JPS593570Y2 - Chip type solid electrolytic capacitor - Google Patents

Chip type solid electrolytic capacitor

Info

Publication number
JPS593570Y2
JPS593570Y2 JP2614277U JP2614277U JPS593570Y2 JP S593570 Y2 JPS593570 Y2 JP S593570Y2 JP 2614277 U JP2614277 U JP 2614277U JP 2614277 U JP2614277 U JP 2614277U JP S593570 Y2 JPS593570 Y2 JP S593570Y2
Authority
JP
Japan
Prior art keywords
solid electrolytic
electrolytic capacitor
chip
anode
type solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2614277U
Other languages
Japanese (ja)
Other versions
JPS53121434U (en
Inventor
和洋 「峰」
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2614277U priority Critical patent/JPS593570Y2/en
Publication of JPS53121434U publication Critical patent/JPS53121434U/ja
Application granted granted Critical
Publication of JPS593570Y2 publication Critical patent/JPS593570Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案はチップ型固体電解コンテ゛ンサに関し、特にチ
ップ型固体電解コンテ゛ンサの引出し電極端子の構造に
関するものである。
[Detailed Description of the Invention] The present invention relates to a chip-type solid electrolytic capacitor, and more particularly to the structure of an extraction electrode terminal of a chip-type solid electrolytic capacitor.

従来、樹脂外装型チップコンテ゛ンサは第1図に示す如
く薄い金属板を階段状に屈折加工して折り曲げ形成して
なる陽極および陰極端子部分10.11をそれぞれコン
デンサ素子12の陽極13および陰極部分に溶接、半田
付等で接合させ、しかる後エポキシ樹脂などの外装樹脂
14で全体を被覆する構造であった。
Conventionally, resin-clad chip capacitors have anode and cathode terminal portions 10 and 11, which are formed by bending and bending a thin metal plate stepwise, as shown in FIG. The structure was such that they were joined by welding, soldering, etc., and then the entire body was covered with an exterior resin 14 such as epoxy resin.

一般にこの種のチップ型コンデンサは耐構特性の関係で
外装樹脂の肉厚は、ある程度必要であり、且つトランス
ファーモールド外装の場合樹脂の流れ性より0.5mm
以上の肉厚が必要となってくる。
In general, this type of chip-type capacitor requires a certain amount of wall thickness for the exterior resin due to its structural durability, and in the case of a transfer mold exterior, the thickness is 0.5 mm due to the flowability of the resin.
A greater wall thickness is required.

また、コンデンサ素子12と陽極端子10および陰極端
子11との組立位置精度より、かかる精度以上の余裕が
ないと素子露出、ピンホール等の外観不良が発生すると
ともに、経時的安定性を悪くする。
Further, if there is not enough margin for the assembly position accuracy of the capacitor element 12, anode terminal 10, and cathode terminal 11, external defects such as element exposure and pinholes will occur, and stability over time will deteriorate.

以上よりこの肉厚、間隙等を考慮すれば、現在、構造的
に小型化は不可能であった。
From the above, considering the wall thickness, gaps, etc., it is currently impossible to miniaturize the structure.

また電気的特性面では陽極端子とコンデンサ素子の陽極
引出リード線13の接合は溶接であり、溶接歪み等が発
生し、陰極端子との平行精度が悪くなり、次の作業工程
でのトランスファーモールド金型にクランプされた時、
コンデンサ素子と陰極端子との接合部分に機械的ストレ
スが加わり、接合が不完全になるという問題が起きる。
In addition, in terms of electrical characteristics, the anode terminal and the anode lead wire 13 of the capacitor element are joined by welding, which causes welding distortion, etc., and deteriorates the parallelism accuracy with the cathode terminal. When clamped to the mold,
A problem arises in that mechanical stress is applied to the joint between the capacitor element and the cathode terminal, resulting in an incomplete joint.

また、トランスファーモールドの際の成形圧力がコンデ
ンサ素子及び接合部分に加わり、外装後の電気的特性を
低下させる欠点を有していた。
Furthermore, the molding pressure applied during transfer molding is applied to the capacitor element and the joint portion, resulting in a disadvantage that the electrical characteristics after packaging are deteriorated.

本考案の目的は以上のような欠点をすべて解消した体積
効率の高い構造を有し、且つ量産性に適したチップ型固
体電解コンデンサを提供することを目的とする。
An object of the present invention is to provide a chip-type solid electrolytic capacitor that has a structure with high volumetric efficiency that eliminates all of the above-mentioned drawbacks and is suitable for mass production.

すなわち、本考案は固体電解コンデンサ素子の陽極線の
設けられた部位に、−側部から底部にかけて設けられた
切り欠き部を有するキャップ状の陽極端子をはめ込み、
かつ底部における切り欠き部の終端部と陽極線とが電気
的に接続されていることを特徴とするチップ型固体電解
コンデンサを提供するものである。
That is, in the present invention, a cap-shaped anode terminal having a notch extending from the negative side to the bottom is fitted into the part of the solid electrolytic capacitor element where the anode wire is provided.
The present invention also provides a chip-type solid electrolytic capacitor characterized in that the terminal end of the notch at the bottom and the anode wire are electrically connected.

