JPH01151813A - Small sized crystal resonator - Google Patents
Small sized crystal resonatorInfo
- Publication number
- JPH01151813A JPH01151813A JP31129487A JP31129487A JPH01151813A JP H01151813 A JPH01151813 A JP H01151813A JP 31129487 A JP31129487 A JP 31129487A JP 31129487 A JP31129487 A JP 31129487A JP H01151813 A JPH01151813 A JP H01151813A
- Authority
- JP
- Japan
- Prior art keywords
- notch
- package
- gas
- container
- crystal resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 11
- 239000003566 sealing material Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 230000002475 laxative effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
近年電子機器の小型薄型化と高精度化に要請に応え、そ
の基準信号を発生させる水晶発振器にあって、本発明は
薄型の小型水晶振動子ユニットを提供するものであり、
特に小型容器に振動子を封入する技術に関するものであ
る。[Detailed Description of the Invention] [Industrial Application Field] In response to the recent demands for smaller, thinner, and more accurate electronic equipment, the present invention relates to a crystal oscillator that generates a reference signal. It provides a child unit,
In particular, it relates to a technique for enclosing a vibrator in a small container.
本発明は、容器の中に水晶振動子を収容し、半田等の金
属ろうで蓋を封着するに際し、その溶融から放出される
ガスを容器内に滞留させず、外部に排出させることを目
的とし、接合面に切り欠きを設け、この切り欠き部が封
止の時間的経過の最後に閉塞するようにしたもので、こ
れにより容器の内部に放出したガスを極力微少なものと
することができる。The purpose of the present invention is to prevent gas released from melting when a crystal resonator is housed in a container and a lid is sealed with a metal solder such as solder to be discharged to the outside instead of remaining inside the container. A notch is provided on the joint surface, and this notch closes at the end of the sealing process, thereby minimizing the amount of gas released into the container. can.
第４図に示すように、従来からの水晶振動子ユニットは
、収納容器１と蓋２との間にワッシャー状の半田材等を
挿さんで、それを真空雰囲気中で加熱し、その封止材３
を溶融して両者を接合し封着していた。しかし、このと
き封止材の溶融に伴って、その中からガスが放出し、そ
れが真空あるいは不活性ガスであるべき容器の中に封じ
込められる。そのため真空度の低下による電気的特性の
劣化や、放出ガスの量に左右される特性のバラツキ等が
多くあり、さらに下剤のガスによる経時変化が大きくな
り、これらの改善が望まれていた。As shown in Fig. 4, a conventional crystal resonator unit is made by inserting a washer-shaped solder material between a storage container 1 and a lid 2, heating it in a vacuum atmosphere, and sealing it. Material 3
The two were joined and sealed by melting. However, at this time, as the sealing material melts, gas is released from the sealing material, and the gas is sealed in a vacuum or an inert gas container. As a result, there are many problems such as deterioration of electrical characteristics due to a decrease in the degree of vacuum, and variations in characteristics depending on the amount of released gas, and furthermore, changes over time due to laxative gas become large, and improvements to these problems have been desired.
上記封止材から放出されるガスが、容器の内側に滞留す
ることを防止するものであり、その特徴としてハンダ等
の封止材の溶融の時間的な流動特性を利用して問題を解
決するものである。This prevents the gas emitted from the sealing material from staying inside the container, and the problem is solved by utilizing the temporal flow characteristics of the melting of the sealing material such as solder. It is something.
本発明の実施例を、水晶振動子を真空封止する工程を引
用して、第１図、第２図、第３図で説明する。第１図は
振動子ユニットとして組立てる前の各構成部材を分離し
て示したものでケースはセラミック等からなる容器で、
図示してないがこの中には水晶より加工された振動子が
基部を固定して収容されている。この容器１の淵４０面
には金属膜５が従来のメタライズ法により設けられてい
る。２は蓋でガラス板等からなり、容器１の淵４と対接
する面には、容器と同様の金属膜５が施されている。３
は半田等の金属ろうでワッシャー状に加工された封止材
であり、容器１と蓋２の間に挿まれて、その溶融により
両者を接合する。この三者の積重方式に代わり、クリー
ム状の半田であっても良い、金属膜の上に半田材のコー
ティングを施しても同じ目的と効果を呈するものである
。Embodiments of the present invention will be described with reference to FIGS. 1, 2, and 3, with reference to the process of vacuum sealing a crystal resonator. Figure 1 shows each component separated before being assembled as a vibrator unit.The case is a container made of ceramic etc.
