JP2013125910A - Capacitor - Google Patents
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- JP2013125910A JP2013125910A JP2011275014A JP2011275014A JP2013125910A JP 2013125910 A JP2013125910 A JP 2013125910A JP 2011275014 A JP2011275014 A JP 2011275014A JP 2011275014 A JP2011275014 A JP 2011275014A JP 2013125910 A JP2013125910 A JP 2013125910A
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Abstract
Description
この発明は、コンデンサ素子の電極部に接続される端子を有するコンデンサに関する。 The present invention relates to a capacitor having a terminal connected to an electrode portion of a capacitor element.
図4に示すように、コンデンサ素子10の両端部に設けられた電極部(メタリコン部)11には、通常、他の電子部品との接続を行うための端子12が接続されるが、メタリコン部11や電子部品との安定的な接続を行う必要があることから、従来より、接続強度を確保し易い平板状の端子12が用いられてきた(例えば特許文献1、2参照)。 As shown in FIG. 4, a terminal 12 for connecting to other electronic components is usually connected to the electrode parts (metallicon parts) 11 provided at both ends of the capacitor element 10. 11 and the electronic component, it is necessary to make a stable connection, and thus, a plate-like terminal 12 that easily secures connection strength has been used (see, for example, Patent Documents 1 and 2).
ところで、コンデンサ素子10のメタリコン部11に端子12を接続するにあたっては、メタリコン部11表面に予め設けられたはんだ層13を溶融する、または溶融したはんだ13をメタリコン部11表面に供給し、この溶融したはんだ13でメタリコン部11と端子12とを接続する、所謂はんだ接続とすることが多い。 By the way, when connecting the terminal 12 to the metallicon part 11 of the capacitor element 10, the solder layer 13 provided in advance on the surface of the metallicon part 11 is melted or the molten solder 13 is supplied to the surface of the metallicon part 11 and this melting is performed. In many cases, a so-called solder connection in which the metallized portion 11 and the terminal 12 are connected by the solder 13 is used.
ところが、特許文献1、2や図4に示すように、平板状の端子12をメタリコン部11に当接させると、図5に示すように、溶融したはんだ13が端子12によって押し退けられ、端子12とメタリコン部11との間にはんだ13が僅かしか残らず、強固な結線が行えない場合があった。 However, as shown in Patent Documents 1 and 2 and FIG. 4, when the flat terminal 12 is brought into contact with the metallicon portion 11, the molten solder 13 is pushed away by the terminal 12 as shown in FIG. There is a case in which only a small amount of solder 13 remains between the metallicon part 11 and the metallized part 11 and a strong connection cannot be made.
また、近年、鉛フリーはんだが使用されることが多いことから、はんだ接続を行うものにおいては、その材料として、はんだ濡れ性を良好にするためのメッキ12aを両面に施したメッキ鋼板を用いることが多いが、このメッキ鋼板をプレス形成してなる端子12では、図5に示すように、端面12bからはんだ濡れ性に劣る素地が露出することとなるため、単に端子12をメタリコン部11に当接させるだけでは、端面12bに十分な量のはんだを付着させることができなかった。 Also, since lead-free solder is often used in recent years, in the case of solder connection, a plated steel sheet with plating 12a for improving solder wettability is used as its material. However, in the terminal 12 formed by press-forming this plated steel sheet, as shown in FIG. 5, the base material having poor solder wettability is exposed from the end surface 12 b, so that the terminal 12 is simply brought into contact with the metallicon part 11. A sufficient amount of solder could not be adhered to the end face 12b only by contact.
そこで、この発明は、上記課題を解決するためになされたもので、簡単な構成でありながらも、コンデンサ素子の電極部と端子とを強固に接続することができるコンデンサの提供を目的としている。 Accordingly, the present invention has been made to solve the above-described problem, and an object of the present invention is to provide a capacitor capable of firmly connecting the electrode portion and the terminal of the capacitor element with a simple configuration.
