JPH03167813A - Metallized film capacitor - Google Patents
Metallized film capacitorInfo
- Publication number
- JPH03167813A JPH03167813A JP1308623A JP30862389A JPH03167813A JP H03167813 A JPH03167813 A JP H03167813A JP 1308623 A JP1308623 A JP 1308623A JP 30862389 A JP30862389 A JP 30862389A JP H03167813 A JPH03167813 A JP H03167813A
- Authority
- JP
- Japan
- Prior art keywords
- metallized film
- lead terminal
- film capacitor
- lead
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 42
- 239000011104 metalized film Substances 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000005507 spraying Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、樹脂ケースに収納した金属化フイルムコンデ
ンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metallized film capacitor housed in a resin case.
従来の技術
電子部品のプリント基板への自動挿入、効率化が進む中
で、金属化フイルムコンデンサにおいても、引出リード
端子のピッチ寸法および引出位置の精度は重要な課題に
なっている。BACKGROUND OF THE INVENTION As automatic insertion of electronic components into printed circuit boards becomes more efficient, the precision of the pitch dimension and position of lead terminals for metallized film capacitors has become an important issue.
従来の金属化フィルムコンデンサは、第9図〜第11図
のように金属化プラスチックフイルムを巻回してコンデ
ンサ素子1を形成し、その両端面にメタリコン金属を溶
射して電極金属層2を形或し、該電極金属層2の外面に
引出リード端子3を溶接し、樹脂ケース4に収納し、樹
脂6を注入し、硬化して製作されていた。In conventional metallized film capacitors, as shown in FIGS. 9 to 11, a capacitor element 1 is formed by winding a metallized plastic film, and electrode metal layers 2 are formed by spraying metallicon metal on both end faces of the capacitor element 1. However, the lead terminal 3 was welded to the outer surface of the electrode metal layer 2, housed in a resin case 4, and resin 6 was injected and hardened.
発明が解決しようとする問題点
しかし、上述の従来の金属化フィルムコンデンサにおい
ては、樹脂ケース4の中でコンデンサ素子1が第10図
のように片側にずれたり、第11図のように傾いたりし
て、引出リード端子3の位置にずれが生じ、プリント基
板に自動挿入することが困難であった。Problems to be Solved by the Invention However, in the conventional metallized film capacitor described above, the capacitor element 1 may shift to one side as shown in FIG. 10 or tilt as shown in FIG. 11 within the resin case 4. As a result, the position of the lead terminal 3 is misaligned, making it difficult to automatically insert it into the printed circuit board.
また、樹脂ケースの片側にずれると引出リード端子3が
樹脂ケース4の開口端内側に接触するため、注入された
樹脂6が硬化するまでに表面張力により第11図矢印の
ように樹脂ケースの外側面に流出するなどの問題があっ
た。In addition, if the lead terminal 3 is shifted to one side of the resin case, it will come into contact with the inside of the open end of the resin case 4, so by the time the injected resin 6 hardens, the surface tension will cause the outside of the resin case to move as shown by the arrow in Figure 11. There were problems such as leakage to the sides.
問題点を解決するための手段
本発明は上述の問題を解決するため、金属化フィルムコ
ンデンサ素子の両端面にメタリコン金属を溶射して電極
金属層を形成し、該電極金属層の1/2以下の下方外面
に引出リード端子の一端部を接続し、該引出リード端子
の他方は対極の引出リード端子に対して逆ハの字形で、
かつその中間の位置にリード間隔が狭くなるよう折曲部
を形威し、樹脂ケースの内側面に沿って上記引出リード
端子を滑らせて、金属化フィルムコンデンサ素子を樹脂
ケースに収納し、樹脂注入し、硬化したことを特徴とす
る金属化フィルムコンデンサである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention forms an electrode metal layer by thermally spraying metallicon metal on both end faces of a metallized film capacitor element, and forms an electrode metal layer with a thickness of 1/2 or less of the electrode metal layer. One end of the lead terminal is connected to the lower outer surface of the lead terminal, and the other end of the lead terminal is in an inverted V shape with respect to the opposite lead terminal.
Then, a bent part is formed in the middle position so that the lead interval becomes narrower, and the lead terminal is slid along the inner surface of the resin case, and the metallized film capacitor element is housed in the resin case. A metallized film capacitor characterized by being poured and cured.
