JP2008187091A - Solid-state electrolytic capacitor - Google Patents

Solid-state electrolytic capacitor Download PDF

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JP2008187091A
JP2008187091A JP2007020838A JP2007020838A JP2008187091A JP 2008187091 A JP2008187091 A JP 2008187091A JP 2007020838 A JP2007020838 A JP 2007020838A JP 2007020838 A JP2007020838 A JP 2007020838A JP 2008187091 A JP2008187091 A JP 2008187091A
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cathode
anode
anode lead
capacitor
electrolytic capacitor
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JP4830875B2 (en
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Kazuo Kawahito
一雄 川人
Junichi Kurita
淳一 栗田
Kenji Kuranuki
健司 倉貫
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/14Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the ESL of a solid-state electrolytic capacitor, and to improve impedance characteristics in a high frequency region. <P>SOLUTION: The solid-state electrolytic capacitor has a plurality of adjacent capacitor elements 1 forming a cathode 7 by successively laminating a dielectric oxide film layer, a solid-state electrolytic layer and a cathode layer on the surface of the porous body of valve action metal powder to which an anode lead wire 3 is joined, and an anode terminal 8 connected to the anode lead wire 3 and a cathode terminal 9 connected to the cathode 7 are exposed to the mounting surface of an exterior resin 10. The anode lead wires 3 of the adjacent capacitor elements 1 are pulled out in opposite directions alternately and connected to a pair of anode terminals 8, respectively. The cathode 7 is connected to the cathode terminal 9 provided between the pair of anode terminals 8. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子機器に使用される表面実装の固体電解コンデンサに関するものである。   The present invention relates to a surface mount solid electrolytic capacitor used in electronic equipment.

電子機器の高速化、高周波化に伴って、インピーダンス特性に優れたコンデンサが強く要望されている。   Capacitors with excellent impedance characteristics are strongly demanded as electronic devices are increased in speed and frequency.

図4は、従来の固体電解コンデンサの透過斜視図である。   FIG. 4 is a transparent perspective view of a conventional solid electrolytic capacitor.

図4に示すように、従来の固体電解コンデンサは、タンタル、ニオブ、チタン、アルミニウム等の弁作用金属粉末を焼結した多孔質体に埋め込まれた弁作用金属からなる陽極リード線33が一方から突出し、前記多孔質体の表面には、誘電体酸化皮膜が形成されている。   As shown in FIG. 4, the conventional solid electrolytic capacitor has an anode lead wire 33 made of a valve action metal embedded in a porous body obtained by sintering a valve action metal powder such as tantalum, niobium, titanium, or aluminum from one side. A dielectric oxide film is formed on the surface of the porous body.

誘電体酸化皮膜の表面には固体電解質層が形成され、さらに固体電解質層の表面に、カーボン層、銀ペースト層を順次形成した陰極層36を形成することよって、コンデンサ素子31を構成している。   A solid electrolyte layer is formed on the surface of the dielectric oxide film, and a cathode layer 36 in which a carbon layer and a silver paste layer are sequentially formed is formed on the surface of the solid electrolyte layer, thereby forming the capacitor element 31. .

さらに複数のコンデンサ素子31が、全ての陽極リード線33を一方側に並べ、隣接するコンデンサ素子31の陰極層36を重ね合わせて積層され、陽極リード線33は、リードフレームからなる陽極端子38に溶接し、陰極層36は、導電性接着剤を介してリードフレームからなる陰極端子39に接合している。この陽極端子38、陰極端子39は、コンデンサ素子31を被覆する外部樹脂部40から実装面41に引出され固体電解コンデンサを構成したものである。   Further, a plurality of capacitor elements 31 are arranged such that all the anode lead wires 33 are arranged on one side and the cathode layers 36 of the adjacent capacitor elements 31 are overlapped, and the anode lead wires 33 are connected to the anode terminal 38 formed of a lead frame. The cathode layer 36 is welded to a cathode terminal 39 made of a lead frame via a conductive adhesive. The anode terminal 38 and the cathode terminal 39 are drawn from the external resin portion 40 covering the capacitor element 31 to the mounting surface 41 to constitute a solid electrolytic capacitor.