上記課題を解決するため、本発明のコンデンサは、端面に電極部3を有するコンデンサ素子2と、上記コンデンサ素子2の電極部3に接続される端子5と、上記コンデンサ素子2及び上記端子5を覆う外装部8とを具備し、上記端子5はメッキ層5aを有し、上記外装部8から外方に延出される接続部6と、上記コンデンサ素子2の電極部3にはんだ4を介して接続される電極接続部7とを備え、上記電極接続部7は、そのメッキ層5aを有する面が上記コンデンサ素子2の電極部3と対向する凹部7bとされていることを特徴としている。 In order to solve the above problems, a capacitor of the present invention includes a capacitor element 2 having an electrode portion 3 on an end face, a terminal 5 connected to the electrode portion 3 of the capacitor element 2, the capacitor element 2 and the terminal 5 And the terminal 5 has a plating layer 5a, the connection part 6 extending outward from the exterior part 8, and the electrode part 3 of the capacitor element 2 via the solder 4. The electrode connecting portion 7 is connected to the electrode connecting portion 7, and the electrode connecting portion 7 is characterized in that the surface having the plated layer 5 a is a concave portion 7 b facing the electrode portion 3 of the capacitor element 2.
また、電極接続部7の凹部7bは、電極接続部7の端部7aを上記コンデンサ素子2の電極部3に向かって湾曲させることで形成されており、電極接続部7の端面7cは、上記端部7aの湾曲に伴って上記コンデンサ素子2の電極部3に向かって傾斜している。 The concave portion 7b of the electrode connecting portion 7 is formed by curving the end portion 7a of the electrode connecting portion 7 toward the electrode portion 3 of the capacitor element 2, and the end surface 7c of the electrode connecting portion 7 is The end portion 7a is inclined toward the electrode portion 3 of the capacitor element 2 along with the curvature of the end portion 7a.
この発明のコンデンサによれば、端子をコンデンサ素子の電極部に接続するにあたって、端子の電極接続部をコンデンサ素子の電極部に当接させても、電極接続部のメッキ層を有する面に設けられた凹部によって、溶融したはんだが凹部とコンデンサ素子の電極部との間に確実に残留し、凹部と電極部との間にはんだ層が充填形成されることとなる。そのため、電極接続部の剥離強度が大となり、熱衝撃性に対する耐性が向上し、端子とコンデンサ素子の電極部との強固な結線が可能となる。 According to the capacitor of the present invention, when the terminal is connected to the electrode portion of the capacitor element, even if the electrode connection portion of the terminal is brought into contact with the electrode portion of the capacitor element, the electrode connection portion is provided on the surface having the plated layer. Due to the concave portion, the molten solder surely remains between the concave portion and the electrode portion of the capacitor element, and a solder layer is filled and formed between the concave portion and the electrode portion. Therefore, the peel strength of the electrode connection portion is increased, the resistance to thermal shock is improved, and a firm connection between the terminal and the electrode portion of the capacitor element is possible.
また、電極接続部の端部が湾曲形成され、それに伴い電極接続部の端面がコンデンサ素子の電極部に向かって傾斜しているため、電極接続部の凹部とコンデンサ素子の電極部とを対向させると、電極接続部の端面とコンデンサ素子の電極部とではんだを挟むような形態とすることができ、電極接続部の端面に電極接続部側方のはんだを良好に付着させることができる。そして、その結果、はんだと端子との接触面が多くなり、端子とコンデンサ素子の電極部との結線をより一層強固なものとすることができる。 In addition, since the end of the electrode connecting portion is curved and the end surface of the electrode connecting portion is inclined toward the electrode portion of the capacitor element, the concave portion of the electrode connecting portion and the electrode portion of the capacitor element are opposed to each other. Then, the solder can be sandwiched between the end face of the electrode connecting portion and the electrode portion of the capacitor element, and the solder on the side of the electrode connecting portion can be satisfactorily adhered to the end face of the electrode connecting portion. As a result, the contact surface between the solder and the terminal increases, and the connection between the terminal and the electrode portion of the capacitor element can be made even stronger.
