JP2007019054A - Solid electrolytic capacitor with built-in fuse - Google Patents
Solid electrolytic capacitor with built-in fuse Download PDFInfo
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- JP2007019054A JP2007019054A JP2005195668A JP2005195668A JP2007019054A JP 2007019054 A JP2007019054 A JP 2007019054A JP 2005195668 A JP2005195668 A JP 2005195668A JP 2005195668 A JP2005195668 A JP 2005195668A JP 2007019054 A JP2007019054 A JP 2007019054A
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本発明は、ヒューズ内蔵型固体電解コンデンサに関するものである。 The present invention relates to a solid electrolytic capacitor with a built-in fuse.
従来のヒューズ内蔵型チップ状固体電解コンデンサは、図5に示すようにリードフレーム13とコンデンサ素子2とを温度ヒューズでワイヤボンディング、超音波接続または熱圧着法により接続していた。(例えば、特許文献1参照)
従来の技術では、上記のように、ヒューズをリードフレームとコンデンサ素子間に接続していたため、ヒューズを接続するスペースの分だけ内部素子の体積効率が低下する問題があり、固体電解コンデンサを小形化し、かつ大容量化をするのが困難であった。 In the conventional technology, as described above, since the fuse is connected between the lead frame and the capacitor element, there is a problem that the volume efficiency of the internal element is reduced by the space for connecting the fuse, and the solid electrolytic capacitor is downsized. In addition, it was difficult to increase the capacity.
本発明は上記課題を解決するもので、ヒューズの接続による内部素子の体積効率の低下がなく、小形かつ大容量のヒューズ内蔵型チップ状固体電解コンデンサを提供するものである。 The present invention solves the above problems, and provides a chip-type solid electrolytic capacitor with a small size and a large capacity, which does not cause a decrease in volumetric efficiency of internal elements due to connection of fuses.
すなわち、本発明は、陽極リードを具備し、誘電体酸化皮膜、固体電解質層、陰極引出層を順次形成したコンデンサ素子とコンデンサの電極となる電極基板と外装樹脂とを有し、
上記電極基板が、複数の貫通孔または切欠き部を有する絶縁層と、該貫通孔または切欠き部に配置される陽極側導電板、陰極側導電板および補助電極用導電板と、陽極側および陰極側外部電極層を有し、
該陽極側導電板と補助電極用導電板とをヒューズを介して接続し、陽極側導電板と陽極側外部電極層、陰極側導電板と陰極側外部電極層とを各々接続してなり、
さらに、陽極リードが金属条材と導電性接着剤を介して補助電極用導電板に接続され、コンデンサ素子の陰極引出層が導電性接着剤を介して陰極側導電板に接続されることを特徴とするヒューズ内蔵型固体電解コンデンサである。
That is, the present invention comprises a capacitor element comprising an anode lead, a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer sequentially formed, an electrode substrate serving as a capacitor electrode, and an exterior resin.
The electrode substrate includes an insulating layer having a plurality of through holes or notches, an anode side conductive plate, a cathode side conductive plate and an auxiliary electrode conductive plate disposed in the through holes or notches, an anode side, and A cathode-side external electrode layer;
The anode side conductive plate and the auxiliary electrode conductive plate are connected via a fuse, the anode side conductive plate and the anode side external electrode layer, the cathode side conductive plate and the cathode side external electrode layer are respectively connected,
Further, the anode lead is connected to the auxiliary electrode conductive plate via the metal strip and the conductive adhesive, and the cathode lead layer of the capacitor element is connected to the cathode side conductive plate via the conductive adhesive. This is a solid electrolytic capacitor with a built-in fuse.