このように複数のコンデンサ素子31を設け、各多孔質体外周の表面積を加算した総表面積を大きくすることによって、固体電解コンデンサの等価直列抵抗(ESR)を小さくしている。   Thus, by providing a plurality of capacitor elements 31 and increasing the total surface area obtained by adding the surface areas of the outer peripheries of the porous bodies, the equivalent series resistance (ESR) of the solid electrolytic capacitor is reduced.

このような従来の固体電解コンデンサとして、特許文献1に示すものが知られている。
特開2005−166832号公報
As such a conventional solid electrolytic capacitor, the one shown in Patent Document 1 is known.
Japanese Patent Laying-Open No. 2005-166832

このような従来の固体電解コンデンサは、周波数が約100kHz付近でのインピーダンス特性を低減することができるが、さらに高周波領域では、等価直列インダクタンス(ESL)の影響によりインピーダンス特性の改善が困難であるという課題があった。   Such a conventional solid electrolytic capacitor can reduce impedance characteristics at a frequency of about 100 kHz, but it is difficult to improve impedance characteristics due to the effect of equivalent series inductance (ESL) in the high frequency region. There was a problem.

本発明は、このような従来の課題を解決し、高周波領域でのインピーダンス特性を改善する固体電解コンデンサを提供することを目的とするものである。   An object of the present invention is to solve such a conventional problem and to provide a solid electrolytic capacitor that improves impedance characteristics in a high frequency region.

上記目的を達成するために本発明は、陽極リード線が接合された弁作用金属粉末の多孔質体の表面に誘電体酸化皮膜層、固体電解質層、陰極層を順次積層して陰極部を形成したコンデンサ素子を複数隣接して備え、前記陽極リード線に接続した陽極端子、及び前記陰極部に接続した陰極端子が外装樹脂部の実装面に露呈した固体電解コンデンサであって、隣接した前記コンデンサ素子の陽極リード線は、交互に相反する方向に引出されて一対の前記陽極端子にそれぞれ接続し、前記陰極部は、前記一対の陽極端子間に設けられた前記陰極端子に接続した固体電解コンデンサである。   In order to achieve the above object, the present invention forms a cathode part by sequentially laminating a dielectric oxide film layer, a solid electrolyte layer, and a cathode layer on the surface of a porous body of valve action metal powder to which an anode lead wire is bonded. A plurality of capacitor elements adjacent to each other, and a solid electrolytic capacitor in which an anode terminal connected to the anode lead wire and a cathode terminal connected to the cathode part are exposed on a mounting surface of an exterior resin part, the adjacent capacitor The anode lead wire of the element is pulled out in opposite directions and connected to the pair of anode terminals, and the cathode portion is connected to the cathode terminal provided between the pair of anode terminals. It is.

以上のように本発明の固体電解コンデンサによれば、複数のコンデンサ素子を陽極リード線が交互に相反する方向に引出され、かつ前記陰極部が重ね合わされて隣接させることにより、コンデンサ素子に充放電電流が流れる際に発生する磁界が、隣接されるコンデンサ素子の磁界を打ち消し合うように働くため、固体電解コンデンサのESLを小さくすることができ、高周波領域でインピーダンス特性を改善することができる効果を奏するものである。   As described above, according to the solid electrolytic capacitor of the present invention, a plurality of capacitor elements are drawn in directions in which the anode lead wires are alternately opposed to each other, and the cathode portions are overlapped and adjacent to each other, thereby charging and discharging the capacitor elements. Since the magnetic field generated when the current flows works to cancel the magnetic field of the adjacent capacitor element, the ESL of the solid electrolytic capacitor can be reduced, and the impedance characteristics can be improved in the high frequency region. It is what you play.

(実施の形態1)
本発明の実施の形態1の固体電解コンデンサについて説明する。
(Embodiment 1)
A solid electrolytic capacitor according to Embodiment 1 of the present invention will be described.

図1は、本発明の実施の形態1における固体電解コンデンサの構成を示す透過斜視図、図2(a)は、同コンデンサ素子の構成を示す断面図、図2(b)は、図2(a)のA部拡大断面図である。   FIG. 1 is a transparent perspective view showing the configuration of the solid electrolytic capacitor according to Embodiment 1 of the present invention, FIG. 2A is a sectional view showing the configuration of the capacitor element, and FIG. It is the A section expanded sectional view of a).