また、 上記引出リード端子の電極金属層との接続箇所
と折曲部との間に上記樹脂ケースと接触する湾曲部を形
成したことを特徴とする金属化フィルムコンデンサであ
る。Further, the metallized film capacitor is characterized in that a curved portion that contacts the resin case is formed between the connecting portion of the lead terminal to the electrode metal layer and the bent portion.
作用
本発明は上述の構成によって、コンデンサ素子を樹脂ケ
ース内に収納したとき、引出リード端子が樹脂ケースの
内側面に沿って、コンデンサ素子が垂直方向に挿入され
ると共に、バネ性を有する逆八の字形の引出リード端子
の折曲部の寸法AおよびBがガイド溝の接触位置から常
に一定となり、端子間隔もバラツキの少ない精度の高い
寸法が得られる。According to the above-described structure, when the capacitor element is housed in the resin case, the lead terminal is inserted in the vertical direction along the inner surface of the resin case, and the capacitor element is inserted vertically along the inner surface of the resin case. Dimensions A and B of the bent portion of the square-shaped pull-out lead terminal are always constant from the contact position of the guide groove, and highly accurate dimensions with little variation in terminal spacing can be obtained.
実施例
以下、本発明を第1図〜第7図に示す金属化フィルムコ
ンデンサについて説明する。EXAMPLES The present invention will now be described with reference to metallized film capacitors shown in FIGS. 1 to 7.
まず、第1図のようにポリブOピレン、ポリエステルな
どのプラスチックフィルムに7ルミニウム、亜鉛などの
金属を蒸着して金属化フィルムを形成し、これを対向さ
せてコンデンサ素子1を形或し、その両端面にはんだな
どのメタリコン金属を溶射して電極金属層2を形成し、
該電極金属層の1/2以下の下方外面(第2図((2)
における34Lの位置)に引出リード端子3の一端部を
溶接、はんだ付けなどにより接続し、次いで第2図のよ
うに引出リード端子3の他方は対極の引出リード端子3
に対して逆八の字形でかつその中間の位置にリード間隔
が狭くなるよう折曲部3aを形成する。First, as shown in Fig. 1, metals such as 7-luminium and zinc are deposited on a plastic film such as polypropylene or polyester to form a metallized film, and the capacitor element 1 is formed by facing each other. An electrode metal layer 2 is formed by spraying metallicon metal such as solder on both end faces,
The lower outer surface of 1/2 or less of the electrode metal layer (Figure 2 ((2)
34L position) by welding, soldering, etc., and then connect the other end of the lead terminal 3 to the opposite lead terminal 3 as shown in FIG.
A bent portion 3a is formed in an inverted figure-eight shape and at a position in the middle thereof so that the lead interval becomes narrower.
このとき、寸法AおよびBは一定に折曲げられる。At this time, dimensions A and B are bent to a constant value.
そして第3図のようにポリエステル、ポリブチレンテレ
フタレートなどの熱可塑性樹脂ケース3の内側面に形成
したガイド溝5に上記引出リード端子3を滑らせ、金属
化フィルムコンデンサ素子1を第4図のように樹脂ケー
ス4内に収納する。このとき、折曲部3aの寸法Aおよ
びBは樹脂ケース4の溝から一定の寸法に位置し、かつ
互いに2本の引出リード端子3は樹脂ケース4からほぼ
平行に引出される。そしてエポキシ樹脂、ポリウレタン
樹脂などの熱硬化性樹脂6を注入し、硬化して完成する
。Then, as shown in FIG. 3, the above-mentioned lead terminal 3 is slid into the guide groove 5 formed on the inner surface of the thermoplastic resin case 3 made of polyester, polybutylene terephthalate, etc., and the metallized film capacitor element 1 is inserted as shown in FIG. It is stored in the resin case 4. At this time, the dimensions A and B of the bent portion 3a are located at a constant distance from the groove of the resin case 4, and the two lead terminals 3 are drawn out from the resin case 4 substantially parallel to each other. Then, a thermosetting resin 6 such as epoxy resin or polyurethane resin is injected and cured to complete the process.
