JPS6032757Y2 - Resin-clad electrical parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin-clad electrical component, and more particularly to the frame lead structure of a resin-clad chip solid electrolytic capacitor.

Conventionally, electric components such as resin-sheathed capacitors, such as resin-sheathed chip capacitors, are made by forming each frame lead 2 of the anode and cathode of a lead frame 1 formed by etching or press punching a thin metal plate as shown in FIG. As shown in Fig. 2, the bent portions 2a and 2b are formed by bending into a stepped shape, and the anode lead wire 3 of the capacitor element 4 is connected to the frame lead 2 by welding, and the cathode portion is connected to the frame lead 2 by soldering. The entire body was covered with an exterior resin 5 such as resin.

In general, this type of chip capacitor is designed to be miniaturized, so the thickness of the exterior resin for the capacitor element is thin. Particularly in the case of a transfer mold exterior, the bent portion 2a of the frame lead located perpendicular to the resin injection direction 6,
2b obstructs the flow of the resin, causes defects in appearance such as exposed pinhole elements in the molded product, and deteriorates stability over time.

On the other hand, if the injection pressure of the resin is increased to eliminate this defect, the flowability of the resin will be improved and the appearance defects such as pinholes and element exposure can be reduced, but the pressure applied to the element will increase, so the electrical There was a drawback that the characteristics deteriorated.

The object of the present invention is to provide a resin-clad electrical component having a uniform and stable resin exterior that eliminates the above-mentioned drawbacks.

That is, the present invention provides a resin-clad electrical device characterized in that a through-hole is provided in a region of the resin-covered part of the electrode frame lead drawn out from the electrical component element, which is bent perpendicularly to the direction in which the frame lead is pulled out. It provides parts.

In particular, according to the present invention, a pair of electrode frame leads connected to an electrical component element of a resin-clad electrical component are bent at almost right angles within the resin and pulled out from the same surface of the resin exterior surface, and The resin-clad electrical component is bent again along the same direction, and is characterized in that a through hole is provided between the two bent portions of each lead, and the end of the through hole is aligned with the bent portion. A resin-clad electrical component is obtained.

Next, an embodiment of the present invention will be described in the case of a chip type solid electrolytic capacitor with reference to FIGS. 3 and 4.

FIG. 3 shows a lead frame used in the present invention. FIG. 4 shows a resin-clad solid electrolytic capacitor according to the present invention.

A lead frame 1 as shown in FIG. 3 is formed by etching or press punching a thin metal plate made of copper, copper, nickel, or the like.

At this time, the positive and cathode frame leads 2 each have through holes 7.
a, 7b are opened, and the through holes 7a, 7b form the bent portions 2 of the frame lead 2 after the stepped bending process, as shown in FIG.
It is formed to be located at at2b.

Next, the anode lead wire 3 of the electrolytic capacitor element is welded to each of the anode and cathode frame leads 2, connected to the cathode part 4 of the element by soldering, and then molded and exteriorized with an exterior resin 5 such as epoxy.

By the way, the positive position perpendicular to the exterior resin injection direction 6,
Since the bent portions 2a and 2b of each frame lead 2 of the cathode have through holes 7ay7b, the flow of the injected resin is not obstructed by the bent portions, so there is no appearance such as pinholes or exposed elements. There are almost no defects, and since the resin injection pressure can be lowered, damage to the elements is reduced and electrical characteristics do not deteriorate.

Furthermore, by providing the through holes 7a and 7b, the heat conduction path from the external terminal 8 is made longer than before, which reduces thermal stress on the internal capacitor element during soldering and mounting. It also has the effect of causing

Furthermore, by aligning the through hole with the bent portion of the frame lead, it also has the effect of facilitating the bending process of the frame lead.

Note that in the embodiment described above, the bent portion 2a of the frame lead 2
, 2b are provided with the through holes 7a and 7b, but it goes without saying that any through holes or a plurality of relatively small holes may be provided as long as the strength of the frame lead is not reduced.

Further, no matter what direction or location the resin is injected into, the resin can be uniformly distributed without being hindered by the frame leads.

Further, the present invention is not limited to solid electrolytic capacitors, but can be widely applied to electrical components having resin exteriors such as coils, semiconductor devices, and resistors.

As described above, the resin-clad electrical component according to the present invention can improve appearance defects, reduce deterioration of electrical characteristics, and improve heat resistance characteristics by using the through holes provided in the frame leads, so its industrial value is great. It is.

[Brief explanation of the drawing]

Figure 1 is an enlarged front view of the main parts of a conventional lead frame, Figure 2
3 is an enlarged front view of the main part of the lead frame according to the present invention, and FIG. 4 is an assembly side sectional view of the present invention. Codes in the diagram: 1...Lead frame, 2...
...Positive, cathode frame leads, 2a, 2b...
・Bending part, 3... Anode lead wire, 4...
... Cathode part of capacitor element, 5 ... Exterior resin, 6 ... Resin injection port, ? a, 7b...
... Frame lead through hole, 8... External terminal.

Claims (1)

[Scope of utility model registration request] A pair of electrode frame leads connected to the electrical component elements of a resin-clad electrical component are bent at almost right angles within the resin, pulled out from the same surface of the resin exterior surface, and then bent again along the pulled-out surface. A resin-clad electrical component, characterized in that a through hole is provided between the two bent portions of each lead, and an end of the through hole is aligned with the bent portion. .