JP4756646B2 - Surface mount capacitor case and surface mount capacitor using the same - Google Patents

Description

  The present invention relates to a surface-mounted capacitor case and a surface-mounted capacitor using the same, and is particularly preferably used for a decoupling circuit for a stabilized power source connected to a CPU.

  It is also called a transmission line type element or a transmission line type noise filter, has a capacity of several hundred μF, has an ESR (equivalent series resistance) of 5 mΩ or less in a frequency band of 100 MHz, and has an ESL (equivalent series inductance) of about 1 pH. Surface mount capacitors that combine the characteristics of capacitors and filters have been developed. This element is particularly suitable for a decoupling circuit for a power supply line connected to a CPU. In addition, devices with higher capacitance by stacking single-layer devices and connecting them in parallel have been developed, such as personal computers (PCs), servers, digital home appliances, communication devices, etc. that are increasing in speed and frequency. The power supply line operates as a high-performance surface mount capacitor.

  A surface mount capacitor is formed by forming an etching layer and a dielectric film for enlarging the surface of a valve metal plate or foil, then separating the end with an insulating resin to provide an anode part and a dielectric film on the center part. A solid electrolyte layer and a conductive material layer are formed and a cathode part is provided to produce a capacitor element. A connecting strip is welded to the anode part to form a capacitor element.

  FIG. 11 is an exploded perspective view of a surface mount capacitor of a single layer element type according to the prior art. The element case 1 is a box shape in which the upper part having the bottom part and the side wall part is opened by the insert mold method on the lead frame on which the terminal is formed, and the thickness is increased at the corner part where the bottom part and the side wall part intersect. The molded resin case provided with the reinforced portion is molded, and the belt-like plate welded to the capacitor element 4 and the anode and cathode portions of the capacitor element 4 are connected to the lead frame in the mold resin case, and at least the mold resin case It is a surface mount type capacitor provided with a case lid 2 or an outer case covering the upper side.

  This will be further described with reference to the drawings of Patent Document 1. FIG. 12 is a side view of a conventional multilayer element type surface mount capacitor corresponding to FIG. 13B of Patent Document 1, and FIG. 13 is a conventional example corresponding to FIG. 13A of Patent Document 1. It is an internal perspective view from the front in a multilayer element type surface mount capacitor. 1 is an element case, 2 is a case lid, 3 is a terminal, 3a is an anode terminal, 3b is a cathode terminal, and 4 is a capacitor element. With such a structure, a surface mount capacitor of a multilayer or single layer type is realized. As can be seen from FIG. 12, in the conventional surface mount capacitor, the tip of the terminal has an acute angle shape to form a solder fillet. However, the tip portion did not protrude from the side surface of the case lid 2.

JP 2006-128247 A

  Conventionally, the case lid width dimension is the same as the cutting width of the terminal on which the solder fillet consisting of an anode and a cathode is formed. If the element case and the case lid are combined based on either one, the side surface of the case lid The terminal did not protrude further, and the positional relationship between the terminal and the case lid did not shift.

  However, due to market demands, it has been demanded that the solder fillet is slightly protruded from the outer case (side surface of the case lid) so that the soldering visibility is improved. FIG. 14 shows the state of soldering at that time. That is, FIG. 14 is a partial sectional view showing a state in which a conventional surface mount capacitor is mounted on a circuit board. 1 is an element case, 2 is a case lid, 3 is a terminal, 5 is solder, and 6 is a circuit board. is there. Only the solder 5 and the circuit board 6 are shown in cross section.

  In order to improve the soldering visibility in this way, when the case lid 2 is attached to the element case 1, the terminal 3 on which the solder fillet is formed becomes longer than the outer case end (side end of the case lid 2). The tip protrudes from the outer case (case lid 2). As a result, the protruding state of the terminals is not uniform, and the appearance as a capacitor may be uneven.

  Also, since the terminal where the solder fillet is formed protrudes from the case lid, if the overhang is too large, if the terminal is accidentally bumped, the terminal deforms or cracks from the terminal and the resin molded joint There was a concern, and sometimes the capacitor characteristics were deteriorated.