図2に示すように、コンデンサ素子1は、タンタル等の弁作用金属からなる棒状の陽極リード線3をタンタル等の弁作用金属粉末からなる直方体に、直方体の一方の端面から突出するように埋め込んだ成形体を、焼結して多孔質体2とし、さらに多孔質体2の表面に、電解陽極酸化により誘電体酸化皮膜層4が形成されている。   As shown in FIG. 2, the capacitor element 1 includes a rod-shaped anode lead wire 3 made of a valve metal such as tantalum and embedded in a rectangular parallelepiped made of a valve metal powder such as tantalum so as to protrude from one end face of the rectangular parallelepiped. The green body is sintered to form a porous body 2, and a dielectric oxide film layer 4 is formed on the surface of the porous body 2 by electrolytic anodization.

誘電体酸化皮膜層4の表面には、ポリピロール、ポリチオフェン、ポリアニリン等の導電性高分子、TCNQ等の有機半導体、及び二酸化マンガン等の無機半導体のいずれか少なくとも一つからなる固体電解質層5が形成され、さらに多孔質体2の外周表面の固体電解質層5表面に、グラファイトを含有するカーボン層、銀粒子とエポキシ樹脂、フェノール樹脂等からなる導電性ペースト層が順次形成された陰極層6が形成されたもので、多孔質体2の表面に誘電体酸化皮膜層4を形成し、この誘電体酸化皮膜層4の表面に固体電解質層5、陰極層6からなる陰極部7を構成してコンデンサ素子1としたものである。   A solid electrolyte layer 5 made of at least one of a conductive polymer such as polypyrrole, polythiophene and polyaniline, an organic semiconductor such as TCNQ, and an inorganic semiconductor such as manganese dioxide is formed on the surface of the dielectric oxide film layer 4. Further, a cathode layer 6 in which a carbon layer containing graphite, a conductive paste layer made of silver particles, an epoxy resin, a phenol resin, and the like are sequentially formed on the surface of the solid electrolyte layer 5 on the outer peripheral surface of the porous body 2 is formed. A dielectric oxide film layer 4 is formed on the surface of the porous body 2, and a cathode portion 7 comprising a solid electrolyte layer 5 and a cathode layer 6 is formed on the surface of the dielectric oxide film layer 4. Element 1 is obtained.

図1に示すように、陽極端子8及び陰極端子9は、銅、鉄、ニッケル、これらの合金等からなる金属導電体であって、ブロック状の金属導電体を切削加工して形成したものである。   As shown in FIG. 1, the anode terminal 8 and the cathode terminal 9 are metal conductors made of copper, iron, nickel, alloys thereof, and the like, and are formed by cutting a block-shaped metal conductor. is there.

また、陽極端子8、陰極端子9は、板状の金属導電体を打ち抜き、折り曲げ加工したリードフレームを用いてもよい。   The anode terminal 8 and the cathode terminal 9 may be a lead frame obtained by punching and bending a plate-like metal conductor.

陽極端子8は、実装面11の底面の両端部に露呈する平板状の金属導電体8aを有し、平板状の金属導電体8aの上部に設けたブロック状スペーサ部8bの上面と、陽極リード線3とを抵抗溶接、レーザ溶接、超音波溶接等を用いて接合したものである。   The anode terminal 8 has flat metal conductors 8a exposed at both ends of the bottom surface of the mounting surface 11, and the upper surface of the block spacer portion 8b provided on the upper part of the flat metal conductor 8a, and the anode lead The wire 3 is joined by resistance welding, laser welding, ultrasonic welding or the like.

平板状の金属導電体8aとスペーサ部8bは、夫々単体の金属導電体を接合したものでもよく、単体の金属導電体から切削加工等により一体に構成されたものでもよい。   The flat metal conductor 8a and the spacer portion 8b may be formed by joining a single metal conductor, or may be integrally formed by cutting or the like from a single metal conductor.

