JP4688704B2 - Solid electrolytic capacitor with built-in fuse - Google Patents

Solid electrolytic capacitor with built-in fuse Download PDF

Info

Publication number
JP4688704B2
JP4688704B2 JP2006067354A JP2006067354A JP4688704B2 JP 4688704 B2 JP4688704 B2 JP 4688704B2 JP 2006067354 A JP2006067354 A JP 2006067354A JP 2006067354 A JP2006067354 A JP 2006067354A JP 4688704 B2 JP4688704 B2 JP 4688704B2
Authority
JP
Japan
Prior art keywords
conductive plate
conductive
fuse
cathode
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006067354A
Other languages
Japanese (ja)
Other versions
JP2007243108A (en
Inventor
一夫 鵜沢
村上　　順一
伊亨 山添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Corp filed Critical Nichicon Corp
Priority to JP2006067354A priority Critical patent/JP4688704B2/en
Publication of JP2007243108A publication Critical patent/JP2007243108A/en
Application granted granted Critical
Publication of JP4688704B2 publication Critical patent/JP4688704B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fuses (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

本発明は、小形で大容量であり、かつ、ヒューズ機能の有無をコンデンサ部品単体で選択可能になしたヒューズ内蔵型固体電解コンデンサに関するものである。   The present invention relates to a solid electrolytic capacitor with a built-in fuse that has a small size and a large capacity, and that enables selection of the presence or absence of a fuse function by a single capacitor component.

従来のヒューズ内蔵型固体電解コンデンサは、図１５に示すように、陽極側リードフレーム１３とコンデンサ素子２とを回路を保護するための温度ヒューズ素子で溶接接合または超音波接続または熱圧着法により接続していた（例えば、特許文献１参照）。
特公平７−３８３６７号公報（特許請求の範囲、第８図および第９図） As shown in FIG. 15, the conventional solid electrolytic capacitor with a built-in fuse connects the anode side lead frame 13 and the capacitor element 2 with a thermal fuse element for protecting the circuit by welding, ultrasonic connection or thermocompression bonding. (For example, refer to Patent Document 1).
Japanese Examined Patent Publication No. 7-38367 (Claims, FIGS. 8 and 9)

従来の技術では、上記のように、ヒューズ素子を陽極側リードフレームとコンデンサ素子間に接続していたため、ヒューズ素子を接続するスペースの分だけ内部素子の体積効率が低下する問題を有しており、固体電解コンデンサを小形化し、かつ大容量化をすることが困難であった。   In the prior art, as described above, since the fuse element is connected between the anode side lead frame and the capacitor element, there is a problem that the volume efficiency of the internal element is reduced by the space for connecting the fuse element. Therefore, it has been difficult to reduce the size and increase the capacity of the solid electrolytic capacitor.

さらに、このヒューズ配線がコイル作用をもつことから、高周波仕様の回路においてはヒューズ内蔵コンデンサ自体のインピーダンス特性が劣化するため、回路によるコンデンサの使い分けが必要であった。   Further, since the fuse wiring has a coil action, the impedance characteristics of the fuse built-in capacitor itself deteriorate in a high-frequency specification circuit, so that it is necessary to properly use the capacitor according to the circuit.

本発明は、上記する課題を解決するものであって、ヒューズ素子の接続による内部素子の体積効率の低下がなく、小形かつ大容量でヒューズ機能の有無をコンデンサ部品単体で選択できるヒューズ内蔵型固体電解コンデンサを提供するものである。   SUMMARY OF THE INVENTION The present invention solves the above-described problems, and does not reduce the volume efficiency of the internal element due to the connection of the fuse element. An electrolytic capacitor is provided.

すなわち、本発明は、上記する目的を達成するにあたって、請求項１に記載の発明は、陽極導出リードを具備し、酸化皮膜層、固体電解質層および陰極引出層とを備えたコンデンサ素子と、該コンデンサ素子の電極となる電極基板と、これらを覆う外装樹脂とを有し、前記電極基板が、前記陽極導出リードに接続された陽極と、前記陰極引出層に接続された陰極と、前記陽極および陰極との間を絶縁する絶縁層を含むものからなるチップ状固体電解コンデンサにおいて、
前記電極基板における陽極および陰極はいずれも、外部電極層形成部分をなす導電板から形成され、
前記電極基板における陽極および陰極のうち少なくともどちらか一方が、独立した二つの導電板により形成され、前記独立した二つの導電板の一方が補助電極用導電板であり、前記独立した二つの導電板の他方が前記コンデンサ素子と電気的に接続されたものからなり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、
前記独立した二つの導電板のうちの他方の導電板と前記陰極側または陽極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記独立した二つの導電板のうちの補助用導電板と前記陰極側または陽極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とするヒューズ内蔵型固体電解コンデンサを構成するものである。
That is, when the present invention achieves the above-mentioned object, the invention according to claim 1 comprises an anode lead, a capacitor element comprising an oxide film layer, a solid electrolyte layer, and a cathode lead layer, An electrode substrate that serves as an electrode of a capacitor element; and an exterior resin that covers the electrode substrate, wherein the electrode substrate includes an anode connected to the anode lead, a cathode connected to the cathode lead layer, the anode, and In a chip-shaped solid electrolytic capacitor comprising an insulating layer that insulates the cathode,
Both of the anode and the cathode in the electrode substrate are formed from a conductive plate forming an external electrode layer forming portion,
At least one of the anode and cathode in the electrode substrate is formed by two conductive plates separate, the independent is one auxiliary electrode conductive plate of the two conductive plates, two conductive plates where the independent The other is electrically connected to the capacitor element , a fuse element is connected between the auxiliary electrode conductive plate and the other conductive plate ,
By connecting the other conductive plate of the two independent conductive plates and the conductive plate on the cathode side or the anode side, the fuse function becomes invalid, and the auxiliary conductive plate out of the two independent conductive plates. By connecting the plate to the cathode side or the anode side conductive plate, a fuse function is made effective, and a solid electrolytic capacitor with a built-in fuse is formed.

