JP4613669B2 - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

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JP4613669B2
JP4613669B2 JP2005107251A JP2005107251A JP4613669B2 JP 4613669 B2 JP4613669 B2 JP 4613669B2 JP 2005107251 A JP2005107251 A JP 2005107251A JP 2005107251 A JP2005107251 A JP 2005107251A JP 4613669 B2 JP4613669 B2 JP 4613669B2
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terminal
cathode
anode
solid electrolytic
electrolytic capacitor
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JP2006190925A (en
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正俊 田制
正弘 藪下
一雄 川人
健司 倉貫
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は各種電子機器に使用されるコンデンサの中で、特に、導電性高分子を固体電解質に用いた固体電解コンデンサ関するものである。 The present invention is in the capacitors that are used in various electronic devices, in particular, a conductive polymer in which relates to a solid electrolytic capacitor using a solid electrolyte.

電子機器の高周波化に伴って電子部品の一つであるコンデンサにも従来よりも高周波領域でのインピーダンス特性に優れるコンデンサが求められてきており、このような要求に応えるために電気伝導度の高い導電性高分子を固体電解質に用いた固体電解コンデンサが種々検討されている。   Along with the higher frequency of electronic devices, capacitors that are one of the electronic components are also required to have better impedance characteristics in the high frequency range than before, and high electrical conductivity is required to meet these requirements. Various solid electrolytic capacitors using a conductive polymer as a solid electrolyte have been studied.

図6は従来のこの種の固体電解コンデンサの構成を示した断面図、図7は同斜視図、図8は同固体電解コンデンサに使用されるコンデンサ素子の構成を示した一部切り欠き斜視図であり、図6〜図8において20はコンデンサ素子を示し、このコンデンサ素子20は弁作用金属であるアルミニウム箔からなる陽極体21の表面に誘電体酸化皮膜層を形成した後に絶縁性のレジスト部22を設けて陽極部23と陰極部24に分離し、この陰極部24の誘電体酸化皮膜層の表面に導電性高分子からなる固体電解質層25、カーボンと銀ペーストからなる陰極層26を順次積層形成することによって構成されたものである。   FIG. 6 is a sectional view showing the structure of this type of conventional solid electrolytic capacitor, FIG. 7 is a perspective view thereof, and FIG. 8 is a partially cutaway perspective view showing the structure of a capacitor element used in the solid electrolytic capacitor. 6 to 8, reference numeral 20 denotes a capacitor element. The capacitor element 20 is formed by forming a dielectric oxide film layer on the surface of an anode body 21 made of an aluminum foil which is a valve metal, and then insulating resist portions. 22 is separated into an anode portion 23 and a cathode portion 24, and a solid electrolyte layer 25 made of a conductive polymer and a cathode layer 26 made of carbon and silver paste are sequentially formed on the surface of the dielectric oxide film layer of the cathode portion 24. It is configured by stacking.

27は陽極端子、28は陰極端子、28aはこの陰極端子28の接続面の一部を曲げ起こすことにより形成されたガイド部であり、上記コンデンサ素子20の陽極部23を陽極端子27の接続面に、同じく陰極部24を陰極端子28の接続面に夫々搭載し、コンデンサ素子20の陽極部23を陽極端子27の接続面の接続部27aを折り曲げて抵抗溶接により接合し、陰極部24を陰極端子28の接続面に図示しない導電性銀ペーストを介して接合したものである。   27 is an anode terminal, 28 is a cathode terminal, 28a is a guide part formed by bending a part of the connection surface of the cathode terminal 28, and the anode part 23 of the capacitor element 20 is connected to the connection surface of the anode terminal 27. Similarly, the cathode portion 24 is mounted on the connecting surface of the cathode terminal 28, the anode portion 23 of the capacitor element 20 is joined by resistance welding by bending the connecting portion 27a of the connecting surface of the anode terminal 27, and the cathode portion 24 is joined to the cathode. It is joined to the connection surface of the terminal 28 via a conductive silver paste (not shown).

29はこのようにコンデンサ素子20を接合した陽極端子27と陰極端子28の一部が夫々外表面に露呈する状態で上記コンデンサ素子20を被覆した絶縁性の外装樹脂であり、この外装樹脂29から表出した陽極端子27と陰極端子28は夫々外装樹脂29に沿って側面から底面へと折り曲げられることによって外部端子を構成し、これにより面実装型の固体電解コンデンサを構成したものであった。   Reference numeral 29 denotes an insulating exterior resin that covers the capacitor element 20 in a state where parts of the anode terminal 27 and the cathode terminal 28 to which the capacitor element 20 is bonded are exposed on the outer surface. The exposed anode terminal 27 and cathode terminal 28 were each bent from the side surface to the bottom surface along the exterior resin 29 to constitute an external terminal, thereby constituting a surface mount type solid electrolytic capacitor.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2000−340463号公報
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2000-340463 A

