JP2009182265A - Electrode terminal for film capacitor, and the film capacitor - Google Patents

Electrode terminal for film capacitor, and the film capacitor Download PDF

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JP2009182265A
JP2009182265A JP2008021975A JP2008021975A JP2009182265A JP 2009182265 A JP2009182265 A JP 2009182265A JP 2008021975 A JP2008021975 A JP 2008021975A JP 2008021975 A JP2008021975 A JP 2008021975A JP 2009182265 A JP2009182265 A JP 2009182265A
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film capacitor
terminal
thickness
electrode
electrode terminal
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Senichi Kozasa
干一 小笹
Yasuhiro Ebara
裕啓 江原
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals

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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrode terminal capable of improving the junction properties of a film capacitor with respect to a metallikon electrode, and to provide a film capacitor having the electrode terminal improved in the junction properties. <P>SOLUTION: This electrode terminal for a film capacitor is provided with a terminal body 11, and connection object parts 12 that extend from the terminal body 11, each having a thickness (t) smaller than the thickness T of the terminal body 11, and each having a substantially oval or circular shape. The thickness t1 in the vicinity 12b of the boundary between the terminal body 11 and the connection object part 12 is smaller than the thickness (t) of the tip part 12a of the connection object part 12. The connection object part 12 is bent toward a joint part 3 to a metallikon electrode 2 from the terminal body 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、フィルムコンデンサ用電極端子及びフィルムコンデンサに関するものである。   The present invention relates to an electrode terminal for a film capacitor and a film capacitor.

図１１に示すように、コンデンサ素子１の端面に形成されたメタリコン電極２へ半田付けすることによって接合するタイプのフィルムコンデンサ用電極端子３０は、ほとんどの場合、半田付け性を良好にするために端子本体３１の先端部から側方に分枝した被接合部３２、３２を有する構造にされている（例えば、特許文献１参照）。そして、このような構造の電極端子３０は、通常は１枚の銅板を所定の金型で打ち抜くことによって製造されており、その厚さは、図１２に示すように、全体にわたって同一である。
特開２００４−３４９４４７号公報 As shown in FIG. 11, in most cases, the electrode terminal 30 for a film capacitor that is joined by soldering to the metallicon electrode 2 formed on the end face of the capacitor element 1 is used to improve solderability. The terminal body 31 has a structure having joined portions 32 and 32 branched laterally from the distal end portion (see, for example, Patent Document 1). And the electrode terminal 30 of such a structure is normally manufactured by stamping out one copper plate with a predetermined metal mold | die, and the thickness is the same as the whole, as shown in FIG.
JP 2004-349447 A

しかしながら、上記した従来のフィルムコンデンサ用電極端子では、電極端子の板厚が薄い場合には良好な半田付けを行うことが可能であるが、高周波かつ大電流に対応するために端子本体の厚さを厚くして、板厚が１．５ｍｍ以上にもなると、良好な半田付け性が得られにくくなるという欠点がある。それは、被接合部の熱容量が増加するために半田付け用熱源（半田鏝）からの熱によって、所定温度にまで温度上昇するのに長い時間を有すること、及び加熱時間の経過と共に、被接合部から端子本体への熱放散量が増加することに起因している。特に、近年の環境対策として鉛フリー半田を使用するようになっているが、この場合には、鉛フリー半田の融点が高いため、上記問題は顕著に現れる。   However, in the conventional electrode terminals for film capacitors described above, it is possible to perform good soldering when the plate thickness of the electrode terminals is thin. However, the thickness of the terminal body is required to cope with high frequencies and large currents. If the thickness is increased to 1.5 mm or more, there is a drawback that good solderability is difficult to obtain. It has a long time to rise to a predetermined temperature due to heat from a soldering heat source (solder rod) because the heat capacity of the bonded portion increases, and as the heating time elapses, the bonded portion This is due to an increase in heat dissipation from the terminal body to the terminal body. In particular, lead-free solder is used as a recent environmental measure, but in this case, the melting point of lead-free solder is high, and thus the above problem appears remarkably.

