JP3797061B2 - Ceramic package sealing method and sealing structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement in a sealing method and a sealing structure for accommodating a piezoelectric vibrating piece or the like in a ceramic package and sealing with a cap.
[0002]
[Prior art]
FIG. 15 is a schematic cross-sectional view showing a sealing structure of a piezoelectric vibrator as a sealing structure in which an electronic component is sealed in a ceramic package.
[0003]
The piezoelectric vibrator 1 includes a box-shaped package 3 in which a housing portion 3a for housing a plate-shaped crystal vibrating piece 2 is formed, and a plate-shaped cap 4 joined to the package 3 so as to seal the housing portion 3a. It has.
[0004]
The package 3 is provided with an electrode 5 for connection to the outside, and the crystal vibrating piece 2 is disposed on the electrode 5 whose one end portion 2a is exposed in the housing portion 3a via a conductive adhesive 5a. The other end 2b is a free end. An excitation electrode or the like (not shown) is provided on the surface of the crystal vibrating piece 2 and connected to the electrode 5.
[0005]
Thus, the drive voltage applied from the electrode 5 can vibrate at a predetermined frequency.
[0006]
Such a piezoelectric vibrator 1 is manufactured as follows.
[0007]
1. First, the package 3 is prepared by forming and firing with a ceramic material so as to have the shape shown in the figure.
[0008]
2. Next, the piezoelectric vibrating reed 2 in which an excitation electrode (not shown) is formed on the surface in advance by photoetching or vapor deposition is mounted in the package 3. That is, the electrodes of the piezoelectric vibrating reed 2 are connected and fixed via the conductive adhesive 5 a to the mount portion where the external power supply electrode is exposed in the package 3.
[0009]
3. While the piezoelectric vibrating piece 2 is vibrated by applying a driving voltage from the outside, for example, an electrode film component is added to the electrode portion of the piezoelectric vibrating piece 2 by vapor deposition or the like, or the mass is increased. Then, the frequency is adjusted so that the vibration frequency of the piezoelectric vibrating reed 2 is adjusted to a desired frequency by reducing the mass of the piezoelectric vibrating piece 2 by applying an ion beam or laser beam.
[0010]
4). Next, for example, the sealing member 6 is interposed between the upper end surface of the package 3 and the cap 4 in a nitrogen atmosphere, and the piezoelectric vibrating reed 2 is sealed in the package 3 by heating. Send to.
[0011]
[Problems to be solved by the invention]
By the way, in the sealing process described in the above 4 of the piezoelectric vibrator 1, lead-containing sealing glass has been used as the sealing material 6.
[0012]
However, if lead-containing sealing glass is used, the environment may be contaminated by the lead component. Therefore, so-called lead-free glass that does not use the lead component, particularly silver phosphate glass, for example, should be used. Is being considered.
[0013]
However, when such a lead-free glass is used as the sealing material 6, the lead-free glass has a weak bonding strength at the bonding interface with the ceramic package 3 and has a problem of deterioration due to water permeation from a slight gap. there were.
[0014]
For this reason, there is a method in which lead-free glass for sealing is applied to both the cap 4 and the upper end surface of the package 3 in consideration of the bonding strength, but not only the cost of the package is increased, but also vacuum heat treatment, wet Since it is not easy to introduce an assembly process for improving the characteristics of the piezoelectric vibrator such as cleaning, it is impossible to improve the characteristics of the piezoelectric vibrator as a result.
[0015]
Further, in order to supplement the bonding strength between the ceramic package 3 and the lead-free glass as much as possible, it is necessary to provide a wide width for applying the lead-free glass as a sealing material to the upper end surface of the ceramic package 3. It is necessary to increase the bill. Specifically, since the effective sealing allowance of about 0.3 mm is necessary for the entire upper end surface of the ceramic package 3, in order to ensure this, the application width of the melt-sealed glass is 0.00. About 5 mm is required.