陰極端子9は、一対の陽極端子8間の、実装面11の底面中央部に露呈する平板状の金属導電体9aの上面と導電性接着剤を介して陰極部7とを接合したものである。   The cathode terminal 9 is obtained by joining the upper surface of a flat metal conductor 9a exposed between the pair of anode terminals 8 to the center of the bottom surface of the mounting surface 11 and the cathode portion 7 via a conductive adhesive. .

コンデンサ素子1は、複数のコンデンサ素子1が実装面11に平行で、陽極リード線3の方向と垂直な方向である横方向に隣接して配置され、隣接するコンデンサ素子1の陽極リード線3が、交互に相反する方向に引出されて、一対の陽極端子8にそれぞれ接続し、隣接するコンデンサ素子1の陰極部7が、陰極部7側面(コンデンサ素子同士の隣接面)の略全体が重なり合って当接され、この重なり合う面に交差する陰極部7の面(実装方向面)と陰極端子9とを接続したものである。   The capacitor element 1 is arranged such that a plurality of capacitor elements 1 are parallel to the mounting surface 11 and adjacent to each other in the lateral direction, which is a direction perpendicular to the direction of the anode lead wire 3, and the anode lead wires 3 of the adjacent capacitor elements 1 are arranged. The cathode portions 7 of the adjacent capacitor elements 1 are pulled out in directions opposite to each other and connected to the pair of anode terminals 8, and the substantially entire side surfaces of the cathode portions 7 (adjacent surfaces of the capacitor elements) overlap each other. The cathode terminal 9 is connected to the surface (mounting direction surface) of the cathode portion 7 that is in contact with and intersects the overlapping surface.

また、隣接する陰極部7は、重ね合わされた陰極層6面間を導電性接着剤で接合したものでもよい。   Moreover, the adjacent cathode part 7 may join what overlapped the cathode layer 6 surface with a conductive adhesive.

さらに、エポキシ樹脂、フェノール樹脂等からなる絶縁性の外装樹脂部10により、コンデンサ素子1と陽極端子8、陰極端子9との接続部、及びコンデンサ素子1が被覆され、陽極端子8及び陰極端子9は、外装樹脂部10内又は外装樹脂部10の外周に沿ってコンデンサ素子1の下方に延在し、実装面11となる外装樹脂部10の底面と同一面に繋がって露呈しているものである。   Further, the connecting portion between the capacitor element 1 and the anode terminal 8 and the cathode terminal 9 and the capacitor element 1 are covered with an insulating exterior resin portion 10 made of epoxy resin, phenol resin or the like, and the anode terminal 8 and the cathode terminal 9 are covered. Is extended below the capacitor element 1 along the outer periphery of the exterior resin portion 10 or along the outer periphery of the exterior resin portion 10, and is exposed on the same surface as the bottom surface of the exterior resin portion 10 that becomes the mounting surface 11. is there.

以上のように、コンデンサ素子1が、隣接し相反することにより、コンデンサ素子1の多孔質体2の弁作用金属を流れる電流と隣接したコンデンサ素子1の多孔質体2の弁作用金属を流れる電流とが反対方向に流れ、夫々の電流で生じる磁界を相殺するため、固体電解コンデンサのESLを小さくすることができる。   As described above, the current flowing through the valve metal of the porous body 2 of the capacitor element 1 and the current flowing through the valve metal of the porous body 2 of the capacitor element 1 adjacent to each other due to the capacitor element 1 being adjacent and conflicting with each other. Flow in the opposite directions and cancel the magnetic fields generated by the respective currents, so that the ESL of the solid electrolytic capacitor can be reduced.

また、溶接治具を陽極リード線3に当接する抵抗溶接や超音波溶接等を用いる場合、一方方向に配列したコンデンサ素子1の陽極リード線3間の隣接する距離は、全てのコンデンサ素子1を同一方向に配列したものに比較し、他方方向に配列したコンデンサ素子1のひとつ分大きくすることができるので、隣接する陽極リード線3と陽極端子8との接合部が溶接により変形することを低減し組立精度を高くすることができ、コンデンサ素子1の体積を大きくし静電容量を高めることができ、大容量の固体電解コンデンサを得ることができる。   When resistance welding, ultrasonic welding, or the like in which the welding jig is brought into contact with the anode lead wire 3 is used, the adjacent distance between the anode lead wires 3 of the capacitor elements 1 arranged in one direction is such that all the capacitor elements 1 are connected. Compared to the one arranged in the same direction, it can be enlarged by one capacitor element 1 arranged in the other direction, so that the joint portion between the adjacent anode lead wire 3 and the anode terminal 8 is less deformed by welding. As a result, the assembly accuracy can be increased, the volume of the capacitor element 1 can be increased, the capacitance can be increased, and a large-capacity solid electrolytic capacitor can be obtained.

