JP2000286661A - Surface mount electronic parts - Google Patents
Surface mount electronic partsInfo
- Publication number
- JP2000286661A JP2000286661A JP11091954A JP9195499A JP2000286661A JP 2000286661 A JP2000286661 A JP 2000286661A JP 11091954 A JP11091954 A JP 11091954A JP 9195499 A JP9195499 A JP 9195499A JP 2000286661 A JP2000286661 A JP 2000286661A
- Authority
- JP
- Japan
- Prior art keywords
- base
- electronic parts
- surface mount
- reduce
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、水晶振動子その他
圧電振動子の実装構造で、従来の表面実装型形態を更に
簡素化し、製品価格を安価にする振動子のベース構造に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a quartz oscillator or a piezoelectric oscillator, and more particularly to a base structure of a resonator which further simplifies a conventional surface mount type and reduces the product price.
【0002】[0002]
【従来の技術】今日ごく一般的に使用している携帯電話
機、移動体通信機、その他演算機能を有する小型電子装
置に、小型で表面実装が可能の圧電振動子が広く使われ
ている。例えば従来技術の振動子として、実公平1−2
2260号公報(実開昭59−72032号公報:弊社
出願)に開示された構造のものがある。これは図3
(a)、(b)に示すように、圧電振動子の底面に垂直
に植設された一対のリード端子が貫通する一対の孔が設
けられた一枚の絶縁板を備え、この絶縁板の下面にあら
かじめ溝を形成しておき、この溝にそってリード端子を
折り曲げる構造のものである。2. Description of the Related Art Small-sized and surface-mountable piezoelectric vibrators are widely used in portable telephones, mobile communication devices, and other small electronic devices having an arithmetic function, which are very commonly used today. For example, as a vibrator of the prior art, actual
Japanese Unexamined Patent Application Publication No. 2260 (Japanese Utility Model Application Laid-Open No. 59-72032: our application) has a structure disclosed in Japanese Patent Application Publication No. 59-72032. This is Figure 3
As shown in (a) and (b), there is provided a single insulating plate provided with a pair of holes through which a pair of lead terminals vertically planted on the bottom surface of the piezoelectric vibrator penetrates. A groove is formed in the lower surface in advance, and the lead terminal is bent along the groove.
【0003】また、これらの構造のものはいずれもプリ
ント回路基板の印刷電極面にリード端子が接触するよう
に配置されて、はんだフロー処理により印刷電極面に溶
接することによりプリント回路基板に実装される。In each of these structures, the lead terminals are arranged so as to contact the printed electrode surface of the printed circuit board, and are mounted on the printed circuit board by welding to the printed electrode surface by solder flow processing. You.
【0004】[0004]
【発明が解決しようとする課題】前述する実公平1−2
2260号公報に示すものが最も広く用いられている
が、リード端子を絶縁板の孔に挿通したり、挿通したリ
ード端子を折り曲げたりなどを必要とすることから、絶
縁板の材料コストや製造工程(挿通処理)といった加工
費用も発生する。SUMMARY OF THE INVENTION The above-mentioned actual fairness 1-2
Although the one disclosed in Japanese Patent No. 2260 is most widely used, since it is necessary to insert lead terminals into holes in the insulating plate or bend the inserted lead terminals, the material cost of the insulating plate and the manufacturing process are required. Processing costs such as (insertion processing) also occur.
【0005】[0005]
【課題を解決するための手段】本発明は、ベース底面に
ほぼ垂直に植設されたリード端子と、前記リード端子が
底面にほぼ垂直に対向方向に折り曲げてなる表面実装型
圧電振動子において、ベースの少なくとも裏面全面に絶
縁材を塗布されていることを特徴とする表面実装型圧電
振動子を構成するものである。SUMMARY OF THE INVENTION The present invention relates to a surface mount type piezoelectric vibrator comprising: a lead terminal implanted substantially perpendicularly to a base bottom surface; and a lead terminal bent substantially perpendicularly to the bottom surface in a facing direction. A surface-mounted piezoelectric vibrator is characterized in that an insulating material is applied to at least the entire back surface of the base.