第5図は他の実施例で、コンデンサ素子1の電極金属層
2に引出リード端子を接続する前に予め湾曲部3bを形
成しておき、溶接、はんだなどで接続した後、上述の実
施例と同様に逆八の字形でかつ折曲部3aを形成し、樹
脂ケース4に収納できる。なお、この場合コンデンサ素
子の電極金属層2との間に寸法の余裕があるコンデンサ
は第6図のように収納でき、余裕の少ないコンデンサは
第7図のようにガイド溝5に接触した湾曲部3bが伸張
して第7図のように収納できる。FIG. 5 shows another embodiment in which a curved portion 3b is formed in advance before connecting the lead terminal to the electrode metal layer 2 of the capacitor element 1, and after the connection is made by welding, soldering, etc., the above-mentioned embodiment is applied. Similarly, it has an inverted figure-eight shape and a bent portion 3a, and can be housed in a resin case 4. In this case, capacitors with a dimensional margin between the electrode metal layer 2 of the capacitor element and the electrode metal layer 2 can be stored as shown in FIG. 3b can be extended and stored as shown in Figure 7.
いずれの場合においても上述の折曲部3aの寸法(A%
BまたはE%FもしくはC%O)がガイド溝から一定の
位置に製作でき、コンデンサの引出リード端子3のピッ
チ寸法のバラツキが少ない位置に構成できる。In either case, the above-mentioned dimensions of the bent portion 3a (A%
B or E%F or C%O) can be manufactured at a constant position from the guide groove, and the lead terminals 3 of the capacitor can be configured at positions with little variation in pitch dimension.
表は、上述の実施例に基づいて製作した定格250 V
%0. 2244 Fの金属化フィルムコンデンサの第
8図に示す各部の寸法を測定した結果を示し、本発明品
は寸法バラツキの少ないことが実証された。The table shows the rated 250 V manufactured based on the above example.
%0. The results of measuring the dimensions of each part shown in FIG. 8 of a 2244 F metallized film capacitor are shown, and it was demonstrated that the product of the present invention has little dimensional variation.
n=50
なお、上述の実施例は、ガイド溝5を樹脂ケース4内に
設けた場合について述べたが、第11図のようなコンデ
ンサ素子の傾きを防止するためにリード線をテーピング
したものやリード線クランブ治具を用いる場合など製造
方法によっては、ガイド溝5を省略してもよい。n=50 In the above embodiment, the guide groove 5 was provided in the resin case 4, but it is also possible to use a case where the lead wire is taped to prevent the capacitor element from tilting as shown in FIG. Depending on the manufacturing method, such as when using a lead wire clamp jig, the guide groove 5 may be omitted.
発明の効果
以上のように本発明の金属化フィルムコンデンサは寸法
精度が高くプリント基板への自動挿入が容易になり、生
産性向上に大きく寄与し、工業的ならびに実用的価値の
大なるものである。Effects of the Invention As described above, the metallized film capacitor of the present invention has high dimensional accuracy, facilitates automatic insertion into printed circuit boards, greatly contributes to improved productivity, and has great industrial and practical value. .