  Therefore, a method is used in which a jig having a groove formed in the upper part and a step corresponding to the terminal length is used and the case lid and the element case are bonded in an inverted state. FIG. 16 shows a bonding process for keeping the amount of the terminal protruding from the case lid uniform, FIG. 16 (a) is a partial sectional view showing the bonding process between the element case and the case lid, and FIG. It is a perspective view at the time of setting the front surface mounting type capacitor to a jig. As described above, since the case lid 2 and the element case 1 are bonded to the jig 16 in an inverted state, the number of processes and the number of jigs and tools are increased and the cost is increased.

  By the way, due to the structure of covering the upper and side walls of the upper open box-shaped element case with a case lid, the outer circumference of the element case dimension must be minus tolerance and the case lid dimension must be plus tolerance. A gap is generated by the mutual tolerance gap. FIG. 15 is a side view showing the case lid in a shifted state.

  When the finish tolerance of the mutual resin cases is limited, or when it is manufactured with a little “tight fit tolerance”, cracks etc. enter the corners of the resin when covering the case lid, and the product appearance is significantly impaired. In some cases, cracks occurred in the side walls of the element case or cracks in the terminal portions forming the anode and the cathode. FIG. 17 is a perspective view of a surface-mounted capacitor showing a state where cracks 17 are formed in the resin corners.

  Capacitor characteristics LC (leakage current) due to a decrease in the connection strength between the terminal and resin case due to cracking, and stresses such as thermal expansion in the reflow soldering process and connection from the anode terminal and cathode terminal to the capacitor element. There have been problems such as openness, short-circuiting, ESR (equivalent series resistance), and the like, and a deterioration in reliability.

  In other words, on the lead frame on which the terminals are formed, a box shape with the upper part having the bottom and side walls opened by the insert molding method, and a reinforcing part with increased thickness is provided at the corner where the side walls intersect. In a surface mount capacitor case in which a capacitor element is housed in a surface mount capacitor case formed by molding a molded resin element case and forming a case lid covering at least the upper side of the element case, the outer case (case cover) At the time of mounting, there is a defect that the terminal is uneven due to unevenness of terminals or the accuracy of finished parts, or that the case lid and the element case are cracked, resulting in poor product characteristics and appearance.

  Accordingly, it is an object of the present invention to provide a surface mount capacitor case and a surface mount capacitor using the surface mount capacitor case in which the protruding amount of the terminal on which the solder fillet is formed is uniform and the reliability is high and the capacitor characteristics can be secured.

  In order to solve the above-mentioned problems, the insert frame method is used on the lead frame on which the terminal portion is formed, and the thickness is increased at the corner where the side wall intersects in the box shape with the bottom and side walls open. An element case made of molded resin with a reinforced part is molded, and at that time, the outer periphery of the side wall forms a taper that spreads outward from the upper end of the case toward the lead frame, and the case lid matches the taper of the element case By forming the element case and case lid so as to have a taper that forms a surface mount capacitor case, a surface mount capacitor case with a self-alignment function added when the case cover and case element are fitted is obtained. .

In addition, by providing a taper on the outer periphery of the side wall from the outer periphery of the upper side of the side wall of the box-shaped element case with the top open toward the lead frame surface, which is the lower end of the element case, With the case cover on, the displacement between the element case and the case cover is avoided, and the amount of protrusion of the terminal from the case cover in appearance is not uniform, or the case cover is cracked and the terminal is deformed. Disappear. In addition, a semi-cylindrical or prismatic convex portion extending in the vertical direction is formed on the outer periphery of the side wall portion of the element case, and the convex portion has a cross-sectional area downward from an upper end opening portion of the side wall portion. The taper has an increasing shape, and the case lid is formed with a recess that fits into the protrusion of the element case. In addition, an inverted trapezoidal, V-shaped or U-shaped cut is formed at the upper end of the side wall of the element case, and a convex portion that fits into the cut is formed on the case lid. Further, a surface mount type capacitor is obtained in which the capacitor element is housed in the surface mount type capacitor case described above.