また、この発明において請求項２に記載の発明は、請求項１に記載のヒューズ内蔵型固体電解コンデンサであって、前記電極基板の陽極側が、独立した二つの導電板でなり、前記独立した二つの導電板の一方が補助電極用導電板であり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、前記陽極導出リードが、金属条材を介して導電性接続手段により前記陽極側の他方の導電板に接続され、前記コンデンサ素子の陰極引出層が、導電性接着剤により前記陰極側の導電板に接続されているものからなり、
前記陽極側の他方の導電板と前記陰極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記陽極側の補助用導電板と前記陰極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とするものである。
According to a second aspect of the present invention, there is provided the fuse-embedded solid electrolytic capacitor according to the first aspect, wherein the anode side of the electrode substrate comprises two independent conductive plates, and the independent two one of the one conductive plate is conductive plate auxiliary electrode, it said and fuse element is connected between the auxiliary electrode conductive plate and the other conductive plate, the anode lead lead, through a metal strip material the conductive connection means connected to the other conductive plate of the anode side, the cathode lead-out layer of the capacitor element, Ri Do from those connected to the conductive plate of the cathode by a conductive adhesive,
By connecting the other conductive plate on the anode side and the conductive plate on the cathode side, the fuse function becomes invalid, and by connecting the auxiliary conductive plate on the anode side and the conductive plate on the cathode side, The fuse function is effective .

さらに、この発明において請求項３に記載の発明は、請求項１に記載のヒューズ内蔵型固体電解コンデンサであって、前記電極基板の陰極側が、独立した二つの導電板でなり、前記独立した二つの導電板の一方が補助電極用導電板であり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、前記陽極導出リードが、金属条材を介して導電性接続手段により陽極側の導電板に接続され、前記コンデンサ素子の陰極引出層が、導電性接着剤により前記陰極側の他方の導電板に接続されているものからなり、
前記陰極側の他方の導電板と前記陽極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記陰極側の補助用導電板と前記陽極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とするものである。
Further, in this invention, the invention according to claim 3 is the solid electrolytic capacitor with built-in fuse according to claim 1, wherein the cathode side of the electrode substrate is composed of two independent conductive plates, and the independent two one of the one conductive plate is conductive plate auxiliary electrode, it said and fuse element is connected between the auxiliary electrode conductive plate and the other conductive plate, the anode lead lead, through a metal strip material the conductive connection means connected to the conductive plate on the anode side, the cathode lead-out layer of the capacitor element, Ri Do from those connected to the other conductive plate of the cathode by a conductive adhesive,
By connecting the other conductive plate on the cathode side and the conductive plate on the anode side, the fuse function becomes invalid, and by connecting the auxiliary conductive plate on the cathode side and the conductive plate on the anode side, The fuse function is effective .

さらに、この発明において請求項４に記載の発明は、請求項２あるいは請求項３に記載のヒューズ内蔵型固体電解コンデンサであって、前記導電性接続手段が、導電性接着剤またはレーザー溶接であることを特徴とするものである。   Further, in the present invention, the invention described in claim 4 is the solid electrolytic capacitor with a built-in fuse according to claim 2 or 3, wherein the conductive connecting means is a conductive adhesive or laser welding. It is characterized by this.

さらに、この発明において請求項５に記載の発明は、請求項１〜請求項４に記載のヒューズ内蔵型固体電解コンデンサであって、前記ヒューズ素子が、パターニングにより形成されていることを特徴とするものである。   Further, in the present invention, the invention described in claim 5 is the solid electrolytic capacitor with built-in fuse according to any one of claims 1 to 4, wherein the fuse element is formed by patterning. Is.