その対策として、熱源による加熱温度を高くしたり、加熱時間を長くしたりすることが考えられるが、このような対策を採用した場合には、誘電体であるプラスチックフィルムが熱に弱いために、フィルムコンデンサの電気特性が劣化するという問題が生じることになる。   As countermeasures, it is conceivable to increase the heating temperature by the heat source or lengthen the heating time, but when such countermeasures are adopted, the plastic film that is a dielectric is vulnerable to heat, The problem arises that the electrical characteristics of the film capacitor deteriorate.

この発明は、上記従来の課題を解決するためになされたものであって、その目的は、フィルムコンデンサ素子のメタリコン電極に対する接合性を改善することが可能な電極端子、及び接合性の改善された電極端子を備えたフィルムコンデンサを提供することにある。   The present invention has been made in order to solve the above-described conventional problems, and an object of the present invention is to improve the bondability of the film capacitor element to the metallicon electrode, and the bondability. It is providing the film capacitor provided with the electrode terminal.

請求項１のフィルムコンデンサ用電極端子は、フィルムコンデンサ素子１の端面に形成されたメタリコン電極２に接続されるフィルムコンデンサ用電極端子であって、端子本体１１と、端子本体１１から延設されると共に、厚さｔが端子本体１１の厚さＴよりも薄く、かつ形状がほぼ小判形あるいは円形である被接続部１２とを備えていることを特徴とする。   The electrode terminal for film capacitor according to claim 1 is an electrode terminal for film capacitor connected to the metallicon electrode 2 formed on the end face of the film capacitor element 1, and extends from the terminal body 11 and the terminal body 11. In addition, a thickness t is thinner than a thickness T of the terminal body 11, and a connected portion 12 having a substantially oval or circular shape is provided.

また、上記端子本体１１と被接続部１２との境界付近１２ｂの厚さｔ１は、上記被接続部１２の先端部１２ａの厚さｔよりもさらに薄くしていることを特徴とする。   Further, the thickness t1 of the vicinity 12b between the terminal main body 11 and the connected portion 12 is further thinner than the thickness t of the distal end portion 12a of the connected portion 12.

さらに、上記被接続部１２は、上記端子本体１１から上記メタリコン電極２との接合部３側へと屈曲させていることを特徴とする。   Further, the connected portion 12 is bent from the terminal body 11 toward the joint portion 3 with the metallicon electrode 2.

そして、上記電極端子１０をフィルムコンデンサ１のメタリコン電極２に接続することによって、フィルムコンデンサを形成する。   Then, a film capacitor is formed by connecting the electrode terminal 10 to the metallicon electrode 2 of the film capacitor 1.

この発明のフィルムコンデンサ用電極端子によれば、被接続部の厚さを端子本体の厚さよりも薄くしているので、被接続部を端子本体と同じ板厚にした場合に比較して、被接続部の熱容量が小さくなる。そのため、投与熱量が少なくても、被接続部は短時間で所定温度にまで温度上昇し、半田付けなどによる接合性が向上する。また、被接続部の先端部は、滑らかに湾曲した形状（小判形、円形）となっているため半田が一様に濡れ易くなり、半田付けなどの接合が行い易くなる。   According to the electrode terminal for a film capacitor of the present invention, the thickness of the connected portion is made thinner than the thickness of the terminal body, so that compared to the case where the connected portion has the same plate thickness as the terminal body, The heat capacity of the connecting portion is reduced. For this reason, even if the administration heat quantity is small, the temperature of the connected portion rises to a predetermined temperature in a short time, and the bondability by soldering or the like is improved. Further, since the tip of the connected portion has a smoothly curved shape (oval shape, circular shape), the solder is easily wetted uniformly, and joining such as soldering is facilitated.

また、端子本体と被接続部との境界付近の厚さを、被接続部の先端部厚さよりもさらに薄くしているので、被接続部から端子本体への熱放散量が減少し、被接続部が温度上昇し易くなって、接合性が向上する。さらに、被接続部を、端子本体からメタリコン電極との接合部側へと屈曲させているので、被接続部の先端部がメタリコン電極に接触する接触面積が減少し、そのため、半田などの濡れ始めが迅速に行われることになって接合性が一段と向上する。   In addition, since the thickness near the boundary between the terminal body and the connected part is made thinner than the tip part thickness of the connected part, the amount of heat dissipation from the connected part to the terminal body is reduced, and the connected part The temperature of the part is likely to rise, and the bondability is improved. Furthermore, since the connected part is bent from the terminal body to the joint part side with the metallicon electrode, the contact area where the tip of the connected part comes into contact with the metallicon electrode is reduced, and therefore, the solder starts to get wet. As a result, the bondability is further improved.