  In the present invention, a reinforcing part having an increased thickness at a corner where four side walls intersect with each other in a box shape in which an upper part having a bottom part and a side part is opened by an insert molding method on a lead frame on which terminals are formed. An element case made of a molded resin provided with a taper and having a taper that spreads outward from the case opening upper part toward the lead frame surface is formed, and at least the inside of the case cover covering the upper side is the element By having a taper that matches the side wall of the case, first the position of the terminal on which the solder fillet is formed is prevented, and further, by forming a tapered portion on the element case and the case lid, the center is determined at the time of fitting, For example, the contact between the four side walls of the element case and the inside of the case cover, and the contact between the upper end surface of the side wall and the inner side surface of the case cover causes the element case to be centered. As case lid center matches can accurate positioning, as a result, the amount of projection of the terminal becomes uniform, can process also simplified without special jigs and tools.

  Furthermore, due to the taper provided in the element case, the side wall of the base of the terminal is thickened, increasing the strength of the element case, resulting in a more robust capacitor element storage case, and a high-performance surface mount type that does not impair the capacitor characteristics and has no appearance defects Capacitors can be provided.

  That is, according to the present invention, it is possible to provide a surface-mounted capacitor case and a surface-mounted capacitor that can eliminate appearance defects associated with deterioration of capacitor characteristics and reduced visibility of soldered state.

  First, a general surface mount capacitor case according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a taper portion of an element case and a case lid according to an embodiment of the present invention. FIG. 1A is a cross-sectional view before fitting the element case and the case lid (displayed only by a cut surface), FIG. b) is a side view after fitting. FIG. 2 is a cross-sectional view of the element case in the embodiment of the present invention. 3 shows a surface mount capacitor case according to the embodiment of the present invention, FIG. 3 (a) is a perspective view showing the case lid, FIG. 3 (b) is a perspective view showing the element case, and FIG. (C) is AA sectional drawing of an element case. FIG. 4 is a perspective view showing a lead frame of a surface mount type terminal according to the present invention and a conventional example, and shows a portion corresponding to one surface mount type capacitor. FIG. 5 is a perspective view showing a surface-mounted capacitor case in the embodiment of the present invention.

  On the lead frame on which the anode terminal 3a and the cathode terminal 3b of FIG. 4 are formed, as shown in FIG. 2, FIG. 3 (b) and FIG. An element case 1 made of mold resin is formed, which is an open box shape and is further provided with a reinforcing portion with an increased thickness at a corner 9 (corner) where the side walls intersect. At this time, the element case 1 is formed in which the outer peripheral portion of the side wall is provided with the tapered surface 8 that spreads outward from the open upper portion of the element case 1 toward the lead frame surface (the surface of the terminal 3). Further, as shown in FIGS. 1 and 3, a case lid 2 having a tapered surface 8 fitted to the element case 1 is formed.

  That is, as shown in FIGS. 1 and 3, a case lid 2 is used in which the inner surface of the case lid 2 is formed so as to match the taper portion on the outer periphery of the element case, and the upper surface and outer periphery of the element case 1 can be covered. When the case lid 2 is fitted to the case 1, the taper portions provided on the four sides come into contact with each other, the element case center coincides with the case lid center, no lateral displacement occurs, and the tip of the terminal 3 where the solder fillet is formed And the positional relationship between the outer surface of the case lid 2 and the outer surface of the case lid 2 are properly maintained.

  Generally, more accurate positioning is possible by adding composite elements on the outer peripheral surface, the curved ridgeline, and the tapered surface formed by each of the element case 1 and the case lid 2.

  Also, as shown in FIG. 2, a bottom protrusion is provided at the opposing portion of the anode terminal 3a and the cathode terminal 3b of the lead frame of FIG. 4, and an anchor structure is formed by biting into the bottom portion of the element case. While the bottom surface becomes thick, ribs are formed at the lower part of the side wall, and a more rigid element case can be obtained.

  By storing a capacitor element produced by a known technique in the surface mount capacitor case as described above, the capacitor element can be reliably protected, and the surface with good appearance relating to the extension of the terminal can be obtained without impairing the capacitor characteristics. A mounted capacitor is obtained.

  Next, individual embodiments will be described.

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to the drawings. As shown in FIG. 4, the element case has a single lead frame, generally a nickel plate on a copper plate base, a silver plate on one side, and a lead frame on the other side with a tin plate. The two anode terminals 3a are formed, and the bottom surface of the lead frame is formed with a notch as shown in FIG. A box-shaped mold resin case (element case 1) having an open top as shown in FIG. 3B is formed on the lead frame by an insulating mold using an insulating resin.