[0016]
However, since the external dimensions of the ceramic package 3 are fixed and cannot be increased, the space of the housing portion 3a described above must be narrowed. For this purpose, the piezoelectric vibrating piece 2 must be downsized. For this reason, when the piezoelectric vibrating piece 2 is reduced in size, another problem that the vibration characteristic becomes insufficient occurs.
The present invention eliminates the above problems and provides a sealing method and a sealing structure capable of obtaining a sufficient sealing performance using lead-free glass without reducing the outer dimensions of the ceramic package from the current level. The purpose is to provide.
[0017]
[Means for Solving the Problems]
According to the first aspect of the present invention, in the state in which the electronic component is accommodated in a ceramic package having an accommodating portion for accommodating the electronic component therein, a cap is provided on the end surface of the ceramic package. A method for sealing a ceramic package for bonding and sealing, wherein an adhesion improving means is provided between the ceramic package and the cap, and then the lead-free glass is sealed via the adhesion improving means This is achieved by a ceramic package sealing method in which the package and the cap are bonded with glass, and the bonding end face of the ceramic package is previously formed in a glass-rich manner as the adhesion improving means.
[0018]
According to the configuration of the first aspect, since the adhesion improving means is provided between the ceramic package and the cap, the bonding strength between the ceramic package or the cap and the lead-free glass can be improved. Thereby, sufficient sealing performance can be obtained without enlarging the package and increasing the sealing allowance.
In addition, if the glass end surface of the ceramic package is preliminarily made to contain a large amount of glass component to make it rich in glass, the bondability with the sealing glass is improved by the action of this glass component.
[0027]
According to the second aspect of the present invention, in the state in which the electronic component is housed in a ceramic package having a housing portion for housing the electronic component therein, the end surface of the ceramic package is accommodated. A ceramic package sealing method in which a cap is joined and sealed, wherein an adhesion improving means is provided between the ceramic package and the cap, and then the lead-free glass sealing is performed via the adhesion improving means. The package and the cap are joined with a stop glass, and as the adhesion improving means between the ceramic package and the cap, the region corresponding to the joining portion of the cap is made thin, and the projection or In addition to forming the protrusions, the ceramic package further forms another protrusion or protrusion on the inside of the protrusion or protrusion. The method for sealing over di-, is achieved.
[0028]
According to the configuration of the second aspect, since the adhesion improving means is provided between the ceramic package and the cap, the bonding strength between the ceramic package or the cap and the lead-free glass can be improved. Thereby, sufficient sealing performance can be obtained without enlarging the package and increasing the sealing allowance.
Moreover, for example, when ceramic is used for the cap, in particular, by providing an adhesion improving means at the cap-side joint, the joint strength with the cap-side joint is improved, and the joint of the cap Since the thickness of the region corresponding to is reduced, the gap formed can be filled with the sealing glass, and the protrusion of the sealing glass in the thickness direction can be suppressed to reduce the thickness of the entire package. Furthermore, it is possible to prevent the sealing glass from flowing inward due to the another protrusion or protrusion.
[0035]
According to a third aspect of the present invention, the electronic component is housed in a ceramic package having a housing portion for housing the electronic component in the interior of the ceramic package. A ceramic package sealing method in which a cap is joined and sealed, wherein an adhesion improving means is provided between the ceramic package and the cap, and then the lead-free glass sealing is performed via the adhesion improving means. The package and the cap are joined with a stop glass, and as the adhesion improving means between the ceramic package and the cap, by the sealing method of the ceramic package using hard glass on the joining end surface of the ceramic package, Achieved.
[0036]
According to the configuration of the third aspect, since the adhesion improving means is provided between the ceramic package and the cap, the bonding strength between the ceramic package or the cap and the lead-free glass can be improved. Thereby, sufficient sealing performance can be obtained without enlarging the package and increasing the sealing allowance. In addition, since the joining end face of the ceramic package is joined to the hard glass, the joining strength of the joining interface is improved as compared with the case where the ceramic is in direct contact with the sealing glass. Furthermore, the sealing glass made of hard glass and lead-free glass is mainly composed of a glass component, so that the bonding strength is high. Therefore, the bonding strength between the package and the cap is improved.
