JPS5840599Y2 - high frequency coil - Google Patents
high frequency coilInfo
- Publication number
- JPS5840599Y2 JPS5840599Y2 JP18169178U JP18169178U JPS5840599Y2 JP S5840599 Y2 JPS5840599 Y2 JP S5840599Y2 JP 18169178 U JP18169178 U JP 18169178U JP 18169178 U JP18169178 U JP 18169178U JP S5840599 Y2 JPS5840599 Y2 JP S5840599Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip capacitor
- frequency coil
- high frequency
- convex body
- terminal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【考案の詳細な説明】
本考案は、高周波コイルに内蔵されている同調用コンテ
゛ンサの格納に関するものである。[Detailed Description of the Invention] The present invention relates to the storage of a tuning capacitor built into a high frequency coil.
高周波コイルの同調用コンデンサとして、小型な割に容
量の大きいチップコンテ゛ンサを用いることは、製品の
小型化、性能向上などの点からみて望ましいことである
が、このようなチップコンデンサは通常のコンデンサの
ようなリード線がなく、両端部に電極が露出されている
だけであるから、これを高周波コイルの端子ピンに半田
付けするには色々な工夫が必要である。It is desirable to use a chip capacitor with a large capacitance despite its small size as a tuning capacitor for a high-frequency coil, from the viewpoint of product miniaturization and performance improvement. Since there are no lead wires and only electrodes are exposed at both ends, various ingenuity is required to solder these to the terminal pins of the high-frequency coil.
本考案の主な目的はこのようなチップコンテ゛ンサを半
田付けする前に、これを端子ピン間に無理なく確実に仮
付けできるようにして作業性を向上することにある。The main purpose of the present invention is to improve workability by making it possible to safely and securely temporarily attach such a chip capacitor between terminal pins before soldering it.
以下、本考案を図面について説明する。Hereinafter, the present invention will be explained with reference to the drawings.
図中１はコイルのベースを示すもので゛、その底面から
側面にかけて段部２が切込まれ、その段部２の水平面Ａ
から同調用コンデンサを接続すべき端子ピン３，３が下
方に突出している。In the figure, 1 indicates the base of the coil, and a step 2 is cut from the bottom to the side, and the horizontal surface A of the step 2 is
Terminal pins 3, 3 to which a tuning capacitor is to be connected protrude downward from.
そしてこれらの端子ピン３，３の間に前記水平面Ａと適
当な間隔を隔て・平行する凸体４が突出されている。A convex body 4 protrudes between these terminal pins 3, 3 and is parallel to and spaced apart from the horizontal plane A by an appropriate distance.
この凸体４はベース１と１体で、その両側と端子ピン３
との間は、第３図に示すように適度な間隔Ｂをあけてあ
り、したがって凸体４があっても端子ピン３，３の根本
は下方に開放されている。This convex body 4 is integrated with the base 1, and the terminal pin 3 is attached to both sides of the base 1.
As shown in FIG. 3, there is a suitable distance B between them, so that even with the protrusion 4, the bases of the terminal pins 3, 3 are open downward.
そして端子ピン３，３の間に接続されるチップコンデン
サ５は凸体４と水平面Ａとの間に挿込まれて仮付けされ
、その両端にある露出電極と端子ピン３との間は半田デ
イツプ法によって半田付けされる。The chip capacitor 5 connected between the terminal pins 3 and 3 is inserted between the convex body 4 and the horizontal surface A and temporarily attached, and a solder dip is formed between the exposed electrodes at both ends and the terminal pin 3. Soldered according to the law.
凸体４の両側と端子ピン３との間に適度な間隔Ｂをあけ
たのは、端子ピン３の根本を下方に開放して半田デイツ
プ法を可能にするためである。The reason why a suitable distance B is provided between both sides of the convex body 4 and the terminal pin 3 is to open the base of the terminal pin 3 downward to enable the solder dip method.