  Here, the filled insulating resin is made of a thermoplastic or thermosetting resin such as a liquid crystal polymer to form four side walls so that the lead frame bent portion bites into the resin when injected. A thicker case is manufactured by increasing the thickness of the four side wall inner corners (corner portions 9) so that the side walls can complement each other.

  Further, taper is formed so that the outer periphery of the side wall becomes thicker on the lead frame surface from the upper surface of the box-shaped element case 1 opened upward to the lead frame (terminal 3) which is the lower surface (FIG. 2). As shown in FIG. 3C, the side wall is formed so that the side wall forms a trapezoidal cross section. The taper angle is preferably an angle in consideration of mold release and thickness of the resin mold, but this angle is not particularly limited.

  As shown in FIGS. 1 and 3A, the case lid 2 has a box shape that opens downward, and is provided with a taper (inclination) on the inner side so that the side wall gradually becomes thicker from the lower open end toward the upper surface of the case lid. . At this time, the taper is set to a taper angle matching the outer periphery of the element case side wall.

  A conductive adhesive is applied to the anode terminal 3a and the cathode terminal 3b in the element case 1 of FIG. 2, a capacitor element is inserted, and weighted and fixed in a heated state. Further, a resin adhesive is applied to the upper surface of the side wall of the element case 1 and a case lid is placed thereon, and is weighted and fixed in a heated state to complete a surface mount type capacitor. Here, the adhesion schematic diagram is omitted.

(Embodiment 2)
Next, a second embodiment of the present invention will be described. Although the fitting structure of the element case and the case lid is different from the first embodiment, the element case 1 and the case lid 2 are molded in substantially the same manner as the first embodiment. FIG. 6 is a cross-sectional view showing the shape of the element case 1 according to the second embodiment only by a cut end. A tapered surface 81 is provided on the inner surface of the upper opening at the four side walls of the element case 1 from the upper end of the opening downward. The taper angle is set so that the case lid 2 can enter smoothly. The angle is not particularly limited as in the first embodiment.

  On the other hand, the case lid 2 is provided with crosspieces 21 on four sides along the inner side of the element case 1, the taper of the element case 1 matches the outer peripheral surface of the crosspiece 21, and the center of the case cover 2 coincides with the center of the element case 1. Thus, a tapered surface 81 is provided, and the tapered surfaces 81 are in contact with each other during fitting.

  The four side bars 21 provided in the case lid 2 serve to prevent twisting and warping of the case lid body, and perform an alignment function by contact between the tapered portions. The case of bonding to the element case 1 is the same as in the first embodiment.

(Embodiment 3)
Next, a third embodiment of the present invention will be described. The point of manufacturing a box-shaped molding resin case on the lead frame is the same as in the first embodiment, and is omitted. 7 shows a side wall portion of the element case in which a convex portion having a taper is formed. FIG. 7A is a perspective view showing a case in which a semi-cylindrical convex portion having a taper is formed, and FIG. FIG. 5 is a schematic perspective view showing a case where a triangular prism-shaped convex portion having a taper is formed.

  As shown in FIG. 7, the element case upper open type box-like shape is formed with a straight line and a curved line (FIG. 7A), or a substantially triangular shape (FIG. 7B) in the outer peripheral direction, and the element case 1 A taper (inclination) is provided from the upper end surface toward the terminal 3 of the lower lead frame. Although the illustration of the case lid is omitted here, the shape of the case lid is assumed to have a recess that matches the shape of the element case 1. Further, the case of bonding to the element case 1 is the same as that of the first embodiment. Although one or two convex portions are shown on one side of the side wall, the number of convex portions is not limited to this because it has an alignment function (a function for determining the mounting position of the case lid) as long as it is one or more.

  In general, the element case 1 and the case lid 2 are fitted with various shapes having a self-alignment function (a function of automatically aligning the center of the case lid with the center of the element case). FIG. 8, FIG. 9, and FIG. A typical example is shown.

  FIG. 8 is a perspective view showing a surface-mounted capacitor case that is fitted and positioned without a taper on the convex part and the concave part itself, and FIG. 8A is a perspective view of the first example, FIG. FIG. 8B is a perspective view of the second example, and FIG. 8C is a perspective view of the third example.

