JPH0757901A - Surface mounting component and production thereof - Google Patents

Abstract

PURPOSE:To provide a surface mounting component, excellent in quality and productivity, being employed in various electronic appliances. CONSTITUTION:Terminal plates 11-13 are led out from the mold 10 of electronic component with a protrusion being provided previously by bending perpendicularly to the lead out direction thus forming bottom terminal parts 11a, 13a and side terminal parts 11b, 13b. This structure improves the bending accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component used in various electronic devices and a manufacturing method thereof.

[0002]

2. Description of the Related Art A typical conventional surface mount component has a structure and manufacturing method as shown in FIG.

That is, as shown in FIG. 4 (a), an electronic component element 1 such as a coil, a resistor, and a capacitor is bent and connected to a terminal plate 3 formed by punching out a metal hoop 2 to form a molding die. 4 is set and the exterior resin is injected into the molding die 4 to form the exterior 5 as shown in FIG.
The terminal board 3 pulled out in parallel with the bottom surface of the exterior 5 is shown in FIG.
4 (c) by cutting at the position of the broken line shown in (b) to separate it from the metal hoop 2 and bending this terminal board 3 along the exterior 5 to the side surface side of the exterior 5. The surface mount component shown in FIG. 4D was used.

That is, in this surface mount component, the bottom surface terminal portion 3a is provided on the bottom surface of the exterior 5 and the side surface terminal portion 3b is provided on the side surface of the exterior 5.
The terminal board 3 is provided with two.

With such a structure, when molding the exterior 5, the exterior resin adheres to the surface of the bottom terminal portion 3a of the terminal plate 3 to form burrs, which greatly hinders solderability during surface mounting. However, deburring work was required and productivity was poor.

Further, the terminal plate 3 is bent from the metal hoop 2 and then bent to the side surface with the corner of the outer casing 5 as a fulcrum.
In this case, due to the springback of the terminal plate 3 or the like, the bending is not a right angle, and the side terminal portion 3b floats from the side surface of the exterior 5 or the bottom terminal portion 3a floats from the bottom surface of the exterior 5 to form a surface mount component. Was inferior in quality and had a great problem in solderability at the time of mounting.

From the above, a method of forming the molding die 6 so as to vertically pull out the terminal plate 3 from the bottom surface of the exterior 5 as shown in FIG. 5 can be considered, but in this method, the molding die 6 is used. It is required that the drawn-out portion of the terminal plate 3 be highly accurate, and that the metal hoop 2 also needs to be bent in the direction perpendicular to the terminal plate 3 in advance. There was a problem that it could not be bent at a right angle.

Further, as shown in FIGS. 6 (a) to 6 (d),
The terminal plate 3 integrated with the metal hoop 2 is pulled out from the side surface of the outer package 5, the terminal plate 3 is cut from the metal hoop 2 to a predetermined size and separated, and then the terminal plate 3 is bent at a right angle, The bottom terminal portion 3a and the side surface terminal portion 3 are bent by bending along the exterior 5.
A method of forming b is also considered.

[0009]

According to the method described above, it is not necessary for the molding die to be subjected to highly accurate processing, but after cutting and separating from the metal hoop 2, the molding die shown in FIG.
Since the terminal plate 3 is bent at a right angle as shown in (c), the terminal plate 3 cannot be bent at a right angle. The surface of the surface-mounted component was inferior in quality as the surface-mounting component had a problem in solderability during mounting.

It is an object of the present invention to eliminate the above-mentioned conventional defects and provide a surface mount component having high quality and excellent productivity and a method for manufacturing the same.

[0011]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention is directed to a bottom surface or a side surface on the bottom surface side of an exterior for molding a terminal plate punched with a metal hoop to which the electronic parts element is connected to mold the electronic parts element. From the outer terminal, the terminal plate is provided with a protruding portion that projects in one direction orthogonal to the withdrawing direction and is bent vertically, and the base of the drawer from this exterior is bent to form the bottom terminal portion and the side terminal portion. It is to be configured.

[0012]

With the above structure, the bottom terminal portion is bent perpendicularly to the side terminal portion while being connected to the metal hoop, so that the bending accuracy is easy to obtain and the side and bottom surfaces of the exterior On the other hand, it can be bent exactly, and the solderability during mounting can be remarkably stable.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the surface mount component of the present invention will be described below with reference to the accompanying drawings.

In FIGS. 1A to 1C, reference numeral 10 denotes an outer casing in which an electronic component element is resin-molded, and three terminal plates 11, 12, 13 are drawn out from a bottom surface 10a of the outer casing 10. Exterior 10 from which the terminal boards 11 to 13 are drawn out
A terminal accommodating recess 14 is formed on the bottom surface of the outer casing 10.
Bottom face 1 of both side faces 10b, 10c adjacent to the bottom face 10a of the
The terminal storage recess 15 is also formed on the 0a side.

The terminal plates 11 to 13 are pulled out from the bottom surface 10a of the outer casing 10 and bent, and then housed in the terminal accommodating recesses 14 of the bottom surface 10a. Are configured to be flush with each other. The terminal plates 11 and 13 located at both ends of the bottom surface 10a of the outer package 10 are projected in one direction orthogonal to the bottom terminal portions 11a and 13a that are bent and housed in the terminal housing recess 14 of the bottom surface 10a, The side surface 10 is bent at a right angle and bent along the bottom surface 10a in advance.
The terminal housing recesses 15b and 10c are provided with side terminal portions 11b and 13b which are fitted into the terminal housing recessed portion 15.

