JP2005101418A - Chip type solid electrolytic capacitor and its manufacturing method, and lead frame used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor which is superior in productivity and reliability and has a plated fillet surface, and to provide its manufacturing method, and a lead frame used therefor. <P>SOLUTION: The chip type solid electrolytic capacitor which is faced with exterior resin 19 and equipped with an anode terminal 13 and a cathode terminal 14 having their exposure surfaces on a substrate mount surface and an external flank nearly perpendicular to the substrate mount surface is characterized in that the exposure surface of the anode terminal 13 on the external flank is composed of a cut surface and a plated fillet surface 15a. Further, an anode terminal cutting surface 16 is arranged adjacently to the periphery of the plated fillet surface 15a, whose plated surface is isolated from the exterior resin 19. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a solid electrolytic capacitor, and more particularly to a chip-type solid electrolytic capacitor, a manufacturing method thereof, and a lead frame used therefor.

  Conventionally, solid electrolytic capacitors using tantalum, niobium or the like as a valve action metal are small, have a large capacitance, are excellent in frequency characteristics, and are widely used in power supply circuits for CPUs. In addition, with the development of portable electronic devices, chip-type solid electrolytic capacitors are becoming smaller and thinner.

  When such a chip-type solid electrolytic capacitor is mounted on a substrate, a terminal portion where a fillet is formed on the side surface of the product is important together with a terminal portion on the substrate mounting surface of the product. One of the reasons is to observe the soldering condition in the fillet after soldering and inspect the soldering condition including the board mounting surface, and the other reason is to melt to the fillet surface. In addition, when the solder wets up, the product will be tilted if it does not wet up evenly on the anode side and the cathode side, and yet another reason is that the solder does not rise enough on the fillet surface. This is because the solder stays only on the bottom surface, which is the substrate mounting surface, and the product floats.

  Therefore, in order to improve the solder wet-up, the fillet surface is plated. This situation will be further described with respect to a chip-type solid electrolytic capacitor having a terminal called a bottom electrode type. This bottom electrode type technology is suitable for miniaturization and thinning of products. The bottom surface of the lead frame is used as the bottom surface of the electrode (anode terminal and cathode terminal), and the cut surface of the lead frame is used as a fillet surface. This is the technology of the chip-type solid electrolytic capacitor used.

  First, a capacitor element manufactured by a known manufacturing method is connected to a lead frame manufactured for a bottom electrode type, and then an exterior resin is molded and separated from the lead frame by cutting, and then a side fillet surface A chip-type solid electrolytic capacitor is manufactured by plating the cut surface.

  This situation will be further described with reference to the drawings. 9A and 9B are diagrams showing a conventional chip-type solid electrolytic capacitor. FIG. 9A is a side view of the anode side, FIG. 9B is an internal perspective view from the front, and FIG. 9C is a cathode. It is a side view of a side. 9, 91 is a capacitor element, 92 is an anode lead wire, 93 is an anode terminal, 94 is a cathode terminal, 97 is an insulating resin, 99 is an exterior resin, 100 is a conductive adhesive, and 96 is plated. The anode side fillet surface 98 is a plated cathode side fillet surface. FIG. 10 is an internal perspective view showing a state in which the capacitor element is bonded to the lead frame and molded with an exterior resin. 101 is an anode terminal forming portion of the lead frame, 102 is a cathode terminal forming portion, and 103a and 103b are cut surfaces, which are the side surfaces of the product.

  The steps so far and the subsequent steps will be described with reference to FIG. FIG. 11 is a process flow diagram of a conventional example, S111 is a lead frame molding step, S112 is a step of bonding and fixing the capacitor element to the lead frame, and S113 is a molding step using an exterior resin, as already described. is there.

  Next, S114 is a process for cutting the exterior resin and the lead frame, S115 is a process for plating the side fillet surface exposed by the cutting, and S116 is a process for separating products in the orientation in the plating process. This is an alignment process.

  As a technique for plating the side face lead frame cut surface and making it a part of the terminal as described above, there is an example disclosed in the following Patent Document 1 as a similar technique.

