JP4020479B2

JP4020479B2 - Resin-sealed capacitor

Info

Publication number: JP4020479B2
Application number: JP00683498A
Authority: JP
Inventors: 利男牧野; 亨中路
Original assignee: Nichicon Capacitor Ltd
Current assignee: Nichicon Capacitor Ltd
Priority date: 1998-01-16
Filing date: 1998-01-16
Publication date: 2007-12-12
Anticipated expiration: 2018-01-16
Also published as: JPH11204382A

Description

【０００１】
【発明の属する技術分野】
本発明は、コンデンサ素子に外部端子を接合後、樹脂ケース内に該コンデンサ素子を収納し、その樹脂ケース内に熱硬化性樹脂を充填、硬化してなる樹脂封口型コンデンサに関するものである。
【０００２】
【従来の技術】
従来、この種のコンデンサは図８に示すようなコンデンサ素子２の電極引出部３、４に、図７に示すような黄銅をプレス成形し表面にスズまたはスズ合金鍍金を施した端子２３a 、２３b をそれぞれ溶接またははんだ付け等により接合し、これを樹脂ケース５内に収納し、その樹脂ケース内に熱硬化性樹脂６を充填、硬化することにより形成されている。
また、コンデンサ素子２とダイオード１６等よりなる複合形コンデンサにおいては、図１０に示すように、コンデンサ素子２の電極引出部４をダイオード１６を介して図９に示す端子２４ b の接続部１８に接合し、コンデンサ素子の他の電極引出部３を図９に示す端子２４ a の電極接合部１１a に接合し、さらに該電極引出部４と外部引出しリード線２２とを接合し共通端子として形成している。
ところで、このようなコンデンサにおいては、図８、図１０に示すように端子が平行に位置せず、端子間のピッチＰの精度が悪くなったり、端子間の平面的なずれｄが発生したりする場合がある。
【０００３】
【発明が解決しようとする課題】
一方、コンデンサを基板や半導体モジュール等に実装するには、コンデンサの各部分の寸法精度が要求され、特に端子間の寸法精度の向上が重要になってきている。しかしながら、従来のコンデンサの端子取付方法では、端子が個々に分離しているので、端子をコンデンサ素子の電極引出部に接合する際、端子を整列し、位置決めする作業が必要となり、位置決めや整列の精度により、接合後の端子間のピッチ精度や平面的なずれ精度にばらつきが発生していた。
【０００４】
上記の理由からこれ迄は、端子位置決めの治具や、整列させるための設備が必要となり、生産設備の構造が複雑となるなどの問題を生じていた。
【０００５】
【課題を解決するための手段】
本発明は、上記課題を解決するものであり、コンデンサ端子間のピッチ精度や端子間の平面的なずれ精度を大幅に向上できる優れたコンデンサを提供するものである。
【０００６】
すなわち、コンデンサ素子に接続する端子金具１の外部端子７_１、７_２の平坦部７a 、７a と脚部７b 、７b との折曲げ部９a 、９a 、および脚部７b 、７b と接続部１２、１２との折曲げ部９b 、９b に各々リブ加工部１０a 、１０a 、１０b 、１０b を設け、接続部１２、１２から該接続部１２、１２より肉薄のヘッダ加工部１１、１１を伸延させてなる外部端子７_１、７_２を共通結合部８を介して一体成形した端子金具１の、上記ヘッダ加工部１１、１１を各々コンデンサ素子２の電極引出部３、４に接合した後、共通結合部（８）にて同一平面とした外部端子７ _１、７ _２の平坦部（７ a 、７ a ）を樹脂ケース（５）の開口部の一辺に沿わせ、脚部（７ b 、７ b ）を、上記開口部の一辺から樹脂ケース（５）の底面に伸延する内壁の同一面に沿わせて配置し、上記コンデンサ素子２を樹脂ケース５内に収納し、該樹脂ケース内に熱硬化性樹脂６を充填、硬化後、上記共通結合部８を切離し、独立した外部端子７_１、７_２とすることにより、端子間のピッチ精度を改善し、平面的なずれをなくしたことを特徴としている。
【０００７】
また、上記の端子金具１の外部端子７_１の接続部１２から伸延するヘッダ加工部１１をコンデンサ素子２の電極引出部３に接合し、他の外部端子７_２の接続部１８をダイオード１６を介して電極引出部４に接続し、端子金具１の外部端子７_１と他の外部端子７_２の間に共通結合部８を介して接合された外部端子７_３の脚部７b をコンデンサ素子２の電極引出部４に接続し、上記コンデンサ素子２とダイオード１６とを樹脂ケース５内に収納し、該樹脂ケース内に熱硬化性樹脂６を充填、硬化後、上記共通結合部８を切離し、独立した外部端子７_１、７_２、７_３とすることにより、端子間のピッチ精度を改善し、平面的なずれをなくしたことを特徴としている。