しかしながら上記従来の固体電解コンデンサでは、陽極端子27と陰極端子28のコンデンサ素子20との接触面(陽極部23と陰極部24)から実装面までの距離が長いことからESL(等価直列インダクタンス)特性が悪いという課題があり、近年、パーソナルコンピュータのCPU周り等に使用される電解コンデンサには小型大容量化が強く望まれており、更に高周波化に対応して低ESR(等価直列抵抗)化のみならず、ノイズ除去性や過度応答性に優れ、かつ低ESL化が要求されている状況下では採用できないという課題を有したものであった。   However, in the above-described conventional solid electrolytic capacitor, since the distance from the contact surface (the anode portion 23 and the cathode portion 24) between the anode terminal 27 and the capacitor element 20 of the cathode terminal 28 to the mounting surface is long, ESL (equivalent series inductance) characteristics are obtained. In recent years, there has been a strong demand for smaller and larger electrolytic capacitors used around CPUs in personal computers, and only low ESR (equivalent series resistance) is required for higher frequencies. In other words, it has a problem that it cannot be employed in a situation where noise eliminability and transient response are excellent and low ESL is required.

本発明はこのような従来の課題を解決し、コンデンサ素子から端子までの引き出し距離を短くすることにより低ESL化を達成することが可能な固体電解コンデンサ提供することを目的とするものである。 An object of the present invention is to solve such a conventional problem and to provide a solid electrolytic capacitor capable of achieving low ESL by shortening a drawing distance from a capacitor element to a terminal. .

上記目的を達成するために本発明は、陽極部と陰極部を有する平板状のコンデンサ素子を陽極フレームフレーム上に接合し、この陽極フレームと陰極フレームを陽極端子と陰極端子上に夫々接合し、この陽極端子と陰極端子の実装面となる夫々の下面を露呈させて上記コンデンサ素子を外装樹脂で被覆した固体電解コンデンサにおいて、上記陽極端子と陰極端子とを結ぶ方向と交差する方向上にある上記陽極端子の両端に、上記陽極端子の下面から上方へ階段状の段差を形成して上記陽極フレームと接合される接合面を設けると共に、上記陰極端子の中央部に上記陰極端子の下面から上方へ隆起した上記陰極フレームと接合される接合面を設け、さらに、上記陰極端子と陽極端子の下面が近接した部分の上記陽極端子ならびに陰極端子の下面端部から相手側に向かって上方へ延びる遮蔽部を上記陽極端子と陰極端子に夫々設け、かつ、上記陽極端子と陰極端子に設けた夫々の接合面と遮蔽部が外装樹脂に被覆されるように構成したものである。   In order to achieve the above object, the present invention joins a plate-like capacitor element having an anode part and a cathode part on an anode frame frame, and joins the anode frame and the cathode frame on the anode terminal and the cathode terminal, respectively. In the solid electrolytic capacitor in which the lower surfaces of the mounting surfaces of the anode terminal and the cathode terminal are exposed and the capacitor element is covered with the exterior resin, the above-described direction that intersects the direction connecting the anode terminal and the cathode terminal At both ends of the anode terminal, a stepped step is formed upward from the lower surface of the anode terminal to provide a joining surface joined to the anode frame, and at the center of the cathode terminal upward from the lower surface of the cathode terminal. A joint surface to be joined to the raised cathode frame is provided, and further, the anode terminal and the lower surface of the cathode terminal at a portion where the cathode terminal and the lower surface of the anode terminal are close to each other A shielding portion extending upward from the first portion toward the other side is provided on each of the anode terminal and the cathode terminal, and the respective joint surfaces and shielding portions provided on the anode terminal and the cathode terminal are covered with the exterior resin. It is composed.

以上のように本発明によれば、コンデンサ素子の陽極部を陽極フレームに接合し、この陽極フレームを陽極端子の両端部の下面から階段状の段差を形成した接合面に接合したものと、コンデンサ素子の陰極部を陰極フレームに接合し、この陰極フレームを陰極端子の下面から中央部に隆起した接合面に接合したのものと、さらに陽極端子と陰極端子との実装面となる下面を近接させた構成により、コンデンサ素子の陽極部と陰極部から夫々陽極端子、陰極端子の実装面までの引き出し距離が短く、陽極端子と陰極端子が接近して外部との電気的回路を形成するためESLが小さくなる効果が得られる。   As described above, according to the present invention, the anode part of the capacitor element is joined to the anode frame, and the anode frame is joined to the joining surface formed with the stepped step from the lower surface of both ends of the anode terminal, and the capacitor The cathode part of the element is joined to the cathode frame, and the cathode frame joined to the joining surface raised from the lower surface of the cathode terminal to the center part, and the lower surface that becomes the mounting surface of the anode terminal and the cathode terminal are brought closer to each other. With this configuration, the lead-out distance from the anode part and the cathode part of the capacitor element to the anode terminal and the mounting surface of the cathode terminal is short, and the anode terminal and the cathode terminal come close to form an electric circuit with the outside. The effect of decreasing is obtained.