JP-A-9-298256

  However, when the chip is cut from the lead frame and then the cut surface to be the fillet surface is plated, there are the following problems. In the case of barrel plating, which is generally used as post-plating for electronic parts, the product orientations are scattered after plating, so the product must be aligned in the vertical, vertical, horizontal, and polar directions. Therefore, the following problems occur. (1) Expensive equipment such as a product aligner must be manufactured and used, which increases the manufacturing cost. (2) The number of manufacturing days becomes longer. (3) Deterioration of product characteristics may occur due to penetration of the plating solution into the product.

  The chip-type solid electrolytic capacitor of the present invention includes a capacitor element from which an anode lead wire is derived, an anode terminal connected to the anode lead wire, a cathode terminal connected to the cathode of the capacitor element, and the anode terminal A chip-type solid electrolytic capacitor comprising a part and a part of the cathode terminal exposed to cover the capacitor element and covering the capacitor element, wherein the anode terminal is a mounting surface of the component outer surface and the anode lead wire Each of the first side surfaces is exposed and has an exposed surface continuous across the boundary between the mounting surface and the first side surface. Inside the exterior resin, the anode terminal is crushed 2 Having a stepped staircase shape, wherein the thickness on the first side surface is larger than the thickness of the tip portion toward the center of the mounting surface, and one step of the staircase shape is It is larger than the shortest distance between the surface on the mounting side of the cathode layer and the outer peripheral surface of the anode lead wire, and the first side surface is composed of a cut surface and a plating surface provided at a part of the anode terminal. It is characterized by.

  The cathode terminal is exposed at a part of each of the second side surface opposite to the mounting surface and the anode lead wire of the component outer surface, and the exposed surface is continuous across the boundary between the mounting surface and the second side surface. In the exterior resin, the cathode terminal has a two-step staircase shape formed by crushing, and the thickness on the second side surface is larger than the thickness of the front end portion on the center side of the mounting surface. And one step of the step shape is larger than the shortest distance between the surface on the cathode layer mounting side and the outer peripheral surface of the anode lead wire, and the second side surface is a part of the cut surface and the cathode terminal. It is good to consist of a plating surface provided.

  The plating surface of the first side surface or the second side surface is adjacent to the mounting surface, and the cut surface of the anode terminal that separates the plating resin surface from the exterior resin may be disposed in a substantially U-shaped band shape. .

  A film containing at least one of Ag, Au, Cu, Pd, and Sn may be formed on part of the anode terminal and the cathode terminal.

  For the connection between the cathode layer and the cathode terminal, a conductive adhesive containing Ag may be used.

  The lead frame of the present invention is a lead frame for a chip-type solid electrolytic capacitor, and includes an anode terminal forming portion in which a plated recess is formed, and a cathode terminal forming portion in which another plated recess is formed It is good to have.

  The concave portion may be a polygonal shape or a shape in which at least one side is a straight line.

  The method for manufacturing a chip-type solid electrolytic capacitor of the present invention includes a step of bonding a capacitor element on a lead frame having a concave portion at least one side which is linear and plated, and the capacitor element and the lead frame are packaged. A step of molding with resin, and a step of cutting the lead frame and the exterior resin to form an outer surface to be a side surface of the product while leaving the plated surface along the plated surface of the recess. Features.

  In the step of bonding the capacitor elements, an insulating resin may be applied to a part of the anode terminal forming portion before bonding the capacitor elements.

  According to the present invention, since it is not necessary to perform a plating process after a chip is obtained by cutting, an increase in cost associated with product alignment after plating can be avoided. Furthermore, adverse effects on the product of the plating solution during the plating process can be avoided. In addition, since the lead frame of the present invention has a concave portion that has been plated, it is possible to eliminate the need for plating the chip after cutting.

  That is, according to the present invention, it is possible to provide a chip-type solid electrolytic capacitor having excellent productivity and reliability and having a plated fillet surface, a manufacturing method thereof, and a lead frame used therefor.