【０００８】
さらに、上記の端子金具１の外部端子７_１の接続部１２から伸延するヘッダ加工部１１をコンデンサ素子２の電極引出部３に接合し、他の外部端子７_２の接続部１８をダイオード１６を介して電極引出部４に接続し、外部引出しリード線２２をコンデンサ素子２の電極引出部４に接合した後、上記コンデンサ素子２とダイオード１６とを樹脂ケース５内に収納し、該樹脂ケース内に熱硬化性樹脂６を充填、硬化後、外部端子７_１、７_２を接合する共通結合部８を切離し、独立した外部端子７_１、７_２とすることにより、端子間のピッチ精度を改善し、平面的なずれをなくしたことを特徴としている。
【０００９】
【発明の実施の形態】
上記のように、本願発明の樹脂封口型コンデンサは、複数個の外部端子を共通結合部を介して一体成形してなる端子金具にて形成し、コンデンサ素子の電極引出部と接合した後、樹脂ケース内に収納し、熱硬化性樹脂を充填、硬化後、共通結合部を切離し、独立した外部端子にすることにより、端子間のピッチ精度を改善し、平面的なずれをなくすことができる。
【００１０】
【実施例１】
本発明の一実施例について図面を参照しながら説明する。図１は本発明の一実施例における樹脂封口型コンデンサに用いる一体成形よりなる端子金具を示す図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は右側面図であり、（ｄ）はその斜視図である。
図１に示すように、端子金具１は、１枚の黄銅、銅等よりなる金属板を同一金属板上で打抜き加工の一体成形にて形成したものであり、７ ₁ 、７ ₂ は外部端子で、共通結合部８は外部端子７ ₁ 、７ ₂ 間を結合しており、ヘッダ加工部１１は、端子金具１の接続部１２から伸延するように形成され、該ヘッダ加工部１１はコンデンサ素子の電極引出部３、４と接合する。折曲げ部９a 、９b に加工処理されたリブ加工部１０ａ、１０ｂは、上記折曲げ部の強度を補強し端子間のピッチ精度やずれ精度を保ち、変形を防止するものであり、端子金具１を成形後、表面にスズまたはスズ合金鍍金を施すことにより構成されている。端子金具１の先端部分にヘッダ加工部１１を形成するのは、外部端子７ ₁ 、７ ₂ としての耐電流性を維持するとともに、外部接続ネジ（図示せず）の大きさから規定される板厚の厚さよりも薄くして上記電極引出部３、４との接合作業を容易にし接合強度のばらつきを少なくするためである。また基板等に差込む外部端子（図示せず）の場合は金属板の板厚の厚さは薄くてもよい場合があり、この場合は上記ヘッダ加工部を省略してもよい。
【００１１】
図２は、本発明の一実施例を示す樹脂封口型コンデンサの熱硬化性樹脂の充填、硬化後の図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図である。図２において、一体成形した端子金具１のそれぞれのヘッダ加工部１１とコンデンサ素子の電極引出部３、４とを接合し、上記コンデンサ素子を樹脂ケース５に収納し、熱硬化性樹脂６を充填、硬化させる。その後、外部端子７ ₁ 、７ ₂ を結合している共通結合部８をニッパーあるいは治工具等で切離し、独立した外部端子７１、７２として樹脂封口型コンデンサを得るものである。
【００１２】
【実施例２】
図３は、本発明の他の実施例の端子金具の斜視図であり、図４は図３の端子金具にコンデンサ素子２とダイオード１６とを接合し、ケースに収納し、熱硬化性樹脂を充填、硬化させた複合形の樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図、（ｄ）は結線回路図である。図３において、一体成形された端子金具１は端子７ ₁ 、７ ₂ 、７ ₃ の３個の外部端子から形成され、一つの外部端子７₁ はコンデンサ素子の電極引出部３と接合し、一つの端子７₂ はダイオード１６と接合し、該ダイオードの放熱性をよくするために端子７ ₂ の接続部分１８とダイオード１６とを密着させ、ネジ１７にて固定する。さらに上記ダイオードと他の電極引出部４を接合するとともに引出しリード線１９を介して別の外部端子７₃ とを接合し共通端子として、上記コンデンサ素子２とダイオード１６とを樹脂ケース５内に収納し、熱硬化性樹脂６を充填、硬化させる。その後、端子金具１の共通結合部８をニッパーあるいは治工具等で切離し、独立した外部端子７ ₁ 、７ ₂ 、７ ₃ として樹脂封口型コンデンサを得るものである。
