JP2636679B2 - Surface mount components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component used for various electronic devices and a method for manufacturing the same.

[0002]

2. Description of the Related Art A typical conventional surface mount component has a structure and a manufacturing method as shown in FIG.

[0003] That is, as shown in FIG. 4 (a), a terminal plate 3 formed by punching a metal hoop 2 is connected to an electronic component element 1 such as a coil, a resistor, a capacitor, etc. by bending and connecting it. 4 and the exterior resin is injected into the molding die 4 to form an exterior 5 as shown in FIG.
The terminal plate 3 pulled out in parallel with the bottom surface of the exterior 5 is shown in FIG.
FIG. 4C shows a state in which the terminal plate 3 is cut off at the position indicated by the broken line in FIG. This was the surface mount component shown in FIG.

That is, this surface mount component has a bottom terminal portion 3a on the bottom surface of the exterior 5 and a side terminal portion 3b on the side surface of the exterior 5.
, And two terminal plates 3 having the above configuration.

In such a configuration, when molding the exterior 5, the exterior resin adheres to the surface of the bottom terminal portion 3 a of the terminal plate 3 to form burrs, which greatly impairs the solderability at the time of surface mounting. And deburring work was required, resulting in poor productivity.

After the terminal plate 3 is cut from the metal hoop 2, the terminal plate 3 is bent to the side with the corner of the exterior 5 as a fulcrum.
In this case, the bend does not become a right angle due to the spring back of the terminal plate 3 or the like, and the side terminal portion 3b floats from the side surface of the exterior 5 or the bottom terminal portion 3a floats from the bottom surface of the exterior 5 to be a surface mount component. And the solderability during mounting was also a major issue.

In view of the above, it is conceivable to construct the molding die 6 so that the terminal plate 3 is pulled out vertically from the bottom surface of the exterior 5 as shown in FIG. It is required that the lead portion of the terminal plate 3 be high-precision, and the metal hoop 2 also needs to be bent in a direction perpendicular to the terminal plate 3 in advance. There was a problem that it could not be bent at a right angle.

Further, as shown in FIGS. 6 (a) to 6 (d),
After the terminal plate 3 integrated with the metal hoop 2 is pulled out from the side surface of the exterior 5 and the terminal plate 3 is cut from the metal hoop 2 to a predetermined size and separated, the terminal plate 3 is bent at a right angle. Fold along the exterior 5 to make the bottom terminal portion 3a and the side terminal portion 3
A method for forming b is also considered.

[0009]

According to the above-mentioned method, a molding die that has been subjected to high-precision processing is not required. However, after cutting and separating from the metal hoop 2, FIG.
As shown in (c), since the terminal plate 3 is bent at a right angle, the terminal plate 3 cannot be bent at a perfect right angle. This has caused problems in the solderability at the time of mounting due to being lifted up, and has been inferior in quality as a surface mount component.

SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned drawbacks of the prior art and to provide a surface-mounted component having high quality and excellent productivity, and a method of manufacturing the same.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an electronic component element and a method of coating the electronic component element.
And a terminal board pulled out from the bottom of the exterior.
The exterior is provided with terminal receiving recesses on both side surfaces and a bottom surface.
Wherein the terminal plate includes a bottom terminal portion and the bottom terminal portion.
From, the end of the exterior side surface orthogonal to the bottom terminal portion
A side terminal protruding in the direction of the child housing recess,
The surface terminal portion protrudes from the terminal storage recess on the exterior bottom surface.
At the same time,
So that the side terminal portion is
Bent along the terminal storage recess, the bottom of the terminal plate
The outer surface and the bottom surface of the exterior are flush with each other.

[0012]

According to the above construction , the terminal plate is formed by the side terminal portion and the bottom surface.
With terminal part, connect terminal board to metal hoop
When connecting the bottom terminal and the metal hoop,
Parts need not be connected to the metal hoop,
Fold the side terminals in advance while connected to the
Can be bent, improving the accuracy of folding, terminal storage recess on the side of the exterior
Be sure to bend the side terminals so that
Can improve the solderability.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a surface mount component according to an embodiment of the present invention.

