JP2012028624A - Printed circuit board insulation spacer, and printed circuit board unit including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board insulation spacer which can improve workability and prevent a worker from forgetting to mount it by automatically mounting the spacer on a printed circuit board using an inserter mounting apparatus, and to provide a printed circuit board unit including the same.SOLUTION: A printed circuit board unit 1 includes a printed circuit board insulation spacer 10. The printed circuit board insulation spacer 10 includes a not-recessed surface to be at least in contact with a printed circuit board 3, is mounted on a rear face of the printed circuit board 3 so that a space between the rear face of the printed circuit board 3 and a case 2 to be a required distance, has insulation performance and heat-resistant temperature of 240°C or more, and does not deform by flow soldering.

Description

  The present invention relates to a printed circuit board insulating spacer attached to a printed circuit board and a printed circuit board unit provided with the printed circuit board insulating spacer.

  Conventionally, a printed circuit board on which a metal spacer is mounted is heated in a hot air circulation type heating furnace, and after the solder is melted by the heating, the printed circuit board insulating spacer is bonded to the printed circuit board by cooling. A printed circuit board unit including a printed circuit board insulating spacer is known (for example, see Patent Document 1).

JP 2000-59000 (FIG. 4, paragraph 0017)

The printed circuit board insulating spacer and the printed circuit board unit provided with the printed circuit board insulating spacer described in Patent Document 1 described above can be automatically mounted, and can be favorably mounted on the printed circuit board.
However, the printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer described in Patent Document 1 described above cannot be fixed with flow solder because the metal spacer is fixed with reflow solder.
Therefore, the printed circuit board insulating spacer and the printed circuit board unit provided with the printed circuit board insulating spacer described in Patent Document 1 described above cannot be mounted on the back surface of the printed circuit board.

By the way, there has been proposed a printed circuit board insulating spacer in which an insulating spacer is attached to a printed circuit board with a double-sided tape and a printed circuit board unit including the printed circuit board insulating spacer.
However, the conventional printed circuit board insulating spacer and the printed circuit board unit including the printed circuit board insulating spacer are work by humans.
Therefore, the conventional printed circuit board insulating spacer and the printed circuit board unit provided with the printed circuit board insulating spacer may fail to be attached. Therefore, if the application is forgotten, the insulating spacer is not provided. Cause insulation failure.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a printed circuit board insulating spacer capable of improving workability and preventing forgetting to attach by automatically mounting the printed circuit board with an inserter mounting device. An object of the present invention is to provide a printed circuit board unit including a printed circuit board insulating spacer.

  The printed circuit board insulating spacer according to the present invention has at least a non-recessed surface for contacting the printed circuit board, and is attached to the back surface of the printed circuit board so as to have a desired distance between the back surface of the printed circuit board and the case. The printed circuit board insulating spacer has an insulating performance and a heat-resistant temperature of 240 ° C. or higher, and is not deformed by flow soldering.

  The spacer for insulating a printed circuit board according to the present invention is provided with a surface that does not contact the printed circuit board on the outer periphery of the non-recessed surface for contacting the printed circuit board.

  The spacer for insulating a printed circuit board according to the present invention is provided with a protrusion at the center of the surface in contact with the printed circuit board.

  In the printed circuit board insulating spacer according to the present invention, the shape of the surface on the opposite side of the surface in contact with the printed circuit board is the same shape as the surface in contact with the printed circuit board.

  The spacer for insulating a printed circuit board according to the present invention has a taping specification that is mounted in the same manner as a surface mount component by an inserter mounting apparatus.

  In the printed circuit board unit according to the present invention, the printed circuit board insulating spacer is bonded to the printed circuit board with an epoxy adhesive.

  In the printed circuit board unit according to the present invention, the hole for inserting the protrusion of the printed board insulating spacer is provided in the printed circuit board so that the protrusion and the hole of the printed board insulating spacer are fitted to each other. And bonded to a printed circuit board with an epoxy adhesive.

  According to the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the present invention, it is possible to improve workability and prevent forgetting to attach by automatically mounting the printed circuit board on the printed circuit board with the inserter mounting device. Play.