  Next, the best mode for carrying out the invention will be described with reference to the drawings. 1 shows a chip-type solid electrolytic capacitor of the present invention, FIG. 1 (a) is a side view on the anode side, FIG. 1 (b) is an internal perspective view from the front, and FIG. 1 (c) is a side view on the cathode side. FIG. 11 is a capacitor element, 12 is an anode lead wire, 13 is a bottom electrode type anode terminal, 14 is a bottom electrode type cathode terminal, 15a is an anode side plated fillet surface, and 15b is a cathode side plating treatment. 16 is a substantially U-shaped anode terminal cutting surface, 17 is an insulating resin, 18 is a cathode terminal cutting surface, 19 is an exterior resin, and 20 is a conductive adhesive.

  FIG. 3 is a perspective view from below showing the chip-type solid electrolytic capacitor of the present invention. The anode terminal substrate mounting surface 31, the cathode terminal substrate mounting surface 32, and the anode-side fillet surface 15a are plated. Although not shown, the fillet surface on the cathode side is also plated. With this structure, the posture when the chip is mounted on the substrate is kept stable.

  Next, the chip-type solid electrolytic capacitor of the present invention will be described along the manufacturing process. First, a capacitor element is manufactured by a known technique. In parallel, a lead frame used in the manufacturing process of the chip-type solid electrolytic capacitor of the present invention is manufactured. FIG. 4 is a plan view showing a part of the lead frame of the present invention, wherein 41 is an anode terminal forming portion, 42 is a cathode terminal forming portion, and 43a and 43b are recess forming portions. FIG. 5 is a perspective view showing a state where the anode terminal forming portion 51 and the cathode terminal forming portion 52 are molded. 53a and 53b are concave portions which are rectangular parallelepiped spaces. The recess will be described with reference to FIG. FIG. 6A is a cross-sectional view showing the first mold recess. In FIG. 6 (a), 61a is a recess, which is formed in the same manner as embossing by pressing using a mold. Then, plating processing is performed on the entire surface of the lead frame or the anode terminal forming portion including the concave portion and the cathode terminal forming portion. A metal film of at least one of Ag, Au, Cu, Pd, and Sn is used for this plating film. Further, as shown in a sectional view as a second-type recess in FIG. 6B, the recess 61b may be deeper on the side closer to the tip of the terminal and shallower on one far side.

  FIG. 2 is an internal perspective view showing a state in which a capacitor element is bonded to the lead frame thus manufactured and molded with an exterior resin. Reference numeral 21 denotes an anode terminal forming portion of the lead frame, and 22 denotes a cathode terminal forming portion of the lead frame. Further, when the exterior resin 19 and the lead frame are cut at the cut surfaces 23a and 23b, the recesses 24a and 24b are separated to become fillet surfaces 15a and 15b.

  Here, the manufacturing method of the chip-type solid electrolytic capacitor of the present invention will be organized with reference to FIG. S81 is a process for crushing the anode welded portion and forming a recess in the flat lead frame, S82 is a plating process, S83 is a process for bonding and fixing the capacitor element, and S84 is an exterior resin molding process. Step S85 is a step of cutting the lead frame and the exterior resin. Through such steps, the chip-type solid electrolytic capacitor of the present invention is obtained.

Next, examples of the present invention will be given and further described. The case where tantalum is used as the valve metal is described. Around the tantalum wire, tantalum powder is molded with a press and sintered at high vacuum and high temperature. Next, an oxide film of Ta ₂ O ₅ is formed on the surface of the tantalum metal powder. Further, after being immersed in manganese nitrate, it is thermally decomposed to form MnO ₂ , and subsequently a cathode layer made of graphite and Ag is formed to obtain a capacitor element. If a conductive polymer such as polythiophene or polypyrrole is used instead of MnO ₂ in the cathode layer, low ESR can be easily obtained. In addition to tantalum, niobium, aluminum, titanium, or the like can be used as the valve metal.