そして、上記電極端子が良好な接合性を有することから、上記電極端子を備えたフィルムコンデンサは、投与熱量が少なくてもよいため、電気的特性の劣化が抑制された良質なものとなる。   And since the said electrode terminal has favorable bondability, since the film capacitor | condenser provided with the said electrode terminal may have little heat of administration, it will become the quality thing by which deterioration of the electrical property was suppressed.

次に、この発明のフィルムコンデンサ用電極端子、及びこの電極端子を備えたフィルムコンデンサの具体的な実施の形態について、図面を参照しつつ詳細に説明する。この発明の実施形態に係るフィルムコンデンサは、図１に示すように、フィルムコンデンサ素子１の端面に形成されたメタリコン電極２に対し、第１実施形態に係る電極端子１０を接続している。電極端子１０は、銅製のものであって、端子本体１１と、端子本体１１の先端部の両側から側方へと延設された一対の被接続部１２、１２とからなるものである。上記被接続部１２は、平面視小判形の形状をしたものであって、その先端部及びその近傍が半田付け部３、３によってメタリコン電極２に接合されている。そして、図２の断面図に示しているように、被接続部１２の厚さｔを、端子本体１１の厚さＴよりも薄くしている。端子本体１１の厚さＴが、１．５ｍｍ以上の電極端子１０の場合、被接合部１２の厚さｔは、０．３〜１．２ｍｍ程度にするのが好ましい。   Next, specific embodiments of the film capacitor electrode terminal of the present invention and the film capacitor including the electrode terminal will be described in detail with reference to the drawings. As shown in FIG. 1, the film capacitor according to the embodiment of the present invention connects the electrode terminal 10 according to the first embodiment to the metallicon electrode 2 formed on the end face of the film capacitor element 1. The electrode terminal 10 is made of copper, and includes a terminal main body 11 and a pair of connected parts 12 and 12 extending from both sides of the front end of the terminal main body 11 to the side. The connected portion 12 has an oval shape in plan view, and the tip portion and the vicinity thereof are joined to the metallicon electrode 2 by soldering portions 3 and 3. As shown in the cross-sectional view of FIG. 2, the thickness t of the connected portion 12 is made thinner than the thickness T of the terminal body 11. When the thickness T of the terminal main body 11 is 1.5 mm or more, the thickness t of the bonded portion 12 is preferably about 0.3 to 1.2 mm.

上記第１実施形態のフィルムコンデンサ用電極端子１０によれば、被接続部１２の厚さｔを端子本体の厚さＴよりも薄くしているので、被接続部１２を端子本体１１と同じ板厚にした場合に比較して、被接続部１２の熱容量が小さくなる。そのため、投与熱量が少なくても、被接続部１２は短時間で半田の溶融温度にまで温度上昇し、半田付け性が向上する。また、被接続部１２の先端部１２ａは、滑らかに湾曲した小判形となっているため、被接続部１２の先端部１２ａの周囲において、半田が一様に濡れ易くなり、半田付けが行い易くなる。   According to the film capacitor electrode terminal 10 of the first embodiment, since the thickness t of the connected portion 12 is made thinner than the thickness T of the terminal body, the connected portion 12 is the same plate as the terminal body 11. Compared with the case where the thickness is increased, the heat capacity of the connected portion 12 is reduced. Therefore, even if there is little administration heat amount, the to-be-connected part 12 rises to the melting temperature of solder in a short time, and solderability improves. Further, since the tip end portion 12a of the connected portion 12 has a smoothly curved oval shape, the solder easily gets wet around the tip portion 12a of the connected portion 12 and soldering is easy. Become.

