端子53,54は、
補助端子56,57と共にフープ材58から突出した状態で、
金属製平板の打ち抜き加工により製作される。従って、
その平面，正面，右側面の各形状は第５図（ａ），
（ｂ），（ｃ）に示す如くであり、平面的形状である。As shown in FIG. 5, the lead terminals 53 and 54 of the electronic component are
With the auxiliary terminals 56 and 57 protruding from the hoop material 58,
It is manufactured by punching a metal flat plate. Therefore,
The shapes of the plane, front, and right side are shown in Fig. 5 (a),
As shown in (b) and (c), it has a planar shape.
第６図に示すように、フープ材58から突設しているリー
ド端子53,54は、溶融半田60中にディップされ、いわゆ
る半田めっきを施される。これは半田付け性を保証する
ためである。As shown in FIG. 6, the lead terminals 53 and 54 protruding from the hoop material 58 are dipped in the molten solder 60 and subjected to so-called solder plating. This is to ensure solderability.
次に、第７図に示すように、リード端子53,54及び補助
端子56,57の間に、電子部品本体52を挟むように保持す
る。この時、リード端子53と54とは、それぞれ電子部品
本体52の反対側の面に振り分けられる。Next, as shown in FIG. 7, the electronic component body 52 is held so as to be sandwiched between the lead terminals 53, 54 and the auxiliary terminals 56, 57. At this time, the lead terminals 53 and 54 are distributed to the opposite surfaces of the electronic component body 52, respectively.
次いで、第８図に示すように、リード端子53,54と電子
部品本体52とを半田付けし、リード端子53,54の末端部
を切断してフープ材58から切り離せば、電子部品51が得
られる。Then, as shown in FIG. 8, the lead terminals 53, 54 and the electronic component body 52 are soldered, and the end portions of the lead terminals 53, 54 are cut and separated from the hoop material 58 to obtain the electronic component 51. To be
かかる電子部品51の具体例としては、圧電セラミック発
振子や圧電セラミックフィルタが挙げられる。Specific examples of the electronic component 51 include a piezoelectric ceramic oscillator and a piezoelectric ceramic filter.
上記従来の電子部品51では、リード端子53,54が電子部
品52の反対側の面に各々半田付けされているため、リー
ド端子53と54とを含む面は電子部品本体52の対角線方向
を向いたものとなる。In the above conventional electronic component 51, since the lead terminals 53 and 54 are soldered to the opposite surfaces of the electronic component 52, the surface including the lead terminals 53 and 54 faces the diagonal direction of the electronic component main body 52. It will be what it was.
このため、リード端子53,54の末端をテープに接着して
多数の電子部品51をひとまとめにする（テーピングす
る）時、テープのラインに対してリード端子53,54を含
む面が平行となるから、各電子部品本体52は傾いて保持
されることとなり、取り扱い上種々の不便を生じる問題
点がある。Therefore, when the ends of the lead terminals 53 and 54 are adhered to the tape and a large number of electronic components 51 are put together (taping), the surface including the lead terminals 53 and 54 becomes parallel to the tape line. Since each electronic component main body 52 is held in an inclined state, there is a problem that various inconveniences occur in handling.
特に、かかる電子部品51を基板に自動装着する際に、不
良率が高くなる問題点がある。In particular, when the electronic component 51 is automatically mounted on the substrate, there is a problem that the defect rate becomes high.
従って、本考案の目的とするところは、電子部品本体の
両面に各々半田付けされたリード端子が、電子部品本体
の面と平行な一つの面内に揃っているような電子部品を
提供することにある。Therefore, it is an object of the present invention to provide an electronic component in which the lead terminals soldered on both sides of the electronic component body are aligned in one plane parallel to the plane of the electronic component body. It is in.
本考案の電子部品は、電子部品本体の第１の面とその裏
面である第２の面とに各々少なくとも１本のリード端子
が半田付けされている電子部品において、第１の面のリ
ード端子および／または第２の面のリード端子が電子部
品本体側の近傍部位で反対面側へ折り曲げられ且つ反対
面側のリード端子と同一面内に至る部位で再び折り曲げ
られ、電子部品本体の面と平行な一つの面内に両面のリ
ード端子が揃えられていると共に、それらリード端子が
鉛錫合金めっきを施されていることを構成上の特徴とす
るものである。The electronic component of the present invention is an electronic component in which at least one lead terminal is soldered to each of a first surface of a body of the electronic component and a second surface which is a back surface thereof. And / or the lead terminal on the second surface is bent to the opposite surface side in the vicinity of the electronic component main body side and is bent again to a part in the same plane as the lead terminal on the opposite surface side, and The constitutional feature is that lead terminals on both surfaces are aligned in one parallel surface and the lead terminals are plated with a lead-tin alloy.
