JPH0115152Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component, and more particularly to a composite component that combines an integrated circuit (IC) chip and a laminated composite capacitor network.

Many proposals have been made to meet the demand for miniaturization through the integration of electronic circuits, including resistors, inductors,
Ingenuity has been put into the capacitors, IC chips, and their combinations. The present invention was developed as a result of these efforts, and the capacitor part is made into a single chip with parallel sides as a capacitor network having a large number of capacitors, and preferably a resistor having a large number of resistive elements on its surface. A network is formed, and on opposite parallel sides of this capacitor section, a row of external terminals connected to the lead-out conductor for the capacitor electrode is formed in a membrane shape, and the lead-out conductor of the resistor network is similarly connected to the external terminal. A vertical row of lead-out pins is formed on both sides of the dual-in-line IC chip at intervals corresponding to inter-row spacing and intra-row spacing of the external terminals, and the capacitor portion is inserted between the pull-out pin rows. The device is characterized in that the connection between the external terminal and the extraction pin is made using the method. With this configuration, the composite component of the present invention can be made more compact than the conventional composite component, and the density of attachment to the printed wiring board can be further increased. Also,
With the composite component of the present invention, matching between connecting conductors can be achieved by simply inserting the capacitor section between the pins of the IC chip, and soldering can be performed immediately, greatly simplifying the assembly process.

Hereinafter, the present invention will be described in detail with reference to examples. Figure 1 shows the capacitor part of the composite component of the present invention.
A membrane-like external terminal is produced by combining lamination and firing, and the wiring 3 is drawn out around the dielectric body 4 which has a plurality of capacitors 2 and wiring 3 built therein so as to hug the parallel opposing sides. 5 are formed in two rows. If desired, a plurality of resistance elements 6 are baked onto the surface of the capacitor section 1 as shown in FIG.

Figure 3 shows the dual inline IC section 8 of the present invention.
It has an integrated circuit inside, and two rows of extraction pins 9 projecting downward from parallel opposing sides of the IC section are formed on the outside. The distance between the rows of these extraction pins is set approximately equal to the distance between rows of external terminals 5 in the capacitor section 1, and the interval between pins within each row is set equal to the interval within a row of external terminals. As will be described later, when the capacitor part 1 is inserted between the lead-out pins of the IC part 8, it is preferable to determine the distance between the rows of the lead-out pins so that a suitable elasticity retention effect can be obtained.

As shown in FIG. 4, the capacitor part 1 is inserted between the extraction pins of the IC part 8. The external terminals of the capacitor section are aligned with the extraction pins 9, and the elasticity of the pins 9 holds the capacitor section 1 in place.
By setting the width of the external terminal to be sufficiently larger than the pin diameter, solder or conductive paste can be easily applied between the external terminal and the pin.

The composite component configured as described above has a circuit configuration shown in FIG. 5, for example.

As described above, since the composite component of the present invention is inserted and held between two rows of pins of an integrated circuit chip, it has a large space saving effect and can increase the mounting density on the main printed circuit board. can.
Furthermore, the assembly of the capacitor section and the integrated circuit is easy, and interconnections can be made in one go.

[Brief explanation of the drawing]

Figure 1 is a perspective view of the capacitor part of the composite component of the present invention, Figure 2 is a rear perspective view of the capacitor part, Figure 3 is a perspective view of the integrated circuit chip of the composite component of the present invention, and Figure 4 is the main part of the composite component of the present invention. FIG. 5 is a perspective view showing an assembled state of the composite component of the invention, and a circuit diagram of the same component. The main parts in the figure are as follows. 1: Capacitor section, 2: Capacitor, 3: Wiring, 4: Dielectric, 5: External terminal, 6: Resistance element,
7: Wiring, 8: Integrated circuit chip, 9: Pull-out pin.

Claims (1)

[Claims for Utility Model Registration] (1) Connecting terminals of the capacitors are drawn out from opposite sides of a multilayer dielectric body containing a plurality of capacitors to form membrane-like external terminals, and the multilayer composite capacitor thus constructed is integrated. 1. A composite component, characterized in that the component fits between vertical extraction pins formed on both sides of a circuit chip, and a predetermined connection is made between the external terminal and the extraction pin by solder or conductive paste. (2) The multilayer capacitor is a composite component according to item 1 above, which includes a resistance network on its surface.