1 (a) to 1 (c), reference numeral 10 denotes an exterior in which electronic component elements are resin-molded, and three terminal plates 11, 12, 13 are drawn out from a bottom surface 10a of the exterior 10. As shown in FIG. The exterior 10 from which the terminal plates 11 to 13 are drawn out
A terminal housing recess 14 is formed on the bottom surface of the exterior 10.
Bottom surface 1 of both side surfaces 10b and 10c adjacent to the bottom surface 10a
A terminal housing recess 15 is also formed on the 0a side.

Further, the terminal plates 11 to 13 are drawn out from the bottom surface 10a of the exterior 10 and bent, are accommodated in the terminal accommodating recess 14 of the bottom surface 10a, and are connected to the bottom surfaces of the terminal plates 11 to 13 and the bottom surface 10a of the exterior 10. Are configured to be flush. The terminal plates 11 and 13 located at both ends of the bottom surface 10a of the exterior 10 project in one direction orthogonal to the bottom terminal portions 11a and 13a which are bent and housed in the terminal housing recesses 14 of the bottom surface 10a. The side surface 10 is bent at a right angle in advance and bent along the bottom surface 10a.
b, 10c are provided with side surface terminal portions 11b, 13b that fit into the terminal storage recesses 15 of 10c.

A method for manufacturing such a surface mount component will be described with reference to FIGS. As shown in FIG. 2A, a metal hoop 16 is punched to form terminal plates 11 to 13, and electronic component elements are connected to the distal ends of the terminal plates 11 to 13, and this is divided into upper and lower split mold metal. The package is set in a mold, and a part of the electronic component element and the terminal plates 11 to 13 is molded with a package resin to form a package 10. At this time, the terminal plates 11 to 13 drawn out of the exterior 10 are drawn out from the mold mating surface of the molding die.

At this time, the terminal plates 11 and 13 extending from both ends of the bottom surface 10a of the exterior 10 are connected to the terminal plates 11,
13 are integrally provided with projections 17 orthogonal to the drawing direction.

Next, as shown in FIG.
While being connected to 6, the protruding portions 17 of the terminal plates 11, 13 are bent at right angles using a press die or the like.

Subsequently, as shown in FIG. 2C, each of the terminal plates 11 to 13 is cut off from the metal hoop 16 to a predetermined length and separated. Finally, as shown in FIG. 2 (d), the terminal housing recesses 14 provided with the terminal plates 11 to 13 drawn from the bottom surface 10 a of the exterior 10 on the bottom surface 10 a of the exterior 10 and the exterior 1.
It is bent so as to be accommodated in the terminal accommodating recess 15 on the 0 side surface. That is, the projecting portions 17 of the terminal plates 11 and 13 are formed by bending the terminal plates 11 and 13 along the terminal receiving recesses 14 on the bottom surface 10a.
5 will be stored.

As described above, the terminal plates 11 and 13 are
Bottom terminal portions 11a, 13a and side terminal portions 11b, 13b
Will be provided.

As described above, in a state where the side terminal portions 11b, 13b of the terminal plates 11 and 13 are connected to the metal hoop 16 with respect to the bottom surface terminal portions 11a, 13a,
6 can be bent at a right angle, so that the bending accuracy can be made high.
a, a terminal surface flush with both side surfaces 10b and 10c can be obtained.

Therefore, the surface mount component shown in FIG. 1 can have extremely excellent solderability at the time of mounting, and can be extremely stable in external form.

Next, another embodiment will be described with reference to FIGS.
This will be described with reference to FIG. The one shown in FIG. 3 is the same as the one shown in FIG.
As shown in FIG.
The metal hoop 16 is punched out from the bottom surface 10a side of the side surfaces 10b and 10c of the terminal plates 11 and 1c.
3 is provided in one direction orthogonal to the pull-out direction, and as shown in FIG. 3B, the protrusion 17 is bent at a right angle with respect to the metal hoop 16 as shown in FIG. c)
After being cut and separated from the metal hoop 16 as shown in FIG.
The terminal plate 12 is bent so as to fit into the terminal storage recess 14 on the bottom surface 10a.