本考案の電子部品では、電子部品本体の両面に各々半田
付けされたリード端子のいずれか一方若しくは両方が折
り曲げられ、両面のリード端子が電子部品本体の面と平
行な一つの面内に揃うようにされている。In the electronic component of the present invention, either one or both of the lead terminals soldered on both sides of the electronic component body are bent so that the lead terminals on both sides are aligned in one plane parallel to the plane of the electronic component body. Has been
従って、リード端子の末端部をテープに接着して複数の
電子部品をひとまとめにした時に、テープのラインと各
電子部品本体の面とが平行となり、取り扱いが容易とな
る。また、好適に自動装着することができ、不良率が低
減される。Therefore, when a plurality of electronic components are grouped together by adhering the end portions of the lead terminals to the tape, the tape line and the surface of each electronic component body are parallel to each other, which facilitates handling. In addition, the automatic mounting can be suitably performed, and the defective rate is reduced.
なお、リード端子を鉛錫合金めっきしているから、半田
付け性も良好になる。Since the lead terminal is plated with a lead-tin alloy, solderability is also improved.
以下、図に示す実施例に基づいて本考案を更に詳しく説
明する。ここに第１図（ａ），（ｂ），（ｃ）は本考案
の電子部品に用いるリード端子の一例の平面図，正面
図，右側面図である。第２図は第１図に示すリード端子
に鉛錫合金めっきを施す状態を示す模式的概念図であ
る。第３図（ａ），（ｂ），（ｃ）は第１図に示すリー
ド端子に電子部品本体を挟持した状態を示す平面図，正
面図，右側面図である。第４図（ａ），（ｂ），（ｃ）
は本考案の一実施例の電子部品の平面図，正面図，右側
面図である。なお、図に示す実施例により本考案が限定
されるものではない。Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings. Here, FIGS. 1 (a), (b), and (c) are a plan view, a front view, and a right side view of an example of a lead terminal used in the electronic component of the present invention. FIG. 2 is a schematic conceptual view showing a state in which lead-tin alloy plating is applied to the lead terminals shown in FIG. 3 (a), (b), and (c) are a plan view, a front view, and a right side view showing a state in which the electronic component body is held between the lead terminals shown in FIG. 4 (a), (b), (c)
FIG. 3A is a plan view, a front view, and a right side view of an electronic component according to an embodiment of the present invention. The present invention is not limited to the embodiments shown in the drawings.
第１図において、リード端子3,4は、補助端子6,7と共
に、フープ材８より突設されている。そして、それらリ
ード端子3,4の先端は、第１図（ａ），（ｃ）に示され
ているように、折り曲げられている。かかるリード端子
3,4は、銅薄板を打ち抜き加工し、更に曲げ加工して製
作される。In FIG. 1, the lead terminals 3 and 4 are projected from the hoop material 8 together with the auxiliary terminals 6 and 7. The tips of the lead terminals 3 and 4 are bent as shown in FIGS. 1 (a) and 1 (c). Such lead terminal
3 and 4 are manufactured by punching and bending a thin copper plate.
次に、第２図に示すように、フープ材８から突設された
リード端子3,4は、鉛錫合金めっき液10中において鉛錫
合金めっきを施される。この鉛錫合金めっきを行う目的
は、半田付け性を良好にするためである。ここで、従来
のように溶融半田中にディップしていわゆる半田めっき
を行わないのは、リード端子3,4の先端を折り曲げてい
るために、従来の半田ディップ処理では折り曲げ部分に
半田が過剰に付着する不都合があるからである。Next, as shown in FIG. 2, the lead terminals 3 and 4 protruding from the hoop material 8 are subjected to lead-tin alloy plating in a lead-tin alloy plating solution 10. The purpose of this lead-tin alloy plating is to improve solderability. Here, the so-called solder plating is not performed by dipping in the molten solder as in the conventional case. This is because there is a problem of adhesion.