ここでは、複合形の樹脂封口型コンデンサとしてダイオードを収納した場合を示したが、抵抗、またはダイオードと抵抗との組合せでもよい。
【００１３】
【実施例３】
図５は、本発明の他の実施例の端子金具の斜視図であり、図６は図５の端子金具にコンデンサ素子２とダイオード１６とを接合し、ケースに収納し、共通端子として外部引出しリード線２２を接合し、熱硬化性樹脂を充填、硬化させた複合形の樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図、（ｄ）は結線回路図である。図５において、一体成形された端子金具１は外部端子７ ₁ 、７ ₂ の２個から形成され、端子７ ₁ はコンデンサ素子の電極引出部３と接合し、端子７ ₂ はダイオード１６と接合し、該ダイオードの放熱性をよくするために端子７ ₂ の接続部１８とダイオード１６とを密着させ、ネジ１７にて固定する。さらに上記ダイオードと他の電極引出部４を接合するとともに共通端子となる外部引出しリード線２２と他の電極引出部４とを接合した後、上記コンデンサ素子２とダイオード１６とを樹脂ケース５内に収納し、熱硬化性樹脂６を充填、硬化させる。その後、端子金具１の共通結合部８をニッパー等あるいは治工具で切離し、独立した外部端子７ ₁ 、７ ₂ として樹脂封口型コンデンサを得るものである。
【００１４】
このように上記実施例によれば、複数個の外部端子を共通結合部を介して一体成形してなる端子金具をコンデンサ素子の電極引出部あるいはダイオード等に接合し、熱硬化性樹脂を充填、硬化後、それぞれの外部端子に分割しているため、極めて端子間のピッチＰの精度が高く、かつ端子間の平面的なずれもない樹脂封口型コンデンサを作成することができる。
【００１５】
なお、上記実施例では熱硬化性樹脂を充填、硬化後に外部端子を結合している共通結合部を切離し、独立した外部端子とする場合を示したが、端子金具をコンデンサ素子の電極引出部あるいはコンデンサ素子の電極引出部とダイオード等とに接合した後、あるいは端子金具をコンデンサ素子の電極引出部あるいはコンデンサ素子の電極引出部とダイオード等とに接合し、上記コンデンサ素子またはコンデンサ素子とダイオード等とを樹脂ケースに収納し、熱硬化性樹脂を２／３〜１／５程度一次充填してコンデンサ素子またはコンデンサ素子とダイオード等とを樹脂ケースに固定した後に外部端子を結合している共通結合部をニッパーあるいは治工具等で切離し、独立した外部端子とする場合でも同一の効果がある。
また、一体成形した端子金具を結合している共通結合部の位置は本願発明の実施例に限らず、その共通結合部は外部端子を構成している位置であればよく、また外部端子と結合している共通結合部にニッパーあるいは治工具等で切断しやすいようＶ字形の切込みを入れてもよい。
【００１６】
【発明の効果】
上記のことから本願発明の樹脂封口型コンデンサは、複数個の外部端子を共通結合部を介して一体成形にて端子金具を形成し、端子金具の折曲げ部にリブ加工を施し、コンデンサ素子の電極引出部と接合する端子金具の先端部にヘッダ加工部を形成し板厚の厚さを薄くしているので、コンデンサ素子の電極引出部との接合作業のばらつきを少なくするとともに、コンデンサ端子間のピッチ精度や端子間の平面的なずれ精度を大幅に向上ができ、安定した品質のコンデンサを提供することができるなど工業的、実用的にその価値は極めて大なるものがある。
【図面の簡単な説明】
【図１】図１は、本発明の一実施例を示す樹脂封口型コンデンサに用いる一体成形してなる端子金具の図で、（ａ）は平面図、（ｂ）は正面図、（ｃ）は右側面図であり、（ｄ）はその斜視図である。
【図２】図２は、本発明の一実施例を示す樹脂封口型コンデンサの熱硬化性樹脂の充填、硬化後の図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図である。
【図３】図３は、本発明の他の実施例の端子金具の斜視図である。
【図４】図４は、図３の端子金具にコンデンサ素子とダイオードとを接合し、ケースに収納し、熱硬化性樹脂を充填、硬化させた複合形の樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図、（ｄ）は結線回路図である。
【図５】図５は、本発明の他の実施例の端子金具の斜視図である。
【図６】図６は、図５の端子金具にコンデンサ素子とダイオードとを接合し、ケースに収納し、共通端子として外部引出しリード線を接合し、熱硬化性樹脂を充填、硬化させた複合形の樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図、（ｄ）は結線回路図である。