Although not shown in the drawings, a vibrator made of crystal is housed in the vibrator with its base fixed. A metal film 5 is provided on the edge 40 of the container 1 by a conventional metallization method. A lid 2 is made of a glass plate or the like, and a metal film 5 similar to that of the container is provided on the surface of the container 1 that comes into contact with the edge 4. 3
is a sealing material processed into a washer shape using a metal solder such as solder, which is inserted between the container 1 and the lid 2, and joins them together by melting the sealing material. Instead of this three-way stacking method, creamy solder may be used, or a coating of solder material may be applied on the metal film to achieve the same purpose and effect.
これまでの説明は従来の構造や機能と同一であるが、次
の本発明の特徴について述べる。容器１の淵４の面の一
部に切り欠き６がある。この容器１゜蓋２．封止材３の
三者を仮に重装した場合、切り欠き６は容器１の内と外
との通気口となる。第１図では容器ｌの長手方向に２個
の切り欠き６を示したが必要に応じて点線で示したよう
に横方向にも切り欠き６°を設けてもよく、その個数に
特定するものではないし、図ではＶ型の溝状にしである
が、他の型状でもよい。また図では容器１の淵４の面に
施したが、Ｍ２の対応する面に切り欠きを設けてもよく
、要件は切り欠き部にも金属膜が施されていることであ
り、それによる目的と効果は同一である。Although the explanation so far has been the same as the conventional structure and function, the following features of the present invention will be described. There is a notch 6 in a part of the surface of the edge 4 of the container 1. This container 1° lid 2. If the three types of sealing material 3 are mounted heavily, the cutout 6 will serve as a vent between the inside and outside of the container 1. In Fig. 1, two notches 6 are shown in the longitudinal direction of the container l, but if necessary, notches 6° may also be provided in the lateral direction as shown by dotted lines, and the number of notches 6 is specified. In the figure, the groove is V-shaped, but other shapes may be used. In addition, in the figure, a notch is provided on the surface of the edge 4 of the container 1, but a notch may be provided on the corresponding surface of M2, and the requirement is that the notch is also coated with a metal film, and the purpose of The effect is the same.
次に第２図と第３図により本発明の封止の過程を説明す
る。第２図は前述した三者を重装した状態の側面図で、
接合部に微少な圧接力をかけるため、蓋２の方向から矢
示Ｆのような微弱な力が加えられている。この加重は蓋
２の自重でも、逆にして容器１の自重でもよい。この状
態から、まず真空環境にする。そして次に加熱Ｔを加え
る・この間も図示してないが真空ポンプは排気を継続し
ている。上記加熱により封止材３は溶融を始める。Next, the sealing process of the present invention will be explained with reference to FIGS. 2 and 3. Figure 2 is a side view of the three members mentioned above, heavily armed.
In order to apply a slight pressure force to the joint, a weak force as indicated by arrow F is applied from the direction of the lid 2. This load may be the own weight of the lid 2 or, conversely, the own weight of the container 1. From this state, first create a vacuum environment. Then, heating T is applied.Although not shown during this time, the vacuum pump continues to pump out air. The sealing material 3 begins to melt due to the above heating.