次に、第３図に示すように、リード端子3,4および補助
端子6,7の間に、電子部品本体２を挟持させる。リード
端子3,4の先端の折り曲げにより形成される間隙を、電
子部品本体２の厚みと適合する幅としておけば、電子部
品本体２を挟持させても、リード端子3,4の末端側部分
は同一平面上となり、その平面は電子部品本体２の面と
平行となる。Next, as shown in FIG. 3, the electronic component body 2 is held between the lead terminals 3 and 4 and the auxiliary terminals 6 and 7. If the gap formed by bending the tips of the lead terminals 3 and 4 is set to have a width that matches the thickness of the electronic component body 2, even if the electronic component body 2 is held, the end portions of the lead terminals 3 and 4 are It is on the same plane, and the plane is parallel to the surface of the electronic component body 2.
次に、第４図に示すように、リード端子3,4の先端と電
子部品本体２とを半田付けし、リード端子3,4の末端部
でフープ材８と切り離せば、目的の電子部品１が得られ
る。Next, as shown in FIG. 4, the tip ends of the lead terminals 3 and 4 and the electronic component body 2 are soldered and separated from the hoop material 8 at the end portions of the lead terminals 3 and 4, and the target electronic component 1 is obtained. Is obtained.
この電子部品１では、リード端子3,4が各々半田付けさ
れている面より反対面側に折り曲げられ、且つ、両リー
ド端子3,4が同一面内に至ったときに再び折り曲げら
れ、電子部品本体２の面と平行な一つの面に両面のリー
ド端子3,4が揃うようにされている。In this electronic component 1, the lead terminals 3 and 4 are bent to the opposite surface side from the soldered surface, and when both lead terminals 3 and 4 reach the same surface, the electronic parts are bent again. The lead terminals 3 and 4 on both surfaces are aligned on one surface parallel to the surface of the main body 2.
従って、リード端子3,4の末端をテープに接着し多数の
電子部品１をひとつにまとめた時に、テープのラインと
電子部品本体２の方向とが一致し、取り扱いが極めて容
易となる。Therefore, when the ends of the lead terminals 3 and 4 are adhered to a tape and a large number of electronic components 1 are put together, the tape line and the direction of the electronic component main body 2 coincide with each other, which makes handling extremely easy.
また、基板への自動装着を良好に行うことができ、不良
率を低減することができる。In addition, the automatic mounting on the substrate can be favorably performed, and the defect rate can be reduced.
かかる電子部品の具体例としては、先述した如く、圧電
セラミック発振子や圧電セラミックフィルタが挙げられ
る。Specific examples of such electronic components include a piezoelectric ceramic oscillator and a piezoelectric ceramic filter, as described above.
〔考案の効果〕 本考案によれば、電子部品本体の第１の面とその裏面で
ある第２の面とに各々少なくとも１本のリード端子が半
田付けされている電子部品において、第１の面のリード
端子および／または第２の面のリード端子が電子部品本
体側の近傍部位で反対面側へ折り曲げられ且つ反対面側
のリード端子と同一面内に至る部位で再び折り曲げら
れ、電子部品本体の面と平行な一つの面内に両面のリー
ド端子が揃えられていると共に、それらリード端子が鉛
錫合金めっきを施されていることを特徴とする電子部品
が提供され、これにより電子部品本体の面と平行な面内
にリード端子が揃うから、リード端子の末端部をテープ
に貼着して複数の電子部品をひとまとめにして取り扱う
際の取り扱いが非常に容易になる。また、自動装着が良
好に行なえるようになり不良率を低減できる。[Advantage of the Invention] According to the present invention, in an electronic component in which at least one lead terminal is soldered to each of the first surface and the second surface which is the back surface of the electronic component main body, The lead terminal on the surface and / or the lead terminal on the second surface are bent to the opposite surface side in the vicinity of the electronic component body side, and are bent again to the part in the same plane as the lead terminal on the opposite surface side. An electronic component is provided, in which lead terminals on both sides are aligned in one plane parallel to the plane of the main body, and the lead terminals are plated with a lead-tin alloy. Since the lead terminals are aligned in a plane parallel to the surface of the main body, handling when a plurality of electronic components are collectively handled by sticking the end portions of the lead terminals to the tape is facilitated. Further, automatic mounting can be favorably performed, and the defective rate can be reduced.