実施の形態1は、コンデンサ素子1が、実装面11に平行に横方向に配列されたものであるが、複数のコンデンサ素子1が実装面11に対し垂直方向に隣接して順次積層され、隣接するコンデンサ素子1の陽極リード線3が、交互に相反する方向に引出されて、夫々両端の陽極端子8に接続し、隣接するコンデンサ素子1の陰極部7が、陰極部7の側面の略全体が重ね合わさり当接されて、陰極端子9に接続したものでもよい。   In the first embodiment, the capacitor elements 1 are arranged in a lateral direction parallel to the mounting surface 11, but a plurality of capacitor elements 1 are sequentially stacked adjacent to each other in the vertical direction with respect to the mounting surface 11. The anode lead wires 3 of the capacitor element 1 to be drawn are alternately drawn in opposite directions and connected to the anode terminals 8 at both ends, respectively, and the cathode portion 7 of the adjacent capacitor element 1 is substantially the entire side surface of the cathode portion 7. May be connected to the cathode terminal 9 in contact with each other.

(実施の形態2)
次に、本発明の実施の形態2について説明する。
(Embodiment 2)
Next, a second embodiment of the present invention will be described.

図3は、本発明の実施の形態2における固体電解コンデンサの斜視図である。   FIG. 3 is a perspective view of the solid electrolytic capacitor according to Embodiment 2 of the present invention.

実施の形態2は、複数のコンデンサ素子1が実装面15に平行に横方向に隣接して配置され、隣接するコンデンサ素子1の陽極リード線3同士が、交互に相反する方向に引出されて、一対の陽極端子12にそれぞれ接続し、隣接するコンデンサ素子1の陰極部7の側面が、陽極リード線3側から陰極部7の先端側の一部を重ね合わせ、陰極端子13に接続したものであり、実施の形態2では、2つのコンデンサ素子が配置されたものである。   In the second embodiment, a plurality of capacitor elements 1 are arranged adjacent to each other in the horizontal direction in parallel to the mounting surface 15, and the anode lead wires 3 of the adjacent capacitor elements 1 are drawn out in opposite directions, A pair of anode terminals 12 are connected to each other, and the side surfaces of the cathode portions 7 of the adjacent capacitor elements 1 are connected to the cathode terminals 13 by overlapping a part of the cathode lead 7 from the anode lead wire 3 side. In the second embodiment, two capacitor elements are arranged.

つまり、前記複数のコンデンサ素子1は、コンデンサ素子1の陰極部7を、隣接した他のコンデンサ素子1の陽極リード線3と対向するように陽極リード線3の方向にずらしてコンデンサ素子1同士を配置してなっている。   That is, the plurality of capacitor elements 1 are arranged such that the cathode elements 7 of the capacitor elements 1 are shifted in the direction of the anode lead wires 3 so as to face the anode lead wires 3 of other adjacent capacitor elements 1. It is arranged.

さらに、コンデンサ素子1の陰極部7は、陽極リード線3に沿う方向に、隣接した陰極部7より突出している。突出した陰極部7は、隣接した陽極リード線3又は他方の陽極端子12を含むように陽極リード線3に沿う方向に垂直に切り取られる他方の陽極端子12側の部分に、隣接した陰極部7から延在して設けられている。   Further, the cathode portion 7 of the capacitor element 1 protrudes from the adjacent cathode portion 7 in the direction along the anode lead wire 3. The protruding cathode portion 7 is adjacent to a portion on the other anode terminal 12 side that is cut perpendicularly in the direction along the anode lead wire 3 so as to include the adjacent anode lead wire 3 or the other anode terminal 12. It is provided to extend from.