The side view of the printed circuit board unit in the printed circuit board unit provided with the printed circuit board insulation spacer of 1st Embodiment which concerns on this invention, and the printed circuit board insulation spacer FIG. 1 is an external perspective view of the printed circuit board insulating spacer shown in FIG. (A) is a plan view of the printed circuit board insulating spacer of FIG. 2, (B) is a side view of the printed circuit board insulating spacer of FIG. 2, and (C) is a bottom view of the printed circuit board insulating spacer of FIG. (A) is a front view of the taping specification of the printed board insulating spacer of FIG. 1, and (B) is a side view of the taping specification of the printed board insulating spacer of FIG. The external perspective view which looked at the printed circuit board insulation spacer in the printed circuit board unit provided with the spacer for printed circuit board insulation of 2nd Embodiment which concerns on this invention, and the printed circuit board insulation spacer from diagonally upward. 5A is a plan view of the printed circuit board insulating spacer of FIG. 5, FIG. 5B is a side view of the printed circuit board insulating spacer of FIG. 5, and FIG. 5C is a bottom view of the printed circuit board insulating spacer of FIG. 5A is a side view of the first step of automatic mounting of the printed circuit board insulating spacer of FIG. 5, FIG. 5B is a side view of the second step of automatic mounting of the printed circuit board insulating spacer of FIG. 5, and FIG. Side view of the third step of automatic mounting of the printed circuit board insulating spacer of FIG. 3 is a perspective view of a printed circuit board insulation spacer according to a third embodiment of the present invention and an external perspective view of the printed circuit board insulation spacer in the printed circuit board unit provided with the printed circuit board insulation spacer, as viewed obliquely from above. 8A is a plan view of the printed board insulating spacer in FIG. 8, FIG. 8B is a side view of the printed board insulating spacer in FIG. 8, and FIG. 8C is a bottom view of the printed board insulating spacer in FIG. FIG. 8 is a side view for explaining the action of the printed circuit board insulating spacer of FIG. External perspective view of a printed circuit board insulating spacer and a printed circuit board insulating spacer in the printed circuit board unit provided with the printed circuit board insulating spacer according to the fourth embodiment of the present invention as viewed obliquely from above. (A) is a plan view of the printed circuit board insulating spacer of FIG. 11, (B) is a side view of the printed circuit board insulating spacer of FIG. 11, and (C) is a bottom view of the printed circuit board insulating spacer of FIG. External appearance perspective view seen from diagonally lower side of printed circuit board insulating spacer in printed circuit board insulating spacer and printed circuit board insulating spacer according to fifth embodiment of the present invention (A) is a plan view of the printed circuit board insulating spacer of FIG. 13, (B) is a side view of the printed circuit board insulating spacer of FIG. 13, and (C) is a bottom view of the printed circuit board insulating spacer of FIG. Side view for explaining the action of the printed circuit board insulating spacer of FIG.

Hereinafter, a printed circuit board unit including a printed circuit board insulating spacer and a printed circuit board insulating spacer according to a plurality of embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 shows a side view of a printed circuit board unit in a printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention.
As shown in FIG. 1, a printed circuit board unit 1 according to the first embodiment of the present invention includes a case 2, a printed circuit board 3 accommodated in the case 2, an electronic component 4, a surface mount component 5, and a printed circuit board. It is comprised from the spacer 10 for insulation.

An electronic component 4 is mounted on the surface of the printed board 3. The electronic component 4 has its lead wire 6 inserted through the through hole 7 and into the flow surface as the back surface. A surface mounting component 5 is mounted on the flow surface of the printed circuit board 3, and a printed circuit board insulating spacer 10 is bonded to the flow surface.
For mounting by flow soldering, the surface mounting component 5 and the printed circuit board insulating spacer 10 are joined to the flow surface of the printed circuit board 3 by the epoxy adhesive 8 from the dispenser, and then the surface mounting component together with the lead wire 6 of the electronic component 4. 5 and the printed circuit board insulating spacer 10 are immersed in a flow solder bath.