以下、この発明のコンデンサの実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ1は、図1に示すように、コンデンサ素子2と端子5と外装部8とから構成されている。 Embodiments of a capacitor according to the present invention will be described below in detail with reference to the drawings. As shown in FIG. 1, the capacitor 1 of the present invention includes a capacitor element 2, a terminal 5, and an exterior portion 8.
コンデンサ素子2は、例えば絶縁性のフィルム上に金属が蒸着された金属化フィルムを円柱状に巻回することでなるフィルムコンデンサであって、図1に示すように、軸方向両端部には金属(亜鉛)を溶射してなる電極部(メタリコン部)3、3が形成されている。また、メタリコン部3の表面には、はんだを溶射してなるはんだ層4が形成されている。なお、コンデンサ素子2としては、フィルムコンデンサに限らず、セラミックコンデンサ等、公知の種々のコンデンサ素子が使用可能である。また、その形状も円柱状に限らず、立方体状等でも良い。 Capacitor element 2 is a film capacitor formed by, for example, winding a metallized film in which a metal is vapor-deposited on an insulating film in a cylindrical shape, and as shown in FIG. Electrode parts (metallicon parts) 3 and 3 formed by spraying (zinc) are formed. Also, a solder layer 4 formed by spraying solder is formed on the surface of the metallicon part 3. The capacitor element 2 is not limited to a film capacitor, and various known capacitor elements such as a ceramic capacitor can be used. Further, the shape is not limited to a cylindrical shape, and may be a cubic shape.
端子5は、図2に示すように、一方端が外部の電子部品との接続に用いられる接続部6とされ、他方端がコンデンサ素子2のメタリコン部3との接続に用いられる電極接続部7とされている。具体的には、端子5は、はんだ濡れ性を良好にするためのメッキ5aを両面に施したメッキ鋼板を略凸字状に打ち抜くことでなり、狭幅とされた一方端が接続部6とされ、広幅とされた他方端が電極接続部7とされている。 As shown in FIG. 2, the terminal 5 has one end serving as a connection portion 6 used for connection with an external electronic component, and the other end used as an electrode connection portion 7 used for connection with the metallicon portion 3 of the capacitor element 2. It is said that. Specifically, the terminal 5 is formed by punching a plated steel plate having a plating 5a for improving solder wettability on both sides in a substantially convex shape, and one end having a narrow width is connected to the connection portion 6. The other end that is wide is the electrode connecting portion 7.
また、電極接続部7は、図2に示すように、幅方向両端部7a、7aがそれぞれ板厚方向で且つ同一方向(図3において、メタリコン部3方向)に湾曲形成され、平面視略円弧状とされており、幅方向両端部7a、7a間には略円弧状の凹部7bが形成されている。なお、電極接続部7の幅方向端面7cは、幅方向端部7aを湾曲させたことにより、湾曲させた側(図において、メタリコン部3側)に向かって傾斜した状態とされる。 Further, as shown in FIG. 2, the electrode connecting portion 7 has both end portions 7a and 7a in the width direction curved in the plate thickness direction and in the same direction (in the direction of the metallicon portion 3 in FIG. 3). It has an arc shape, and a substantially arc-shaped concave portion 7b is formed between both ends 7a and 7a in the width direction. In addition, the width direction end surface 7c of the electrode connection part 7 is in a state of being inclined toward the curved side (the metallicon part 3 side in the drawing) by curving the width direction end part 7a.
外装部8は、コンデンサ素子2や端子5の電極接続部7を被覆する樹脂であって、エポキシ樹脂やウレタン樹脂等、公知の種々の樹脂を使用可能である。なお、外装部8としては、コンデンサ素子2や端子5の電極接続部7を被覆するものであれば良く、コンデンサ素子2や端子5の電極接続部7を樹脂モールドするために使用するケースも含まれる。 The exterior portion 8 is a resin that covers the capacitor element 2 and the electrode connection portion 7 of the terminal 5, and various known resins such as an epoxy resin and a urethane resin can be used. The exterior portion 8 only needs to cover the capacitor element 2 and the electrode connection portion 7 of the terminal 5, and includes a case where the electrode connection portion 7 of the capacitor element 2 and the terminal 5 is used for resin molding. It is.