本発明は、陽極または陰極のうちの少なくともどちらか一方が独立した二つの導電板からなり、この独立した二つの導電板のいずれか一方が補助電極導電板であり、前記独立した二つの導電板の他方が前記コンデンサ素子と接続されたものからなり、陽極側導電板または陰極側導電板と補助電極用導電板とをヒューズ素子を介して接続することにより、ヒューズ素子接続時のコンデンサ素子へのストレスが軽減され、かつ、ヒューズ素子による体積効率の低下を防止できるため、漏れ電流が低減し、小形で大容量のヒューズ内蔵型固体電解コンデンサを得ることができる。さらに、陽極側または陰極側導電板と基板上の電極とをはんだ接続することで、ヒューズ機能を無効にすることができ、補助電極導電板と基板上の電極とをはんだ接続することで、ヒューズ機能を有効にすることができるので、ヒューズ機能の有無が選択可能なヒューズ内蔵型固体電解コンデンサを得ることができる。 In the present invention, at least one of the anode and the cathode is composed of two independent conductive plates , and one of the two independent conductive plates is an auxiliary electrode conductive plate , and the two independent conductive plates The other side of the capacitor element is connected to the capacitor element, and the anode side conductive plate or the cathode side conductive plate and the auxiliary electrode conductive plate are connected via the fuse element, so that the capacitor element can be connected to the capacitor element when the fuse element is connected. Since the stress is reduced and the volumetric efficiency due to the fuse element can be prevented from being lowered, the leakage current is reduced, and a small-sized and large-capacity built-in solid electrolytic capacitor can be obtained. Furthermore, the fuse function can be disabled by soldering the anode side or cathode side conductive plate and the electrode on the substrate, and the fuse function can be achieved by soldering the auxiliary electrode conductive plate and the electrode on the substrate. Since the function can be validated, it is possible to obtain a solid electrolytic capacitor with a built-in fuse capable of selecting whether or not the fuse function is present.

以下、本発明によるヒューズ内蔵型固体電解コンデンサについて、図面に示す具体的な実施例に基づいて詳細に説明する。図１は、本発明の第１の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図であり、図３は、本発明の第２の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図であり、図４は、本発明の第３の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図であり、
図５は、本発明の第４の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図である。図２は、第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサの詳細構成を示す概略的な断面図であり、図６は、第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサの詳細構成を示す概略的な断面図である。 Hereinafter, a solid electrolytic capacitor with a built-in fuse according to the present invention will be described in detail based on specific embodiments shown in the drawings. FIG. 1 is a plan view schematically showing an electrode substrate of a solid electrolytic capacitor with a built-in fuse according to a first embodiment of the present invention. FIG. 3 is a diagram with a built-in fuse according to a second embodiment of the present invention. FIG. 4 is a plan view schematically showing an electrode substrate of a solid electrolytic capacitor, and FIG. 4 is a plan view schematically showing an electrode substrate of a solid electrolytic capacitor with a built-in fuse according to a third embodiment of the present invention;
FIG. 5 is a plan view schematically showing an electrode substrate of a solid electrolytic capacitor with a built-in fuse according to a fourth embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a detailed configuration of the solid electrolytic capacitor with built-in fuses according to the first and second embodiments, and FIG. 6 is a diagram with a built-in fuse according to the third and fourth embodiments. It is a rough sectional view showing the detailed composition of a solid electrolytic capacitor.

図７は、第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極側の導電性接続手段が、レーザー溶接による例を示す概略的な断面図であり、図８は、第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極側の導電性接続手段が、レーザー溶接による例を示す概略的な断面図である。   FIG. 7 is a schematic cross-sectional view showing an example of a solid electrolytic capacitor with a built-in fuse according to the first and second embodiments, in which the conductive connecting means on the anode side is formed by laser welding. FIG. 5 is a schematic cross-sectional view showing an example of a solid electrolytic capacitor with a built-in fuse according to third and fourth embodiments, in which the conductive connection means on the anode side is formed by laser welding.

図９は、第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図であり、図１０は、第１の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図であり、図１１は、第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図であり、
図１２は、第３の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図であり、図１３は、第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図であり、図１４は、第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図である。 FIG. 9 shows a solid electrolytic capacitor with a built-in fuse according to the first and second embodiments, which is a schematic internal perspective view seen from the anode end face side, and FIG. 10 shows a fuse according to the first embodiment. FIG. 11 is a schematic internal perspective view of a built-in solid electrolytic capacitor as seen from the cathode end face side, and FIG. 11 is a schematic diagram of the fuse built-in solid electrolytic capacitor according to the second embodiment as seen from the cathode end face side. Is a typical internal perspective view,
12 is a solid electrolytic capacitor with a built-in fuse according to the third embodiment, and is a schematic internal perspective view seen from the anode end face side. FIG. 13 is a fuse according to the third and fourth embodiments. FIG. 14 is a schematic internal perspective view of a built-in solid electrolytic capacitor as seen from the cathode end face side, and FIG. 14 is a schematic diagram of a fuse built-in solid electrolytic capacitor according to the fourth embodiment as seen from the anode end face side. FIG.