[0037]
According to a fourth aspect of the present invention, in the configuration of the third aspect, as the means for improving the adhesion between the ceramic package and the cap, hard glass is used for the joint end surface of the ceramic package and the joint portion of the cap. Features.
[0038]
According to the structure of Claim 4, the joint strength as a whole will further improve by applying hard glass also to the cap side.
[0039]
According to a fifth aspect of the present invention, in the structure according to the third or fourth aspect, a groove is formed on a joining end surface of the ceramic package as the adhesion improving means between the ceramic package and the cap. It is characterized by using hard glass contained in the inside.
[0040]
According to the configuration of claim 5, when a groove is formed in the joining end surface of the ceramic package and the hard glass is accommodated in the groove, the hard glass can be prevented from flowing, and a narrow groove is formed. However, it is possible to reliably hold the hard glass and obtain an effect of improving the bonding force.
[0041]
According to a sixth aspect of the present invention, there is provided a ceramic package comprising: a ceramic package having an accommodating portion for accommodating an electronic component therein; and a cap joined to an end face of the ceramic package. An adhesion improving means provided between the ceramic package and the cap, and a sealing glass made of lead-free glass that is in contact with the adhesion improving means between the ceramic package and the cap; And, as the adhesion improving means, it is achieved by a sealing structure of a ceramic package having hard glass.
[0042]
A seventh aspect of the invention is characterized in that, in the configuration of the sixth aspect, a groove is formed in a joining end face of the ceramic package, and a hard glass is accommodated in the groove.
[0044]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
[0045]
FIG. 1 is a schematic perspective view showing a piezoelectric vibrator as an application example of the sealing structure according to the present embodiment, and FIG. 2 is a schematic cross-sectional view thereof.
[0046]
In these drawings, the piezoelectric vibrator 10 serves as a container for storing a plate-like piezoelectric vibrating piece 11 as an electronic component, so that the box-shaped package 12 in which the storage portion 12a is formed and the storage portion 12a are sealed. A plate-like cap 13 joined to the package 12 is provided.
[0047]
The piezoelectric vibrating reed 11 is connected and fixed on the electrode 14 disposed on a step portion integrally provided in the housing portion 12a at one end portion 11a, and the other end portion 11b is a free end. The package 12 and the cap 13 are joined via a sealing material 15 made of lead-free glass, which will be described later.
[0048]
Here, as a material of the piezoelectric vibrating piece 11, for example, an artificial crystal is used as a material that exhibits a piezoelectric action, and an excitation electrode (described later) required for driving the piezoelectric vibrating piece 11 on the surface thereof is used. An electrode (not shown) is formed.
[0049]
As the material of the package 12, for example, ceramic such as alumina is used. For example, the package 12 uses a green sheet or the like to form a space 12a in the upper base 12c on the lower base 12b. After being formed into a box shape as shown in the figure, it is formed by firing.
[0050]
A material close to the linear expansion coefficient of the package 12 is suitable for the cap 13, and the cap 13 is made of a metal or ceramic such as alumina, for example, in a flat plate shape. In the case of metal, for example, Kovar, 42 alloy, stainless steel (SUS) and the like are suitable.
[0051]
3 shows another example to which a similar sealing structure is applied. In this case, the sealing structure of the piezoelectric oscillator 20 is shown.
[0052]
In the figure, components common to those of the piezoelectric vibrator 10 described in FIGS. 1 and 2 are denoted by the same reference numerals, overlapping description is omitted, and differences will be mainly described.
[0053]
In the figure, in the package 21 of the piezoelectric oscillator 20, a second ceramic base 21b having a space on the inside is superimposed on a first ceramic base 21a, and a third ceramic base 21c having a space on the inside is further formed thereon. Overlaid. Thereby, compared with FIG. 2, the step part is further provided under the accommodating part 12a as internal space, and the other accommodating part 22a lower by one step is formed.
[0054]
Then, the integrated circuit 23 is mounted on the conductive pattern formed on the upper surface of the first ceramic base 21a, is accommodated in the accommodating portion 22a, and is connected to the electrode portion 24. As a result, a predetermined drive voltage is applied to the piezoelectric vibrating piece 11 to vibrate, and the output thereof is input to the integrated circuit 23, whereby a signal having a predetermined frequency is taken out.