  Next, production of a lead frame will be described. As the lead frame of the present invention, a flat lead frame as shown in FIG. 4 is produced. Next, in the recess forming portions 43a and 43b, recesses are formed from below the paper surface. Further, the connecting portion with the anode lead of the capacitor element and the connecting portion with the cathode layer of the capacitor element are crushed to form the connecting portion with the capacitor element as shown in FIG. In addition, the shape obtained by crushing has a two-step staircase shape, and the thickness at the side when it becomes a product is larger than the thickness of the tip toward the center of the mounting surface. The one step is a shape that is larger than the shortest distance between the mounting side surface of the cathode layer and the outer peripheral surface of the anode lead wire.

  Here, the concave portion characteristic of the lead frame of the present invention will be further described. The shape of the recess in Example 1 is a rectangular parallelepiped as shown in FIG. 7A, and the cross-sectional shape thereof is a square as shown in FIG. 6A. In FIGS. 7A to 7D, the substrate mounting surface is drawn up in a perspective view. 42 alloy (42% Ni-58% Fe alloy) is used as the material of the lead frame, and a die cutting process is performed on the flat lead frame to form a recess as shown in FIG. 6 (a) or FIG. 7 (a). 61a or recess 71 was formed. In addition, for the bonding of the capacitor element to the lead frame, on the anode side, the insulating resin 17 is applied to the anode terminal portion approaching the cathode layer of the capacitor element, and then connected to the anode lead wire by laser welding. The cathode side was connected by a conductive adhesive 20 containing Ag. Next, after molding the exterior resin by transfer molding, the two surfaces which are the product side surfaces were cut by a dicing saw to obtain the chip-type solid electrolytic capacitor of Example 1.

  Next, a second embodiment of the present invention will be described. In Example 2, the shape of FIG. 6B was used as the recess. Others are the same as in the first embodiment.

  As shown in FIG. 6 (b), the concave portion of the second embodiment is formed by deepening the side closer to the tip of the terminal of the concave portion 61b and shallowing one far side, and plating that portion to fillet surface. It becomes.

  In the present Example 3, the shape of FIG.7 (b)-FIG.7 (d) was used as a recessed part. Others are the same as in the first embodiment.

  The first shape of the recess of the third embodiment has a triangular space as shown in a perspective view as the recess 72 in FIG. The cross section near the terminal tip becomes the fillet surface after plating.

  Further, the second shape of the concave portion of the third embodiment has a trapezoidal space as shown in a perspective view as the concave portion 73 in FIG. The cross section near the terminal tip becomes the fillet surface after plating.

  Further, the third shape of the concave portion of the third embodiment has a space formed by a circular or elliptical arc-shaped portion and a straight portion as shown in a perspective view as the concave portion 74 in FIG. Yes. The cross section near the terminal tip becomes the fillet surface after plating.

  Thus, in Examples 2 and 3, the shape of the recesses is different, but an appropriate one is used depending on the elastic and plastic properties of the lead frame alloy, the thickness of the lead frame, the dimensions of the required fillet surface, etc. It is good to do.

The figure which shows the chip-type solid electrolytic capacitor of this invention. 1A is a side view of the anode side, FIG. 1B is an internal perspective view from the front, and FIG. 1C is a side view of the cathode side. The internal perspective view which shows the state which joined the capacitor | condenser element to the lead frame of this invention, and was molded with exterior resin. The perspective view from the lower part which shows the external shape of the chip-type solid electrolytic capacitor of this invention. The top view which shows the lead frame of this invention. The perspective view which shows the anode terminal formation part and cathode terminal formation part of the lead frame of this invention. Sectional drawing which shows the recessed part in the lead frame of this invention. FIG. 6A is a cross-sectional view showing a first-type recess, and FIG. 6B is a cross-sectional view showing a second-type recess. The perspective view which shows the recessed part of an Example. 7A is a perspective view showing a quadrangular concave portion, FIG. 7B is a perspective view showing a triangular concave portion, FIG. 7C is a perspective view showing a trapezoidal concave portion, and FIG. 7D. FIG. 3 is a perspective view showing a concave portion formed of an arc-shaped portion and a straight portion. The process flowchart of this invention. The figure which shows the conventional chip-type solid electrolytic capacitor. 9A is a side view on the anode side, FIG. 9B is an internal perspective view from the front, and FIG. 9C is a side view on the cathode side. The internal perspective view which shows the state which connected the capacitor | condenser element to the conventional lead frame, and was molded by exterior resin. Conventional process flow diagram.