A method of manufacturing such a surface mount component will be described with reference to FIGS. 2 (a) to 2 (d). As shown in FIG. 2 (a), the metal hoop 16 is punched to form the terminal plates 11 to 13, the electronic component elements are connected to the tips of the terminal plates 11 to 13, and this is divided into upper and lower split molds. The package 10 is set in a mold, and a part of the electronic component element and the terminal boards 11 to 13 is molded with a package resin to form the package 10. At this time, the terminal plates 11 to 13 pulled out from the exterior 10 are pulled out from the die mating surface of the molding die.

At this time, the terminal plates 11 and 13 pulled out from both ends of the bottom surface 10a of the outer casing 10 are
The protrusions 17 orthogonal to the pull-out direction of 13 are integrally provided.

Next, as shown in FIG. 2B, the metal hoop 1
In a state where the terminal plates 11 and 13 are connected to each other, the projecting portions 17 of the terminal plates 11 and 13 are bent at a right angle using a press die or the like.

Then, as shown in FIG. 2 (c), the terminal plates 11 to 13 are cut and separated from the metal hoop 16 to a predetermined length. Finally, as shown in FIG. 2D, the terminal housing recesses 14 and the outer casing 1 in which the terminal plates 11 to 13 drawn out from the bottom face 10a of the outer casing 10 are provided on the bottom face 10a of the outer casing 10 are formed.
Bent so as to be housed in the terminal housing concave portion 15 on the side surface of No. That is, the protrusions 17 of the terminal plates 11 and 13 are formed by bending the terminal plates 11 and 13 along the terminal accommodating recesses 14 on the bottom surface 10a.
It will be stored in 5.

As described above, the terminal boards 11 and 13 are
Bottom terminal portions 11a, 13a and side terminal portions 11b, 13b
Will be equipped with.

Thus, with the side terminal portions 11b and 13b of the terminal plates 11 and 13 connected to the metal hoop 16 with respect to the bottom terminal portions 11a and 13a, the metal hoop 1
Since it can be bent at a right angle based on 6, the bending accuracy can be high, and finally the bottom surface 10 of the exterior 10
It is possible to obtain a terminal surface that is flush with a and both side surfaces 10b and 10c.

Therefore, even the surface-mounted component shown in FIG. 1 can be made extremely excellent in solderability during mounting, and can be remarkably stable externally.

Next, another embodiment will be described with reference to FIGS.
An explanation will be given using (d). The one shown in FIG. 3 is the same as the one shown in FIG. 2 in the three-terminal type.
As shown in (a), the terminal plates 11 and 13 at both ends are attached to the exterior 10
The metal hoop 16 is punched out so as to be pulled out from the side faces 10b, 10c of the bottom face 10a, and the terminal plates 11, 1
The protrusion 17 is provided in one direction orthogonal to the pulling-out direction of 3, and the protrusion 17 is bent at a right angle with the metal hoop 16 as a reference, as shown in FIG. c)
After being cut and separated from the metal hoop 16 as shown in FIG.
The terminal board 12 is bent so that it fits into the terminal accommodating recess 14 of the bottom surface 10a.

Due to the bending of the terminal plates 11 and 13, the projecting portions 17 of the terminal plates 11 and 13 are fitted into the terminal accommodating recesses 14 provided on the bottom surface of the exterior 10 and the bottom terminal portions 11a and 13a of the terminal plates 11 and 13 are formed. Make up.

Also in this configuration and method, the terminal board 1
Since the metal hoop 16 can be used as a reference for bending the protruding portions 17 of the terminals 1 and 13 at right angles, the bending accuracy is high, and the fitting into the terminal accommodating recesses 15 and 14 is also highly accurate as a result. , And can be a high quality surface mount component.

[0026]

As described above, according to the surface mount component and the method of manufacturing the same of the present invention, a complicated molding die is not required, burrs are not formed on the terminal plate during molding, and the terminal plate The bending accuracy of the side terminal part with respect to the bottom terminal part for expanding the soldering area and increasing the mounting strength is also high, and it can be formed flush with the bottom and side surfaces of the outer package, which is excellent in solderability during mounting Has the advantage that it can be
It is of great industrial value.

[Brief description of drawings]

1A to 1C are a front view, a side view and a bottom view showing an embodiment of the surface mount component of the present invention.

FIG. 2A to FIG. 2D are perspective views in each step showing an embodiment of a method for manufacturing a surface mount component of the present invention.

3 (a) to 3 (d) are perspective views in each step showing another embodiment of the method for manufacturing the surface mount component of the present invention.

4A to 4D are sectional views and perspective views of respective steps showing a conventional method of manufacturing a surface mount component.

FIG. 5 is an explanatory view of another conventional molding die for surface mounting components.

FIG. 6A to FIG. 6D are perspective views of respective steps showing another conventional method of manufacturing a surface mount component.

[Explanation of symbols]

 10 Exterior 10a Bottom 10b, 10c Side 11-11 Terminal board 11a, 13a Bottom terminal 11b, 13b Side terminal 14,15 Terminal storage recess 16 Metal hoop 17 Projection

Claims (2)

[Claims] 1. A terminal plate punched out from a metal hoop to which an electronic component element is connected is drawn out from a bottom surface or a side surface on the bottom side of an exterior for molding the electronic component element, and the terminal board is formed in one direction orthogonal to the drawing direction. A surface mount component in which a protruding and bent vertically portion is provided, and a bottom terminal portion and a side terminal portion are formed by bending the base of the drawer from the exterior. 2. An exterior is formed by a molding die using a terminal plate integrated with a metal hoop having an electronic component element connected to one end thereof, and the exterior is projected in one direction orthogonal to the direction in which the terminal plate is pulled out from the exterior. A method of manufacturing a surface mount component in which the protruding terminal is bent at a right angle, then the terminal board is cut from the metal hoop and separated, and the terminal board drawn from the exterior is bent along the drawing surface.