また、陽極リードを具備し、誘電体酸化皮膜、固体電解質層、陰極引出層を順次形成したコンデンサ素子とコンデンサの電極となる電極基板と外装樹脂とを有し、
上記電極基板が、複数の貫通孔または切欠き部を有する絶縁層と、該貫通孔または切欠き部に配置される陽極側導電板、陰極側導電板および補助電極用導電板と、陽極側および陰極側外部電極層を有し、
該陰極側導電板と補助電極用導電板とをヒューズを介して接続し、陽極側導電板と陽極側外部電極層、陰極側導電板と陰極側外部電極層とを各々接続してなり、
さらに、陽極リードが金属条材と導電性接着剤を介して陽極側導電板に接続され、コンデンサ素子の陰極引出層が導電性接着剤を介して補助電極用導電板に接続されることを特徴とするヒューズ内蔵型固体電解コンデンサである。
In addition, a capacitor element having an anode lead, a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer formed in this order, an electrode substrate serving as a capacitor electrode, and an exterior resin,
The electrode substrate includes an insulating layer having a plurality of through holes or notches, an anode side conductive plate, a cathode side conductive plate and an auxiliary electrode conductive plate disposed in the through holes or notches, an anode side, and A cathode-side external electrode layer;
The cathode side conductive plate and the auxiliary electrode conductive plate are connected via a fuse, the anode side conductive plate and the anode side external electrode layer, and the cathode side conductive plate and the cathode side external electrode layer are respectively connected.
Furthermore, the anode lead is connected to the anode side conductive plate via the metal strip and the conductive adhesive, and the cathode lead layer of the capacitor element is connected to the auxiliary electrode conductive plate via the conductive adhesive. This is a solid electrolytic capacitor with a built-in fuse.
本発明は、陽極または陰極側導電板のいずれか一方の近傍に補助電極用導電板を設け、陽極または陰極側導電板と補助電極用導電板とをヒューズを介して接続することにより、ヒューズ接続時のコンデンサ素子へのストレスが軽減され、かつ、ヒューズによる体積効率の低下を防止できるため、漏れ電流が低減し、小形で大容量のヒューズ内蔵型固体電解コンデンサを得ることができる。 The present invention provides an auxiliary electrode conductive plate in the vicinity of either the anode or cathode side conductive plate, and connects the anode or cathode side conductive plate and auxiliary electrode conductive plate via a fuse, thereby connecting the fuse. Since the stress on the capacitor element at the time is reduced and the volumetric efficiency due to the fuse can be prevented, the leakage current is reduced, and a small-sized and large-capacity built-in solid electrolytic capacitor can be obtained.
以下、本発明の実施例について、図面を参照しながら説明する。
[実施例1]陽極側導電板と補助電極用導電板との間をヒューズ接続(図1、2)
図1は本発明の実施例1を示すヒューズ内蔵型固体電解コンデンサの断面図、図2は電極基板の平面図である。
まず、タンタルワイヤーからなる陽極リードを植立した弁作用金属粉末のタンタル粉末を加圧成形後、焼結し、得られた焼結体に誘電体酸化皮膜、固体電解質層、陰極引出層を順次形成し、コンデンサ素子2を作製する。
次に、絶縁層4に少なくとも2箇所の貫通孔を設け、該貫通孔に陽極側導電板3a、陰極側導電板3bおよびヒューズ接続のための補助電極用導電板3cを嵌合させ、コンデンサ素子実装部分および外部電極層形成部分とし、さらに、メッキ層6a〜6dを形成して電極基板7を作製する。
Embodiments of the present invention will be described below with reference to the drawings.
[Example 1] Fuse connection between anode side conductive plate and auxiliary electrode conductive plate (FIGS. 1 and 2)
FIG. 1 is a sectional view of a solid electrolytic capacitor with a built-in fuse showing Example 1 of the present invention, and FIG. 2 is a plan view of an electrode substrate.
First, tantalum powder of valve action metal powder in which an anode lead made of tantalum wire is implanted is pressed and then sintered, and the obtained sintered body is sequentially provided with a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer. Then, the
Next, at least two through holes are provided in the
続いて、該陽極側導電板3aと補助電極用導電板3cとの間を、幅15μmのヒューズ11で接続し、該ヒューズ上にシリコーンレジン12を被覆する。
次に、陽極リード1と板状の金属条材5を抵抗溶接し、該金属条材5と補助電極用導電板3c上のメッキ層6aおよびコンデンサ素子2の陰極引出層とメッキ層6cとを導電性接着剤8を介して各々接続した後、樹脂外装する。
さらに、陽極側外部電極メッキ層6bおよび陰極側外部電極メッキ層6dの表面に外部電極層10を形成し、ヒューズ内蔵型固体電解コンデンサを作製した。
Subsequently, the anode side
Next, the
Further, the
[実施例2]陰極側導電板と補助電極用導電板との間をヒューズ接続(図3、4)
図3は本発明の実施例2を示すヒューズ内蔵型固体電解コンデンサの断面図、図4は電極基板の平面図である。
陰極側導電板3bと補助電極用導電板3cとの間をヒューズ11で接続した以外は、実施例1と同様の方法でヒューズ内蔵型固体電解コンデンサを作製した。
[Embodiment 2] Fuse connection between cathode side conductive plate and auxiliary electrode conductive plate (FIGS. 3 and 4)
3 is a cross-sectional view of a solid electrolytic capacitor with a built-in fuse showing Example 2 of the present invention, and FIG. 4 is a plan view of an electrode substrate.