上記構成により、同時にコンデンサ素子から陽極端子、陰極端子の実装面までの引き出し距離が短くなるためESRが小さくなるという効果が得られる。   With the above configuration, the ESR can be reduced because the lead-out distance from the capacitor element to the mounting surface of the anode terminal and the cathode terminal is shortened at the same time.

しかも陽極端子ならびに陰極端子に夫々設けた遮蔽部を設けた構成により、外装樹脂から浸入する酸素、水分がコンデンサ素子に到達することが抑制され、ESR特性、漏れ電流特性を劣化させることを大きく低減することができる効果が得られる。   In addition, the structure provided with shielding portions provided on the anode terminal and the cathode terminal respectively suppresses oxygen and moisture entering from the exterior resin from reaching the capacitor element, greatly reducing degradation of ESR characteristics and leakage current characteristics. The effect which can be done is acquired.

さらに陰極フレームと陰極端子の下面から中央部に隆起した接合面とを接続し、この接合面を外装樹脂で被覆する構成により、陰極端子と陰極フレームの接合強度を安定にすることができるという効果が得られる。   Further, by connecting the cathode frame and the joint surface raised from the lower surface of the cathode terminal to the center, and covering the joint surface with an exterior resin, the joint strength between the cathode terminal and the cathode frame can be stabilized. Is obtained.

(実施の形態)
以下、実施の形態を用いて、本発明ついて説明する。
(Embodiment)
Hereinafter, with reference to the embodiment, it will be described with the present invention.

図1(a)〜(d)は本発明の一実施の形態による固体電解コンデンサの構成を示した側面断面図とA−A断面図とB−B断面図と底面図、図2は同固体電解コンデンサに使用されるコンデンサ素子の構成を示した一部切り欠き斜視図、図3(a)〜(c)は同コンデンサ素子ユニットの構成を示した平面図と側面図と正面図、図4は同固体電解コンデンサに使用される陽極端子と陰極端子の構成を示した要部斜視図、図5の同固体電解コンデンサに使用される陽極端子、陰極端子の下面端部の要部断面図である。   1A to 1D are a side sectional view, a sectional view taken along a line AA, a sectional view taken along a line BB, and a bottom view showing a configuration of a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 4 is a partially cutaway perspective view showing the configuration of a capacitor element used in an electrolytic capacitor, FIGS. 3A to 3C are a plan view, a side view, and a front view showing the configuration of the capacitor element unit, FIG. FIG. 4 is a perspective view of a main part showing a configuration of an anode terminal and a cathode terminal used in the solid electrolytic capacitor, and a cross-sectional view of a main part of a bottom end of the anode terminal and the cathode terminal used in the solid electrolytic capacitor in FIG. is there.

図1〜図5において、1はコンデンサ素子を示し、このコンデンサ素子1は弁作用金属であるアルミニウム箔からなる陽極体2の表面に図示しない誘電体酸化皮膜層を形成した後に絶縁性のレジスト部3を設けることによって陽極部4と陰極部5に分離し、この陰極部5の表面に導電性高分子からなる固体電解質層6、カーボンと銀ペーストからなる陰極層7を順次積層形成することにより構成されたものである。   1 to 5, reference numeral 1 denotes a capacitor element. The capacitor element 1 has an insulating resist portion after a dielectric oxide film layer (not shown) is formed on the surface of an anode body 2 made of an aluminum foil which is a valve metal. 3 is separated into an anode portion 4 and a cathode portion 5, and a solid electrolyte layer 6 made of a conductive polymer and a cathode layer 7 made of carbon and silver paste are sequentially laminated on the surface of the cathode portion 5. It is configured.

8は陽極フレームであり、この陽極フレーム8上に上記コンデンサ素子1を複数枚(本実施の形態においては5枚)積層した状態で陽極部4を載置し、両端のガイド部8aを折り曲げて陽極部4を包み込み、接合部8bでレーザー溶接を行うことによって陽極部4を陽極フレーム8上に一体に接合している。   Reference numeral 8 denotes an anode frame. The anode part 4 is placed in a state where a plurality of the capacitor elements 1 (5 sheets in the present embodiment) are stacked on the anode frame 8, and the guide parts 8a at both ends are bent. The anode part 4 is encased and the anode part 4 is integrally joined to the anode frame 8 by performing laser welding at the joint part 8b.

9は陰極フレームであり、この陰極フレーム9上に上記コンデンサ素子1を複数枚積層した状態で図示しない導電性接着剤を介して陰極部5を載置し、両端のガイド部9aならびに終端のガイド部9bにより位置決め固定をして陰極部5を陰極フレーム9上に一体に接合している。   Reference numeral 9 denotes a cathode frame. A plurality of the capacitor elements 1 are stacked on the cathode frame 9 and the cathode portion 5 is placed via a conductive adhesive (not shown). The cathode portion 5 is integrally joined to the cathode frame 9 by positioning and fixing by the portion 9b.