次に本考案の一実施例を第2図乃至第5図を用いて説明
する。
Next, one embodiment of the present invention will be described using FIGS. 2 to 5.

第2図は本考案による完成状態のチップ型電子部品の斜
視図であり、第3図および第4図はそれぞれ本考案で用
いるキャップ形状の陰極端子および陽極端子の斜視図を
示しまず、銅、洋白、黄銅、ニッケルなどの薄い金属板
をプレス絞り加工し、その後、半田メッキ、金メッキ、
銀メッキなどの表面処理を施してキャップ形状の陰極端
子2を形成する。
FIG. 2 is a perspective view of a chip-type electronic component in a completed state according to the present invention, and FIGS. 3 and 4 respectively show perspective views of a cap-shaped cathode terminal and an anode terminal used in the present invention. Thin metal plates such as nickel silver, brass, and nickel are pressed and drawn, and then solder plated, gold plated,
A cap-shaped cathode terminal 2 is formed by surface treatment such as silver plating.

一方キャップ形状に加工されたものに側部から底部のほ
ぼ中心に至る切欠き部1aを設は底面部分18の切欠き
部最終部に外方に突出した折曲げ突部1bを形成して陽
極端子1とする。
On the other hand, a notch 1a extending from the side to approximately the center of the bottom is formed in the cap-shaped product, and a bent protrusion 1b protruding outward is formed at the final part of the notch in the bottom portion 18. Set it as terminal 1.

次に第5図の如く、帯状の金属板5に等間隔に接合され
てバッチ組されて形成されたコンデンサ素子3にキャッ
プ状の陰極端子2を導電性接着剤又は半田等により、接
合を行いコンデンサ素子3の露出している部分に液状エ
ポキシ樹脂層6などをコーティング、テ゛イツピングエ
法等で表面被覆する。
Next, as shown in FIG. 5, a cap-shaped cathode terminal 2 is bonded to the capacitor element 3, which is formed by batch-assembling and bonded to a band-shaped metal plate 5 at equal intervals, using a conductive adhesive or solder. The exposed portion of the capacitor element 3 is coated with a liquid epoxy resin layer 6 or the like, and the surface is covered by a taping method or the like.

その後、帯状の金属板5に等間隔に取付けられた状態の
まま、キャップ状の陽極端子1の切欠き部1aよりコン
デンサ素子の陽極引出リード線4を通してかぶせ、陽極
リード線4と折り曲げ突部1bと、溶接接続し、陽極端
子とコンデンサ素子1との間の空隙を切欠き部1aから
液状のエポキシ樹脂を注入し封目して補強する。
Thereafter, the anode lead wire 4 of the capacitor element is passed through the notch 1a of the cap-shaped anode terminal 1 while being attached to the band-shaped metal plate 5 at equal intervals, and the anode lead wire 4 and the bent protrusion 1b are covered. Then, the gap between the anode terminal and the capacitor element 1 is sealed and reinforced by injecting liquid epoxy resin from the notch 1a.

しかる後帯状の金属板5に等間隔に取付けられた複数個
のチップ型コンデンサを、コンデンサ素子3の引出しリ
ード線4の折り曲げ突部より複数個同時に切断して本考
案によるチップ型コンテ゛ンサが得られる。
After that, a plurality of chip-type capacitors attached to the strip-shaped metal plate 5 at equal intervals are simultaneously cut from the bent protrusion of the lead wire 4 of the capacitor element 3 to obtain a chip-type capacitor according to the present invention. .

本考案によれば陽極端子1、陰極端子2、は薄い金属板
でキャップ形状であり、コンデンサ素子3へ直接接合し
た構造となり、体積効率が高く、かかるチップ型コンデ
゛ンサを回路基板にマウントするに際し、自動的に高速
かつ信頼性よくマウント出来、集積密度の高い回路基板
上にも取付けることが可能である。
According to the present invention, the anode terminal 1 and the cathode terminal 2 are thin metal plates in the shape of caps, and have a structure in which they are directly connected to the capacitor element 3, resulting in high volumetric efficiency and the ability to mount such a chip-type capacitor on a circuit board. It can be mounted automatically, quickly and reliably, even on highly integrated circuit boards.

更に、製造上に於いては、陽極端子に切欠き部が設けら
れているため、帯状の金属板5に等間隔に取付られた複
数個のコンデンサ素子3を切離すことなく同時に接合作
業が可能であり、その製作工程が極めて簡潔になるのみ
ならず、量産性にも適するという顕著な効果を有するの
である。
Furthermore, in manufacturing, since a notch is provided in the anode terminal, it is possible to simultaneously join multiple capacitor elements 3 attached to the strip-shaped metal plate 5 at equal intervals without having to separate them. This has the remarkable effect that the manufacturing process is not only extremely simple, but also suitable for mass production.