A solid electrolytic capacitor with a built-in fuse was produced in the same manner as in Example 1 except that the cathode side
(従来例)リードフレームとコンデンサ素子との間をヒューズ接続(図5)
図5は従来のヒューズ内蔵型固体電解コンデンサの断面図である。実施例と同様の方法で、陽極リードを具備し、誘電体酸化皮膜、固体電解質層、陰極引出層を順次形成したコンデンサ素子2を作製し、次に、陽極リード1と陽極側リードフレーム13をヒューズで接続し、コンデンサ素子2と陰極側リードフレーム14を導電性接着剤8で接続した後、樹脂外装し、ヒューズ内蔵型固体電解コンデンサを作製した。
(Conventional example) Fuse connection between lead frame and capacitor element (Fig. 5)
FIG. 5 is a sectional view of a conventional solid electrolytic capacitor with a built-in fuse. In the same manner as in the example, a
実施例1、2と従来例の製品体積に対するコンデンサ素子体積の占有率および漏れ電流を比較した結果を表1に示す。 Table 1 shows the result of comparing the occupation ratio of the capacitor element volume and the leakage current with respect to the product volume of Examples 1 and 2 and the conventional example.
表1から明らかなように、実施例1、2は、従来例と比較して素子占有率が高く、内部素子の体積効率が大幅に改善され、かつ、漏れ電流も改善されていることが分かる。
また、ヒューズは、コスト面、技術面から鉛、または鉛、錫、ビスマス、カドミウムなどの合金、あるいはアルミニウム、銅を用いることが望ましい。
As is clear from Table 1, Examples 1 and 2 have a higher element occupancy rate than the conventional example, the volume efficiency of the internal elements is greatly improved, and the leakage current is also improved. .
The fuse is preferably made of lead, an alloy such as lead, tin, bismuth, or cadmium, aluminum, or copper from the viewpoint of cost and technology.
1 陽極リード
2 コンデンサ素子
3a 導電板(陽極側)
3b 導電板(陰極側)
3c 導電板(補助電極用)
4 絶縁層
5 金属条材
6a メッキ層(陽極側内部電極)
6b メッキ層(陽極側外部電極)
6c メッキ層(陰極側内部電極)
6d メッキ層(陰極側外部電極)
7 電極基板
8 導電性接着剤
9 外装樹脂
10 外部電極層
11 ヒューズ
12 シリコーンレジン
13 陽極リードフレーム
14 陰極リードフレーム
1
3b Conductive plate (cathode side)
3c Conductive plate (for auxiliary electrode)
4 Insulating
6b Plating layer (Anode-side external electrode)
6c Plating layer (cathode side internal electrode)
6d Plating layer (cathode side external electrode)
7
Claims (2)
上記電極基板が、複数の貫通孔または切欠き部を有する絶縁層と、該貫通孔または切欠き部に配置される陽極側導電板、陰極側導電板および補助電極用導電板と、陽極側および陰極側外部電極層を有し、
該陽極側導電板と補助電極用導電板とをヒューズを介して接続し、陽極側導電板と陽極側外部電極層、陰極側導電板と陰極側外部電極層とを各々接続してなり、
さらに、陽極リードが金属条材と導電性接着剤を介して補助電極用導電板に接続され、コンデンサ素子の陰極引出層が導電性接着剤を介して陰極側導電板に接続されることを特徴とするヒューズ内蔵型固体電解コンデンサ。 A capacitor element having an anode lead, a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer sequentially formed, an electrode substrate that serves as an electrode of the capacitor, and an exterior resin;
The electrode substrate includes an insulating layer having a plurality of through holes or notches, an anode side conductive plate, a cathode side conductive plate and an auxiliary electrode conductive plate disposed in the through holes or notches, an anode side, and A cathode-side external electrode layer;
The anode side conductive plate and the auxiliary electrode conductive plate are connected via a fuse, the anode side conductive plate and the anode side external electrode layer, the cathode side conductive plate and the cathode side external electrode layer are respectively connected,
Further, the anode lead is connected to the auxiliary electrode conductive plate via the metal strip and the conductive adhesive, and the cathode lead layer of the capacitor element is connected to the cathode side conductive plate via the conductive adhesive. A solid electrolytic capacitor with a built-in fuse.