それと同時にガスを放出する。ここで容器１の外側に出
たガスはそのまま排気され、容器１の内側に出たガスは
切り欠き６の貫通穴から外部に排気される。この経過に
ついて第３図で説明すると、第３図Ａは封止材３の溶融
直前の状態で、同図Ｂは溶融中の状態を示すもので、こ
の図Ａから図Ｂに至る溶融初期に特に多量のガスを放出
する。それらの時間経過の後に切り火き６以外の平坦な
淵４に対応する平坦な面の部分は溶融が流れ廻り封止の
条件が完了する。しかし切り欠き６の部分はまだ完全に
封止されず容器ｌの内部の放出ガスを排出する貫通穴３
′として機能する。しかる後に蓋２からの押圧力と溶融
の流動性により切り欠き部６は同図Ｃのように閉塞され
完全にシールされる。その後、加熱を断ち封止材が固化
した後に排気を停止し空気を導入し、ペルジャーから水
晶振動子ユニットを取り出す。At the same time, it releases gas. Here, the gas discharged to the outside of the container 1 is exhausted as is, and the gas discharged to the inside of the container 1 is discharged to the outside through the through hole of the notch 6. To explain this process with reference to Fig. 3, Fig. 3A shows the state immediately before melting of the sealing material 3, and Fig. 3B shows the state during melting. In particular, it releases large amounts of gas. After these times have elapsed, the melt flows around the portions of the flat surface corresponding to the flat edge 4 other than the opening 6, and the sealing conditions are completed. However, the notch 6 is not completely sealed yet, and the through hole 3 through which the released gas inside the container l is discharged
′. Thereafter, due to the pressing force from the lid 2 and the fluidity of the melt, the notch 6 is closed and completely sealed as shown in FIG. Thereafter, after the heating is cut off and the sealing material is solidified, the exhaust is stopped, air is introduced, and the crystal resonator unit is taken out from the Pelger.
以上の説明は真空封止の工程を例にしたが、不活性ガス
を置換して封止する場合も同じである。Although the above explanation took the vacuum sealing process as an example, the same applies to the case where sealing is performed by replacing an inert gas.
したがって、その容器１の中は封止材から放出されたガ
スを極力少なくした状態で閉塞し、封止が完成する。Therefore, the inside of the container 1 is closed with the gas released from the sealing material being minimized, and the sealing is completed.
以上説明したように、本発明は封止材の溶融中であって
も、容器内の放出ガスを排出するので、封止後の製品と
して特性の良い水晶振動子が得られる。特に直列共振抵
抗を低く押さえると共にそのバラツキも少なくなり、経
時変化も低減できる等多大な効果を示すものである。As explained above, in the present invention, the released gas in the container is discharged even while the sealing material is melting, so that a crystal resonator with good characteristics can be obtained as a product after sealing. In particular, it exhibits great effects such as keeping the series resonance resistance low, reducing its variation, and reducing changes over time.
第１図は本発明の小型振動子ユニットの構成部材を分解
して示した斜視図、第２図は本発明の側面図、第３図は
第２図のＡ部を拡大して示し本発明による工程の変化を
（Ａ）、（Ｂ）、（Ｃ）で示している。第４図は従来の
小型振動子ユニットの斜視図である。
ｌ・・・・容器 ４・・・・淵
２・・・・蓋 ５・・・・金属膜３・・・・封止
材 ６．６° ・切り欠き以上
出願人 セイコー電子部品株式会社
代理人 セイコー電子工業株式会社
第１！］
第２図のＡ部の経過δ材枳九区 第４図第３
図FIG. 1 is an exploded perspective view of the components of a small vibrator unit according to the present invention, FIG. 2 is a side view of the present invention, and FIG. 3 is an enlarged view of part A in FIG. (A), (B), and (C) show the changes in the process. FIG. 4 is a perspective view of a conventional small vibrator unit. l...Container 4...Brim 2...Lid 5...Metal film 3...Sealing material 6.6° ・Notch or more Applicant: Seiko Electronic Components Co., Ltd. Agent Seiko Electronic Industries Co., Ltd. No. 1! ] Progress of part A in Figure 2 δ material 9 sections Figure 4 3
figure
Claims (1)
溶融により蓋を封着する封着材を備えたものにおいて、
前記封着材が溶融して接合する面に切り欠きを設けたこ
とを特徴とする小型水晶振動子。In a container that houses a crystal resonator and is equipped with a sealing material that seals the lid by melting a metal brazing material such as solder,
A small crystal resonator, characterized in that a notch is provided on a surface to which the sealing material is melted and bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31129487A JPH01151813A (en) | 1987-12-09 | 1987-12-09 | Small sized crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31129487A JPH01151813A (en) | 1987-12-09 | 1987-12-09 | Small sized crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01151813A true JPH01151813A (en) | 1989-06-14 |
Family