【0006】要するに、底面にほぼ垂直に植設されたリ
ード端子と、このリード端子が底面にほぼ垂直に対向方
向に折り曲げてなる表面実装型圧電振動子において、ベ
ースの少なくとも裏面全面に絶縁材を塗布することで、
絶縁材のコート(皮膜)が、前述する実公平1−222
60号公報に示す絶縁板の役目を奏することにより、金
属ベースの底面とリード端子が直接触れない構造とな
り、実質上従来から広く用いられている表面実装型の形
態を持つ振動子を得ることができる。In short, in a lead terminal implanted substantially vertically on the bottom surface and a surface mount type piezoelectric vibrator in which the lead terminal is bent substantially perpendicular to the bottom surface in a facing direction, an insulating material is provided on at least the entire back surface of the base. By applying
The coating (film) of the insulating material is the same as that of the above-mentioned actual article 1-222.
By playing the role of the insulating plate shown in Japanese Patent Publication No. 60, a structure in which the bottom surface of the metal base does not directly contact the lead terminals can be obtained, and a vibrator having a surface mount type that has been widely used in the past can be obtained. it can.
【0007】[0007]
【作用】本発明のベースの少なくとも裏面全面に絶縁材
を塗布する形態で、最大の利点としては、従来の振動子
に用いていた絶縁板を削減することができる。その結
果、絶縁板自体の材料費と絶縁板にリード端子を挿通す
るという製造工程を削減し作業を簡略化することで、製
品単価を大幅に削減することができる。また、従来セラ
ミック等で作られた表面実装型パッケージにおいては、
その機械的強度を保つためには、通常0.2ミリ以上の
ベース厚みが必要であったが、本発明によればセラミッ
ク等を用いたベース材料に代わり金属ベースを用いるこ
とから、0.2ミリ以下でも機械的強度を確保すること
が可能であり、従来の絶縁板を削減することもあいまっ
て、振動子の高さ方向については従来品より小型化(高
さ方向)を実現した圧電振動子を得ることもできる。The most advantageous effect of the present invention is that the insulating material is applied to at least the entire back surface of the base, and the greatest advantage is that the insulating plate used in the conventional vibrator can be reduced. As a result, the material cost of the insulating plate itself and the manufacturing process of inserting the lead terminals through the insulating plate are reduced and the operation is simplified, so that the product unit price can be significantly reduced. Also, in the surface mount type package conventionally made of ceramic etc.,
In order to maintain the mechanical strength, a base thickness of 0.2 mm or more was usually required. However, according to the present invention, a metal base was used instead of a base material using ceramics or the like. It is possible to secure mechanical strength even at millimeters or less, combined with the reduction in the number of conventional insulating plates, and the piezoelectric vibrator has been made smaller (height direction) than the conventional product in the height direction of the vibrator. You can get a child.
【0008】当然のことながら、従来品と同様に圧電振
動子のベース、フタも金属を用いていること、リード端
子の植設部分(金属とリード端子の導出部)はガラスハ
ーメチックシールが施されていること、ベースとフタと
の接合はウエルド工法を用いていることなどから、圧電
振動子自体の密閉(気密雰囲気)は非常に高い水準を維
持できるなどの利点には何ら変わるものはない。As a matter of course, the base and the lid of the piezoelectric vibrator are also made of metal as in the case of the conventional product, and the portion where the lead terminal is implanted (the metal and the lead terminal lead-out portion) is provided with a glass hermetic seal. In addition, since the welding between the base and the lid is performed using a weld method, there is no change in the advantage that the hermetic sealing (airtight atmosphere) of the piezoelectric vibrator itself can be maintained at a very high level.