このようにコンデンサ素子1を複数枚積層して陽極フレーム8ならびに陰極フレーム9により一体化したものを図3に示し、以下、これをコンデンサ素子ユニットと呼ぶ。   A structure in which a plurality of capacitor elements 1 are stacked and integrated by the anode frame 8 and the cathode frame 9 is shown in FIG. 3 and is hereinafter referred to as a capacitor element unit.

10は陽極端子であり、この陽極端子10には、陽極端子10と後述する陰極端子11とを結ぶ方向と交差する方向上にある陽極端子10の両端に陽極端子の下面13から上方へ向かう階段状の段差を形成した陽極フレーム8と接合される平面状の接合面10aと、陰極端子11の方向に向かって陽極端子の下面13の端部からの斜めの上方へ延びる遮蔽部10bとを設ける。   Reference numeral 10 denotes an anode terminal. The anode terminal 10 has a staircase that goes upward from the lower surface 13 of the anode terminal to both ends of the anode terminal 10 that is on the direction intersecting the direction connecting the anode terminal 10 and the cathode terminal 11 described later. A planar joining surface 10a to be joined to the anode frame 8 having a stepped shape and a shielding portion 10b extending obliquely upward from the end of the lower surface 13 of the anode terminal toward the cathode terminal 11; .

これらは1枚の銅合金からなる厚み0.1mmを有する板状の基材を打ち抜いて折り曲げることにより一体に形成され、陽極端子10の接合面10a上に上記コンデンサ素子ユニットの陽極フレーム8を載置し、接合部10cでレーザー溶接を行うことにより接合する。   These are integrally formed by punching and bending a sheet-like base material made of a copper alloy having a thickness of 0.1 mm, and mounting the anode frame 8 of the capacitor element unit on the joint surface 10a of the anode terminal 10. And joining by performing laser welding at the joint 10c.

また、10dは陽極端子10の下面の一端を、後述する外装樹脂12から上方へ突出するように延長した突出部であり、この突出部10dは外装樹脂12の側面に沿って上方へ折り曲げられており、これにより基板実装時に半田フィレットが形成され易いようにしたものである。   Reference numeral 10d denotes a protrusion that extends from one end of the lower surface of the anode terminal 10 so as to protrude upward from an exterior resin 12 described later. The protrusion 10d is bent upward along the side surface of the exterior resin 12. This facilitates the formation of solder fillets during board mounting.

11は陰極端子であり、この陰極端子11には、陰極端子の下面14を陽極端子の下面13に可能な限り近接させて、陰極端子11の中央部に陰極端子11の幅全体を陰極端子の下面14から上方へ隆起した陰極フレーム9と接合される接合面11aと、さらに、この陰極端子の下面14の端部から上記陽極端子10側に向かって斜め上方へ延びる遮蔽部11bとを設ける。   Reference numeral 11 denotes a cathode terminal. To the cathode terminal 11, the lower surface 14 of the cathode terminal is placed as close as possible to the lower surface 13 of the anode terminal, and the entire width of the cathode terminal 11 is placed at the center of the cathode terminal 11. A joining surface 11a joined to the cathode frame 9 protruding upward from the lower surface 14 and a shielding portion 11b extending obliquely upward from the end of the lower surface 14 of the cathode terminal toward the anode terminal 10 are provided.

陽極端子、陰極端子の下面13、14は実装面となるものである。   The lower surfaces 13 and 14 of the anode terminal and the cathode terminal serve as mounting surfaces.

これらは1枚の銅合金からなる板状の基材を打ち抜いて折り曲げることにより一体に形成されており、陰極端子11の接合面11a上に上記コンデンサ素子ユニットの陰極フレーム9を載置し、接合面11aで図示しない導電性接着剤を介して接合する。   These are integrally formed by punching and bending a plate-like base material made of a single copper alloy. The cathode frame 9 of the capacitor element unit is placed on the joining surface 11a of the cathode terminal 11 and joined. The surface 11a is joined through a conductive adhesive (not shown).

また、11cは陰極端子11の下面の一端を、後述する外装樹脂12から外方へ突出するように延長した突出部であり、この突出部11cは外装樹脂12の側面に沿って上方へ折り曲げられており、これにより基板実装時に半田フィレットが形成され易いようにしたものである。   Reference numeral 11c denotes a protruding portion obtained by extending one end of the lower surface of the cathode terminal 11 so as to protrude outward from an exterior resin 12 described later. The protruding portion 11c is bent upward along the side surface of the exterior resin 12. This facilitates the formation of solder fillets during board mounting.

12は上記陽極端子と陰極端子の下面13,14を露呈させた状態で上記コンデンサ素子ユニットを一体に被覆した絶縁性の外装樹脂であり、本実施の形態においてはエポキシ樹脂を用いたものである。   Reference numeral 12 denotes an insulating exterior resin in which the capacitor element unit is integrally covered with the anode terminals and the lower surfaces 13 and 14 of the cathode terminals exposed. In this embodiment, an epoxy resin is used. .