【図７】図７は、従来例による端子金具の斜視図である。
【図８】図８は、図７の端子金具にコンデンサ素子を接合し、ケースに収納し、熱硬化性樹脂を充填、硬化させた樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図である。
【図９】図９は、他の従来例による端子金具の斜視図である。
【図１０】図１０は、図９の端子金具にコンデンサ素子とダイオードとを接合し、ケースに収納し、共通端子として外部引出しリード線を接合し、熱硬化性樹脂を充填、硬化させた複合形の樹脂封口型コンデンサの図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側断面図である。
【符号の説明】
１端子金具
２コンデンサ素子
３電極引出部
４電極引出部
５樹脂ケース
６熱硬化性樹脂
７₁ 外部端子
７₂ 外部端子
７₃ 外部端子
７a 平坦部
７b 脚部
７c 孔
８共通結合部
９a 折曲げ部
９b 折曲げ部
１０a リブ加工部
１０b リブ加工部
１１ヘッダ加工部
１１a 電極接合部
１２接続部
１６ダイオード
１７ネジ
１７a ネジ孔
１８接続部
１９引出しリード線
２２外部引出しリード線
２３a 端子
２３b 端子
２４a 端子
２４b 端子
Ｐ端子間のピッチ
ｄ端子間の平面的なずれ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin-sealed capacitor in which an external terminal is joined to a capacitor element, the capacitor element is accommodated in a resin case, and a thermosetting resin is filled and cured in the resin case.
[0002]
[Prior art]
Conventionally, this type of capacitor has terminals 23a and 23b in which brass as shown in FIG. 7 is press-formed on the electrode lead-out portions 3 and 4 of the capacitor element 2 as shown in FIG. These are joined by welding or soldering, etc., accommodated in a resin case 5, and filled with a thermosetting resin 6 in the resin case and cured.
In the composite type capacitor consisting etc. capacitor element 2 and the diode 16, as shown in FIG. 10, the electrode lead portion 4 of the capacitor element 2 through the diode 16 to the terminal 24 b of the connecting portion 18 shown in FIG. 9 joined, joining the other electrode lead-out portion 3 of the capacitor element to the electrode junction 11a of the terminal 24 a shown in FIG. 9, and further joining the said electrode lead portion 4 and the external lead-out lead wire 22 is formed as a common terminal ing.
By the way, in such a capacitor, as shown in FIGS. 8 and 10, the terminals are not positioned in parallel, the accuracy of the pitch P between the terminals is deteriorated, or a planar deviation d between the terminals is generated. There is a case.