FIG. 2 is an external perspective view of the printed board insulating spacer 10.
As shown in FIG. 2, the printed board insulating spacer 10 is formed in a cylindrical shape using a PPS (polyphenylene sulfide) material. The printed circuit board insulating spacer 10 has good adhesion to the epoxy adhesive 8. The printed circuit board insulating spacer 10 has a property of not deforming even when immersed in a flow solder bath at 240 ° C. or higher, and has an insulating performance.

3A is a plan view of the printed board insulating spacer 10, FIG. 3B is a side view of the printed board insulating spacer 10, and FIG. 3C is a bottom view of the printed board insulating spacer 10. The figure is shown.
As shown in FIG. 3A, the printed board insulating spacer 10 has a circular top surface 11.
As shown in FIG. 3B, the printed board insulating spacer 10 has a body portion 12 that is square in a side view.
As shown in FIG. 3C, the printed board insulating spacer 10 has a circular bottom surface 13.

  The printed circuit board insulating spacer 10 has a top surface 11 and a bottom surface 13 that are flat. In the printed board insulating spacer 10, the shape of the bottom surface 13 on the opposite side of the top surface 11 joined to the printed circuit board 3 is the same as that of the top surface 11 joined to the printed circuit board 3. The bottom surface 13 is in contact with the case 2. The printed board insulating spacer 10 is a surface in which the top surface 11 and the bottom surface 13 are not recessed. The printed circuit board insulating spacer 10 has a flat adhesive surface because the top surface 11 and the bottom surface 13 are not recessed, and air hardly enters the printed circuit board 3 during bonding. At this time, when the upper and lower adhesive surfaces are recessed, if the adhesive is cured while air remains in the recess, the air expands due to the heat of the flow solder, and the adhesive is peeled off. Decrease and the adhesive strength falls extremely.

FIG. 4A shows a front view of the taping specification of the printed board insulating spacer 10, and FIG. 4B shows a side view of the taping specification of the printed board insulating spacer 10.
As shown in FIGS. 4A and 4B, the printed board insulating spacer 10 has a taping specification. The printed board insulating spacer 10 is transported in an inserter mounting apparatus (not shown) through a feed hole 15 provided in the taping 14 through a predetermined pitch. In the inserter mounting apparatus, the printed board insulating spacer 10 is mounted in the same manner as the other surface mount components 5 and the like.

  At this time, in the printed board insulating spacer 10, the shape of the bottom surface 13 on the opposite side of the top surface 11 joined to the printed board 3 is the same as that of the top surface 11 joined to the printed board 3. Therefore, since the printed board insulating spacer 10 has no mistake in assembling in the vertical direction, it is possible to reduce the number of steps related to taping specifications and the number of steps related to manufacturing.

  Returning to FIG. 1, the printed circuit board insulating spacer 10 is bonded to the back surface of the printed circuit board 3 by the epoxy adhesive 8 so as to form a desired distance between the flow surface of the printed circuit board 3 and the case 2. At this time, when the top surface 11 of the printed circuit board insulating spacer 10 is joined to the flow surface of the printed circuit board 3 by the epoxy adhesive 8, the top surface 11 is a surface that is not recessed and the adhesive surface is flat. For this reason, air does not enter between the printed circuit board 3 and the bonding strength of the epoxy adhesive 8 is not lowered.

As described above, in the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention described above, the printed circuit board insulating spacer 10 has an insulating performance and has a heat resistant temperature. It is 240 ° C or higher and does not deform with flow solder.
Accordingly, in the printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board insulating spacer 10 is automatically mounted on the printed circuit board 3 by the inserter mounting apparatus. This improves workability and prevents forgetting to attach.

In the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board insulating spacer 10 is upside down with respect to the top surface 11 bonded to the printed circuit board 3. The shape of the bottom surface 13 on the side is the same shape as the top surface 11 to be joined to the printed circuit board 3.
Accordingly, in the printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board insulating spacer 10 has no arbitrary difference in assembly in the vertical direction. Man-hours related to taping specifications can be reduced and man-hours related to manufacturing can be greatly reduced.