そして、上記陽極端子10と陰極端子11に設けた接合面10a、11aと遮蔽部10b、11bは、夫々この外装樹脂12によって全て被覆されるようになり、外観には露呈しないように構成されているものである。   The joining surfaces 10a and 11a and the shielding portions 10b and 11b provided on the anode terminal 10 and the cathode terminal 11 are all covered with the exterior resin 12, respectively, and are configured not to be exposed to the exterior. It is what.

また、このように構成された陽極端子10と陰極端子11は、銅合金からなるフープ状の基材に所定の間隔で、対になって複数が連続して設けられ、このような一対の陽極端子10と陰極端子11との上にコンデンサ素子ユニットを搭載して接合し、外装樹脂12で一体に被覆した後に基材から分断して個片にするものである。   Also, the anode terminal 10 and the cathode terminal 11 configured as described above are provided in pairs at a predetermined interval on a hoop-shaped base material made of a copper alloy, and a plurality of such anode terminals 10 and cathode terminals 11 are continuously provided. A capacitor element unit is mounted on and joined to the terminal 10 and the cathode terminal 11, and is integrally covered with the exterior resin 12, and then separated from the base material into individual pieces.

このように構成された本実施の形態による固体電解コンデンサは、略平板状に形成された陽極端子10と陰極端子11によりコンデンサ素子1の陽極部4と陰極部5の外部取り出しを行うようにしたことにより、コンデンサ素子1から各端子までの引き出し距離を可能な限り短くし、さらに、陰極端子11の下面を陽極端子10の下面に可能な限り近づけて陽極端子10と陰極端子11間のパスを最短距離にした構成により、ESR特性に優れ、かつ低ESL化を実現することができる。   In the solid electrolytic capacitor according to the present embodiment configured as described above, the anode portion 4 and the cathode portion 5 of the capacitor element 1 are taken out from the anode terminal 10 and the cathode terminal 11 formed in a substantially flat plate shape. Accordingly, the lead-out distance from the capacitor element 1 to each terminal is shortened as much as possible, and further, the path between the anode terminal 10 and the cathode terminal 11 is made by bringing the lower surface of the cathode terminal 11 as close as possible to the lower surface of the anode terminal 10. With the shortest distance configuration, the ESR characteristics are excellent and low ESL can be realized.

特にESL特性に関しては、本実施の形態による固体電解コンデンサは530pHと低く、従来品の1500pHと比べると約1/3となる結果を得ることができた。   In particular, regarding the ESL characteristics, the solid electrolytic capacitor according to the present embodiment was as low as 530 pH, and a result that was about 1/3 compared with 1500 pH of the conventional product could be obtained.

また、陽極端子10ならびに陰極端子11の下面端面から相手側の端子方向に向かって斜め上方へ延びる遮蔽部10b,11bを陽極端子10ならびに陰極端子11に夫々設け、かつこの遮蔽部10b,11bを夫々外装樹脂12で被覆した構成により、外装樹脂12と、外装樹脂12と陽極端子10、陰極端子11との界面とから浸入する酸素、水分が、板状の金属からなる遮蔽部10b,11bで抑制されコンデンサ素子1に到達してESR特性、漏れ電流特性の性能を劣化させることを大きく低減することができる。   Further, shielding portions 10b and 11b extending obliquely upward from the lower surface end surfaces of the anode terminal 10 and the cathode terminal 11 toward the mating terminal direction are provided on the anode terminal 10 and the cathode terminal 11, respectively, and the shielding portions 10b and 11b are provided. With the structure coated with the exterior resin 12, respectively, oxygen and moisture entering from the exterior resin 12 and the interface between the exterior resin 12 and the anode terminal 10 and the cathode terminal 11 are shielded by the shielding portions 10b and 11b made of plate-like metal. Suppressing the capacitor element 1 and degrading the performance of the ESR characteristic and leakage current characteristic can be greatly reduced.

陰極端子の下面14から隆起させた接合面11aの裏面に外装樹脂12が十分に回り込み、接合面11aでの陰極端子11と陰極フレーム9との接合強度を安定にすることができる。   The exterior resin 12 sufficiently wraps around the back surface of the joining surface 11a raised from the lower surface 14 of the cathode terminal, and the joining strength between the cathode terminal 11 and the cathode frame 9 at the joining surface 11a can be stabilized.

同様に、陽極端子10の陽極フレーム8が接合された接合面10aの周囲に外装樹脂が形成され、接合面10aでの陽極端子10と陽極フレーム8との接合強度を安定にすることができる。   Similarly, an exterior resin is formed around the joint surface 10a to which the anode frame 8 of the anode terminal 10 is joined, and the joining strength between the anode terminal 10 and the anode frame 8 at the joint surface 10a can be stabilized.