ID=18015399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31129487A Pending JPH01151813A (en) | 1987-12-09 | 1987-12-09 | Small sized crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01151813A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04212927A (en) * | 1990-12-06 | 1992-08-04 | Dainippon Ink & Chem Inc | Liquid crystal device and its manufacture |
| JPH0511535U (en) * | 1991-07-18 | 1993-02-12 | シチズン時計株式会社 | Crystal oscillator |
| JP2012034086A (en) * | 2010-07-29 | 2012-02-16 | Nippon Dempa Kogyo Co Ltd | Method of manufacturing piezoelectric device and piezoelectric device |
| JP2013051512A (en) * | 2011-08-30 | 2013-03-14 | Nippon Dempa Kogyo Co Ltd | Crystal resonator |
| JP2013175542A (en) * | 2012-02-24 | 2013-09-05 | Seiko Epson Corp | Manufacturing method of electronic device, electronic device, electronic apparatus, and wiring board |
| JP2013179228A (en) * | 2012-02-29 | 2013-09-09 | Seiko Epson Corp | Method for manufacturing electronic device and electronic equipment |
| JP2014049561A (en) * | 2012-08-30 | 2014-03-17 | Kyocera Corp | Package for housing electronic element, and electronic device |
| CN103837145A (en) * | 2012-11-26 | 2014-06-04 | 精工爱普生株式会社 | Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object |
| JP2014106016A (en) * | 2012-11-26 | 2014-06-09 | Seiko Epson Corp | Package manufacturing method for electronic device, electronic device, electronic apparatus, and moving body |
| CN103972180A (en) * | 2013-01-30 | 2014-08-06 | 精工爱普生株式会社 | Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object |
| JP2016163005A (en) * | 2015-03-05 | 2016-09-05 | セイコーインスツル株式会社 | Component for package, electronic component, and manufacturing method of electronic component |
| KR20160110127A (en) * | 2015-03-11 | 2016-09-21 | 니혼도꾸슈도교 가부시키가이샤 | Ceramic package, electronic component device, and method for manufacturing the electronic component device |
| US9644962B2 (en) | 2013-10-31 | 2017-05-09 | Seiko Epson Corporation | Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body |
| US9706673B2 (en) | 2013-10-31 | 2017-07-11 | Seiko Epson Corporation | Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620323A (en) * | 1979-07-27 | 1981-02-25 | Citizen Watch Co Ltd | Container for miniature quartz oscillator |
| JPS5654082A (en) * | 1979-09-14 | 1981-05-13 | Thomson Csf | Filmmlike composite piezoelectric material and method of manufacturing same |
| JPS5693412A (en) * | 1979-12-26 | 1981-07-29 | Seiko Instr & Electronics Ltd | Superthin quartz oscillator |
-
1987
- 1987-12-09 JP JP31129487A patent/JPH01151813A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620323A (en) * | 1979-07-27 | 1981-02-25 | Citizen Watch Co Ltd | Container for miniature quartz oscillator |
| JPS5654082A (en) * | 1979-09-14 | 1981-05-13 | Thomson Csf | Filmmlike composite piezoelectric material and method of manufacturing same |
| JPS5693412A (en) * | 1979-12-26 | 1981-07-29 | Seiko Instr & Electronics Ltd | Superthin quartz oscillator |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04212927A (en) * | 1990-12-06 | 1992-08-04 | Dainippon Ink & Chem Inc | Liquid crystal device and its manufacture |
| JPH0511535U (en) * | 1991-07-18 | 1993-02-12 | シチズン時計株式会社 | Crystal oscillator |
| JP2012034086A (en) * | 2010-07-29 | 2012-02-16 | Nippon Dempa Kogyo Co Ltd | Method of manufacturing piezoelectric device and piezoelectric device |
| JP2013051512A (en) * | 2011-08-30 | 2013-03-14 | Nippon Dempa Kogyo Co Ltd | Crystal resonator |
| JP2013175542A (en) * | 2012-02-24 | 2013-09-05 | Seiko Epson Corp | Manufacturing method of electronic device, electronic device, electronic apparatus, and wiring board |
| JP2013179228A (en) * | 2012-02-29 | 2013-09-09 | Seiko Epson Corp | Method for manufacturing electronic device and electronic equipment |
| CN103296990A (en) * | 2012-02-29 | 2013-09-11 | 精工爱普生株式会社 | Base member, manufacturing method for electronic device, and electronic apparatus |