［実施例１］陽極側のみが独立した二つの導電板からなり、そのうちのどちらか一方を補助電極用導電板３ｃとして、もう一方を陽極側導電板３ａとして、その間をヒューズ素子１１によりヒューズ接続したものであって、絶縁層４を介して一つの陰極側導電板３ｂを設けた構成例（図１、図２参照）。
まず、弁作用金属粉末のタンタル粉末に陽極導出リード１を埋め込み加圧成形した後、焼結し、得られた焼結体に酸化皮膜層、固体電解質層、陰極引出層を順次形成し、コンデンサ素子２を作製する。
次に、絶縁層４に少なくとも３箇所の貫通孔を設け、該貫通孔に陽極側導電板３ａ、陰極側導電板３ｂ、およびヒューズ接続のための補助電極用導電板３ｃを嵌合させ、コンデンサ素子実装部分および外部電極層形成部分とし、さらに、陽極側内部電極メッキ層６ａ、陽極側外部電極メッキ層６ｂ、陰極側内部電極メッキ層６ｃ、陰極側外部電極メッキ層６ｄを形成して電極基板７を作製する。 [Embodiment 1] Only the anode side is composed of two independent conductive plates, one of which is an auxiliary electrode conductive plate 3c and the other is an anode side conductive plate 3a, and a fuse element 11 connects between them. A configuration example in which one cathode side conductive plate 3b is provided via an insulating layer 4 (see FIGS. 1 and 2).
First, the anode lead 1 is embedded in the tantalum powder of the valve action metal powder, press-molded and sintered, and the resulting sintered body is sequentially formed with an oxide film layer, a solid electrolyte layer, and a cathode lead layer. Element 2 is produced.
Next, at least three through holes are provided in the insulating layer 4, and the anode side conductive plate 3a, the cathode side conductive plate 3b, and the auxiliary electrode conductive plate 3c for connecting the fuse are fitted into the through holes, and the capacitor An electrode substrate is formed by forming an element mounting portion and an external electrode layer forming portion, and further forming an anode side internal electrode plating layer 6a, an anode side external electrode plating layer 6b, a cathode side internal electrode plating layer 6c, and a cathode side external electrode plating layer 6d. 7 is produced.

続いて、該陽極側導電板３ａと補助電極用導電板３ｃとの間を、幅１５μｍのヒューズ素子１１をつづら折り状のパターニングにより接続し、該ヒューズ素子上にシリコーンレジン１２を被覆する。
次に、陽極導出リード１と板状の金属条材５とを抵抗溶接し、該金属条材５と陽極側導電板３ａ上の陽極側内部電極メッキ層６ａおよびコンデンサ素子２と陰極側内部電極メッキ層６ｃとを導電性接着剤８を介して各々接続する。この際、該金属条材５と補助電極用導電板３ｃとの接触を防止するため、間に絶縁物等を介しておくことが望ましい。さらに、陽極導出リード１を陽極側導電板３ａ側に偏心させておくとより望ましい。その後、外装樹脂９で外装する。
さらに、陽極側導電板３ａ、補助電極用導電板３ｃ、陰極側導電板３ｂ、陽極側外部電極メッキ層６ｂおよび陰極側外部電極メッキ層６ｄの表面に外部電極層１０を形成し、ヒューズ内蔵型コンデンサを作製した。 Subsequently, a fuse element 11 having a width of 15 μm is connected between the anode side conductive plate 3a and the auxiliary electrode conductive plate 3c by means of a folded patterning, and a silicone resin 12 is coated on the fuse element.
Next, the anode lead 1 and the plate-shaped metal strip 5 are resistance-welded, the metal strip 5 and the anode-side internal electrode plating layer 6a on the anode-side conductive plate 3a, the capacitor element 2, and the cathode-side internal electrode. The plating layer 6 c is connected to each other through the conductive adhesive 8. At this time, in order to prevent the metal strip 5 and the auxiliary electrode conductive plate 3c from coming into contact with each other, it is desirable to put an insulator or the like therebetween. Furthermore, it is more desirable that the anode lead 1 is eccentric to the anode side conductive plate 3a side. Thereafter, the exterior resin 9 is used for exterior packaging.
Further, the external electrode layer 10 is formed on the surface of the anode side conductive plate 3a, the auxiliary electrode conductive plate 3c, the cathode side conductive plate 3b, the anode side external electrode plating layer 6b, and the cathode side external electrode plating layer 6d. A capacitor was produced.

［実施例２］陽極側と陰極側の両方が独立した二つの導電板からなり、陽極側のどちらか一方の導電板を補助電極用導電板３ｃとして、もう一方を陽極側導電板３ａとして、その間をヒューズ素子１１によりヒューズ接続したものであって、絶縁層４を介して二つの陰極側導電板３ｂを設けた構成例（図２、図３参照）。
陽極側と陰極側の両方が独立した二つの導電板からなる以外は、上記する実施例１と同様の方法でヒューズ内蔵型固体電解コンデンサを作製した。 [Example 2] Both the anode side and the cathode side are composed of two independent conductive plates, and one of the anode side conductive plates is used as the auxiliary electrode conductive plate 3c, and the other is used as the anode side conductive plate 3a. A configuration example in which two fuse-side conductive plates 3b are provided with an insulating layer 4 interposed therebetween (see FIGS. 2 and 3).
A built-in fuse type solid electrolytic capacitor was produced in the same manner as in Example 1 except that both the anode side and the cathode side were composed of two independent conductive plates.