また、陽極端子10と陰極端子11に接合面10a,11aを夫々設け、この接合面10a,11aで陽極フレーム8ならびに陰極フレーム9を夫々レーザー溶接ならびに導電性接着剤で接合し、かつこの接合面10a,11aを夫々外装樹脂12で被覆した構成により、接合による接合痕が外装樹脂12により被覆されてしまうために外観が綺麗になるばかりでなく、特に溶接痕により実装時に浮きが発生して実装不良を引き起こすという恐れが皆無になり、信頼性の向上に大きく貢献することができるようになるものである。   Further, joining surfaces 10a and 11a are respectively provided on the anode terminal 10 and the cathode terminal 11, and the anode frame 8 and the cathode frame 9 are joined to each other by laser welding and a conductive adhesive at the joining surfaces 10a and 11a. 10a and 11a are each covered with the exterior resin 12, so that the joint traces of the joints are covered with the exterior resin 12, so that the appearance is not only beautiful, but also the mounting traces are generated due to the weld traces. This eliminates the fear of causing defects, and can greatly contribute to the improvement of reliability.

なお、本実施の形態においてはコンデンサ素子1を構成する陽極体2はアルミニウム箔からなる構成を例にして説明したが、本発明はこれに限定されるものではなく、タンタルやニオブの箔、あるいは焼結体、さらにはこれらの材料の組み合わせでも良いものである。   In the present embodiment, the anode body 2 constituting the capacitor element 1 has been described by taking an example of a structure made of an aluminum foil. However, the present invention is not limited to this, and a tantalum or niobium foil, A sintered body or a combination of these materials may be used.

また、本実施の形態においては陽極端子および/または陰極端子の下面13、14の一部の一端を、外装樹脂12から外方へ突出するように延長して設けた突出部10d,11cを外装樹脂12の側面に沿って上方へ折り曲げた構成で説明したが、この外装樹脂12の側面に沿って上方へ折り曲げる突出部10d,11cが嵌まり込む凹部を外装樹脂12に設けることにより、より小型化を図ることができるようになるものである。   In the present embodiment, the projecting portions 10d and 11c provided by extending one end of a part of the lower surfaces 13 and 14 of the anode terminal and / or the cathode terminal so as to project outward from the exterior resin 12 are provided on the exterior. Although the configuration in which the resin 12 is bent upward along the side surface of the resin 12 has been described, by providing the exterior resin 12 with recesses into which the protruding portions 10d and 11c that are bent upward along the side surface of the exterior resin 12 are fitted, the size is further reduced. It becomes possible to plan.

また図5において、10f、11f、10h、11hは、接合面10a、11a、遮蔽部10b、11bを形成する陽極端子、陰極端子の下面13、14に連結する端部を示し、この端部と結ばれるテーパ部15の厚みを下面13、14の板状の基材厚みより小さくなるようにプレス金型を用いて押しつぶして接合面10a、11a、遮蔽部10b、11bを上方に曲げ加工して形成することにより端部10f、11f、10h、11hが小さい曲げ半径Rとなるように構成してもよい。   Further, in FIG. 5, 10f, 11f, 10h, and 11h denote end portions connected to the joining surfaces 10a and 11a, the anode terminals forming the shielding portions 10b and 11b, and the lower surfaces 13 and 14 of the cathode terminals, The connecting surfaces 10a and 11a and the shielding portions 10b and 11b are bent upward by crushing them using a press mold so that the thickness of the taper portion 15 to be tied is smaller than the thickness of the plate-like base material of the lower surfaces 13 and 14. By forming, the end portions 10f, 11f, 10h, and 11h may be configured to have a small bending radius R.

上記曲げ加工はオフセット曲げ加工が望ましい。   The bending process is preferably an offset bending process.

上記曲げ半径Rが0.001mmより小さい場合、プレス金型の加工が困難であり、曲げ半径Rが0.05mmより大きい場合、外装樹脂12の回り込み長さが大きくなるため、曲げ半径R0.001mm〜0.05mmが望ましい。   When the bending radius R is smaller than 0.001 mm, it is difficult to process the press mold, and when the bending radius R is larger than 0.05 mm, the wraparound length of the exterior resin 12 is increased. ~ 0.05 mm is desirable.

実装面となる下面端部に小さい曲げ半径を設ける構成にすることにより、外装樹脂12の回り込み長さが下面端部より0.05mm以下に抑えられ、実装面の長さが確保でき優れた実装性が得られる。   By providing a small bend radius at the bottom surface end that becomes the mounting surface, the wraparound length of the exterior resin 12 is suppressed to 0.05 mm or less from the bottom surface end, and the mounting surface length can be secured and excellent mounting Sex is obtained.