Due to the bending of the terminal plates 11 and 13, the projecting portions 17 of the terminal plates 11 and 13 fit into the terminal storage recesses 14 provided on the bottom surface of the exterior 10, and the bottom terminal portions 11a and 13a of the terminal plates 11 and 13 are provided. Is configured.

In this configuration and method, the terminal plate 1
Since the metal hoop 16 can be used as a reference to bend the projections 17 of the first and the right 13 at a right angle, the bending accuracy is increased, and the fitting into the terminal storage recesses 15 and 14 due to the bending is also high as a result. And high quality surface mount components.

[0026]

As described above, according to the surface mount component and the method of manufacturing the same of the present invention, a complicated molding die is not required, no burrs are formed on the terminal plate at the time of molding, and the terminal plate is formed. The bending accuracy of the side terminals with respect to the bottom terminals to increase the soldering area and increase the mounting strength is also high, and it can be formed flush with the bottom and side surfaces of the exterior, and has excellent solderability during mounting Has the advantage that it can be
It is of great industrial value.

Further , the side terminal portion is located at a position opposite to the bottom terminal portion.
To make it orthogonal, and to the terminal storage recess direction on the exterior side
And make the bottom terminal part of the exterior bottom
Protrude from the terminal storage recess, bend along this,
Fold the side terminal along the terminal recess on the exterior side
Spring back at the bottom terminals
May occur, but in the side terminals,
There is no possibility of springback.

That is, on the bottom side of the exterior,
Even if springback occurs, the terminal board
Springback does not occur, so the side edge of the exterior side
It is possible to further improve the solderability when mounting
it can.

Further, the bottom surface of the terminal plate and the bottom surface of the exterior are flush with each other.
The terminal board spring
Even if backing occurs, spring back
Occurs in the child storage recess, and the bottom of the exterior
Direct contact makes it suitable for mounting on printed circuit boards, etc.
Stability can be further improved.

As a result, both sides of the exterior and both sides of the bottom surface
In addition, solderability at the time of mounting can be improved
In addition, it is possible to improve the stability of mounting on printed circuit boards, etc.
You can do it.

[Brief description of the drawings]

FIGS. 1A to 1C are a front view, a side view, and a bottom view showing one embodiment of a surface mount component of the present invention.

FIGS. 2 (a) to 2 (d) are perspective views showing steps of a method for manufacturing a surface-mounted component according to an embodiment of the present invention.

FIGS. 3 (a) to 3 (d) are perspective views showing steps in another embodiment of the method for manufacturing a surface mount component of the present invention.

4 (a) to 4 (d) are cross-sectional views and perspective views of respective steps showing a conventional method of manufacturing a surface mount component.

FIG. 5 is an explanatory view of another conventional mold for molding surface-mounted components.

6 (a) to 6 (d) are perspective views of respective steps showing a method for manufacturing another conventional surface mount component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Exterior 10a Bottom surface 10b, 10c Side surface 11-13 Terminal plate 11a, 13a Bottom terminal portion 11b, 13b Side terminal portion 14, 15 Terminal storage recess 16 Metal hoop 17 Projection

Claims (2)

(57) [Claims] An electronic component element and said electronic component element are covered.
The covered exterior and the terminal board pulled out from the bottom of the exterior
The exterior has terminal receiving recesses on both side surfaces and a bottom surface thereof.
Part, the terminal plate is a bottom terminal part, the bottom terminal
From the part, orthogonal to the bottom terminal part,
A side terminal protruding in the direction of the terminal storage recess,
The bottom terminal portion protrudes from the terminal storage recess on the outer bottom surface.
To the terminal storage recess on the bottom of the exterior.
Bend so that the outer side surface is
Of the terminal plate.
A surface mount component in which a bottom surface and the exterior bottom surface are flush with each other . 2. A terminal board comprising: a side terminal;
Part, the terminal on the exterior bottom surface orthogonal to the side terminal part
A bottom terminal protruding in the direction of the storage recess;
The terminal portion protrudes from the terminal storage recess on the exterior side surface.
And along the terminal receiving recess on the exterior side surface
So that the bottom terminal portion is in front of the exterior bottom surface.
Bent along the terminal storage recess, and the bottom surface of the terminal plate
The surface-mounted component according to claim 1, wherein a surface of the package and a bottom surface of the exterior are flush with each other .