【0009】[0009]
【発明の実施の形態】以下、添付図面に従ってこの発明
の実施例を説明する。なお、各図において同一の符号は
同様の対象を示すものとする。図1は本発明の一実施例
を示す側面図、図2は本発明の部分断面拡大側面図であ
る。図1は金属ベース1底面にほぼ垂直に植設されたリ
ード端子2と、前記リード端子2が金属ベース1底面に
ほぼ垂直に対向方向に折り曲げてなる表面実装型圧電振
動子の側面図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 is a side view showing one embodiment of the present invention, and FIG. 2 is an enlarged partial cross-sectional side view of the present invention. FIG. 1 is a side view of a lead terminal 2 implanted substantially perpendicularly to the bottom surface of a metal base 1 and a surface mount type piezoelectric vibrator formed by bending the lead terminal 2 substantially perpendicularly to the bottom surface of the metal base 1 in a facing direction. .
【0010】圧電振動子は金属ベース1と金属のフタと
からなり、ベースに植設されたリード端子2の一端には
圧電素板(水晶振動子片)を固着し、他端は底面にほぼ
垂直に対向方向に折り曲げた表面実装型のリード端子2
形態を構成している。金属ベース1と金属のフタを用い
ていることからこの両者の接合にはウエルド工法を用
い、リード端子2の植設部分(金属とリード端子の導出
部)はガラスハーメチックシールが施されていることか
ら圧電振動子自体の密閉(気密雰囲気)は非常に品質の
高い水準を確保することができる。The piezoelectric vibrator comprises a metal base 1 and a metal lid. A piezoelectric element (a crystal vibrating piece) is fixed to one end of a lead terminal 2 implanted in the base, and the other end is substantially at the bottom. Surface mount type lead terminal 2 bent vertically in the opposite direction
Make up form. Since the metal base 1 and the metal lid are used, a welding method is used for joining the metal base 1 and the lead terminal 2 (the lead-out portion of the metal and the lead terminal) has a glass hermetic seal. Therefore, the hermeticity (airtight atmosphere) of the piezoelectric vibrator itself can be maintained at a very high level.
【0011】本発明の特徴は、前述する振動子の形態で
従来(実公平1−22260号公報)から広い範囲で使
用している表面実装型の振動子と同じ機能と効果を持つ
もので、従来品で使用する絶縁板を削減したものであ
る。本発明では絶縁板に代わり、ベース部の少なくとも
裏面全面に絶縁材3を塗布したことを特徴とするもの
で、ここで用いる絶縁材3の種類については、樹脂、テ
フロン、ゴム剤を想定している。The feature of the present invention is that the above-described vibrator has the same functions and effects as the surface-mounted vibrator used in a wide range from the conventional one (Japanese Utility Model Publication No. 1-2260). The number of insulating plates used in conventional products is reduced. The present invention is characterized in that the insulating material 3 is applied to at least the entire back surface of the base portion instead of the insulating plate, and the type of the insulating material 3 used here is assumed to be resin, Teflon, and rubber. I have.
【0012】図2の部分断面拡大側面図に示すように、
ベース底面にほぼ垂直に植設されたリード端子2と、前
記リード端子2が該底面にほぼ垂直に対向方向に折り曲
げてなる表面実装型圧電振動子の、ベースの少なくとも
裏面全面に絶縁材3を塗布したものである。この場合、
ベースとフタとの接合にはウエルドを用いることから、
絶縁材3の塗布についてはベースの外周部分(ウエルド
部分)には絶縁材3の塗布は行われていない。As shown in the enlarged partial sectional side view of FIG.
An insulating material 3 is provided on at least the entire back surface of the base of a lead terminal 2 implanted substantially perpendicularly to the base bottom surface and a surface mount type piezoelectric vibrator formed by bending the lead terminal 2 substantially perpendicularly to the bottom surface in a facing direction. It has been applied. in this case,
Since a weld is used for joining the base and lid,
Regarding the application of the insulating material 3, the insulating material 3 is not applied to the outer peripheral portion (weld portion) of the base.