図３には、第２実施形態の断面図を示している、この第２実施形態は、端子本体１１と被接続部１２との境界付近１２ｂの厚さｔ１を、被接続部１２の先端部１２ａの厚さｔよりもさらに薄くしたという点において、第１実施形態と相違するもので、それ以外の構成は第１実施形態と同様である。この第２実施形態の電極端子１０によれば、上記第１実施形態の効果に加えて、半田付けがさらに行い易くなる。すなわち、端子本体１１と被接続部１２との境界付近１２ｂの厚さｔ１を、被接続部１２の先端部１２ａの厚さｔよりもさらに薄くしているので、被接続部１２から端子本体１１への熱放散量が減少し、被接続部１２が温度上昇し易くななり、この結果、さらに接合性が向上するのである   FIG. 3 shows a cross-sectional view of the second embodiment. In the second embodiment, the thickness t1 near the boundary between the terminal body 11 and the connected portion 12 is set to the tip end portion of the connected portion 12. It is different from the first embodiment in that it is thinner than the thickness t of 12a, and the other configuration is the same as that of the first embodiment. According to the electrode terminal 10 of the second embodiment, in addition to the effects of the first embodiment, soldering is further facilitated. That is, the thickness t1 near the boundary 12b between the terminal body 11 and the connected part 12 is made thinner than the thickness t of the tip part 12a of the connected part 12, so This reduces the amount of heat dissipated and the temperature of the connected portion 12 is likely to rise. As a result, the bondability is further improved.

図４には、第３実施形態の断面図を示している。この第３実施形態は、被接続部１２を端子本体１１からメタリコン電極２との半田付け部３側へと屈曲させた
という点において、第２実施形態と相違するもので、それ以外の構成は第２実施形態と同様である。この第３実施形態の電極端子１０によれば、上記第２実施形態の効果に加えて、被接続部１２を、端子本体１１からメタリコン電極２との半田付け部３側へと屈曲させているので、被接続部１２の先端部１２ａがメタリコン電極２に接触する接触面積が減少し、そのため、半田の濡れ始めが迅速に行われることになって接合性が一段と向上するとの効果が得られる。 FIG. 4 shows a cross-sectional view of the third embodiment. This third embodiment is different from the second embodiment in that the connected portion 12 is bent from the terminal body 11 to the soldered portion 3 side with the metallicon electrode 2, and the other configurations are the same. This is the same as in the second embodiment. According to the electrode terminal 10 of the third embodiment, in addition to the effects of the second embodiment, the connected portion 12 is bent from the terminal body 11 to the soldering portion 3 side with the metallicon electrode 2. As a result, the contact area where the tip 12a of the connected portion 12 contacts the metallicon electrode 2 is reduced, so that the solder starts to be wet quickly and the bonding property is further improved.

図５には、電極端子１０の製造方法を示している。まず、同図（ａ）に示すように、平面視逆Ｔ字状に銅プレートを打ち抜いてＴ字状素材を製作し、このＴ字状素材２０の両側の突出部を、（ｂ）に示すように、金型２１、２１でプレスして押し潰すことで、（ｃ）に示すように、端子本体１１の両側に形状円形の被接続部１２が形成された電極端子１０を製造する。この場合、金型２１の押圧面としては、第１実施形態と同様な断面形状の被接続部１２を成形するための平面形状のもの（図６）、第２実施形態と同様な断面形状の被接続部１２を成形するためのテーパ形状のもの（図７）、端子本体１１と被接続部１２との境界付近１２ｂの凹部を成形するためにＲ状突条２２を設けた形状のもの（図８）を使用することができる。   FIG. 5 shows a method for manufacturing the electrode terminal 10. First, as shown in FIG. 6A, a copper plate is punched out in a reverse T shape in plan view to produce a T-shaped material, and the protrusions on both sides of the T-shaped material 20 are shown in FIG. Thus, by pressing and crushing with the dies 21, 21, the electrode terminal 10 having the circularly connected portions 12 formed on both sides of the terminal body 11 is manufactured as shown in FIG. In this case, the pressing surface of the mold 21 has a planar shape for forming the connected portion 12 having the same cross-sectional shape as in the first embodiment (FIG. 6), and a cross-sectional shape similar to that in the second embodiment. Tapered shape for forming the connected portion 12 (FIG. 7), and a shape provided with an R-shaped protrusion 22 for forming a recess 12b near the boundary between the terminal body 11 and the connected portion 12 ( FIG. 8) can be used.

