JPS6242539Y2 - - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to hybrid integrated circuits.

Generally, a hybrid integrated circuit has silver or silver on the surface of an insulating substrate 1 made of alumina or the like, as shown in FIGS. 1 and 2.
A wiring conductor layer and a resistor layer made of palladium-silver or the like are sequentially printed and fired using a screen printing method, and chip-shaped individual parts made of semiconductors, capacitors, etc. and lead-out terminals 2 are attached thereto.
After each connection is made with solder, the exterior resin 3 is coated using a dip method, a powder coating method, or the like.

However, in a single in-line type hybrid integrated circuit as shown in FIG. 1, as the number of integrated elements and components increases, the height of the product increases and the fixation becomes unstable. Furthermore, in a dual-in-line type hybrid integrated circuit as shown in FIG.
Since the resin 3 is drawn out perpendicularly to the surface of the resin 3, it is difficult to apply the resin 3 thereto.

The present invention aims to eliminate the above-mentioned drawbacks and to provide a hybrid integrated circuit which has significantly improved quality and can be manufactured at low cost.

That is, a plurality of insulating substrates on which circuit patterns consisting of wiring conductor layers, resistor layers, semiconductor capacitors, etc. are formed and arranged in parallel at predetermined intervals, and a connection frame bridged between the insulating substrates. This is a hybrid integrated circuit comprising: a lead terminal fixed to the insulating substrate and connected to the wiring conductor layer; and an exterior resin covering both the front and back surfaces of each of the insulating substrates.

The present invention will be described below with reference to embodiments shown in FIGS. 3 to 6.

FIG. 3 is a perspective view of the connection frame 4. The frame 4 is formed by pressing and punching a conductor such as copper, brass, or phosphor bronze, and the insulating substrate 1 is inserted into both ends of the frame 4. A recess 4' is provided.

First, a semiconductor and a capacitor are attached to a circuit pattern in which a wiring conductor layer 6 and a resistor layer are respectively formed on two insulating substrates 5 made of alumina or the like in the same manner as described above, and a wiring conductor layer provided on the insulating substrate 5. 6
At the same time as attaching the drawer terminal 2 to the drawer part of the fourth
As shown in FIG. 5 and FIG. 5, two insulating substrates 5 are arranged in parallel with a predetermined distance L between them without sandwiching the insulating substrates on the back side, and the connecting frame 4 is bridged, and the connecting frame 4 is immersed in molten solder. to electrically connect the respective connection parts. As a result, the lead terminals 2 are fixed to the respective insulating substrates 5, and the two insulating substrates 5 are held by the connection frame 4.
Further, since the wiring conductor layer 6 and the connection frame 4 can be connected by solder, the two insulating substrates 5 are also electrically connected. Next, as shown in FIG. 6, the exterior resin 3 is applied to the insulating substrate 5 by dip method, powder coating method, etc. and cured, so that the space between the parallel insulating substrates is not filled with the exterior resin 3. Both the front and back surfaces of each insulating substrate 5 are coated with exterior resin 3 to complete the process.

The hybrid integrated circuit of the present invention is constructed as described above.

Therefore, since the insulating substrates 5 are arranged in parallel with a predetermined distance L between them by the connecting frame 4, when covering the exterior resin 3, the exterior resin easily enters from this distance L. Since the back surface of the insulating substrate 5 can also be reliably coated with the exterior resin 3, effects such as significantly improved moisture resistance, stable fixing, and extremely low cost production are produced.

In the above embodiment, the connecting frame 4 bridged between the insulating substrates 5 is made of a metal conductor, but it may be made of an insulating material. Further, the shape of the connection frame and the position of the bridge are not limited to the examples, and three or more insulating substrates 5 are arranged in parallel with a predetermined interval in the same manner as described above, and each is connected. It is also possible to construct a similar structure by cross-linking with a frame for obtaining a higher degree of integration.
Furthermore, it goes without saying that similar effects can be obtained by storing the device in a resin case and filling the resin case.

As mentioned above, the hybrid integrated circuit of the present invention is extremely advantageous in terms of quality and price, and has great industrial and practical value.

[Brief explanation of the drawing]

1 and 2 are cutaway perspective views of the main parts of a conventional hybrid integrated circuit, FIG. 3 is a perspective view of a connection frame according to the present invention, and FIG. 4 is a main part of the assembly of the hybrid integrated circuit of the present invention. FIG. 5 is a side view of the hybrid integrated circuit of the present invention before packaging, and FIG. 6 is a completed side view of the hybrid integrated circuit of the present invention. 2... Output terminal, 3... Exterior resin, 4... Connection frame, 5... Insulating board, 6... Wiring conductor layer.

Claims (1)

[Scope of utility model registration request] A plurality of insulating substrates, each having a circuit pattern made of a wiring conductor layer, a resistor layer, a semiconductor, a capacitor, etc. formed on the surface and arranged in parallel at a predetermined interval without sandwiching an insulating substrate on the back side, and the insulating substrate Covering both the front and back of each insulating substrate without filling the space between the connecting frame bridged between the substrates, the pull-out terminal fixed to the insulating substrate and connected to the wiring conductor layer, and the insulating substrates arranged in parallel. A hybrid integrated circuit formed by filling an exterior resin.