［実施例３］陰極側のみが独立した二つの導電板からなり、そのうちのどちらか一方を補助電極用導電板３ｃとして、もう一方を陰極側導電板３ｂとして、その間をヒューズ素子１１によりヒューズ接続したものであって、絶縁層４を介して一つの陽極側導電板３ａを設けた構成例（図４、図６参照）。
陰極側のみが二つの独立した導電板からなり、陰極側導電板３ｂと補助電極用導電板３ｃとの間をヒューズ素子１１で接続した以外は、上記する実施例１と同様の方法でヒューズ内蔵型固体電解コンデンサを作製した。 [Embodiment 3] Only the cathode side is composed of two independent conductive plates, one of which is the auxiliary electrode conductive plate 3c and the other is the cathode conductive plate 3b, and the fuse element 11 connects between them. A configuration example in which one anode side conductive plate 3a is provided via an insulating layer 4 (see FIGS. 4 and 6).
Only the cathode side is composed of two independent conductive plates, and the fuse side is built in the same manner as in the first embodiment except that the cathode side conductive plate 3b and the auxiliary electrode conductive plate 3c are connected by the fuse element 11. Type solid electrolytic capacitor was produced.

［実施例４］陽極側と陰極側の両方が二つの独立した導電板からなり、陰極側のどちらか一方の導電板を補助電極用導電板３ｃとして、もう一方を陰極側導電板３ｂとして、その間をヒューズ素子１１によりヒューズ接続したものであって、絶縁層４を介して二つの陽極側導電板３ａを設けた構成例（図５、図６参照）。
陽極側と陰極側の両方が二つの独立した導電板からなり、陰極側導電板３ｂと補助電極用導電板３ｃとの間をヒューズ素子１１で接続した以外は、上記する実施例１と同様の方法でヒューズ内蔵型固体電解コンデンサを作製した。 [Embodiment 4] Both the anode side and the cathode side are composed of two independent conductive plates, and one of the cathode side conductive plates is used as the auxiliary electrode conductive plate 3c, and the other is used as the cathode side conductive plate 3b. A configuration example in which the two anode side conductive plates 3a are provided via the insulating layer 4 in which the fuse element 11 is connected between them (see FIGS. 5 and 6).
Both the anode side and the cathode side are composed of two independent conductive plates, and the same as in the first embodiment described above except that the fuse side 11 is connected between the cathode side conductive plate 3b and the auxiliary electrode conductive plate 3c. A solid electrolytic capacitor with a built-in fuse was fabricated by this method.

（従来例）リードフレームとコンデンサ素子との間をヒューズ接続（図１５参照）。
図１５は、従来のヒューズ内蔵型固体電解コンデンサの断面図である。実施例と同様の方法で、陽極導出リード１を具備し、酸化皮膜層、固体電解質層および陰極引出層を順次形成したコンデンサ素子２を作製し、次に、前記陽極導出リード１と陽極側リードフレーム１３をヒューズ素子で接続し、コンデンサ素子２と陰極側リードフレーム１４を導電性接着剤８で接続した後、外装樹脂９で外装し、ヒューズ内蔵型固体電解コンデンサを作製した。 (Conventional example) Fuse connection between a lead frame and a capacitor element (see FIG. 15).
FIG. 15 is a cross-sectional view of a conventional solid electrolytic capacitor with a built-in fuse. In the same manner as in the example, a capacitor element 2 having an anode lead 1 and having an oxide film layer, a solid electrolyte layer, and a cathode lead layer formed in sequence was prepared, and then the anode lead 1 and anode lead The frame 13 was connected by a fuse element, the capacitor element 2 and the cathode side lead frame 14 were connected by the conductive adhesive 8, and then the outer resin 9 was used to produce a solid electrolytic capacitor with a built-in fuse.

本発明に従い作製したコンデンサをヒューズ素子が接続された陽極側導電板３ａまたは陰極側導電板３ｂ上の電極層と、補助電極用導電板３ｃ上の電極層のうちどちらか一方と接続できるようにパターニングした基板へ実装した。ヒューズ素子が接続された陽極側導電板３ａまたは陰極側導電板３ｂ上の電極層と接続することでヒューズ機能の無いコンデンサにでき、補助電極用導電板３ｃ上の電極層と接続することでヒューズ機能を有するコンデンサにできる。これにより、ヒューズ機能の有無を電極の取り出し位置変更により選択できる。   The capacitor manufactured according to the present invention can be connected to either the electrode layer on the anode side conductive plate 3a or the cathode side conductive plate 3b to which the fuse element is connected, or the electrode layer on the auxiliary electrode conductive plate 3c. Mounted on a patterned substrate. A capacitor without a fuse function can be obtained by connecting to the electrode layer on the anode side conductive plate 3a or the cathode side conductive plate 3b to which the fuse element is connected, and a fuse can be obtained by connecting to the electrode layer on the auxiliary electrode conductive plate 3c. Capacitor with function can be made. Thereby, the presence or absence of the fuse function can be selected by changing the electrode extraction position.

次に、実施例１〜４と従来例の製品体積に対するコンデンサ素子体積の占有率および漏れ電流を比較した結果を表１に示す。   Next, Table 1 shows the results of comparison of the occupation ratio of the capacitor element volume and the leakage current with respect to the product volumes of Examples 1 to 4 and the conventional example.