【0013】なお、本発明の実施例では水晶振動子や水
晶発振器をはじめとする圧電材料(水晶振動子やセラミ
ック)の収納するパッケージの端子構造(表面実装型)
であるが、この他一般的な電子部品を表面実装型の収納
パッケージと使用することもできる。また、ベース底面
に植設するリード端子の本数に制限をなく、リード端子
先端(回路基板実装面)をベースに這わした形状であっ
ても構わない。In the embodiment of the present invention, a terminal structure (surface mounting type) of a package for accommodating a piezoelectric material (a quartz oscillator or a ceramic) such as a quartz oscillator or a quartz oscillator.
However, other general electronic components can also be used as the surface mount type storage package. There is no limitation on the number of lead terminals to be implanted on the bottom surface of the base, and the shape may be such that the end of the lead terminal (circuit board mounting surface) extends along the base.
【0014】[0014]
【発明の効果】本発明によれば、従来の表面実装型振動
子の絶縁板を削減することで、絶縁板自体の材料費と絶
縁板にリード端子を挿通するという製造工程を削減し作
業を簡略化することで、製品単価を大幅に削減すること
ができる。また、従来振動子の絶縁板を削減することに
より、振動子の高さ方向も従来品より低くすることも可
能となり、より小型化(高さ方向)を実現した表面実装
型の電子部品を得ることもでき、ベース部全体を絶縁材
で被うことにより特にリード端子の付け根などの機械的
強度を強化することができる。According to the present invention, by reducing the number of insulating plates of a conventional surface mount type vibrator, the material cost of the insulating plate itself and the manufacturing process of inserting lead terminals through the insulating plate can be reduced and the work can be reduced. The simplification can greatly reduce the product unit price. Also, by reducing the insulating plate of the conventional vibrator, the height direction of the vibrator can be made lower than that of the conventional product, and a surface-mounted electronic component that is more compact (height direction) can be obtained. By covering the entire base portion with an insulating material, the mechanical strength, particularly at the base of the lead terminal, can be enhanced.
【図1】本発明第一実施例の構成を示す部分断面拡大正
面図。FIG. 1 is a partially enlarged front view showing the configuration of a first embodiment of the present invention.
【図2】本発明第一実施例の構成を示す拡大断面図。FIG. 2 is an enlarged sectional view showing the configuration of the first embodiment of the present invention.
【図3】従来例を示すもので、(a)は部分断面拡大正
面図、(b)は底面部方向から見た斜視図である。3A and 3B show a conventional example, in which FIG. 3A is a partially enlarged front view, and FIG. 3B is a perspective view as viewed from the bottom.
1 金属ベース 2 リード端子 3 絶縁材 DESCRIPTION OF SYMBOLS 1 Metal base 2 Lead terminal 3 Insulation material
Claims (3)
ド端子を有する圧電部品であって、 前記ベースの少なくとも裏面全面に絶縁材を塗布され、
前記リード端子が該ベース底面にほぼ垂直に対向方向に
折り曲げて表面実装型の形態を成していることを特徴と
する圧電部品。1. A piezoelectric component having lead terminals planted substantially vertically on a bottom surface of a base, wherein an insulating material is applied to at least the entire back surface of the base,
A piezoelectric component, wherein the lead terminal is bent substantially perpendicularly to the bottom surface of the base in a facing direction to form a surface mount type.
ド端子と、前記端子が該底面にほぼ垂直に対向方向に折
り曲げてなる表面実装型圧電部品において、 該ベースの少なくとも裏面全面に絶縁材を塗布されてい
ることを特徴とする表面実装型圧電部品。2. A surface mount type piezoelectric component comprising: a lead terminal implanted substantially vertically on a bottom surface of a base; and the terminal bent substantially perpendicularly to the bottom surface in a facing direction. A surface-mount type piezoelectric component characterized by being coated with.