陽極端子12及び陰極端子13は、平板状の金属導電体を打ち抜き、折り曲げ加工により構成したリードフレームを用いたものであり、外装樹脂部14内でコンデンサ素子1の下方に延び、実装面15となる外装樹脂部14の底面に繋がって、底面と同一面に露呈したもので、陽極端子12は、外装樹脂14の実装面15の両端及び外装樹脂部14の両端側面に露呈し、陰極端子13は、実装面15の中央部及び外装樹脂部14の両側側面に露呈している。   The anode terminal 12 and the cathode terminal 13 use a lead frame formed by punching a flat metal conductor and bending it, and extend below the capacitor element 1 in the exterior resin portion 14. The anode terminal 12 is exposed to both ends of the mounting surface 15 of the exterior resin 14 and both side surfaces of the exterior resin portion 14 so as to be exposed to the same surface as the bottom surface. Are exposed on the center of the mounting surface 15 and on both side surfaces of the exterior resin portion 14.

一対の陽極端子12は、実装面15の端部から外装樹脂部14の端面にかけてそれぞれ露呈して配置され、陽極リード線3側には、実装面15から上方に向って階段状に屈曲した平坦状の上部12bが形成され、この上部12bと陽極リード線3が、抵抗溶接、レーザ溶接、超音波溶接等を用いて接合したものである。   The pair of anode terminals 12 are arranged so as to be exposed from the end portion of the mounting surface 15 to the end surface of the exterior resin portion 14, and on the anode lead wire 3 side, a flat surface bent upwardly from the mounting surface 15. An upper portion 12b is formed, and the upper portion 12b and the anode lead wire 3 are joined using resistance welding, laser welding, ultrasonic welding, or the like.

陽極端子12の隣接する突出した陰極部7側には、上方に向って屈曲したものであり、屈曲した先端は、外装樹脂部14を介して突出した陰極部7と電気的に絶縁している。また、前記先端に、絶縁性樹脂シートを貼付し又は絶縁性樹脂を塗布し形成した絶縁樹脂層を設け、陽極端子12と突出した陰極部7とを絶縁してもよい。   On the adjacent protruding cathode portion 7 side of the anode terminal 12 is bent upward, and the bent tip is electrically insulated from the protruding cathode portion 7 through the exterior resin portion 14. . Further, an insulating resin layer formed by sticking an insulating resin sheet or applying an insulating resin may be provided at the tip, and the anode terminal 12 and the protruding cathode portion 7 may be insulated.

陰極端子13は、一対の陽極端子12間の中央部に配置される。また、前記一対の陽極端子12間を結ぶ方向に対し実装面上で垂直な方向の、実装面15の両端部に露呈し、さらにこの両端部から上方に向って中央に連結するように階段状に屈曲して平坦状の上部13bが形成され、この上部13bの上面には、導電性接着剤を介して陰極部7が接合されている。   The cathode terminal 13 is disposed at the center between the pair of anode terminals 12. Further, a staircase pattern is formed so as to be exposed at both ends of the mounting surface 15 in a direction perpendicular to the mounting surface with respect to the direction connecting the pair of anode terminals 12 and further to be connected to the center upward from both ends. The upper portion 13b is bent to form a flat upper portion 13b, and the cathode portion 7 is bonded to the upper surface of the upper portion 13b with a conductive adhesive.

さらに、外装樹脂部14により、コンデンサ素子1と、コンデンサ素子1と陽極端子12、陰極端子13の接続部が被覆されたものである。   Furthermore, the exterior resin portion 14 covers the capacitor element 1 and the connection portion between the capacitor element 1 and the anode terminal 12 and the cathode terminal 13.

以上のように、コンデンサ素子1を隣接させ相反することにより、固体電解コンデンサのESLを小さくすることができる。また、コンデンサ素子1の陰極部7を、隣接した陰極部7より陽極リード線3に沿う方向に突出させることより、コンデンサ素子1の体積を大きくし静電容量を高めることができ、低インピーダンスかつ大容量の固体電解コンデンサを得ることができる。   As described above, the ESL of the solid electrolytic capacitor can be reduced by making the capacitor elements 1 adjacent to each other and conflicting with each other. Further, by projecting the cathode part 7 of the capacitor element 1 in the direction along the anode lead 3 from the adjacent cathode part 7, the volume of the capacitor element 1 can be increased and the capacitance can be increased, and the low impedance and A large-capacity solid electrolytic capacitor can be obtained.