Explanation of symbols

11, 91 Capacitor element 12, 92 Anode lead wire 13, 93 Anode terminal 14, 94 Cathode terminal 15a, 15b, 96, 98 Fillet surface 16 Anode terminal cut surface 17, 97 Insulating resin 18 Cathode terminal cut surface 19, 99 Exterior resin 20, 100 Conductive adhesive 21, 41, 51, 101 Anode terminal forming portions 22, 42, 52, 102 Cathode terminal forming portions 23a, 23b, 103a, 103b Cut surfaces 24a, 24b, 53a, 53b, 61a, 61b, 71, 72, 73, 74 Recess 31 Anode terminal substrate mounting surface 32 Cathode terminal substrate mounting surface 43a, 43b Recessed portion formation portion

Claims (9)

  A capacitor element from which an anode lead is derived, an anode terminal connected to the anode lead, a cathode terminal connected to the cathode of the capacitor element, a part of the anode terminal, and a part of the cathode terminal A chip-type solid electrolytic capacitor including an insulating exterior resin that is exposed and coated with the capacitor element, wherein the anode terminal is exposed on a part of each of a mounting surface and a first side surface on the anode lead wire side of a component outer surface. And having an exposed surface continuous across the boundary between the mounting surface and the first side surface, and inside the exterior resin, the anode terminal has a two-step staircase shape by crushing, The thickness on one side surface is larger than the thickness of the tip portion toward the center of the mounting surface, and one step of the step shape is formed on the mounting side surface of the cathode layer and the anode lead. Of a larger than the shortest distance between the outer peripheral surface, the first side surface is provided in a portion of the cut surface and the anode terminal, a chip type solid electrolytic capacitor characterized in that comprising the plated surface.   The cathode terminal is exposed at a part of each of the second side surface opposite to the mounting surface and the anode lead wire of the component outer surface, and the exposed surface is continuous across the boundary between the mounting surface and the second side surface. In the exterior resin, the cathode terminal has a two-step staircase shape formed by crushing, and the thickness on the second side surface is larger than the thickness of the front end portion on the center side of the mounting surface. And one step of the step shape is larger than the shortest distance between the surface on the cathode layer mounting side and the outer peripheral surface of the anode lead wire, and the second side surface is a part of the cut surface and the cathode terminal. The chip type solid electrolytic capacitor according to claim 1, wherein the chip type solid electrolytic capacitor is provided with a plated surface.   The plating surface of the first side surface or the second side surface is adjacent to the mounting surface, and the cut surface of the anode terminal that separates the plating surface from the exterior resin is disposed in a substantially U-shaped band shape. 3. The chip-type solid electrolytic capacitor according to claim 2, wherein   4. The chip-type solid electrolytic capacitor according to claim 3, wherein a film containing at least one of Ag, Au, Cu, Pd, and Sn is formed on a part of the anode terminal and the cathode terminal.   5. The chip-type solid electrolytic capacitor according to claim 3, wherein a conductive adhesive containing Ag is used for connection between the cathode layer and the cathode terminal.   A lead frame for a chip-type solid electrolytic capacitor, comprising an anode terminal forming portion in which a plated recess is formed, and a cathode terminal forming portion in which another plated recess is formed Lead frame.   The lead frame according to claim 6, wherein the recess has a polygonal shape or a shape in which at least one side is a straight line.   A step of bonding a capacitor element on a lead frame having a recess, at least one side of which is linear and plated, a step of molding the capacitor element and the lead frame with an exterior resin, and a plating surface of the recess And a step of cutting the lead frame and the exterior resin while leaving the plated surface to form an outer surface to be a side surface of the product.   9. The method of manufacturing a chip-type solid electrolytic capacitor according to claim 8, wherein in the step of bonding the capacitor element, an insulating resin is applied to a part of the anode terminal forming portion before bonding the capacitor element. .

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