本発明のコンデンサ1は、端子5の電極接続部7をコンデンサ素子2のメタリコン部3に接続するとともに、端子5の接続部6を外方に延出するようにして、コンデンサ素子2と端子5の電極接続部7とを樹脂モールドすることで構成される。 In the capacitor 1 of the present invention, the electrode connecting portion 7 of the terminal 5 is connected to the metallicon portion 3 of the capacitor element 2, and the connecting portion 6 of the terminal 5 is extended outward so that the capacitor element 2 and the terminal 5 are connected. The electrode connection part 7 is configured by resin molding.
なお、コンデンサ素子2への端子5の接続にあたっては、抵抗溶接等によりメタリコン部3表面に予め設けられたはんだ層4を溶融させた状態において、電極接続部7のメッキ層5a側に設けられた凹部7bをコンデンサ素子2のメタリコン部3に対向させるとともに、電極接続部7をメタリコン部3に向かって付勢し、電極接続部7をメタリコン部3に当接させることで行う。 In addition, in connecting the terminal 5 to the capacitor element 2, it was provided on the plated layer 5a side of the electrode connecting portion 7 in a state where the solder layer 4 previously provided on the surface of the metallicon portion 3 was melted by resistance welding or the like. The concave portion 7 b is opposed to the metallicon part 3 of the capacitor element 2, the electrode connecting part 7 is biased toward the metallicon part 3, and the electrode connecting part 7 is brought into contact with the metallicon part 3.
この場合、図3に示すように、電極接続部7の幅方向両端部7a、7aの角部がメタリコン部3に当接した段階で、それ以上の付勢が規制される、すなわち、幅方向両端部7a、7aがスペーサとして機能するため、凹部7bとメタリコン部3との間に溶融したはんだ4を確実に残留させることができる。そのため、凹部7bとメタリコン部3との間に凹部7b深さ分のはんだ層4が形成されることとなり、電極接続部の剥離強度が大となり、熱衝撃性に対する耐性が向上し、端子5とメタリコン部3との強固な結線が可能となる。 In this case, as shown in FIG. 3, further biasing is restricted at the stage where the corners of the width direction end portions 7 a, 7 a of the electrode connecting portion 7 are in contact with the metallicon portion 3, that is, in the width direction. Since the both end portions 7a and 7a function as spacers, the molten solder 4 can be reliably left between the recess 7b and the metallicon portion 3. Therefore, the solder layer 4 corresponding to the depth of the concave portion 7b is formed between the concave portion 7b and the metallicon portion 3, the peeling strength of the electrode connection portion is increased, the resistance to thermal shock is improved, and the terminal 5 and A strong connection with the metallicon part 3 becomes possible.
また、電極接続部7の幅方向端面7cがメタリコン部3に向かって傾斜しているため、幅方向両端部7a、7aをメタリコン部3に当接させることにより、幅方向端面7cとメタリコン部3とではんだ4を挟むような形態となり、幅方向端面7cにメッキ層5aが施されていないにも拘らず、幅方向端面7cにはんだ4を良好に付着させることができる。そして、幅方向端面7cにもはんだ層4が形成されるため、幅方向端面7cにはんだ4が付着していない従来のものと比べて、はんだ4と端子5との接触面が多くなり、端子5とメタリコン部3との結線をより一層強固なものとすることができる。 In addition, since the width direction end face 7c of the electrode connecting portion 7 is inclined toward the metallicon part 3, the width direction end face 7c and the metallicon part 3 are brought into contact with the metallicon part 3 by bringing the width direction both end parts 7a, 7a into contact with the metallicon part 3. Thus, the solder 4 can be satisfactorily adhered to the width direction end surface 7c even though the plating layer 5a is not applied to the width direction end surface 7c. And since the solder layer 4 is formed also in the width direction end surface 7c, the contact surface of the solder 4 and the terminal 5 increases compared with the conventional thing in which the solder 4 does not adhere to the width direction end surface 7c. 5 and the metallicon part 3 can be further strengthened.