第1図〜第7図は本発明に係る金属化フィルムコンデン
サの実施例で、第1図および第2図(イ)はコンデンサ
素子の正面図、第2図((2)はコンデンサ素子の側面
図、第3図は樹脂ケースの斜視図、第4図は金属化フィ
ルムコンデンサの断面図、第5図はコンデンサ素子の正
面図、第6図および第7図は各々異なる金属化フィルム
コンデンサ素子の断面図、第8図は金属化フィルムコン
デンサの平面図、第9図〜第11図は従来のコンデンサ
素子の斜視図、第10図および第11図は従来の金属化
フィルムコンデンサの断面図である。
1:コンデンサ素子 2:電極金属層
3:引出リード端子 3a:折曲部
3b:湾曲部 4=樹脂ケース
5:ガイド溝 6:樹脂Figures 1 to 7 show examples of the metallized film capacitor according to the present invention. Figures 1 and 2 (a) are front views of the capacitor element, and Figure 2 (2) is a side view of the capacitor element. Figure 3 is a perspective view of the resin case, Figure 4 is a sectional view of the metallized film capacitor, Figure 5 is a front view of the capacitor element, and Figures 6 and 7 are of different metallized film capacitor elements. 8 is a plan view of a metallized film capacitor, FIGS. 9 to 11 are perspective views of a conventional capacitor element, and FIGS. 10 and 11 are sectional views of a conventional metalized film capacitor. 1: Capacitor element 2: Electrode metal layer 3: Output lead terminal 3a: Bent part 3b: Curved part 4 = Resin case 5: Guide groove 6: Resin
Claims (2)
コン金属を溶射して電極金属層を形成し、該電極金属層
の1/2以下の下方外面に引出リード端子の一端部を接
続し、該引出リード端子の他方は対極の引出リード端子
に対して逆ハの字形で、かつその中間の位置にリード間
隔が狭くなるよう折曲部を形成し、樹脂ケースの内側面
に沿って上記引出リード端子を滑らせて、金属化フィル
ムコンデンサ素子を樹脂ケースに収納し、樹脂注入し、
硬化したことを特徴とする金属化フィルムコンデンサ。(1) Form an electrode metal layer by thermally spraying metallicon metal on both end faces of a metallized film capacitor element, connect one end of the drawer lead terminal to the lower outer surface of 1/2 or less of the electrode metal layer, and The other lead terminal has an inverted V-shape with respect to the counter lead terminal, and a bent part is formed in the middle position to narrow the lead interval, and the lead terminal is bent along the inner surface of the resin case. The metallized film capacitor element is placed in a resin case, resin is injected,
A metallized film capacitor characterized by being hardened.
曲部との間に上記樹脂ケースの内側面と接触する湾曲部
を形成したことを特徴とする特許請求項1記載の金属化
フィルムコンデンサ。(2) A metallized film according to claim 1, characterized in that a curved part that contacts the inner surface of the resin case is formed between the connection point of the electrode metal layer of the extraction lead terminal and the bent part. capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1308623A JP2758946B2 (en) | 1989-11-27 | 1989-11-27 | Metallized film capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1308623A JP2758946B2 (en) | 1989-11-27 | 1989-11-27 | Metallized film capacitors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03167813A true JPH03167813A (en) | 1991-07-19 |
JP2758946B2 JP2758946B2 (en) | 1998-05-28 |
Family
ID=17983278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1308623A Expired - Fee Related JP2758946B2 (en) | 1989-11-27 | 1989-11-27 | Metallized film capacitors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2758946B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567540A (en) * | 1991-09-05 | 1993-03-19 | Shinei Kk | Film capacitor |
JP2006216756A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Case-molded capacitor and its manufacturing method |
JP2008205074A (en) * | 2007-02-19 | 2008-09-04 | Matsushita Electric Ind Co Ltd | Film capacitor |
JP2013125910A (en) * | 2011-12-15 | 2013-06-24 | Shizuki Electric Co Inc | Capacitor |
JP2014086661A (en) * | 2012-10-26 | 2014-05-12 | Toyota Motor Corp | Metalization film capacitor |
WO2022009681A1 (en) * | 2020-07-07 | 2022-01-13 | パナソニックIpマネジメント株式会社 | Capacitor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11335508B2 (en) | 2018-12-25 | 2022-05-17 | Tdk Corporation | Electronic device |
-
1989
- 1989-11-27 JP JP1308623A patent/JP2758946B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567540A (en) * | 1991-09-05 | 1993-03-19 | Shinei Kk | Film capacitor |
JP2006216756A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Case-molded capacitor and its manufacturing method |
JP4552676B2 (en) * | 2005-02-03 | 2010-09-29 | パナソニック株式会社 | Manufacturing method of case mold type capacitor |
JP2008205074A (en) * | 2007-02-19 | 2008-09-04 | Matsushita Electric Ind Co Ltd | Film capacitor |
JP2013125910A (en) * | 2011-12-15 | 2013-06-24 | Shizuki Electric Co Inc | Capacitor |
JP2014086661A (en) * | 2012-10-26 | 2014-05-12 | Toyota Motor Corp | Metalization film capacitor |
WO2022009681A1 (en) * | 2020-07-07 | 2022-01-13 | パナソニックIpマネジメント株式会社 | Capacitor |
Also Published As
Publication number | Publication date |
---|---|
JP2758946B2 (en) | 1998-05-28 |
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