本発明による固体電解コンデンサ、コンデンサ素子から端子までの引き出し距離を可能な限り短くし、かつ、陰極端子の下面を陽極端子の下面に可能な限り近づけた構成によってESR特性ならびにESL特性に優れ、しかも陽極端子ならびに陰極端子に夫々設けた遮蔽部により外装樹脂と端子間の界面から浸入する酸素、水分がコンデンサ素子に到達して性能を劣化させることを大きく低減することができ、かつ、外装樹脂との結合強度を向上させることができるために、高性能、高信頼性の固体電解コンデンサを安定して提供することができるという格別の効果を有し、特にパーソナルコンピュータのCPU周りに使用されるコンデンサ等として有用である。 The solid electrolytic capacitor according to the present invention has an excellent ESR characteristic and an ESL characteristic due to a configuration in which the lead-out distance from the capacitor element to the terminal is as short as possible and the lower surface of the cathode terminal is as close as possible to the lower surface of the anode terminal. Moreover, it is possible to greatly reduce the deterioration of performance due to oxygen and moisture entering from the interface between the exterior resin and the terminal by the shielding portions provided on the anode terminal and the cathode terminal, respectively, and the exterior resin. In addition, it has a special effect that it can stably provide a high-performance, high-reliability solid electrolytic capacitor, and is particularly used around a CPU of a personal computer. It is useful as a capacitor.

(a)は本発明の実施の形態による固体電解コンデンサの構成を示した側面断面図、(b)は同A-A断面図、(c)は同B-B断面図、(d)は同底面図(A) is a side sectional view showing a configuration of a solid electrolytic capacitor according to an embodiment of the present invention, (b) is a sectional view taken along the line AA, (c) is a sectional view taken along the line BB, and (d) is a sectional view taken along the same line. Bottom view 同固体電解コンデンサに使用されるコンデンサ素子の構成を示した一部切り欠き斜視図Partially cutaway perspective view showing the configuration of a capacitor element used in the solid electrolytic capacitor (a)は同コンデンサ素子ユニットの構成を示した平面図、(b)は同側面図、(c)は同正面図(A) is the top view which showed the structure of the capacitor | condenser element unit, (b) is the side view, (c) is the front view 同固体電解コンデンサに使用される陽極端子と陰極端子の構成を示した要部斜視図The principal part perspective view which showed the structure of the anode terminal and cathode terminal which are used for the solid electrolytic capacitor 同固体電解コンデンサに使用される陽極端子、陰極端子の下面端部の要部断面図Cross-sectional view of the main part of the bottom end of the anode and cathode terminals used in the solid electrolytic capacitor 従来の固体電解コンデンサの構成を示した断面図Sectional view showing the structure of a conventional solid electrolytic capacitor 同斜視図Same perspective view 同固体電解コンデンサに使用されるコンデンサ素子を示した一部切り欠き斜視図Partially cutaway perspective view showing a capacitor element used in the solid electrolytic capacitor

符号の説明Explanation of symbols

1 コンデンサ素子
2 陽極体
3 レジスト部
4 陽極部
5 陰極部
6 固体電解質層
7 陰極層
8 陽極フレーム
8a,9a,9b ガイド部
8b,10c 接合部
9 陰極フレーム
10 陽極端子
10a,11a 接合面
10b,11b 遮蔽部
10d,11c 突出部
10f,10h,11f,11h 端部
11 陰極端子
12 外装樹脂
13 陽極端子の下面
14 陰極端子の下面
15 テーパ部
DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Anode body 3 Resist part 4 Anode part 5 Cathode part 6 Solid electrolyte layer 7 Cathode layer 8 Anode frame 8a, 9a, 9b Guide part 8b, 10c Joint part 9 Cathode frame 10 Anode terminal 10a, 11a Joint surface 10b, 11b Shielding portion 10d, 11c Projection portion 10f, 10h, 11f, 11h End portion 11 Cathode terminal 12 Exterior resin 13 Lower surface of anode terminal 14 Lower surface of cathode terminal 15 Tapered portion

Claims (6)