図９、図１０には、さらに他の実施形態を示している。この場合、図９に示すように、被接続部１２は端子本体１１の下端部から下方へと延設されている。そしてこの場合にも、図１０に示すように、被接続部１２は小判形の形状をなすもので、被接続部１２の厚さｔを、端子本体１１の厚さＴよりも薄くしている。この場合にも上記第１実施形態のものと全く同様な作用効果が得られる。   9 and 10 show still another embodiment. In this case, as shown in FIG. 9, the connected portion 12 extends downward from the lower end portion of the terminal body 11. Also in this case, as shown in FIG. 10, the connected portion 12 has an oval shape, and the thickness t of the connected portion 12 is made thinner than the thickness T of the terminal body 11. . In this case, the same effect as that of the first embodiment can be obtained.

そして、上記電極端子１０を用いてフィルムコンデンサを製造すると、電極端子１０の半田付けに際しては、投与熱量が少なくても良好な半田付けを行うことができるため、電気的特性の劣化が抑制された良好な品質のフィルムコンデンサが得られる。   When a film capacitor is manufactured using the electrode terminal 10, since the soldering of the electrode terminal 10 can be performed with a small amount of administration heat, deterioration of electrical characteristics is suppressed. Good quality film capacitors can be obtained.

以上にこの発明の具体的な実施の形態について説明したが、この発明は上記形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、電極端子１０の素材として銅を例示しているが、これは他の材質のものであってもよい。また、上記各実施形態では、接合方法として半田付け法を例示しているが、これ以外に、他のロウ付け方法、他の接合方法を採用することもある。   Although specific embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention. For example, although copper is illustrated as a material of the electrode terminal 10, this may be made of other materials. In each of the above embodiments, the soldering method is exemplified as the joining method. However, other brazing methods and other joining methods may be employed in addition to this.

この発明のフィルムコンデンサとその電極端子の第１実施形態を示す斜視図である。It is a perspective view which shows 1st Embodiment of the film capacitor of this invention, and its electrode terminal. 上記実施形態の電極端子の断面図である。It is sectional drawing of the electrode terminal of the said embodiment. 電極端子の第２実施形態の断面図である。It is sectional drawing of 2nd Embodiment of an electrode terminal. 電極端子の第３実施形態の断面図である。It is sectional drawing of 3rd Embodiment of an electrode terminal. 電極端子の製造方法を説明するための製造工程の概略図である。It is the schematic of the manufacturing process for demonstrating the manufacturing method of an electrode terminal. 電極端子のプレス用金型の一例を示す断面図である。It is sectional drawing which shows an example of the metal mold | die for press of an electrode terminal. 電極端子のプレス用金型の変形例を示す断面図である。It is sectional drawing which shows the modification of the metal mold | die for press of an electrode terminal. 電極端子のプレス用金型の他の変形例を示す断面図である。It is sectional drawing which shows the other modification of the metal mold | die for press of an electrode terminal. この発明のフィルムコンデンサとその電極端子の他の実施形態を示す斜視図である。It is a perspective view which shows other embodiment of the film capacitor of this invention, and its electrode terminal. 上記実施形態の電極端子の断面図である。It is sectional drawing of the electrode terminal of the said embodiment. この発明のフィルムコンデンサとその電極端子の従来例を示す斜視図である。It is a perspective view which shows the prior art example of the film capacitor of this invention, and its electrode terminal. 上記従来例の電極端子の断面図である。It is sectional drawing of the electrode terminal of the said prior art example.

符号の説明Explanation of symbols

１・・コンデンサ素子、２・・メタリコン電極、３・・半田付け部、１０・・電極端子、１１・・端子本体、１２・・被接続部、１２ａ・・先端部   1 .. Capacitor element, 2 .. Metallicon electrode, 3 .. Solder part, 10 .. Electrode terminal, 11 .. Terminal body, 12 .. Connected part, 12 a.