In the printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board insulating spacer 10 is mounted in the same manner as the surface mounting component 5 by the inserter mounting device. This is a taping specification.
Therefore, in the printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board insulating spacer 10 has an insulating property and can be automatically mounted.

In the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer of the first embodiment according to the present invention, the printed circuit board unit 1 includes an epoxy adhesive from a dispenser together with other electronic components 4 and surface mount components 5. A printed circuit board insulating spacer 10 is applied which is joined to the flow surface of the printed circuit board 3 by 8 and is then flow soldered in a flow solder bath.
Therefore, in the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the first embodiment of the present invention, the printed circuit board unit 1 is automatically mounted on the printed circuit board 3 by the inserter mounting device. Improves sex and prevents forgetting to attach.

(Second Embodiment)
Next, a printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the second embodiment of the present invention will be described. In the following embodiments, components that are the same as those in the first embodiment described above or functionally similar components are simplified or omitted by giving the same reference numerals or equivalent symbols in the drawings. To do.

FIG. 5 shows an external perspective view of the printed board insulating spacer of the second embodiment according to the present invention and the printed board insulating spacer in the printed board unit provided with the printed board insulating spacer as viewed obliquely from above.
As shown in FIG. 5, the printed circuit board insulating spacer 20 is provided with a hemispherical protrusion 22 at the center of the top surface 21 in contact with the case 2 and at the center of the bottom surface 23 to be bonded to the printed circuit board 3. A hemispherical protrusion 24 is provided. In the present embodiment, the bottom surface 23 of the printed board insulating spacer 20 is bonded to the printed board 3.

6A is a plan view of the printed board insulating spacer 20, FIG. 6B is a side view of the printed board insulating spacer 20, and FIG. 6C is a bottom view of the printed board insulating spacer 20. The figure is shown.
As shown in FIG. 6A, the printed circuit board insulating spacer 20 has a hemispherical protrusion 22 at the center of the top surface 21 that protrudes in a direction in contact with the upper case 2 in FIG. It is formed in a hemispherical shape.
As shown in FIG. 6B, the printed circuit board insulating spacer 20 has a body portion 25 that is square in a side view.
As shown in FIG. 6C, the printed circuit board insulating spacer 20 has a hemispherical protrusion 24 at the center of the bottom surface 23 that protrudes in a direction to contact the printed circuit board 3 at the bottom in FIG. It is formed in a hemispherical shape.

  Since the printed circuit board insulating spacer 20 has the hemispherical protrusion 22 at the center of the non-recessed top surface 21 for contacting the case 2, the non-contact surface that does not contact the case 2 on the outer periphery of the top surface 21. 26 is formed. Similarly to the top surface 21, the bottom surface 23 has a hemispherical protrusion 24 that contacts the printed circuit board 3 at the center, and therefore, a non-contact surface 27 that does not contact the printed circuit board 3 is formed on the outer periphery of the bottom surface 23. Is done.

FIG. 7A shows a side view of the first step during the automatic mounting joining of the printed board insulating spacer 20, and FIG. 7B shows the second step during the automatic mounting joining of the printed board insulating spacer 20. FIG. FIG. 7C shows a side view of the third step at the time of automatic mounting joining of the printed board insulating spacer 20.
In the first step shown in FIG. 7A, an epoxy adhesive 8 is applied to a predetermined mounting position on the surface of the printed circuit board 3 by a dispenser. The epoxy adhesive 8 has an outer diameter equivalent to the outer diameter of the trunk portion 25 of the printed board insulating spacer 20. A printed circuit board insulating spacer 20 is disposed above the printed circuit board 3.

  In the second step shown in FIG. 7B, the printed circuit board insulating spacer 20 is lowered from above the printed circuit board 3 toward the mounting position. Then, as the printed circuit board insulating spacer 20 is lowered with respect to the printed circuit board 3, the central hemispherical protrusion 24 of the bottom surface 23 is brought into contact with the epoxy adhesive 8, so that the space between the bottom surface 23 and the printed circuit board 3 is increased. The hemispherical protrusion 24 at the center of the bottom surface 23 is brought into contact with the printed circuit board 3 while extruding the air existing in the outside. Therefore, the epoxy adhesive 8 is pushed out to the non-contact surface 27 side of the outer periphery of the bottom surface 23 of the printed board insulating spacer 20.

