JPH0311943Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> This invention relates to a piezoelectric component such as a thickness-shear vibration resonator, and particularly to terminals at both ends thereof.

<Prior Art> FIG. 4 shows a conventional thickness-shear vibration resonator. In this figure, 1 is a rectangular piezoelectric ceramic substrate provided with electrodes on its front and back surfaces. Reference numeral 2 denotes a terminal made of a thin metal plate, and a plurality of terminals are connected together by a connecting part (not shown) made of the same material.

The terminal 2 has an approximately U-shaped holding part 3 (hereinafter simply referred to as the holding part 3) whose upper half is bent into a semicircular arc shape, and both ends of the board 1 are held between the holding part 3 and the board 1 is held. 1. Solder the electrodes at both ends and the holding part 3.

Thereafter, after applying an exterior coating of resin or the like by means of taping or the like, the connecting portion at the lower end is separated from each terminal 2, although it goes without saying that a gap or an elastic body is provided above the vibrating portion.

<Problem to be solved by the invention> The holding part 3 of the terminal used here is bent so as to sandwich both ends of the board 1, but when soldering is performed from the direction of arrow A in FIG. There are cases where solder accumulates at the tip of the board 1 and the solder does not reach the electrodes of the substrate 1, which causes a problem in that poor contact or soldering is likely to occur.

<Means for Solving the Problems> This invention was devised to solve the above-mentioned problems, and includes a pair of terminals in the electrode lead-out portions at both ends of a rectangular piezoelectric ceramic substrate having electrodes on both main surfaces. In a piezoelectric component having a substantially U-shaped holding portion attached by soldering, a slit having a width smaller than the width of the rectangular piezoelectric ceramic substrate is formed in each of the substantially U-shaped holding portions of the pair of terminals. A piezoelectric component is provided, wherein the substantially U-shaped holding portions of the pair of terminals and the electrode extension portions at both ends of the rectangular piezoelectric ceramic substrate are attached by solder.

<Function> This device has the above-mentioned configuration, and when the approximately U-shaped holding portions of the terminals are soldered to the electrode lead-out portions at both ends of the rectangular piezoelectric ceramic substrate, the substrate is soldered to the approximately U-shaped holding portions to the extent that the substrate does not fall off. Since the slit is provided, the electrode formed on the substrate during bonding can be clearly seen from this slit when bonding is performed using solder.

〈Example〉 Figures 1 to 3 show examples of this invention, in which numeral 11 is a piezoelectric ceramic substrate, on the surface of which, for example, electrodes constituting a thickness-shear vibration resonator are provided as appropriate. be.

Reference numeral 12 denotes a terminal, which is formed by punching out a metal plate using a press or the like, and the lower ends of a large number of terminals 12 are connected by a connecting portion (not shown).

Moreover, the upper part of this terminal 12 is a substantially U-shaped holding part 1.
3 (hereinafter simply referred to as the holding section 13), and the substrate 1
The holding portion 13 has a slit 1 smaller than the width of the substrate 11.
4 is provided.

When soldering, thread-like, paste-like solder, etc. is used.
Solder while watching the electrodes at both ends. Thereby, the soldering between the holding part 13 of the terminal 12 and the electrode lead-out part of the board 11 becomes reliable.

As mentioned above, after soldering the holding parts 13 of the terminals 12 to the electrode lead-out parts at both ends of the board 11, by applying the exterior 15 by means such as dipping,
A piezoelectric component A as shown in FIG. 3 is obtained.

<Effects of the invention> As described above, this invention provides a slit in the approximately U-shaped holding part of the terminal to be soldered to both ends of the board, so that the holding part is soldered to the electrode lead-out parts at both ends of the board. Since the electrode lead-out part is clearly visible, soldering between the electrode lead-out part and the holding part can be performed reliably.

For items soldered using the conventional method, the incidence of soldering defects was 10 to 20 ppm, but with the method of this invention, it was reduced to 2 to 3 ppm.
The effect is clear.

Furthermore, since the holding portion is provided with a slit, the bending rigidity is reduced, the life of the press die is extended, and the bending dimensional accuracy is also improved.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing an embodiment of this invention.
FIG. 2 is a perspective view of the same as the above after soldering, FIG. 3 is a front view of the completed product of the same, and FIG. 4 is an exploded perspective view of the conventional electronic component. 11...Piezoelectric ceramic substrate, 12...Terminal,
13...Substantially U-shaped holding part, 14...Slit.

Claims (1)

[Scope of utility model registration request] A piezoelectric component in which approximately U-shaped holding portions for a pair of terminals are attached by soldering to electrode lead-out portions at both ends of a rectangular piezoelectric ceramic substrate having electrodes on both principal surfaces,
A slit having a width smaller than the width of the rectangular piezoelectric ceramic substrate is formed in each of the substantially U-shaped holding portions of the pair of terminals, and the substantially U-shaped holding portion of the pair of terminals and the rectangular piezoelectric ceramic substrate are connected through the slits. A piezoelectric component characterized by having electrode lead-out portions at both ends of a ceramic substrate attached using solder.