JPS60220922A - Chip type capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip type capacitor mounted on a printed circuit board. In particular, it relates to chip-type capacitors molded and packaged with insulating resin.

2. Description of the Related Art The structure of a conventional chip-type capacitor lead will be explained with reference to FIGS. 2 to 5.

In FIG. 2, an anode lead 3 and a cathode lead 4 connected to a capacitor element 1 and an anode lead 2 led out from the element are bent into a crank shape and are parallel to the bottom surface 6 of a molded resin 5. and pull out leads 3 and 4 in the opposite direction.
3A and 4A are exposed, and in FIG. 3, the anode lead 7 and the cathode lead 8 are bent into a U-shape inside and outside the exterior insulating resin 5, and the side wall of the resin 9°10, and the tips 7A and 8A are drawn out in opposite directions along the bottom surface of the resin. The exposed portions 11A and 12A from the resin 5 are exposed not from the bottom surface 6 of the resin 5 but from the intermediate portion thereof, and are drawn out in opposite directions. Since all of these lead leads protrude from the resin 5, the size of the capacitor becomes large, which tends to cause problems when automatically supplying the capacitor.

In the chip type capacitor in the case of FIG.
, 14A are folded into the bottom surface 6 of the resin 5, so that the overall size of the capacitor is more compact than in the case of FIGS. 2 to 4.

Problems to be Solved by the Invention Conventional chip-type capacitors have an outer insulating resin 5;
Even in the case where the anode and cathode drawer 5 that protrudes from the resin 5 is shown in FIG. 5, it protrudes from the side 19.10 of the resin 5, which may reduce the attachment rate by the automatic attachment machine. The demand for miniaturization had not yet been met.

Means for Solving the Problems The present invention aims to miniaturize chip-type capacitors and facilitate automatic mounting, and has a structure in which the lead-out leads do not protrude from the side walls of the exterior resin. ,
In the present invention, when the protruding part of the drawer lead connected to the capacitor element is bent to the wall surface of the exterior resin, the width of the lower insulation resin is This is a chip-type capacitor in which the resin width is made small so that the outer surface of the lead-out lead is approximately flush with the outer wall of the exterior insulating resin.

Embodiment An embodiment of the present invention will be described with reference to the drawings. Reference numeral 20 is a tantalum capacitor element, and a cathode lead 21 is mechanically and electrically fixed to the circumferential surface of the element 20. An anode lead 23 is led out from the element 20, and the anode lead 23 is welded. Anode and cathode drawer leads 2
1.23 are arranged on the same plane. This flat part becomes the parting line 24 of the upper mold and lower mold when molding the resin. When the capacitor element 20 is molded with resin, it becomes as shown in FIG. When performing this molding, the width B of the outer wall portion 24 of the upper insulating resin 25 is set at the boundary tIA24 where the lead leads 21 and 23 are drawn out.
It is necessary to reduce the width of the outer wall portion 29 of the lower insulating resin 26.

The molded capacitor is then attached to the lower resin sidewall 2.
7.28 and along the bottom surface, the outer surfaces 21B and 23B of the leads are formed on the same plane as the resin outer wall 29, and a chip type capacitor 40 having the structure shown in FIG. 8 is formed. can get. Another embodiment will be explained with reference to FIG. 9. The figure shows a bottom view, and a groove 31 having a width A wider than the width a of the lead-out lead 21.23 is formed in the side wall portion 27.28 of the resin. Then, if the leads 21.23 are bent and stored in this groove 31, the leads 21.23
fits within the resin side walls 27,28.

In addition, although the case of a solid electrolytic capacitor was explained as an example, it can be applied to any capacitor.

Effects of the Invention The chip-type capacitor of the present invention has improved reliability when automatically mounted on a printed circuit board, and can also be made smaller than conventional capacitors.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the present invention, Figs. 2 to 5 are cross-sectional views of the conventional device, Fig. 6 is a front view of the element of the present invention with a drawer lead attached, and Fig. 7 is a cross-section of the device molded with resin. Figure, 8th
The figure is a cross-sectional view of a bent lead-out lead, and FIG. 9 is a bottom view of another embodiment. In the drawings, 20: capacitor element, 21. 23: drawer lead, 24: boundary line, 25: upper resin, 26
: Lower resin, 27.28: Side wall portion of lower resin. Patent applicant Hitachi Capacitor Co., Ltd. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9

Claims (4)

[Claims] (1) In a chip type capacitor in which the protruding part of the drawer lead connected to the capacitor element is bent along the wall surface of the outer insulating resin, the width of the upper insulating resin with the drawer lead protruding from the outer insulating resin as the boundary line. In contrast, chip-type capacitors are characterized by a smaller width of the lower insulating resin. (2) The chip type capacitor according to claim 1, wherein the boundary line is a parting line. (3) The chip type capacitor according to claim 1, wherein the outer surface of the lead-out lead is provided so as to be substantially flush with the outer wall of the exterior insulating resin. (4) The chip type capacitor according to claim 1, wherein a groove for a lead-out lead is provided in the side wall of the lower insulating resin.