本発明の実施の形態1における固体電解コンデンサの透過斜視図1 is a transparent perspective view of a solid electrolytic capacitor according to Embodiment 1 of the present invention. FIG. (a)本発明の実施の形態1のコンデンサ素子の構成を示す断面図、(b)同コンデンサ素子のA部拡大断面図(A) Sectional drawing which shows the structure of the capacitor | condenser element of Embodiment 1 of this invention, (b) A section enlarged sectional view of the capacitor | condenser element 本発明の実施の形態2における固体電解コンデンサの透過斜視図Transmission perspective view of solid electrolytic capacitor in Embodiment 2 of the present invention 従来の固体電解コンデンサの透過斜視図Transmission perspective view of a conventional solid electrolytic capacitor

符号の説明Explanation of symbols

1 コンデンサ素子
2 多孔質体
3 陽極リード線
4 誘電体酸化皮膜層
5 固体電解質層
6 陰極層
7 陰極部
8、12 陽極端子
9、13 陰極端子
10、14 外装樹脂部
11、15 実装面
DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Porous body 3 Anode lead wire 4 Dielectric oxide film layer 5 Solid electrolyte layer 6 Cathode layer 7 Cathode part 8, 12 Anode terminal 9, 13 Cathode terminal 10, 14 Exterior resin part 11, 15 Mounting surface

Claims (2)

陽極リード線が接合された、弁作用金属粉末の多孔質体の表面に誘電体酸化皮膜層、固体電解質層、陰極層を順次積層して陰極部を形成したコンデンサ素子を複数隣接して備え、前記陽極リード線に接続した陽極端子、及び前記陰極部に接続した陰極端子が外装樹脂部の実装面に露呈した固体電解コンデンサであって、隣接した前記コンデンサ素子の陽極リード線は、交互に相反する方向に引出されて一対の前記陽極端子にそれぞれ接続し、前記陰極部は、前記一対の陽極端子間に設けられた前記陰極端子に接続した固体電解コンデンサ。 Provided with a plurality of adjacent capacitor elements in which a cathode portion is formed by sequentially laminating a dielectric oxide film layer, a solid electrolyte layer, and a cathode layer on the surface of a porous body of a valve action metal powder to which an anode lead wire is bonded, A solid electrolytic capacitor in which an anode terminal connected to the anode lead wire and a cathode terminal connected to the cathode portion are exposed on the mounting surface of the exterior resin portion, and the anode lead wires of adjacent capacitor elements are alternately opposed to each other. A solid electrolytic capacitor which is pulled out in a direction to be connected to the pair of anode terminals, and the cathode portion is connected to the cathode terminal provided between the pair of anode terminals. 前記コンデンサ素子の陰極部は、陽極リード線に沿う方向に、隣接した他のコンデンサ素子の陰極部より突出するように配置してなる請求項1に記載の固体電解コンデンサ。 The solid electrolytic capacitor according to claim 1, wherein the cathode portion of the capacitor element is disposed so as to protrude from a cathode portion of another adjacent capacitor element in a direction along the anode lead wire.
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Publication number Priority date Publication date Assignee Title
JP2010141172A (en) * 2008-12-12 2010-06-24 Nichicon Corp Chip-like solid electrolytic capacitor and manufacturing method therefor
JP2010199360A (en) * 2009-02-26 2010-09-09 Hitachi Cable Precision Co Ltd Method of manufacturing lead frame for capacitors, and lead frame for capacitors
JP2011014601A (en) * 2009-06-30 2011-01-20 Nichicon Corp Chip-like solid electrolytic capacitor
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JP2011049347A (en) * 2009-08-27 2011-03-10 Sanyo Electric Co Ltd Solid electrolytic capacitor and method of manufacturing the same
JP2011071218A (en) * 2009-09-24 2011-04-07 Showa Denko Kk Method for producing solid electrolytic capacitor
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WO2023181748A1 (en) * 2022-03-23 2023-09-28 パナソニックIpマネジメント株式会社 Surface-mounted solid electrolytic capacitor, module, and electronic device

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