Figure 0004688704
Figure 0004688704

表１から明らかなように、実施例１〜４は従来例と比較して素子占有率が高く、内部素子の体積効率が大幅に改善され、かつ、漏れ電流も改善されていることが分かる。
また、ヒューズ素子は、コスト面、技術面から銅またはアルミニウムを用いることが望ましい。
さらに、金属条材５と補助電極用導電板３ｃ上のメッキ層６ａとの接続を図７、図８に示すようにレーザー溶接で接続しても同様の効果が得られる。 As is apparent from Table 1, it can be seen that Examples 1 to 4 have a higher element occupancy rate than the conventional example, the volume efficiency of the internal elements is greatly improved, and the leakage current is also improved.
The fuse element is preferably made of copper or aluminum from the viewpoint of cost and technology.
Further, the same effect can be obtained by connecting the metal strip 5 and the plating layer 6a on the auxiliary electrode conductive plate 3c by laser welding as shown in FIGS.

本発明の第１の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図である。1 is a plan view schematically showing an electrode substrate of a solid electrolytic capacitor with a built-in fuse according to a first embodiment of the present invention. 本発明の第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサの詳細構成を示す概略的な断面図である。It is a schematic sectional drawing which shows the detailed structure of the solid electrolytic capacitor with a built-in fuse which becomes the 1st and 2nd Example of this invention. 本発明の第２の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図である。It is a top view which shows roughly the electrode board | substrate of the solid electrolytic capacitor with a built-in fuse which becomes the 2nd Example of this invention. 本発明の第３の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図である。It is a top view which shows roughly the electrode substrate of the solid electrolytic capacitor with a built-in fuse which becomes the 3rd Example of the present invention. 本発明の第４の実施例になるヒューズ内蔵型固体電解コンデンサの電極基板を概略的に示す平面図である。It is a top view which shows roughly the electrode board | substrate of the solid electrolytic capacitor with a built-in fuse which becomes the 4th Example of this invention. 本発明の第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサの詳細構成を示す概略的な断面図である。It is a schematic sectional drawing which shows the detailed structure of the solid electrolytic capacitor with a built-in fuse which becomes the 3rd and 4th Example of this invention. 本発明の第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極側の導電性接続手段が、レーザー溶接による例を示す概略的な断面図である。FIG. 5 is a schematic cross-sectional view showing an example of a solid electrolytic capacitor with a built-in fuse according to the first and second embodiments of the present invention, in which the conductive connection means on the anode side is formed by laser welding. 本発明の第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極側の導電性接続手段が、レーザー溶接による例を示す概略的な断面図である。の詳細構成を示す概略的な断面図である。FIG. 5 is a schematic cross-sectional view showing an example of a solid electrolytic capacitor with a built-in fuse according to third and fourth embodiments of the present invention, in which the conductive connection means on the anode side is formed by laser welding. It is a schematic sectional drawing which shows detailed structure of these. 本発明の第１および第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図である。FIG. 3 is a schematic internal perspective view of the solid electrolytic capacitor with a built-in fuse according to the first and second embodiments of the present invention, as viewed from the anode end face side. 本発明の第１の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図である。1 is a schematic internal perspective view of a solid electrolytic capacitor with a built-in fuse according to a first embodiment of the present invention, as viewed from the cathode end face side. 本発明の第２の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図である。FIG. 6 is a schematic internal perspective view of a solid electrolytic capacitor with a built-in fuse according to a second embodiment of the present invention, viewed from the cathode end face side. 本発明の第３の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図である。FIG. 6 is a schematic internal perspective view of a solid electrolytic capacitor with a built-in fuse according to a third embodiment of the present invention, viewed from the anode end face side. 本発明の第３および第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陰極端面側からみた概略的な内部透視図である。FIG. 5 is a schematic internal perspective view of a solid electrolytic capacitor with a built-in fuse according to third and fourth embodiments of the present invention, as viewed from the cathode end face side. 本発明の第４の実施例になるヒューズ内蔵型固体電解コンデンサであって、陽極端面側からみた概略的な内部透視図である。FIG. 7 is a schematic internal perspective view of a solid electrolytic capacitor with a built-in fuse according to a fourth embodiment of the present invention, viewed from the anode end face side. 従来例によるヒューズ内蔵型固体電解コンデンサの断面図である。It is sectional drawing of the solid electrolytic capacitor with a built-in fuse by a prior art example.