は、樹脂、テフロン(登録商標)、ゴム剤を用いたこと
を特徴とする表面実装型電子部品。3. A surface-mounted electronic component, wherein the insulating material according to claim 1 uses resin, Teflon (registered trademark), or a rubber agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11091954A JP2000286661A (en) | 1999-03-31 | 1999-03-31 | Surface mount electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11091954A JP2000286661A (en) | 1999-03-31 | 1999-03-31 | Surface mount electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000286661A true JP2000286661A (en) | 2000-10-13 |
Family
ID=14040981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11091954A Pending JP2000286661A (en) | 1999-03-31 | 1999-03-31 | Surface mount electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000286661A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003034486A2 (en) * | 2001-10-18 | 2003-04-24 | Nec Schott Components Corporation | Thin metal package and manufacturing method thereof |
EP1622263A1 (en) * | 2004-07-30 | 2006-02-01 | Nihon Dempa Kogyo, Co., Ltd. | Surface mounted crystal unit |
CN100379148C (en) * | 2004-01-27 | 2008-04-02 | 松下电器产业株式会社 | Surface mounting base for electronic element |
US8072279B2 (en) | 2009-02-10 | 2011-12-06 | Nihon Dempa Kogyo Co., Ltd. | Crystal oscillator with pedestal |
-
1999
- 1999-03-31 JP JP11091954A patent/JP2000286661A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003034486A2 (en) * | 2001-10-18 | 2003-04-24 | Nec Schott Components Corporation | Thin metal package and manufacturing method thereof |
WO2003034486A3 (en) * | 2001-10-18 | 2004-04-29 | Nec Schott Components Corp | Thin metal package and manufacturing method thereof |
US6852927B2 (en) | 2001-10-18 | 2005-02-08 | Nec Schott Components Corporation | Thin metal package and manufacturing method thereof |
CN100379148C (en) * | 2004-01-27 | 2008-04-02 | 松下电器产业株式会社 | Surface mounting base for electronic element |
EP1622263A1 (en) * | 2004-07-30 | 2006-02-01 | Nihon Dempa Kogyo, Co., Ltd. | Surface mounted crystal unit |
US7190235B2 (en) | 2004-07-30 | 2007-03-13 | Nihon Dempa Kogyo Co., Ltd. | Surface mounted crystal unit |
US8072279B2 (en) | 2009-02-10 | 2011-12-06 | Nihon Dempa Kogyo Co., Ltd. | Crystal oscillator with pedestal |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7298069B2 (en) | Crystal unit | |
JP2005086783A (en) | Surface mounted piezoelectric device and its package, mobile phone utilizing surface mounted piezoelectric device, and electronic apparatus utilizing surface mounted piezoelectric device | |
JP2002043886A (en) | Piezoelectric vibrator and surface-mounted piezoelectric vibrator | |
JP2000286661A (en) | Surface mount electronic parts | |
JP3423255B2 (en) | Surface mount crystal oscillator | |
JP2001094378A (en) | Surface mounted container, piezoelectric device and temperature compensating quartz oscillator | |
JP2000077965A (en) | Piezoelectric vibrator and sealing method for piezoelectric vibration element | |
JP2003163567A (en) | Crystal oscillator | |
JP2002185256A (en) | Surface-mounting crystal oscillator | |
JP2000165177A (en) | Surface mounted crystal oscillator | |
JP2000031773A (en) | Crystal vibrator of surface mount type | |
JP2001237665A (en) | Surface-mount container and crystal vibrator using the same | |
JP2001119263A (en) | Crystal oscillator | |
JP3025617U (en) | Airtight body for surface mount oscillator | |
JPS6150413A (en) | Manufacture of piezoelectric vibrator | |
JP2000013170A (en) | Crystal oscillator for surface mounting | |
JP2004363936A (en) | Surface-mounted crystal vibrator and its manufacturing method | |
JPH03140007A (en) | Package for surface mounting | |
JP2002344277A (en) | Package for piezoelectric vibrating device | |
JP3556111B2 (en) | Package for electronic component, electronic component assembly using the same, and method of manufacturing electronic component assembly | |
JP2000165180A (en) | Surface mount container and crystal vibrator | |
JP4080728B2 (en) | Manufacturing method of surface mount type crystal unit | |
JP4479075B2 (en) | Piezoelectric oscillator | |
JP2005101220A (en) | Piezoelectric device | |
JPS6328114A (en) | Piezoelectric vibrating component |