[0003]
[Problems to be solved by the invention]
On the other hand, in order to mount a capacitor on a substrate, a semiconductor module, or the like, dimensional accuracy of each part of the capacitor is required, and in particular, improvement in dimensional accuracy between terminals has become important. However, in the conventional capacitor terminal mounting method, since the terminals are individually separated, it is necessary to align and position the terminals when joining the terminals to the electrode lead portions of the capacitor elements. Due to the accuracy, variations have occurred in the pitch accuracy between terminals after bonding and the planar deviation accuracy.
[0004]
For the above reasons, until now, there have been problems such as the need for terminal positioning jigs and equipment for alignment, which complicates the structure of the production equipment.
[0005]
[Means for Solving the Problems]
The present invention solves the above-described problems, and provides an excellent capacitor capable of greatly improving the pitch accuracy between capacitor terminals and the planar deviation accuracy between terminals.
[0006]
That is, the bent portions 9a and 9a between the flat portions 7a and 7a of the external terminals 7 ₁ and 7 ₂ of the terminal fitting 1 connected to the capacitor element and the leg portions 7b and 7b, and the connecting portions 12 and the leg portions 7b and 7b, Ribbed portions 10 a, 10 a, 10 b, 10 b are respectively provided in the bent portions 9 b, 9 b with 12, and the header processed portions 11, 11 thinner than the connecting portions 12, 12 are extended from the connecting portions 12, 12. After joining the header processing parts 11 and 11 of the terminal fitting 1 integrally molded with the external terminals 7 ₁ and 7 ₂ via the common coupling part 8 to the electrode lead-out parts 3 and 4 of the capacitor element 2, respectively, the common coupling part external terminals ₇ 1, _{7 2} of the flat portion which is flush with (8) a (7 a, 7 a) and along one side of the opening of the resin case (5), the legs (7 b, 7 b) The same surface of the inner wall that extends from one side of the opening to the bottom surface of the resin case (5) Along so arranged to, the capacitor element 2 is housed in the resin case 5, filled with the thermosetting resin 6 in the resin case, after curing, disconnect the common coupling portion 8, independent external terminals 7 ₁ by 7 _2, to improve the pitch accuracy between the terminals, it is characterized in that eliminate planar displacement.
[0007]
Also, the header processing unit 11 which extends from the external terminal ₇₁ of the connecting portion 12 of the terminal fitting 1 is bonded to the electrode lead-out portion 3 of the capacitor element 2, the diode 16 and another external terminal 7 _{and second} connecting portions 18 via connected to the electrode lead-out portion 4, the terminal fitting 1 of the external terminal 7 ₁ and other external terminals 7 ₃ joined via a common coupling portion 8 between the external terminal 7 _second leg 7b of the capacitor element 2 The capacitor element 2 and the diode 16 are accommodated in a resin case 5, filled with a thermosetting resin 6 in the resin case, cured, and then the common coupling portion 8 is separated. By using independent external terminals 7 ₁ , 7 ₂ , and 7 ₃ , the pitch accuracy between the terminals is improved, and planar deviation is eliminated .
[0008]
Furthermore, the header processing unit 11 which extends from the external terminal ₇₁ of the connecting portion 12 of the terminal fitting 1 is bonded to the electrode lead-out portion 3 of the capacitor element 2, the diode 16 and another external terminal 7 _{and second} connecting portions 18 The external lead wire 22 is joined to the electrode lead portion 4 of the capacitor element 2, and then the capacitor element 2 and the diode 16 are accommodated in the resin case 5. to fill the thermosetting resin 6, after curing, disconnect the common coupling portion 8 for joining the external terminal 7 _1, 7 _2, by an independent external terminals 7 _1, 7 _2, improve the pitch accuracy between the terminals However, it is characterized by eliminating the plane shift .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
As described above, the resin-sealed capacitor according to the present invention is formed of a terminal metal fitting formed by integrally molding a plurality of external terminals via a common coupling portion, and is joined to the electrode lead portion of the capacitor element, By storing in the case, filling and curing the thermosetting resin, and separating the common coupling portion to form independent external terminals, it is possible to improve the pitch accuracy between the terminals and eliminate planar deviation.
[0010]
[Example 1]
An embodiment of the present invention will be described with reference to the drawings. FIGS. 1A and 1B are diagrams showing a terminal metal fitting formed by integral molding used in a resin-sealed capacitor according to an embodiment of the present invention. FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. And (d) is a perspective view thereof.