  In the third step shown in FIG. 7C, the lowering of the printed circuit board insulating spacer 20 to the printed circuit board 3 is completed, whereby the outer periphery of the bottom surface 23 of the printed circuit board insulating spacer 20 is on the non-contact surface 27 side. The epoxy adhesive 8 that has been extruded is cured, and the printed circuit board insulating spacer 20 is bonded to the printed circuit board 3 by the epoxy adhesive 8.

  In the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the second embodiment of the present invention, the printed circuit board insulating spacer 20 is a hemisphere that contacts the printed circuit board 3 at the center of the bottom surface 23 thereof. Since the protrusion 24 is provided, a non-contact surface 27 that does not contact the printed circuit board 3 is formed on the outer periphery of the bottom surface 23.

  Therefore, in the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the second embodiment of the present invention, the bottom surface 23 of the printed circuit board insulating spacer 20 is epoxy bonded to the flow surface of the printed circuit board 3. When being joined by the agent 8, the hemispherical protrusion 24 at the center of the bottom surface 23 is in contact with the epoxy adhesive 8 and pushes the air interposed between the bottom surface 23 and the printed circuit board 3 outward. Abutted against the printed circuit board 3. Then, since the epoxy adhesive 8 is pushed out to the non-contact surface 27 side of the outer periphery of the bottom surface 23 of the printed board insulating spacer 20, the epoxy adhesive 8 is bonded without air entering the printed board 3. Can be joined without losing strength.

(Third embodiment)
Next, a printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the third embodiment of the present invention will be described.
FIG. 8 is an external perspective view of the printed board insulating spacer of the third embodiment according to the present invention and the printed board insulating spacer in the printed board unit provided with the printed board insulating spacer, as viewed obliquely from above.
As shown in FIG. 8, the printed circuit board insulating spacer 30 is provided with a cylindrical protrusion 32 on the top surface 31 that contacts the case 2 and a cylindrical protrusion 34 on the bottom surface 33 joined to the printed circuit board 3. Yes. In the present embodiment, the bottom surface 33 of the printed board insulating spacer 30 is bonded to the printed board 3.

9A is a plan view of the printed board insulating spacer 30, FIG. 9B is a side view of the printed board insulating spacer 30, and FIG. 9C is a bottom view of the printed board insulating spacer 30. The figure is shown.
As shown in FIG. 9A, the printed circuit board insulating spacer 30 has a cylindrical protrusion 32 that protrudes in the direction of contacting the case 2 by cutting the outer periphery of the top surface 31 in a stepped shape. Formed.
As shown in FIG. 9B, the printed board insulating spacer 30 has a body portion 35 that is square in a side view.
As shown in FIG. 9C, the printed circuit board insulating spacer 30 has a cylindrical protrusion 34 that protrudes in a direction in which the cylindrical protrusion 34 abuts the printed circuit board 3 by cutting the outer periphery of the bottom surface 33 into a stepped shape. Formed.

FIG. 10 shows a normal view after mounting the printed board insulating spacer 30 on the printed board 3.
As shown in FIG. 10, the printed circuit board insulating spacer 30 is lowered with respect to the printed circuit board 3 to which the epoxy adhesive 8 is applied at a predetermined mounting position on the surface, and the cylindrical projection 34 on the bottom surface 33 is formed of the epoxy. The cylindrical protrusion 34 at the center of the bottom surface 33 is brought into contact with the printed circuit board 3 while pushing out the air, which is in contact with the adhesive 8 and is interposed between the bottom surface 33 and the printed circuit board 3 to the outside. As a result, the printed circuit board insulating spacer 30 is bonded to the printed circuit board 3 by curing the epoxy adhesive 8 that has been pushed to the outer periphery from the cylindrical protrusion 34 at the center of the bottom surface 33. At this time, even if the lateral stress F indicated by the arrow in FIG. 10 is applied to the printed circuit board insulating spacer 30, the printed circuit board insulating spacer 30 is pushed out to the outer periphery from the central cylindrical protrusion 34 of the bottom surface 33. Since it is firmly bonded to the printed circuit board 3 by the epoxy adhesive 8, it can sufficiently withstand the lateral stress F.