  That is, FIG. 8A is an example (first example) in which a semi-cylindrical convex portion 11 is formed on the side wall of the element case 1 and a reverse concave portion is formed on the side wall of the case lid 2. FIG. 8B shows an example (second example) in which a hemispherical convex portion 11 is formed and the case lid 2 is formed with a reverse concave portion. FIG. 8C shows an example (third example) in which a triangular prism-shaped convex portion 11 is formed and the case lid 2 is formed with a reverse concave portion. However, these are representative shapes and are not limited thereto.

  By the way, the fitting structure in which the convex portion and the concave portion are tapered has already been described with reference to FIG. 7, and the fitting structure in which the convex portion and the concave portion themselves are not tapered has been described with reference to FIG. A modification will be described with reference to FIGS.

  First, FIG. 9 is an exploded perspective view for assisting the description of the modification of FIG. FIG. 10 shows six types of modification examples, FIG. 10 (a) is a plan view of the first modification example, FIG. 10 (b) is a sectional view taken along the line BB, and FIG. 10 (c) is a plan view of the second modification example. FIG. 10 (d) is a sectional view taken along the line CC, FIG. 10 (e) is a plan view of the third modification, FIG. 10 (f) is a sectional view taken along the line DD, and FIG. FIG. 10 (h) is a front view thereof, FIG. 10 (i) is a plan view of a fifth modification example, FIG. 10 (j) is a front view thereof, and FIG. 10 (k) is a sixth modification example. FIG. 10 (l) is a front view of FIG.

  In the first modification shown in FIGS. 10A and 10B, a V-shaped projecting portion is formed on the side wall of the element case 1, a corresponding recess is formed in the case lid 2, and the lower end lead frame. It is an example which has a taper toward the surface. Although it is an example similar to FIG.7 (b), in FIG.10 (a), the state by which case cover 2 is fitted by element case 1 is shown with sectional drawing. Note that the terminal 3 in FIG. 17B is not shown in FIG.

  In the second modified example shown in FIGS. 10C and 10D, a protruding portion having a semicircular cross section is formed in the element case 1 instead of the V-shaped protruding portion of the first modified example. This is an example in which the taper shown in FIG. Although it is an example similar to Fig.7 (a), in FIG.10 (d), the state by which a case cover is fitted by the element case is shown with sectional drawing.

  The third modified example shown in FIGS. 10E and 10F is an example in which the corner (corner) has a taper. That is, the reinforcing portions at the four corners inside the case lid are tapered.

  The fourth modification shown in FIGS. 10G and 10H is an example in which a rectangular cut is provided in the upper portion of the side wall of the element case 1 and a convex portion is formed on the inner side of the case lid 2. is there. In this example, a case is shown in which cuts are provided in two opposing side wall portions, but a cut may be formed in all four side walls, and two or more cuts may be provided in one of the side wall portions. May be. Moreover, you may provide one notch only in one side wall part. Further, the outer periphery of the side wall portion with the cuts may or may not be tapered.

  In the fifth modification shown in FIGS. 10 (i) and 10 (j), an inverted trapezoidal notch is formed on the side wall instead of the rectangular shape of the fourth modification, and the inverted trapezoidal convex portion is formed on the inside of the case lid. Is an example of forming.

  In the sixth modified example shown in FIGS. 10 (k) and 10 (l), a U-shaped cut is formed on the side wall instead of the rectangular shape of the fourth modified example, and a convex portion corresponding to the cut shape is formed. It is the example formed in the case lid. In addition, it can replace with U shape and can also be made into V shape.

  The first and second modified examples are examples in which the outer periphery of the element case has both a convex shape and a taper, and the third modified example is an example in which the reinforcing portions at the four corners are tapered, and the fourth to sixth modified examples. The example is an example in which positioning is performed by cutting elements at the outer periphery of the element case side wall and at the upper end of the side wall. The amount of cut is not limited to that illustrated. A surface mount capacitor case having a shape in which the first to third modifications and the fourth to sixth modifications are combined with each other is also possible. For example, there is a case where the inner corner portion of the case lid has the tapered reinforcing portion of the third modified example, and the upper portion of the side wall portion of the element case has the U-shaped cut of the sixth modified example.

  The surface mounting capacitor case of the present invention can be used not only for capacitors but also as a surface mounting case for accommodating various electric circuit elements.