| US9066461B2 (en) | 2012-02-29 | 2015-06-23 | Seiko Epson Corporation | Base member, manufacturing method for electronic device, and electronic apparatus |
| JP2014049561A (en) * | 2012-08-30 | 2014-03-17 | Kyocera Corp | Package for housing electronic element, and electronic device |
| US9350318B2 (en) | 2012-11-26 | 2016-05-24 | Seiko Epson Corporation | Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object |
| CN103837145A (en) * | 2012-11-26 | 2014-06-04 | 精工爱普生株式会社 | Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object |
| JP2014106016A (en) * | 2012-11-26 | 2014-06-09 | Seiko Epson Corp | Package manufacturing method for electronic device, electronic device, electronic apparatus, and moving body |
| CN103972180A (en) * | 2013-01-30 | 2014-08-06 | 精工爱普生株式会社 | Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object |
| US9291457B2 (en) | 2013-01-30 | 2016-03-22 | Seiko Epson Corporation | Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object |
| US9644962B2 (en) | 2013-10-31 | 2017-05-09 | Seiko Epson Corporation | Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body |
| US9706673B2 (en) | 2013-10-31 | 2017-07-11 | Seiko Epson Corporation | Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body |
| JP2016163005A (en) * | 2015-03-05 | 2016-09-05 | セイコーインスツル株式会社 | Component for package, electronic component, and manufacturing method of electronic component |
| KR20160110127A (en) * | 2015-03-11 | 2016-09-21 | 니혼도꾸슈도교 가부시키가이샤 | Ceramic package, electronic component device, and method for manufacturing the electronic component device |
| JP2016171094A (en) * | 2015-03-11 | 2016-09-23 | 日本特殊陶業株式会社 | Ceramic package, electronic component device, and method of manufacturing the same |
| CN105977213A (en) * | 2015-03-11 | 2016-09-28 | 日本特殊陶业株式会社 | Ceramic package, electronic component device, and method for manufacturing same |
| CN105977213B (en) * | 2015-03-11 | 2018-09-14 | 日本特殊陶业株式会社 | Ceramic package, electronic component device and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01151813A (en) | Small sized crystal resonator | |
| EP0849578B1 (en) | Evacuatable package and a method of producing the same | |
| US4451540A (en) | System for packaging of electronic circuits | |
| US4652787A (en) | Piezoelectric oscillator | |
| JPS6351661A (en) | Cover of semiconductor device package and manufacture of the same | |
| US4328921A (en) | Attachment of solder preform to a cover for a sealed container | |
| JPH06151620A (en) | Method of sealing cap of package for enclosing semiconductor chip | |
| US6252337B1 (en) | Piezoelectric resonator and piezoelectric components using the same | |
| JP2000077965A (en) | Piezoelectric vibrator and sealing method for piezoelectric vibration element | |
| JP3797061B2 (en) | Ceramic package sealing method and sealing structure | |
| JP2003204238A (en) | Piezoelectric device, sealing method therefor, portable telephone equipment utilizing piezoelectric device and electronic equipment utilizing piezoelectric device | |
| US5644478A (en) | Electronic component and its manufacturing method | |
| JP2001274649A (en) | Method for air-tightly sealing quartz vibration device | |
| JPH01244651A (en) | Ceramic package type semiconductor device | |
| JPH02108314A (en) | Airtight sealing method for small piezoelectric vibrator | |
| JPH08213864A (en) | Mount method of element chip | |
| JPH0964221A (en) | Method for sealing package airtightly | |
| JP2001009373A (en) | Sealing structure of surface mounting-type piezoelectric oscillator and sealing method | |
| JP2002344277A (en) | Package for piezoelectric vibrating device | |
| JP3207020B2 (en) | Optical package | |
| JPH09107263A (en) | Electronic parts | |
| JPH043499Y2 (en) | ||
| JPH11340349A (en) | Container for electronic component, electronic component, piezoelectric oscillator unit and oscillator | |
| JPH0597123U (en) | Surface mount crystal unit | |
| JPH0645866A (en) | Surface acoustic wave element |