(Fourth embodiment)
Next, a printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the fourth embodiment of the present invention will be described.
FIG. 11 is an external perspective view of the printed circuit board insulating spacer and the printed circuit board insulating spacer of the fourth embodiment according to the present invention as viewed obliquely from above.

  As shown in FIG. 11, the printed circuit board insulating spacer 40 has a cross-shaped protrusion 42 on the top surface 41 that contacts the case 2 and a cross-shaped protrusion 44 on the bottom surface 43 joined to the printed circuit board 3. Provided. In the present embodiment, the bottom surface 43 of the printed circuit board insulating spacer 40 is bonded to the printed circuit board 3.

12A is a plan view of the printed board insulating spacer 40, FIG. 12B is a side view of the printed board insulating spacer 40, and FIG. 12C is a bottom view of the printed board insulating spacer 40. The figure is shown.
As shown in FIG. 12 (A), the printed board insulating spacer 40 has its cross-shaped protrusion 42 cut into a semi-cylindrical shape at four locations so that the outer periphery of the top surface 41 is divided into four. It is formed in a protruding shape that is convex in the direction of contacting the case 2.
As shown in FIG. 12B, the printed circuit board insulating spacer 40 has a body 45 having a square shape in a side view.
As shown in FIG. 12C, the printed circuit board insulating spacer 40 is printed by cutting the cross-shaped projection 44 into a semi-cylindrical shape at four locations so that the outer periphery of the bottom surface 43 is divided into four. It is formed in a protruding shape that is convex in the direction in contact with the substrate 3.

  The printed circuit board insulating spacer 40 is lowered with respect to the printed circuit board 3 to which the epoxy adhesive 8 is applied at a predetermined mounting position on the surface, and the cross-shaped protrusion 44 on the bottom surface 43 contacts the epoxy adhesive 8. As a result, the cross-shaped protrusion 44 at the center of the bottom surface 43 is brought into contact with the printed circuit board 3 while pushing the air interposed between the bottom surface 43 and the printed circuit board 3 outward. As a result, the printed circuit board insulating spacer 40 is firmly bonded to the printed circuit board 3 by curing the epoxy adhesive 8 that has been pushed to the outer periphery from the cross-shaped protrusion 44 at the center of the bottom surface 43.

(Fifth embodiment)
Next, a printed circuit board unit including the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the fifth embodiment of the present invention will be described.
FIG. 13 shows an external perspective view of the printed circuit board insulating spacer in the fifth embodiment according to the present invention and the printed circuit board insulating spacer in the printed circuit board unit provided with the printed circuit board insulating spacer as viewed obliquely from below.

  As shown in FIG. 13, the printed board insulating spacer 50 has a flat top surface 51 that is in contact with the case 2, and a cylindrical protrusion 53 on a bottom surface 52 that is joined to the printed board 3. . In the present embodiment, the bottom surface 52 of the printed circuit board insulating spacer 50 is bonded to the printed circuit board 3.

14A is a plan view of the printed board insulating spacer 50, FIG. 14B is a side view of the printed board insulating spacer 50, and FIG. 14C is a bottom view of the printed board insulating spacer 50. The figure is shown.
As shown in FIG. 14A, the printed board insulating spacer 50 is a flat surface in which the top surface 51 is not recessed.
As shown in FIG. 14B, the printed board insulating spacer 50 has a body portion 54 that is square in a side view.
As shown in FIG. 14 (C), the printed board insulating spacer 50 has a cylindrical protrusion 53 that protrudes in a direction in which the cylindrical protrusion 53 abuts the printed board 3 by cutting the outer periphery of the bottom surface 52 into a stepped shape. Formed.