また、本考案は、作業にも熟練をさほど必要とせずかつ
精度のよいチップ型コンテ゛ンサを得ることが出来る。
Furthermore, the present invention can provide a chip type capacitor with high precision without requiring much skill in operation.

また回路基板にマウントするに際し、実装スペースに応
じた、方向性のもたない特徴を有する。
Furthermore, when mounted on a circuit board, it has the characteristic of not having directionality depending on the mounting space.

更に、電気的特性面に於いても、組立位置精度も必要な
く、又、外部圧力の影響もないので、均一で安定した信
頼性のすぐれたチップ型コンデンサである。
Furthermore, in terms of electrical characteristics, the chip type capacitor is uniform, stable, and highly reliable because it requires no assembly position precision and is not affected by external pressure.

なお本考案は上述した実施例に限定されるものではなく
、例えば陰極端子は陰極層上に被覆されたソルダー等に
よっても良いものである。
It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, the cathode terminal may be a solder coated on the cathode layer.

以上のように本考案によるチップ型コンデンサは体積効
率が高く、量産性に適し、且つ、信頼性の高いものであ
り、工業的価値は大である。
As described above, the chip type capacitor according to the present invention has high volumetric efficiency, is suitable for mass production, and is highly reliable, and has great industrial value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の樹脂外装型チップコンテ゛ンサの側断面
図、第2図は本考案による完成状態のチップ型固体電解
コンデンサの斜視図、第3図は、本考案で用いるキャッ
プ形状の陽極端子の斜視図、第4図は本考案で用いるキ
ャップ形状の陰極端子の拡大斜視図、第5図は、帯状の
金属板に等間隔に接合されたコンデンサ素子の斜視図で
ある。 図中の符号10・・・・・・陽電極部、11・・・・・
・陰電極部、12・・・・・・コンデンサ素子、13・
・・・・・コンテ゛ンサ素子の陽極引出リード線、14
・・・・・・外装樹脂、1・・・・・・陽電極部、1a
・・・・・・陽電極部の切欠き部、1b・・・・・・陽
電極部の折り曲げ突部、1z・・・・・・陽電極部の底
面部分、2・・・・・・陰電極部、3・・・・・・コン
テ゛ンサ素子、4・・・・・・コンデンサ素子の陽極引
出しリード線、5・・・・・・帯状の金属板、6・・・
・・・エポキシ樹脂層。
Fig. 1 is a side sectional view of a conventional resin-clad chip capacitor, Fig. 2 is a perspective view of a completed chip-type solid electrolytic capacitor according to the present invention, and Fig. 3 is a cap-shaped anode terminal used in the present invention. FIG. 4 is an enlarged perspective view of a cap-shaped cathode terminal used in the present invention, and FIG. 5 is a perspective view of a capacitor element joined to a strip-shaped metal plate at equal intervals. Reference numeral 10 in the figure: positive electrode part, 11...
・Cathode part, 12... Capacitor element, 13.
... Anode lead wire of the capacitor element, 14
......Exterior resin, 1...Positive electrode part, 1a
......Notch part of the anode part, 1b...Bending protrusion of the anode part, 1z...Bottom part of the anode part, 2... Cathode part, 3... Condenser element, 4... Anode lead wire of capacitor element, 5... Band-shaped metal plate, 6...
...Epoxy resin layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固体電解コンデンサ素子の陽極線の存在する部位に一側
部から底部にかけて切り欠き部を有するキャップ状の陽
極端子をはめ込み、かつ該底部における切り欠き部の終
端で該陽極線と陽極端子とが電気的に接続されているこ
とを特徴とするチップ型固体電解コンデンサ。
A cap-shaped anode terminal having a notch from one side to the bottom is fitted into the part of the solid electrolytic capacitor element where the anode wire is present, and the anode wire and the anode terminal are electrically connected at the end of the notch at the bottom. A chip-type solid electrolytic capacitor that is characterized by being electrically connected.
JP2614277U 1977-03-04 1977-03-04 Chip type solid electrolytic capacitor Expired JPS593570Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2614277U JPS593570Y2 (en) 1977-03-04 1977-03-04 Chip type solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2614277U JPS593570Y2 (en) 1977-03-04 1977-03-04 Chip type solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPS53121434U JPS53121434U (en) 1978-09-27
JPS593570Y2 true JPS593570Y2 (en) 1984-01-31

Family

ID=28867839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2614277U Expired JPS593570Y2 (en) 1977-03-04 1977-03-04 Chip type solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPS593570Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662317A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Chippshaped solid electrolytic condenrser and method of manufacturing same

Also Published As

Publication number Publication date
JPS53121434U (en) 1978-09-27

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