Claims (4)

フィルムコンデンサ素子（１）の端面に形成されたメタリコン電極（２）に接続されるフィルムコンデンサ用電極端子であって、端子本体（１１）と、端子本体（１１）から延設されると共に、厚さ（ｔ）が端子本体（１１）の厚さ（Ｔ）よりも薄く、かつ形状がほぼ小判形あるいは円形である被接続部（１２）とを備えていることを特徴とするフィルムコンデンサ用電極端子。   An electrode terminal for a film capacitor connected to a metallicon electrode (2) formed on the end face of the film capacitor element (1), which extends from the terminal body (11) and the terminal body (11) and has a thickness. And a connected portion (12) having a shape (t) thinner than the thickness (T) of the terminal body (11) and having a substantially oval or circular shape. Terminal. 上記端子本体（１１）と被接続部（１２）との境界付近（１２ｂ）の厚さ（ｔ１）は、上記被接続部（１２）の先端部（１２ａ）の厚さ（ｔ）よりもさらに薄くしたことを特徴とする請求項１のフィルムコンデンサ用電極端子。   The thickness (t1) in the vicinity of the boundary (12b) between the terminal body (11) and the connected portion (12) is more than the thickness (t) of the distal end portion (12a) of the connected portion (12). The electrode terminal for a film capacitor according to claim 1, wherein the electrode terminal is thin. 上記被接続部（１２）は、上記端子本体（１１）から上記メタリコン電極（２）との接合部（３）側へと屈曲させていることを特徴とする請求項１または請求項２のフィルムコンデンサ用電極端子。   The film according to claim 1 or 2, wherein the connected portion (12) is bent from the terminal body (11) to the joint (3) side with the metallicon electrode (2). Electrode terminal for capacitors. 請求項１〜請求項３のいずれかの電極端子（１０）が、フィルムコンデンサ素子（１）のメタリコン電極（２）に接続されたフィルムコンデンサ。   A film capacitor in which the electrode terminal (10) according to any one of claims 1 to 3 is connected to a metallicon electrode (2) of the film capacitor element (1).
JP2008021975A 2008-01-31 2008-01-31 Electrode terminal for film capacitor, and the film capacitor Pending JP2009182265A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238710A (en) * 2011-05-11 2012-12-06 Sumitomo Wiring Syst Ltd Connector
JP2013125910A (en) * 2011-12-15 2013-06-24 Shizuki Electric Co Inc Capacitor
US20140226259A1 (en) * 2013-02-13 2014-08-14 Sbe, Inc. Mitigating the Effects of Cracks in Metallized Polymer Film Capacitor Arc-Sprayed End Connections
JP2021061318A (en) * 2019-10-07 2021-04-15 パナソニックＩｐマネジメント株式会社 Capacitor

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JPH1041190A (en) * 1996-07-25 1998-02-13 Matsushita Electric Ind Co Ltd Capacitor element aggregate
JPH11204382A (en) * 1998-01-16 1999-07-30 Nichicon Corp Resin encapsulating type capacitor
JP2006294790A (en) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd Case molded capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041190A (en) * 1996-07-25 1998-02-13 Matsushita Electric Ind Co Ltd Capacitor element aggregate
JPH11204382A (en) * 1998-01-16 1999-07-30 Nichicon Corp Resin encapsulating type capacitor
JP2006294790A (en) * 2005-04-08 2006-10-26 Matsushita Electric Ind Co Ltd Case molded capacitor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238710A (en) * 2011-05-11 2012-12-06 Sumitomo Wiring Syst Ltd Connector
JP2013125910A (en) * 2011-12-15 2013-06-24 Shizuki Electric Co Inc Capacitor
US20140226259A1 (en) * 2013-02-13 2014-08-14 Sbe, Inc. Mitigating the Effects of Cracks in Metallized Polymer Film Capacitor Arc-Sprayed End Connections
JP2021061318A (en) * 2019-10-07 2021-04-15 パナソニックＩｐマネジメント株式会社 Capacitor
JP7365679B2 (en) 2019-10-07 2023-10-20 パナソニックＩｐマネジメント株式会社 capacitor

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