[0055]
The sealing structure and the sealing method of the present invention are applied to all products using electronic parts including the piezoelectric vibrator 10 and the piezoelectric oscillator 20.
[0056]
Next, a sealing method (sealing structure) applied to the above-described piezoelectric vibrator 10 and piezoelectric oscillator 20 will be described in detail.
[0057]
FIG. 4 is an enlarged cross-sectional view of a main part when this is applied to the piezoelectric vibrator of FIG. 1 in order to describe the first embodiment of the sealing method.
[0058]
In the figure, the upper end surface 31 of the package 12 is, for example, the upper end of the vertical wall of the rectangular box-like package 12 as described in FIG. 1, and is provided so as to surround a rectangle as shown in FIG. This is a joining end surface with the cap 13.
[0059]
In this type of sealing method, the sealing glass is applied to the upper end surface 31 of the package 12 as a sealing material, the cap 13 is placed, and this sealing is performed by heating in a vacuum or in an inert gas atmosphere. The glass 12 is melted and the package 12 and the cap 13 are joined to perform sealing.
[0060]
Here, in the present invention, lead-free glass is used as the sealing material 15. Lead-free glass does not contain a lead component, and in this respect, there is an advantage that adverse effects on the environment due to the manufacturing process and products can be avoided. In this embodiment, low-melting glass that can use a relatively low temperature that does not adversely affect other members of the piezoelectric vibrator 10 whose heat at the time of sealing is about 300 degrees Celsius is used, and is generally silver phosphate-based. (AgO, P ₂ O _Five Glass) is suitable. This glass is also suitable for the sealing method of the present invention in that it has a thermal expansion coefficient close to that of the ceramic package 12.
[0061]
However, such lead-free glass 15 has low bonding strength with the ceramic package 12.
[0062]
Therefore, as shown in FIG. 4, a rough structure 32 is formed on the upper end surface 31 of the ceramic package 12 as an adhesion improving means, and the cap 13 is joined via a lead-free glass 15 as a sealing material. The bonding strength can be improved. Specifically, first, for example, when the package 12 is molded and fired as described above, a portion corresponding to the upper end surface 12 of the material of the ceramic package 12 is formed by a predetermined press die or the like during the molding. A rough surface is formed. Thereafter, the lead-free glass sealing glass 15 disposed in the joint portion 35 on the cap 13 side is placed on the rough surface 32, the cap 13 is placed on the package 12, and heated to heat the lead-free glass 15. Melt.
[0063]
In this case, the lead-free glass 15 is easy to adhere to the upper end surface 31 because the anchor effect is enhanced with the upper end surface 31 of the ceramic package 12 as the rough surface 32, and is melted and solidified by heating. The bonding strength at the bonding interface between the lead-free glass 15 and the upper end surface 31 is increased.
[0064]
The present embodiment is configured as described above. With the above configuration, the bonding strength is higher than that of the conventional sealing structure. Therefore, in order to supplement the bonding strength as in the conventional case, the cap 13 and the package 12 Since it is not necessary to apply lead-free glass for sealing to both upper end surfaces 31, not only can the cost of the package be avoided, but also assembly aimed at improving the characteristics of the piezoelectric vibrator such as vacuum heat treatment and wet cleaning. Introduction of the process becomes easy.
[0065]
Further, in order to supplement the bonding strength in the conventional sealing method, it is necessary to increase the sealing margin so as to widen the width for applying the lead-free glass as the sealing material to the upper end surface 31 of the ceramic package 12. There is no. For this reason, it is not necessary to enlarge the external dimensions of the package 12.
[0066]
In addition, since it is not necessary to reduce the space of the accommodating portion 12a while maintaining the external dimensions of the ceramic package 12 to be small, the piezoelectric vibrating reed 11 to be accommodated does not need to be reduced more than necessary. Since the vibration characteristics are not deteriorated by reducing the size of the piece 11, a troublesome technical problem is not caused.