上記電極基板が、複数の貫通孔または切欠き部を有する絶縁層と、該貫通孔または切欠き部に配置される陽極側導電板、陰極側導電板および補助電極用導電板と、陽極側および陰極側外部電極層を有し、
該陰極側導電板と補助電極用導電板とをヒューズを介して接続し、陽極側導電板と陽極側外部電極層、陰極側導電板と陰極側外部電極層とを各々接続してなり、
さらに、陽極リードが金属条材と導電性接着剤を介して陽極側導電板に接続され、コンデンサ素子の陰極引出層が導電性接着剤を介して補助電極用導電板に接続されることを特徴とするヒューズ内蔵型固体電解コンデンサ。 A capacitor element having an anode lead, a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer sequentially formed, an electrode substrate that serves as an electrode of the capacitor, and an exterior resin;
The electrode substrate includes an insulating layer having a plurality of through holes or notches, an anode side conductive plate, a cathode side conductive plate and an auxiliary electrode conductive plate disposed in the through holes or notches, an anode side, and A cathode-side external electrode layer;
The cathode side conductive plate and the auxiliary electrode conductive plate are connected via a fuse, the anode side conductive plate and the anode side external electrode layer, and the cathode side conductive plate and the cathode side external electrode layer are respectively connected.
Furthermore, the anode lead is connected to the anode side conductive plate via the metal strip and the conductive adhesive, and the cathode lead layer of the capacitor element is connected to the auxiliary electrode conductive plate via the conductive adhesive. A solid electrolytic capacitor with a built-in fuse.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014049553A (en) * | 2012-08-30 | 2014-03-17 | Nichicon Corp | Solid electrolytic capacitor |
CN107134444A (en) * | 2016-02-26 | 2017-09-05 | 意法半导体股份有限公司 | The method and respective devices of integrated capacitor in the semiconductor device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60257119A (en) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | Condenser with fuse and method of producing same |
JPH05251288A (en) * | 1992-03-06 | 1993-09-28 | Nec Corp | Surface-mounting three-terminal solid electrolytic capacitor with built-in fuse |
JP2001257130A (en) * | 2000-03-10 | 2001-09-21 | Rohm Co Ltd | Solid electrolytic capacitor |
JP2003151425A (en) * | 2001-11-09 | 2003-05-23 | Koa Corp | Chip type current fuse and its manufacturing method |
JP2003173728A (en) * | 2001-12-06 | 2003-06-20 | Koa Corp | Manufacturing method of chip current fuse |
-
2005
- 2005-07-05 JP JP2005195668A patent/JP2007019054A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60257119A (en) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | Condenser with fuse and method of producing same |
JPH05251288A (en) * | 1992-03-06 | 1993-09-28 | Nec Corp | Surface-mounting three-terminal solid electrolytic capacitor with built-in fuse |
JP2001257130A (en) * | 2000-03-10 | 2001-09-21 | Rohm Co Ltd | Solid electrolytic capacitor |
JP2003151425A (en) * | 2001-11-09 | 2003-05-23 | Koa Corp | Chip type current fuse and its manufacturing method |
JP2003173728A (en) * | 2001-12-06 | 2003-06-20 | Koa Corp | Manufacturing method of chip current fuse |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014049553A (en) * | 2012-08-30 | 2014-03-17 | Nichicon Corp | Solid electrolytic capacitor |
CN107134444A (en) * | 2016-02-26 | 2017-09-05 | 意法半导体股份有限公司 | The method and respective devices of integrated capacitor in the semiconductor device |
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