FIG. 1A shows a taper portion of an element case and a case lid in an embodiment of the present invention, FIG. 1A is a cross-sectional view before fitting the element case and the case lid, and FIG. 1B is a side view after fitting. . Sectional drawing of the element case in embodiment of this invention. FIG. 3A is a perspective view showing a case lid, FIG. 3B is a perspective view showing an element case, and FIG. 3C is an element view showing a surface mount capacitor case according to an embodiment of the present invention. AA sectional drawing of a case. The perspective view which shows the lead frame of the surface mount type terminal which concerns on this invention and a prior art example. The perspective view which shows the surface mount type capacitor | condenser case in embodiment of this invention. Sectional drawing which shows the shape of the element case in other embodiment of this invention. FIG. 7A is a perspective view showing a case where a tapered semi-cylindrical convex portion is formed, and FIG. 7A shows a side wall portion of an element case formed with a tapered convex portion according to the present invention. FIG. 5B is a perspective view showing a case where a triangular prism-shaped convex portion having a taper is formed. FIG. 8A is a perspective view of the first example, FIG. 8B is a perspective view of the first example, and FIG. FIG. 8C is a perspective view of the third example, and FIG. 8C is a perspective view of the third example. The disassembled perspective view for assisting description of the modification of FIG. FIG. 10 (a) is a plan view of the first modification, FIG. 10 (b) is a BB cross-sectional view thereof, and FIG. 10 (c) is a second modification. FIG. 10 (d) is a sectional view taken along the line CC, FIG. 10 (e) is a plan view of the third modification, FIG. 10 (f) is a sectional view taken along the line DD, and FIG. FIG. 10 (h) is a front view thereof, FIG. 10 (i) is a plan view of a fifth variant, FIG. 10 (j) is a front view thereof, and FIG. 10 (k) is a sixth variant view thereof. FIG. 10 (l) is a front view of an example plan view. The disassembled perspective view of the surface mount type capacitor of the single layer element type of a prior art example. The side view of the surface mount type capacitor of a prior art example. The internal perspective view from the front in the surface mount type capacitor of the multilayer element type of the conventional example. The fragmentary sectional view which shows the state which mounted the conventional surface mount type capacitor on the circuit board. The side view which shows the deviation | shift state of a case cover of a prior art example. FIG. 16 (a) is a partial cross-sectional view illustrating the bonding process between the element case and the case lid, and FIG. 16 (b) illustrates bonding. The perspective view at the time of setting the front surface mounting type capacitor to a jig. The perspective view of the surface mount-type capacitor | condenser which shows the state by which the resin corner part of the prior art was cracked.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Element case 2 Case cover 3 Terminal 3a Anode terminal 3b Cathode terminal 4 Capacitor element 5 Solder 6 Circuit board 8, 81 Tapered surface 9 Corners 10, 11 Convex part 16 Jig tool 17 Crack 21 Crosspiece

Claims (4)

  An element case formed by molding a box-shaped mold resin having a bottom part and a side wall part on the lead frame on which the terminal part is formed by an insert molding method and having an open top, and a case cover covering at least the upper part of the element case In the surface mounting type capacitor case, a flat taper portion is formed on the outer periphery of the side wall portion of the element case so as to extend outward from the upper end opening portion toward the lower end lead frame surface. Is a surface mount type capacitor case, wherein a planar taper portion matching the taper portion of the element case is formed.   An element case formed by molding a box-shaped mold resin having a bottom part and a side wall part on the lead frame on which the terminal part is formed by an insert molding method and having an open top, and a case cover covering at least the upper part of the element case A semi-cylindrical or prismatic convex portion extending in the vertical direction is formed on the outer periphery of the side wall portion of the element case, and the convex portion is an upper end open portion of the side wall portion. A surface-mount type capacitor case having a taper having a shape in which a cross-sectional area increases further downward, and a concave portion formed in the case lid to be fitted to the convex portion of the element case. Claims the upper end of the side wall portion of the front Symbol element case, an inverted trapezoid, cut V-shaped or U-shaped is formed, in said case lid, wherein a convex portion to be fitted into the notches the formed Item 2. A surface mount capacitor case according to Item 1 .   A surface-mounted capacitor, wherein a capacitor element is accommodated in the surface-mounted capacitor case according to claim 1.

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