[0067]
Thus, a sufficient sealing performance can be obtained by using the lead-free glass 15 without making the outer dimensions of the ceramic package 12 smaller than the current size.
[0068]
Here, as a method of forming the rough surface 32 on the upper end surface 31 of the ceramic package 12, in addition to the above, the rough surface may be physically formed by sandblasting or the like, or may be processed by various chemicals or the like. A chemically rough surface may be formed.
[0069]
FIG. 5 shows a modification of the embodiment of FIG.
[0070]
In FIG. 4, the rough surface 32 is formed only on the upper end surface 31 of the ceramic package 12, but in addition to this, the rough surface 36 is the same as the above in the joint portion 35 of the cap 13 as means for improving adhesion. It may be formed by a method.
[0071]
FIG. 6 is an enlarged cross-sectional view showing a main part of a second embodiment of the sealing method.
[0072]
In the figure, this sealing method is a method of forming a glass rich portion 37 on the upper end surface 31 of the ceramic package 12 as an adhesion improving means.
[0073]
That is, for example, hard glass (described later) is applied to the upper end surface 31 of the ceramic package 12 to form the glass rich portion 37. Here, the ceramic is a porous material and has many fine pores. Therefore, by applying a hard glass in a molten state to the upper end surface 31 of the ceramic package 12, the molten glass component penetrates into these many fine holes and solidifies, so that a layer containing a large amount of glass component is formed on the upper end surface 31. As a result, the glass rich portion 37 is formed.
[0074]
Next, as shown in FIG. 7, the cap 13 in which the lead-free glass 15 is applied to the joint portion 35 is placed on the upper end surface 31 and heated. Thereby, the melted lead-free glass 15 is suitably adapted to the glass rich portion 37 formed on the upper end surface 31 of the ceramic package 12 containing a lot of glass components, and the joint interface is firmly joined.
[0075]
Thereby, also in this embodiment, sealing performance improves and it can exhibit the same effect as embodiment of FIG.
[0076]
FIG. 8 is an enlarged cross-sectional view of a main part showing a third embodiment of the sealing method.
[0077]
In this figure, this sealing method forms an uneven portion 42 as an adhesion improving means on the upper end surface 31 of the ceramic package 12. Preferably, an uneven portion 41 as an adhesion improving means is also formed in the joint portion 35 of the cap 13 and the lead-free glass 15 as a sealing material is applied in advance by welding or the like.
[0078]
Then, as shown in the figure, the joint portion 35 of the cap 13 is placed on the concave and convex portion 42 of the upper end surface 31 of the ceramic package 12 so that the lead-free glass 15 is sandwiched therebetween, and is heated and sealed. Stop.
[0079]
Thereby, when the lead-free glass 15 is melted by heating, the lead-free glass 15 enters the concavo-convex surface of the concavo-convex portion 42 of the upper end surface 31 of the ceramic package 12, so that the contact area between the lead-free glass 15 and the upper end surface 31 of the ceramic package 12 is increased. To increase. Therefore, the lead-free glass 15 and the upper end surface 31 of the ceramic package 12 are firmly bonded to each other due to an increase in the adhesion area of the uneven portion 42 of the upper end surface 31 of the ceramic package 12 and the anchor effect.
[0080]
In addition, since the uneven portion 41 is also formed on the cap 13 side, the bonding strength between the bonding portion 35 of the cap 13 and the lead-free glass 15 is also improved, so that the ceramic package 12 and the cap 13 Are firmly joined.
[0081]
Therefore, also in this embodiment, the same effect as the embodiment of FIG. 4 is exhibited.
[0082]
Here, the concavo-convex portion 42 of the upper end surface 31 of the ceramic package 12 is formed in, for example, a regular concavo-convex shape by a predetermined press die or the like at the time of forming the ceramic. In addition, when the cap 13 is made of ceramic, the uneven portion 41 of the joint portion 35 of the cap 13 is similarly formed at the time of molding, and if the cap 13 is made of metal, it is formed by a predetermined metal processing after molding or the like. Can be formed.