以上に、この発明の具体的な実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施例においては、メタリコン部3表面に予めはんだ層4を設けていたが、メタリコン部3表面にはんだ層4を設けず、端子5をメタリコン部3に接続する場合に、溶融したはんだ4をメタリコン部3表面に供給するようにしても良い。また、上記実施例においては、亜鉛層3を電極部(メタリコン部)と称していたが、亜鉛層3とはんだ層4とを合わせたものを電極部(メタリコン部)としても良い。また、端子5の形状は、略凸字状に限らず、短冊状等種々の形状で良い。但し、接続部6が湾曲すると、外部の電子部品との接続に支障をきたす虞がある、例えば接続部6と電極接続部7との間に切れ込みを入れる等、電極接続部7を湾曲させても、接続部6が湾曲しない形状とすることが好ましい。 Although specific embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, in the above embodiment, the solder layer 4 is provided in advance on the surface of the metallicon part 3, but when the terminal 5 is connected to the metallicon part 3 without providing the solder layer 4 on the surface of the metallicon part 3, molten solder You may make it supply 4 to the metallicon part 3 surface. Moreover, in the said Example, although the zinc layer 3 was called the electrode part (metallicon part), what combined the zinc layer 3 and the solder layer 4 is good also as an electrode part (metallicon part). The shape of the terminal 5 is not limited to a substantially convex shape, and may be various shapes such as a strip shape. However, if the connecting portion 6 is curved, there is a possibility that the connection with an external electronic component may be hindered. For example, the electrode connecting portion 7 may be bent by making a notch between the connecting portion 6 and the electrode connecting portion 7. However, it is preferable that the connecting portion 6 has a shape that does not curve.
1・・コンデンサ、2・・コンデンサ素子、3・・電極部、4・・はんだ、5・・端子、5a・・メッキ、6・・接続部、7・・電極接続部、7a・・端部、7b・・凹部、7c・・端面、8・・外装部 1..Capacitor 2..Capacitor element 3 ... Electrode part 4..Solder 5..Terminal 5a..Plating 6 ... Connection part 7..Electrode connection part 7a..End part , 7b .. Recess, 7c .. End face, 8 .. Exterior part
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190019625A1 (en) * | 2017-07-14 | 2019-01-17 | Denso Corporation | Film capacitor and method of manufacturing same |
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JPH01146316A (en) * | 1987-12-03 | 1989-06-08 | Matsushita Electric Ind Co Ltd | Film capacitor |
JPH03167813A (en) * | 1989-11-27 | 1991-07-19 | Nichicon Corp | Metallized film capacitor |
JP2009182265A (en) * | 2008-01-31 | 2009-08-13 | Shizuki Electric Co Inc | Electrode terminal for film capacitor, and the film capacitor |
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2011
- 2011-12-15 JP JP2011275014A patent/JP2013125910A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01146316A (en) * | 1987-12-03 | 1989-06-08 | Matsushita Electric Ind Co Ltd | Film capacitor |
JPH03167813A (en) * | 1989-11-27 | 1991-07-19 | Nichicon Corp | Metallized film capacitor |
JP2009182265A (en) * | 2008-01-31 | 2009-08-13 | Shizuki Electric Co Inc | Electrode terminal for film capacitor, and the film capacitor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20190019625A1 (en) * | 2017-07-14 | 2019-01-17 | Denso Corporation | Film capacitor and method of manufacturing same |
US11195662B2 (en) * | 2017-07-14 | 2021-12-07 | Denso Corporation | Film capacitor with a film winding core having metallikon electrodes and busbars on its ends |
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