凸体４と水平面Ａとの間隔は、はぼチップコンデンサ５
の厚みに相当する程度であるが、戒可くはチップコンデ
ンサを挿込むとき凸体４が少し弾性変形する位の寸法に
するのがよい。The distance between the convex body 4 and the horizontal surface A is as large as the chip capacitor 5.
The thickness should be approximately the same as the thickness of the capacitor, but it is preferable to set the dimension so that the convex body 4 is slightly elastically deformed when the chip capacitor is inserted.
チップコンデンサ５は、もっばら凸体４と水平面Ａとの
間に適度な圧力で挟持されるから、端子ピン３とチップ
コンデンサ５の端部とは必ずしも接触しなくてもよい。Since the chip capacitor 5 is held between the convex body 4 and the horizontal surface A with appropriate pressure, the terminal pins 3 and the ends of the chip capacitor 5 do not necessarily have to come into contact with each other.
その間に多少の隙間があっても半田付けは可能である。Soldering is possible even if there is some gap between them.
したがって端子ピン３．３の間の寸法精度やチップコン
デンサの長さ寸法に多少のばらつきがあっても差支えな
いから歩留りはよくなるし、殊にチップコンデンサ５を
横方向から挿込むだけで容易かつ確実に仮付けできるた
め、作業性が良好でコストを安くできるし、またスペー
スもあまりとらないから小型化にも有利である。Therefore, there is no problem even if there is some variation in the dimensional accuracy between the terminal pins 3 and 3 or the length dimension of the chip capacitor, which improves the yield.In particular, inserting the chip capacitor 5 from the side is easy and reliable. Since it can be temporarily attached to the surface, it has good workability and can reduce costs, and it is also advantageous for downsizing because it does not take up much space.
なお、第１図において、６はコイルのボビン、７は巻線
を示している。In FIG. 1, 6 indicates a coil bobbin, and 7 indicates a winding.
第１図は本考案に係る高周波コイルを示す正面図、第２
図は要部の斜面図、第３図は側面図である。
１：ベース、２：段部、３：端子ピン、４：凸体、５：
チップコンデンサ、Ａ：水平面。Figure 1 is a front view showing the high frequency coil according to the present invention, Figure 2 is a front view showing the high frequency coil according to the present invention.
The figure is a perspective view of the main part, and Figure 3 is a side view. 1: Base, 2: Step part, 3: Terminal pin, 4: Convex body, 5:
Chip capacitor, A: horizontal plane.
Claims (1)
され、この段部２の水平面Ａよりチップコンデンサを接
続すべき２本の端子ピン３，３が下方に突出し、これら
の端子ピン３，３の間に水平面Ａと適当な間隔を隔てて
平行する凸体４が突出され、前記２本の端子ピン３，３
の間および水平面Ａと凸体４との間にチップコンデンサ
５が挿入されている高周波コイル。A stepped portion 2 is formed from the bottom surface to the side surface of the base 1 of the coil, and two terminal pins 3, 3 to which a chip capacitor is to be connected protrude downward from the horizontal surface A of this stepped portion 2. A convex body 4 that is parallel to the horizontal plane A at an appropriate distance is projected between the two terminal pins 3, 3.
A high frequency coil in which a chip capacitor 5 is inserted between the horizontal surface A and the convex body 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18169178U JPS5840599Y2 (en) | 1978-12-26 | 1978-12-26 | high frequency coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18169178U JPS5840599Y2 (en) | 1978-12-26 | 1978-12-26 | high frequency coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5596638U JPS5596638U (en) | 1980-07-04 |
| JPS5840599Y2 true JPS5840599Y2 (en) | 1983-09-13 |
Family
ID=29193367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18169178U Expired JPS5840599Y2 (en) | 1978-12-26 | 1978-12-26 | high frequency coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840599Y2 (en) |
-
1978
- 1978-12-26 JP JP18169178U patent/JPS5840599Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5596638U (en) | 1980-07-04 |
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