[0083]
FIG. 9 is an enlarged cross-sectional view of a main part showing a fourth embodiment of the sealing method.
[0084]
In the figure, this sealing method is a method of forming protrusions or ridges as adhesion improving means not at the ceramic package 12 side but at the joint portion 35 of the cap 13.
[0085]
That is, in FIG. 9, a protrusion 43 that protrudes downward is formed at the joint portion 35 of the cap 13. When the cap 13 is made of ceramic, the projection 43 is formed by a predetermined mold at the time of molding, for example.
[0086]
The protrusion 43 may be a partially protruding protrusion, or may be a protrusion continuously connected so as to face the upper end surface 31 of the ceramic package 12.
[0087]
As a result, the lead-free glass 15 applied to the cap 13 side increases the bonding area with the bonding surface 35 of the cap 13, and thus the bonding strength is improved accordingly. Thereby, the same effect as the case of FIG. 8 is exhibited.
[0088]
FIG. 10 is an enlarged cross-sectional view of a main part showing a first modification of the sealing structure of FIG.
[0089]
In the figure, the joint surface 35 of the cap 13 is a region where the plate thickness is reduced by forming a step 45 on the periphery of the cap 13 from the periphery to the inside by the width of the sealing margin.
[0090]
In addition, as in the case of FIG. 9, protrusions or ridges 47 are formed on the bonding surface 35 as adhesion improving means.
[0091]
Thereby, as for the lead-free glass 15, the protrusion to the thickness direction of the board | plate of the cap 13 reduces as much as the joint surface 35 was formed thinly. Accordingly, in addition to the same effect of improving the bonding strength as in the structure of FIG. 9, the structure of FIG. 10 reduces the overall thickness of the piezoelectric vibrator 10 by suppressing the lead-free glass 15 from protruding into the thickness method. can do.
[0092]
FIG. 11 is an enlarged cross-sectional view of a main part showing a second modification of the sealing structure of FIG.
[0093]
In the figure, the bonding surface 35 of the cap 13 has a second protrusion or ridge 48 formed on the inner periphery of the peripheral portion of the cap 13 by the width of the sealing margin.
[0094]
That is, on the joint surface 35 of the cap 13, as in the case of FIG. 9, first protrusions or ridges 47 are formed as adhesion improving means. In addition, the second protrusions or protrusions 48 are formed on the joint surface 35 on the inner side of the first protrusions or protrusions 47.
[0095]
Thereby, at the time of sealing, since the 1st protrusion or the protruding item | line 47 as an adhesive improvement means is formed in the junction part 35 of the cap 13, joining strength with the lead-free glass 15 as a sealing material Is to be higher. Moreover, when the lead-free glass 15 that has been melted is placed on the package and heated, the molten lead-free glass 15 is blocked by the second protrusions or ridges 48 and does not flow inward. The sealing material can be secured, and the sealing performance can be improved also in this respect.
[0096]
FIG. 12 is an enlarged cross-sectional view of a relevant part showing a fifth embodiment of the sealing method.
[0097]
In this figure, this sealing method applies a hard glass 51 as an adhesion improving means to the upper end surface 31 of the ceramic package 12.
[0098]
Here, hard glass is a relatively low coefficient of thermal expansion of 30-50 × 10. ^-7 / A glass of about Celsius. If the coefficient of thermal expansion of glass is low, it has strong characteristics against thermal shock. Such hard glass is generally borosilicate glass (Na ₂ O, B ₂ O _Three , SiO ₂ In this embodiment, Kovar glass having a thermal expansion coefficient close to that of Kovar is preferably used in this embodiment. And such hard glass has favorable adhesiveness with a ceramic.
[0099]
In the sealing method (sealing structure) of FIG. 12, first, the hard glass 51 is disposed on the upper end surface 31 of the ceramic package 12.
[0100]
Specifically, for example, powder glass paste-like hard glass is applied to the upper end surface 31 of the ceramic package 12 using a syringe or the like.
[0101]
Alternatively, tablet-shaped hard glass is disposed on the upper end surface 31 of the ceramic package 12 and heated and baked.