符号の説明Explanation of symbols

１ 陽極導出リード
２ コンデンサ素子
３ａ 陽極側導電板
３ｂ 陰極側導電板
３ｃ 補助電極用導電板
４ 絶縁層
５ 金属条材
６ａ メッキ層（陽極側内部電極）
６ｂ メッキ層（陽極側外部電極）
６ｃ メッキ層（陰極側内部電極）
６ｄ メッキ層（陰極側外部電極）
７ 電極基板
８ 導電性接着剤層
９ 外装樹脂
１０ 外部電極層
１１ ヒューズ素子
１２ シリコーンレジン
１３ 陽極リードフレーム
１４ 陰極リードフレーム 1 Anode lead 2 Capacitor element 3a Anode side conductive plate 3b Cathode side conductive plate 3c Auxiliary electrode conductive plate 4 Insulating layer 5 Metal strip 6a Plating layer (anode side internal electrode)
6b Plating layer (Anode-side external electrode)
6c Plating layer (cathode side internal electrode)
6d Plating layer (cathode side external electrode)
7 Electrode substrate 8 Conductive adhesive layer 9 Exterior resin 10 External electrode layer 11 Fuse element 12 Silicone resin 13 Anode lead frame 14 Cathode lead frame

Claims (5)

陽極導出リードを具備し、酸化皮膜層、固体電解質層および陰極引出層とを備えたコンデンサ素子と、該コンデンサ素子の電極となる電極基板と、これらを覆う外装樹脂とを有し、前記電極基板が、前記陽極導出リードに接続された陽極と、前記陰極引出層に接続された陰極と、前記陽極と陰極との間を絶縁する絶縁層とを含むものからなるチップ状固体電解コンデンサにおいて、
前記電極基板における陽極および陰極はいずれも、外部電極層形成部分をなす導電板から形成され、
前記電極基板における陽極および陰極のうち少なくともどちらか一方が、独立した二つの導電板により形成され、前記独立した二つの導電板の一方が補助電極用導電板であり、前記独立した二つの導電板の他方が前記コンデンサ素子と電気的に接続されたものからなり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、
前記独立した二つの導電板のうちの他方の導電板と前記陰極側または陽極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記独立した二つの導電板のうちの補助用導電板と前記陰極側または陽極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とするヒューズ内蔵型固体電解コンデンサ。 A capacitor element having an anode lead and having an oxide film layer, a solid electrolyte layer, and a cathode lead layer; an electrode substrate serving as an electrode of the capacitor element; and an exterior resin covering the capacitor element, the electrode substrate In a chip-shaped solid electrolytic capacitor comprising an anode connected to the anode lead, a cathode connected to the cathode lead layer, and an insulating layer that insulates between the anode and the cathode,
Both of the anode and the cathode in the electrode substrate are formed from a conductive plate forming an external electrode layer forming portion,
At least one of the anode and cathode in the electrode substrate is formed by two conductive plates separate, the independent is one auxiliary electrode conductive plate of the two conductive plates, two conductive plates where the independent The other is electrically connected to the capacitor element , a fuse element is connected between the auxiliary electrode conductive plate and the other conductive plate ,
By connecting the other conductive plate of the two independent conductive plates and the conductive plate on the cathode side or the anode side, the fuse function becomes invalid, and the auxiliary conductive plate out of the two independent conductive plates. A fuse built-in type solid electrolytic capacitor characterized in that a fuse function is made effective by connecting a plate to the cathode side or anode side conductive plate . 前記電極基板の陽極側が、独立した二つの導電板でなり、前記独立した二つの導電板の一方が補助電極用導電板であり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、前記陽極導出リードが、金属条材を介して導電性接続手段により前記陽極側の他方の導電板に接続され、前記コンデンサ素子の陰極引出層が、導電性接着剤により前記陰極側の導電板に接続されているものからなり、
前記陽極側の他方の導電板と前記陰極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記陽極側の補助用導電板と前記陰極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とする請求項１に記載のヒューズ内蔵型固体電解コンデンサ。 Anode side of the electrode substrate is comprised of two conductive plates separate, the one independent two conductive plates is a conductive plate auxiliary electrode, between the auxiliary electrode conductive plate and the other conductive plates fuse element is connected, the anode lead lead is connected to the other conductive plate of the anode by a conductive connecting means via the metal strip material, the cathode lead layer of the capacitor element, a conductive adhesive Ri Do from those connected to the conductive plate of the cathode by,
By connecting the other conductive plate on the anode side and the conductive plate on the cathode side, the fuse function becomes invalid, and by connecting the auxiliary conductive plate on the anode side and the conductive plate on the cathode side, The fuse built-in solid electrolytic capacitor according to claim 1, wherein the fuse function is effective . 前記電極基板の陰極側が、独立した二つの導電板でなり、前記独立した二つの導電板の一方が補助電極用導電板であり、前記補助電極用導電板と他方の導電板との間にはヒューズ素子が接続されており、前記陽極導出リードが、金属条材を介して導電性接続手段により陽極側の導電板に接続され、前記コンデンサ素子の陰極引出層が、導電性接着剤により前記陰極側の他方の導電板に接続されているものからなり、
前記陰極側の他方の導電板と前記陽極側の導電板とを接続することによって、ヒューズ機能が無効となり、前記陰極側の補助用導電板と前記陽極側の導電板とを接続することによって、ヒューズ機能が有効となることを特徴とする請求項１に記載のヒューズ内蔵型固体電解コンデンサ。 Cathode side of the electrode substrate is comprised of two conductive plates separate, the one independent two conductive plates is a conductive plate auxiliary electrode, between the auxiliary electrode conductive plate and the other conductive plates fuse element is connected, the anode lead lead is connected to the conductive plate on the anode side by the conductive connecting means via the metal strip material, the cathode lead layer of the capacitor element, the cathode by a conductive adhesive Ri Do from those connected to the other conductive plate side,
By connecting the other conductive plate on the cathode side and the conductive plate on the anode side, the fuse function becomes invalid, and by connecting the auxiliary conductive plate on the cathode side and the conductive plate on the anode side, The fuse built-in solid electrolytic capacitor according to claim 1, wherein the fuse function is effective . 前記導電性接続手段が、導電性接着剤あるいはレーザー溶接であることを特徴とする請求項２または請求項３に記載のヒューズ内蔵型固体電解コンデンサ。   4. The fuse built-in solid electrolytic capacitor according to claim 2, wherein the conductive connecting means is a conductive adhesive or laser welding. 前記ヒューズ素子が、パターニングにより形成されていることを特徴とする請求項１〜請求項４のいずれかに記載のヒューズ内蔵型固体電解コンデンサ。   The fuse built-in type solid electrolytic capacitor according to any one of claims 1 to 4, wherein the fuse element is formed by patterning.
JP2006067354A 2006-03-13 2006-03-13 Solid electrolytic capacitor with built-in fuse Active JP4688704B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006067354A JP4688704B2 (en) 2006-03-13 2006-03-13 Solid electrolytic capacitor with built-in fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006067354A JP4688704B2 (en) 2006-03-13 2006-03-13 Solid electrolytic capacitor with built-in fuse