第１図（ａ），（ｂ），（ｃ）は本考案の電子部品に用
いるリード端子の一例の平面図，正面図、右側面図であ
る。第２図は第１図に示すリード端子に鉛錫合金めっき
を施す状態を示す模式的概念図である。第３図（ａ），
（ｂ），（ｃ）は第１図に示すリード端子に電子部品本
体を挟持した状態を示す平面図，正面図，右側面図であ
る。第４図（ａ），（ｂ），（ｃ）は本考案の一実施例
の電子部品の平面図，正面図，右側面図、第５図
（ａ），（ｂ），（ｃ）は従来の電子部品に用いるリー
ド端子の平面図，正面図，右側面図である。第６図は第
５図に示すリード端子を半田ディップ処理する状態の模
式的概念図である。第７図（ａ），（ｂ），（ｃ）は第
５図に示すリード端子に電子部品を挟持した状態を示す
平面図，正面図，右側面図である。第８図（ａ），
（ｂ），（ｃ）は従来の電子部品の一例の平面図，正面
図，右側面図である。 〔符号の説明〕 １……電子部品、２……電子部品本体 3,4……リード端子 6,7……補助端子 ８……フープ材 10……鉛錫合金めっき液。1 (a), (b) and (c) are a plan view, a front view and a right side view of an example of a lead terminal used in an electronic component of the present invention. FIG. 2 is a schematic conceptual view showing a state in which lead-tin alloy plating is applied to the lead terminals shown in FIG. Figure 3 (a),
(B), (c) is a plan view, a front view, and a right side view showing a state in which the electronic component body is held between the lead terminals shown in FIG. 4 (a), (b) and (c) are a plan view, a front view and a right side view of an electronic component according to an embodiment of the present invention, and FIGS. 5 (a), (b) and (c) are It is the top view, front view, and right side view of the lead terminal used for the conventional electronic component. FIG. 6 is a schematic conceptual view of the state in which the lead terminals shown in FIG. 5 are subjected to the solder dip processing. 7 (a), (b), and (c) are a plan view, a front view, and a right side view showing a state in which an electronic component is sandwiched between the lead terminals shown in FIG. FIG. 8 (a),
(B), (c) is the top view, front view, and right side view of an example of the conventional electronic component. [Explanation of symbols] 1 ... Electronic component, 2 ... Electronic component body 3,4 ... Lead terminal 6,7 ... Auxiliary terminal 8 ... Hoop material 10 ... Lead tin alloy plating solution.
Claims (1)
第２の面とに各々少なくとも１本のリード端子が半田付
けされている電子部品において、 第１の面のリード端子および／または第２の面のリード
端子が電子部品本体側の近傍部位で反対面側へ折り曲げ
られ且つ反対面側のリード端子と同一面内に至る部位で
再び折り曲げられ、電子部品本体の面と平行な一つの面
内に両面のリード端子が揃えられていると共に、それら
リード端子が鉛錫合金めっきを施されていることを特徴
とする電子部品。1. An electronic component in which at least one lead terminal is soldered to each of a first surface and a second surface which is a back surface of the electronic component main body. Alternatively, the lead terminal on the second surface is bent to the opposite surface side in the vicinity of the electronic component main body side and is bent again to a part in the same plane as the lead terminal on the opposite surface side and is parallel to the surface of the electronic component main body. An electronic component characterized in that lead terminals on both sides are arranged in one plane and the lead terminals are plated with a lead-tin alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8048587U JPH0644108Y2 (en) | 1987-05-27 | 1987-05-27 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8048587U JPH0644108Y2 (en) | 1987-05-27 | 1987-05-27 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63188957U JPS63188957U (en) | 1988-12-05 |
| JPH0644108Y2 true JPH0644108Y2 (en) | 1994-11-14 |
Family
ID=30931331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8048587U Expired - Lifetime JPH0644108Y2 (en) | 1987-05-27 | 1987-05-27 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644108Y2 (en) |
-
1987
- 1987-05-27 JP JP8048587U patent/JPH0644108Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63188957U (en) | 1988-12-05 |
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