陽極部と陰極部を有する平板状のコンデンサ素子を陽極フレーム、陰極フレーム上に接合し、この陽極フレーム、陰極フレームを夫々陽極端子、陰極端子上に接合し、この陽極端子と陰極端子の実装面となる夫々の下面を露呈させて前記コンデンサ素子を外装樹脂で被覆した固体電解コンデンサにおいて、前記陽極端子と前記陰極端子とを結ぶ方向と交差する方向上にある前記陽極端子の両端に、前記陽極端子の前記下面から上方へ階段状の段差を形成して前記陽極フレームと接合される接合面を設けると共に、前記陰極端子の中央部に前記陰極端子の前記下面から上方へ隆起した前記陰極フレームと接合される接合面を設け、さらに、前記陰極端子と前記陽極端子の前記下面が近接した部分の前記陽極端子ならびに前記陰極端子の下面端部から相手側に向かって上方へ延びる遮蔽部を前記陽極端子と前記陰極端子に夫々設け、かつ、前記陽極端子と前記陰極端子に設けた夫々の前記接合面と前記遮蔽部が前記外装樹脂に被覆されるようにした固体電解コンデンサ。 A plate-like capacitor element having an anode part and a cathode part is joined to an anode frame and a cathode frame, and the anode frame and the cathode frame are joined to an anode terminal and a cathode terminal, respectively. in the solid electrolytic capacitor of the capacitor element to expose coated with an exterior resin bottom surface of each of the, at both ends of the anode terminal in the upward direction intersecting the direction connecting the anode terminal and the cathode terminal, the anode from the lower surface of the terminal upward together to form a staircase-like steps provided joint surface joined to the anode frame and the cathode frame the raised from the lower surface to the upper side of the cathode terminal in the center portion of the cathode terminal the bonding surface to be bonded is provided, further, the lower surface end portion of said anode terminal and said cathode terminal portion the lower surface of the anode terminal and the cathode terminal is close A shielding portion that extends upward toward the Luo mating respectively provided on the cathode terminal and the anode terminal, and covering the shielding portion and the anode terminal and the said bonding surface of each provided on the cathode terminal to said exterior resin Solid electrolytic capacitor made to be. 前記陽極端子ならびに前記陰極端子が、板状の基材を打ち抜いて曲げ加工することにより形成された請求項1に記載の固体電解コンデンサ。 The anode terminal and the cathode terminal, the solid electrolytic capacitor according to claim 1 which is formed by bending by punching a plate-shaped base material. 前記接合面および/または前記遮蔽部が、前記陽極端子および/または前記陰極端子の前記下面から上方へ板状の基材を曲げ加工することにより形成され、この曲げ加工された前記接合面、前記遮蔽部を形成する前記陽極端子、前記陰極端子の前記下面に連結する端部が小さい曲げ半径を有することを特徴とする請求項1に記載の固体電解コンデンサ。 The joint surface and / or the shielding portion, wherein the lower surface upwardly is formed by bending a plate-shaped base material, the bending processed the joint surface of the anode terminal and / or the cathode terminal, wherein the anode terminal forming the shielding portion, the solid electrolytic capacitor according to claim 1, characterized in that it has a bending radius end small coupling to the lower surface of the cathode terminal. 前記コンデンサ素子が、表面を粗面化して誘電体酸化皮膜層を形成した弁作用金属からなる陽極体の所定の位置に絶縁部を設けて前記陽極部と前記陰極部に分離し、この陰極部の誘電体酸化皮膜層上に導電性高分子からなる固体電解質層、陰極層を順次積層形成することにより形成されたものである請求項1に記載の固体電解コンデンサ。 The capacitor element, the surface is roughened and separated into the cathode portion and the anode portion is provided an insulating portion in a predetermined position of the anode body made of a valve metal having a dielectric oxide film layer, the cathode portions 2. The solid electrolytic capacitor according to claim 1, wherein the solid electrolytic capacitor is formed by sequentially laminating a solid electrolyte layer made of a conductive polymer and a cathode layer on the dielectric oxide film layer. 前記陽極端子および/または前記陰極端子の前記下面の少なくとも一部を、前記外装樹脂から外方へ突出するように延長し、この延長した部分を前記外装樹脂の側面に沿って上方へ折り曲げた請求項1に記載の固体電解コンデンサ。 Claims wherein the anode terminal and / or at least a portion of said lower surface of said cathode terminal, wherein extending from the packaging resin to protrude outwardly bent upward along the extended portion on a side surface of the exterior resin Item 10. A solid electrolytic capacitor according to Item 1. 前記陽極端子および/または前記陰極端子の前記外装樹脂の前記側面に沿って上方へ折り曲げた部分の少なくとも一部が嵌まり込む凹部を前記外装樹脂に設けた請求項5に記載の固体電解コンデンサ。 The anode terminal and / or the solid electrolytic capacitor according to claim 5, at least a part of writing fits the recess of the portion bent upward along the side surface of the exterior resin provided on the exterior resin of the cathode terminal.
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JP2000077269A (en) * 1998-06-18 2000-03-14 Matsushita Electric Ind Co Ltd Chip solid electrolytic capacitor and its manufacture
JP2000138138A (en) * 1998-08-26 2000-05-16 Matsushita Electric Ind Co Ltd Solid-state electrolytic capacitor and its manufacture
JP2000323357A (en) * 1999-05-07 2000-11-24 Matsushita Electric Ind Co Ltd Chip type solid electrolytic capacitor
JP2004095816A (en) * 2002-08-30 2004-03-25 Matsushita Electric Ind Co Ltd Chip capacitor
JP2004349270A (en) * 2003-04-09 2004-12-09 Sanyo Electric Co Ltd Solid electrolytic capacitor and its fixing method

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Publication number Priority date Publication date Assignee Title
JP2000077269A (en) * 1998-06-18 2000-03-14 Matsushita Electric Ind Co Ltd Chip solid electrolytic capacitor and its manufacture
JP2000138138A (en) * 1998-08-26 2000-05-16 Matsushita Electric Ind Co Ltd Solid-state electrolytic capacitor and its manufacture
JP2000323357A (en) * 1999-05-07 2000-11-24 Matsushita Electric Ind Co Ltd Chip type solid electrolytic capacitor
JP2004095816A (en) * 2002-08-30 2004-03-25 Matsushita Electric Ind Co Ltd Chip capacitor
JP2004349270A (en) * 2003-04-09 2004-12-09 Sanyo Electric Co Ltd Solid electrolytic capacitor and its fixing method

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