Publications (2)

Publication Number Publication Date
JP2007243108A JP2007243108A (en) 2007-09-20
JP4688704B2 true JP4688704B2 (en) 2011-05-25

Family

ID=38588311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006067354A Active JP4688704B2 (en) 2006-03-13 2006-03-13 Solid electrolytic capacitor with built-in fuse

Country Status (1)

Country Link
JP (1) JP4688704B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311716A (en) * 1987-06-12 1988-12-20 Murata Mfg Co Ltd Laminated ceramic capacitor with fuse
JPH0359632U (en) * 1989-10-16 1991-06-12
JPH07302737A (en) * 1994-04-28 1995-11-14 Rohm Co Ltd Structure of solid electrolytic capacitor with safety fuse
JP2001257130A (en) * 2000-03-10 2001-09-21 Rohm Co Ltd Solid electrolytic capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311716A (en) * 1987-06-12 1988-12-20 Murata Mfg Co Ltd Laminated ceramic capacitor with fuse
JPH0359632U (en) * 1989-10-16 1991-06-12
JPH07302737A (en) * 1994-04-28 1995-11-14 Rohm Co Ltd Structure of solid electrolytic capacitor with safety fuse
JP2001257130A (en) * 2000-03-10 2001-09-21 Rohm Co Ltd Solid electrolytic capacitor

Also Published As

Publication number Publication date
JP2007243108A (en) 2007-09-20

Similar Documents

Publication Publication Date Title
CN1866428B (en) Stacked capacitor and method of fabricating the same
US7450366B2 (en) Solid electrolytic capacitor
JP4126021B2 (en) Solid electrolytic capacitor
US20080106854A1 (en) Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method
JP4688675B2 (en) Multilayer solid electrolytic capacitor
WO2012140836A1 (en) Electrolytic capacitor
JP4975946B2 (en) Chip-type solid electrolytic capacitor and manufacturing method thereof
KR20040078583A (en) Stacked solid electrolytic capacitor and stacked transmission line element
JP2008187091A (en) Solid-state electrolytic capacitor
US20120281338A1 (en) Aluminum electrolytic capacitor and method of manfacturing the same
JP4802550B2 (en) Solid electrolytic capacitor
JP4613699B2 (en) Solid electrolytic capacitor, method for manufacturing the same, and digital signal processing board using the same
JP4899114B2 (en) Solid electrolytic capacitor
JP4613669B2 (en) Solid electrolytic capacitor
JP4688704B2 (en) Solid electrolytic capacitor with built-in fuse
JP2007013043A (en) Electrode assembly for mounting electric element, electric component employing the same, and solid electrolytic capacitor
JP2004289142A (en) Laminated solid electrolytic capacitor and laminated transmission line element
JP2008021774A (en) Chip-type solid electrolytic capacitor, and manufacturing method thereof
JP2007019054A (en) Solid electrolytic capacitor with built-in fuse
JP5573396B2 (en) Solid electrolytic capacitor and power circuit
JP2003243257A (en) Solid electrolytic capacitor
JP2008021772A (en) Chip-type solid electrolytic capacitor
JP2004247665A (en) Solid-state electrolytic capacitor
JP2005311216A (en) Solid electrolytic capacitor and its manufacturing method
JP2008135424A (en) Chip-type solid electrolytic capacitor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080919

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090209

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100915

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110209

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110215

R150 Certificate of patent or registration of utility model

Ref document number: 4688704

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140225

Year of fee payment: 3

S201 Request for registration of exclusive licence

Free format text: JAPANESE INTERMEDIATE CODE: R314201

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140225

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140225

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R314533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140225

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250