As shown in FIG. 1, the terminal fitting 1 is formed by integrally forming a single metal plate made of brass, copper or the like on the same metal plate, and 7 ₁ and 7 ₂ are external terminals. The common coupling portion 8 couples the external terminals 7 ₁ and 7 _2, and the header processing portion 11 is formed to extend from the connection portion 12 of the terminal fitting 1, and the header processing portion 11 is a capacitor element. The electrode lead portions 3 and 4 are joined. The rib processed portions 10a and 10b processed into the bent portions 9a and 9b reinforce the strength of the bent portions, maintain the pitch accuracy and displacement accuracy between the terminals, and prevent deformation. Is formed by applying tin or tin alloy plating to the surface. The header processed portion 11 is formed at the distal end portion of the terminal fitting 1 in order to maintain the current resistance as the external terminals 7 ₁ and 7 _{2 and} to be defined by the size of the external connection screw (not shown). This is because it is thinner than the thickness, facilitating the joining operation with the electrode lead-out portions 3 and 4, and reducing the variation in joining strength. In the case of an external terminal (not shown) to be inserted into a substrate or the like, the thickness of the metal plate may be thin, and in this case, the header processing portion may be omitted.
[0011]
2A and 2B are drawings after filling and curing a thermosetting resin of a resin-sealed capacitor according to an embodiment of the present invention. FIG. 2A is a plan view, FIG. 2B is a front sectional view, and FIG. It is sectional drawing. In FIG. 2, each header processing portion 11 of the integrally formed terminal fitting 1 is joined to the electrode lead portions 3 and 4 of the capacitor element, and the capacitor element is accommodated in the resin case 5 and filled with the thermosetting resin 6. , Cure. Thereafter, the common coupling portion 8 coupling the external terminals 7 ₁ and 7 ₂ is separated by a nipper or a jig or the like, and a resin-sealed capacitor is obtained as the independent external terminals 71 and 72.
[0012]
[Example 2]
FIG. 3 is a perspective view of a terminal fitting according to another embodiment of the present invention. FIG. 4 is a perspective view of the terminal fitting shown in FIG. FIG. 2 is a drawing of a filled and cured composite type resin-sealed capacitor, where (a) is a plan view, (b) is a front sectional view, (c) is a right sectional view, and (d) is a connection circuit diagram. In FIG. 3, the integrally formed terminal fitting 1 is a terminal 7 _1. , 7 ₂ , Formed from three external terminals 7 _3, one external terminal ₇₁ is bonded to the electrode lead part 3 of the capacitor element, one terminal 7 ₂ is joined to the diode 16, good heat radiation property of the diode a connecting portion 18 and the diode 16 of the terminal 7 ₂ is adhered to and fixed by screws 17. Further as the common terminal through the drawn lead wire 19 is bonded and another external terminal 7 ₃ with joining the diode and the other electrode lead portion 4, housed and the capacitor element 2 and the diode 16 in the resin case 5 Then, the thermosetting resin 6 is filled and cured. Thereafter, the common coupling portion 8 of the terminal fitting 1 is cut off with a nipper or a jig or the like, and the independent external terminal 7 _{1 is} separated. , 7 ₂ , 7 ₃ As a result, a resin-sealed capacitor is obtained.
Here, a case where a diode is housed as a composite type resin-sealed capacitor is shown, but a resistor or a combination of a diode and a resistor may be used.
[0013]
[Example 3]
FIG. 5 is a perspective view of a terminal fitting of another embodiment of the present invention. FIG. 6 is a perspective view of the terminal fitting shown in FIG. Drawing of composite type resin sealing type capacitor which joined lead wire 22, filled with thermosetting resin, and was hardened, (a) is a top view, (b) is a front sectional view, (c) is a right sectional view (D) is a connection circuit diagram. In FIG. 5, the integrally formed terminal fitting 1 is external terminals 7 ₁ , 7 _2. Is formed of two, terminal ₇₁ is joined to the electrode lead part 3 of the capacitor element, the terminal 7 ₂ is joined to the diode 16, the terminal 7 _{and second} connecting portions 18 in order to improve the heat dissipation of the diode The diode 16 is brought into intimate contact and fixed with screws 17. Furthermore, after joining the said diode and the other electrode lead-out part 4 and joining the external lead-out lead wire 22 which becomes a common terminal, and the other electrode lead-out part 4, the said capacitor | condenser element 2 and the diode 16 are put in the resin case 5. Housed, filled with thermosetting resin 6 and cured. Thereafter, the common coupling portion 8 of the terminal fitting 1 is cut off with a nipper or the like or a jig to obtain resin-sealed capacitors as independent external terminals 7 ₁ and 7 ₂ .