[0102]
Alternatively, powder glass paste-like hard glass is printed on the upper end surface 31 of the ceramic package 12 by screen printing.
[0103]
Alternatively, when the ceramic package 12 is fired, hard glass is baked on the upper end surface 31 thereof.
[0104]
Then, when the hard glass 51 is arranged on the upper end surface 31 of the ceramic package 12 by these methods, the cap 13 is made of ceramic as shown in FIG. 12 with the lead-free glass 15 applied to the joining surface 35 of the cap 13. It is placed on the upper end surface 31 of the package 12 and heated.
[0105]
As a result, the lead-free glass 15 as the molten sealing material is suitably adapted to the hard glass 51 formed on the upper end surface 31 of the ceramic package 12 containing a lot of glass components, and the bonding interface is firmly bonded. Is done.
[0106]
Thereby, the effect similar to embodiment of FIG. 4 can be exhibited.
[0107]
Further, in addition to the sealing structure of FIG. 12, as shown in FIG. 13, hard glass 51 may be applied to the joint portion 35 of the cap 13. As a result, the lead-free glass 15 is sandwiched between the hard glass 51 on the cap 13 side and the hard glass 51 on the package 12 side, and the bonding strength at both bonding interfaces is improved.
[0108]
FIG. 14 is an enlarged cross-sectional view showing a main part of a sixth embodiment of the sealing method.
[0109]
14 is different from the case of FIG. 12 in that a groove 52 is formed in the upper end surface 31 of the ceramic package 12, and the hard glass 51 is filled in the groove 52. It is the point which comprises the adhesive improvement means.
[0110]
Specifically, a groove 52 is formed in the upper end surface 31 of the ceramic package 12 so as to be partially or continuous over the entire circumference. The hard glass 51 is filled into the groove 52. For example, a hard glass 51 that is a ring-shaped tablet that matches the shape of the groove 52 is inserted into the groove 52.
[0111]
Then, with the lead-free glass 15 applied to the bonding surface 35 of the cap 13, the cap 13 is placed on the upper end surface 31 of the ceramic package 12 and heated as shown in FIG. 14.
[0112]
As a result, the molten lead-free glass 15 as the sealing material is suitably adapted to the hard glass 51 in the groove 52 formed in the upper end surface 31 of the ceramic package 12 containing a lot of glass components, and the bonding interface thereof. Are firmly joined.
[0113]
In this case, since the hard glass 51 is held in the groove 52, when the hard glass 51 is formed in the molten state on the upper end surface 31 of the ceramic package 12, it flows out of the sealing allowance and the necessary amount is lost. It will never be. That is, the required amount of hard glass 51 can be reliably held in the narrow groove 52 determined in advance, and therefore, an effect of improving the adhesion can be reliably expected. Therefore, also in this embodiment, the same effect as that of the embodiment of FIG.
The present invention is not limited to the above-described embodiment. For example, the ceramic package is not limited to the illustrated shape, and can be in various forms such as other polygons and oval shapes. Further, the cap is not limited to a simple plate-shaped lid, but a cap having a predetermined depth may be used. Moreover, each structure of each above-mentioned embodiment is abbreviate | omitted or can be combined arbitrarily arbitrarily.
[0114]
The sealing method and the sealing structure of the present invention are not limited to piezoelectric vibrators and piezoelectric oscillators, and can be applied to all components when electronic components are sealed in a ceramic package.
[0115]
【The invention's effect】
As described above, according to the present invention, a sealing method and a sealing structure capable of obtaining a sufficient sealing performance using lead-free glass without reducing the external dimensions of the ceramic package from the current level. Can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a piezoelectric vibrator as a sealing component according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of the piezoelectric vibrator of FIG.
FIG. 3 is a schematic cross-sectional view showing an example of a piezoelectric oscillator as a sealing component according to an embodiment of the present invention.
FIG. 4 is an enlarged cross-sectional view of a main part of a sealing portion of the piezoelectric vibrator according to the first embodiment of the sealing method of the present invention.