FIG. 15 shows a normal view after mounting the printed board insulating spacer 50 on the printed board 3.
As shown in FIG. 15, the printed circuit board 3 is formed with a hole 9 for inserting the cylindrical protrusion 53 of the printed circuit board insulating spacer 50. The printed circuit board insulating spacer 50 is lowered with respect to the printed circuit board 3 on which the epoxy adhesive 8 is applied at a predetermined mounting position on the surface including the hole 9, and the cylindrical protrusion 53 on the bottom surface 52 is formed on the printed circuit board 3. It is brought into contact with the epoxy adhesive 8 while being inserted into the hole 9. At this time, the epoxy adhesive 8 is interposed so as to wrap around the cylindrical protrusion 53 on the bottom surface 52 of the printed board insulating spacer 50.

  The printed circuit board insulating spacer 50 is bonded to the printed circuit board 3 by curing the epoxy adhesive 8 that has entered the cylindrical projection 53 at the center of the bottom surface 52. At this time, the printed circuit board insulating spacer 50 is applied to the printed circuit board 3 including the epoxy adhesive 8 that wraps around the cylindrical protrusion 53 at the center of the bottom surface 52 even if a lateral stress F indicated by an arrow in FIG. Since it is firmly joined, it can sufficiently withstand the lateral stress F.

  In the printed board insulating spacer 50 and the printed board insulating spacer 50 according to the fifth embodiment of the present invention, the printed board insulating spacer 50 has a cylindrical protrusion 53 on the bottom surface 52 in the hole 9 of the printed board 3. By being brought into contact with the epoxy adhesive 8 while being inserted into the substrate, the epoxy adhesive 8 is interposed so as to wrap around the cylindrical protrusion 53 on the bottom surface 52 of the printed board insulating spacer 50.

  Therefore, in the printed circuit board unit provided with the printed circuit board insulating spacer and the printed circuit board insulating spacer according to the fifth embodiment of the present invention, the printed circuit board insulating spacer 50 has the center of the bottom surface 52 even if lateral stress F is applied. Since it is firmly bonded to the printed circuit board 3 by the epoxy adhesive 8 that wraps around the cylindrical protrusion 53, it can sufficiently withstand the lateral stress F.

  The case, the printed circuit board, the electronic component, the surface mounting component, etc. in the printed circuit board insulation spacer and the printed circuit board insulation spacer of the present invention are not limited to the above-described embodiments, and are appropriately selected. Various modifications and improvements are possible.

1 Printed Circuit Board Unit 3 Printed Circuit Board 8 Epoxy Adhesive 9 Hole 10, 20, 30, 40, 50 Printed Circuit Board Insulating Spacer 32, 34, 53 Cylindrical Projection (Protrusion)
42,44 Cross-shaped protrusion (protrusion)

Claims (7)

A printed circuit board insulating spacer that has at least a non-recessed surface for contacting the printed circuit board, and is attached to the back surface of the printed circuit board so as to have a desired distance between the back surface of the printed circuit board and the case. ,
A printed circuit board insulating spacer that has an insulating performance, has a heat resistant temperature of 240 ° C. or higher, and does not deform by flow soldering. The printed circuit board insulating spacer according to claim 1,
A printed circuit board insulating spacer provided with a surface that does not contact the printed circuit board on an outer periphery of the non-recessed surface for contacting the printed circuit board. In the printed circuit board insulating spacer according to claim 1 or 2,
A printed board insulating spacer provided with a protrusion at the center of the surface in contact with the printed board. The printed circuit board insulating spacer according to any one of claims 1 to 3,
A spacer for insulating a printed circuit board, wherein the shape of the surface on the opposite side of the surface contacting the printed circuit board is the same shape as the surface contacting the printed circuit board. The printed circuit board insulating spacer according to any one of claims 1 to 4,
Printed circuit board insulation spacer that is mounted on the inserter mounting device in the same way as surface mount components.   A printed circuit board unit in which the printed circuit board insulating spacer according to claim 1 is joined to the printed circuit board with an epoxy adhesive. A hole for inserting the protrusion of the printed board insulating spacer according to claim 3 is provided in the printed board,
A printed circuit board unit bonded to the printed circuit board with an epoxy adhesive so that the protrusions of the printed circuit board insulating spacer and the holes are fitted.

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