[0014]
Thus, according to the above embodiment, a terminal fitting formed by integrally molding a plurality of external terminals via a common coupling portion is joined to an electrode lead-out portion of a capacitor element or a diode, and filled with a thermosetting resin. Since the resin is divided into external terminals after curing, a resin-sealed capacitor can be produced with extremely high accuracy of the pitch P between terminals and no planar deviation between terminals.
[0015]
In the above embodiment, the case where the thermosetting resin is filled and the common coupling portion that couples the external terminals after curing is separated to form an independent external terminal is used. After joining the electrode lead portion of the capacitor element and the diode or the like, or joining the terminal fitting to the electrode lead portion of the capacitor element or the electrode lead portion of the capacitor element and the diode, the capacitor element or the capacitor element and the diode, etc. Is connected to the external terminal after the capacitor element or the capacitor element and the diode are fixed to the resin case by first filling the thermosetting resin to about 2/3 to 1/5. The same effect can be obtained even when the wire is separated with a nipper or a jig to make an independent external terminal.
In addition, the position of the common coupling portion that couples the integrally formed terminal fitting is not limited to the embodiment of the present invention, and the common coupling portion may be a position that constitutes an external terminal, and is coupled to the external terminal. A V-shaped cut may be made in the common connecting portion so that it can be easily cut with a nipper or a tool.
[0016]
【The invention's effect】
In view of the above, the resin-sealed capacitor of the present invention forms a terminal fitting by integrally molding a plurality of external terminals via a common coupling portion, ribs the bent portion of the terminal fitting, Since the header processing part is formed at the tip of the terminal fitting to be joined to the electrode lead part to reduce the thickness of the plate, the variation in joining work with the electrode lead part of the capacitor element is reduced, and between the capacitor terminals The pitch accuracy and the planar deviation accuracy between the terminals can be greatly improved, and a stable quality capacitor can be provided, and its value is extremely large industrially and practically.
[Brief description of the drawings]
FIG. 1 is a view of an integrally molded terminal fitting used in a resin-sealed capacitor according to an embodiment of the present invention, where (a) is a plan view, (b) is a front view, and (c). Is a right side view, and (d) is a perspective view thereof.
FIG. 2 is a view after filling and curing a thermosetting resin of a resin-sealed capacitor according to an embodiment of the present invention, (a) is a plan view, (b) is a front sectional view, c) is a right sectional view.
FIG. 3 is a perspective view of a terminal fitting according to another embodiment of the present invention.
4 is a drawing of a composite type resin-sealed capacitor in which a capacitor element and a diode are joined to the terminal fitting of FIG. 3, housed in a case, filled with a thermosetting resin, and cured. (a) is a plan view, (b) is a front sectional view, (c) is a right sectional view, and (d) is a connection circuit diagram.
FIG. 5 is a perspective view of a terminal fitting according to another embodiment of the present invention.
6 is a composite in which a capacitor element and a diode are joined to the terminal fitting of FIG. 5, housed in a case, an external lead wire is joined as a common terminal, and a thermosetting resin is filled and cured. 1A is a plan view, FIG. 2B is a front sectional view, FIG. 3C is a right sectional view, and FIG. 3D is a connection circuit diagram.
FIG. 7 is a perspective view of a terminal fitting according to a conventional example.
8 is a drawing of a resin-sealed capacitor in which a capacitor element is joined to the terminal fitting of FIG. 7, housed in a case, filled and cured with a thermosetting resin, (a) is a plan view, (B) is a front sectional view, and (c) is a right sectional view.
FIG. 9 is a perspective view of a terminal fitting according to another conventional example.