FIG. 5 is an enlarged view of a main part showing a modification of the embodiment of FIG. 4;
FIG. 6 is an enlarged cross-sectional view showing a main part of a second embodiment of the sealing method of the present invention.
FIG. 7 is an enlarged cross-sectional view showing a main part of a second embodiment of the sealing method of the present invention.
FIG. 8 is an enlarged cross-sectional view of a main part showing a third embodiment of the sealing method of the present invention.
FIG. 9 is an enlarged cross-sectional view of a main part showing a fourth embodiment of the sealing method of the present invention.
10 is an enlarged cross-sectional view of a main part showing a first modification of the sealing method of FIG. 9;
11 is an enlarged cross-sectional view of a main part showing a second modification of the sealing method of FIG. 9. FIG.
FIG. 12 is an enlarged cross-sectional view showing a main part of a fifth embodiment of the sealing method of the present invention.
13 is an enlarged cross-sectional view of a main part showing a modification of the sealing method of FIG.
FIG. 14 is an enlarged cross-sectional view showing a main part of a sixth embodiment of the sealing method of the present invention.
FIG. 15 is a schematic cross-sectional view showing an example of a conventional sealing component.
[Explanation of symbols]
10 Piezoelectric vibrator
11 Crystal vibrating piece
12 packages
13 cap
15 Lead-free glass (encapsulant)
20 Piezoelectric oscillator
31 Upper end surface
32 Rough surface
35 joints
51 Hard glass

Claims (7)

A sealing method for a ceramic package in which a cap is bonded to an end face of the ceramic package in a state where the electronic component is housed in a ceramic package having a housing portion for housing the electronic component inside Because
An adhesion improving means is provided between the ceramic package and the cap,
Then, the package and the cap are joined with a sealing glass made of lead-free glass through the adhesion improving means,
And as said adhesion improving means,
The bonding end face of the ceramic package is formed in advance in a glass-rich manner. A sealing method for a ceramic package in which a cap is bonded to an end face of the ceramic package in a state where the electronic component is housed in a ceramic package having a housing portion for housing the electronic component inside Because
An adhesion improving means is provided between the ceramic package and the cap,
Then, the package and the cap are joined with a sealing glass made of lead-free glass through the adhesion improving means,
And as the said adhesion improvement means between the said ceramic package and a cap, while reducing the thickness of the area | region equivalent to the junction part of the said cap, forming a protrusion or a protruding item | line,
Furthermore, another processus | protrusion or projecting ridge is formed inside the processus | protrusion or projecting ridge. The sealing method of a ceramic package characterized by the above-mentioned. A sealing method for a ceramic package in which a cap is bonded to an end face of the ceramic package in a state where the electronic component is housed in a ceramic package having a housing portion for housing the electronic component inside Because
An adhesion improving means is provided between the ceramic package and the cap,
Then, the package and the cap are joined with a sealing glass made of lead-free glass through the adhesion improving means,
A method for sealing a ceramic package, comprising using hard glass as a bonding end surface of the ceramic package as the means for improving the adhesion between the ceramic package and the cap.   4. The ceramic package sealing according to claim 3, wherein hard glass is used as a bonding end surface of the ceramic package and a bonding portion of the cap as the means for improving the adhesion between the ceramic package and the cap. Stop method.   4. The hard glass contained in the groove is formed by forming a groove in the bonding end surface of the ceramic package as the means for improving the adhesion between the ceramic package and the cap. Or the method for sealing a ceramic package according to any one of 4 above. A ceramic package sealing structure comprising: a ceramic package having an accommodating portion for accommodating an electronic component therein; and a cap bonded to an end face of the ceramic package,
Adhesion improving means provided between the ceramic package and the cap;
A lead-free glass sealing glass that is in contact with the adhesion improving means between the ceramic package and the cap;
Furthermore, it has a hard glass as said adhesive improvement means. The sealing structure of the ceramic package characterized by the above-mentioned.   The ceramic package sealing structure according to claim 6, wherein a groove is formed on a joining end surface of the ceramic package as the adhesion improving means, and a hard glass accommodated in the groove is provided.

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