FIG. 10 is a composite in which a capacitor element and a diode are joined to the terminal fitting of FIG. 9, housed in a case, an external lead wire is joined as a common terminal, and a thermosetting resin is filled and cured. 1A is a plan view, FIG. 2B is a front sectional view, and FIG. 2C is a right sectional view.
[Explanation of symbols]
1 Terminal fitting 2 Capacitor element 3 Electrode lead part 4 Electrode lead part 5 Resin case 6 Thermosetting resin 7 ₁ External terminal 7 ₂ External terminal 7 ₃ External terminal 7a Flat part 7b Leg part 7c Hole 8 Common joint part 9a Bending part 9b Bending portion 10a Rib processing portion 10b Rib processing portion 11 Header processing portion 11a Electrode joint portion 12 Connection portion 16 Diode 17 Screw 17a Screw hole 18 Connection portion 19 Lead wire 22 External lead wire 23a Terminal 23b Terminal 24a Terminal 24b Terminal P terminal pitch d Planar deviation between terminals

Claims

Bending portions (9a, 9a) of the flat portions (7a, 7a) and the leg portions (7b, 7b) of the external terminals (7 ₁ , 7 ₂ ) of the terminal fitting (1) connected to the capacitor element, and the leg portions Ribbed portions (10a, 10a, 10b, 10b) are respectively provided in the bent portions (9b, 9b) of (7b, 7b) and the connecting portions (12, 12), and the connection is made from the connecting portions (12, 12). Of the terminal fitting (1) in which the external terminals (7 ₁ , 7 ₂ ) formed by extending the header processing parts (11, 11) thinner than the parts (12, 12) are integrally formed via the common coupling part (8) After joining the header processed parts (11, 11) to the electrode lead parts (3, 4) of the capacitor element (2),
The flat portions (7 a , 7 a ) of the external terminals (7 ₁ , 7 ₂ ) that are flush with the common coupling portion (8) are placed along one side of the opening of the resin case (5), and the leg portions (7 b, and 7 b), and arranged along the same surface of the inner wall which extends from one side of the opening in the bottom surface of the resin case (5), the capacitor element (2) housed in the resin case (5) The resin case is filled with a thermosetting resin (6) and cured,
Resin sealing mold characterized in that the common coupling portion (8) is separated to form independent external terminals (7 ₁ , 7 ₂ ), thereby improving the pitch accuracy between the terminals and eliminating the planar deviation. Capacitor.

Joining the header processing part (11) extending from the connection part (12) of the external terminal (7 ₁ ) of the terminal fitting (1) of claim 1 to the electrode lead part (3) of the capacitor element (2),
Connect the connection part (18) of the other external terminal (7 ₂ ) to the electrode lead part (4) via the diode (16),
Legs of the external terminals (7 ₃₎ that are joined via a common coupling unit (8) between the external terminals (7 ₁₎ and the other external terminal (7 ₂₎ (7b) capacitor of the terminal fitting (1) Connected to the electrode lead (4) of the element (2),
The capacitor element (2) and the diode (16) are accommodated in a resin case (5), filled with a thermosetting resin (6) in the resin case, and after curing,
The common coupling portion (8) is cut off to be independent external terminals (7 ₁ , 7 ₂ , 7 ₃ ), thereby improving the pitch accuracy between the terminals and eliminating the planar deviation. Resin-sealed capacitor.

Joining the header processing part (11) extending from the connection part (12) of the external terminal (7 ₁ ) of the terminal fitting (1) of claim 1 to the electrode lead part (3) of the capacitor element (2),
Connect the connection part (18) of the other external terminal (7 ₂ ) to the electrode lead part (4) via the diode (16),
After joining the external lead wire (22) to the electrode lead portion (4) of the capacitor element (2),
The capacitor element (2) and the diode (16) are accommodated in a resin case (5), filled with a thermosetting resin (6) in the resin case, and after curing,
Common coupling unit joining the external terminals (7 _{1, 7} ₂₎ Disconnect (8), by an independent external terminals (7 _{1, 7} _2), to improve the pitch accuracy between the terminals, planar deviation Resin-sealed capacitor, characterized by eliminating