JPH025528Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a chip type solid electrolytic capacitor.
Especially regarding the structure of the anode terminal.

Conventionally, a chip type solid electrolytic capacitor having an anode terminal having a U-shaped cross section has been constructed by attaching a conductive adhesive 3 to the cathode part of a capacitor element 2 having a protruding anode lead wire 1, as shown in FIGS. Then, the outer surface of the capacitor element 2 is coated with an insulating resin 5 by brushing or dipping.

On the other hand, the anode terminal 6 has a U-shaped cross section and is provided with a hole 7 in the center of the bottom through which the anode lead wire 1 passes, and the anode lead wire 1 is electrically connected and fixed to the hole 7 by welding or the like.

Furthermore, for the purpose of improving the connection strength of the anode terminal 6 and adjusting the shape of the outer surface, an insulating resin 5 is placed in the gap between the anode terminal 6 and the capacitor element 2.
It was manufactured by filling and applying it using methods such as brush coating.

However, although capacitors with this conventional structure have advantages such as being extremely compact, having a uniform outer surface shape, and being able to be vacuum-adsorbed, the process of connecting the anode terminal 6 and the connection between the anode terminal 6 and the anode terminal 6 are difficult. The step of applying the insulating resin 5 to the gaps between the capacitor elements 2 with a brush requires a huge amount of man-hours since each step is done individually. Therefore, in order to eliminate these conventional drawbacks, an improved structure as shown in FIGS. 2a and 2b has been developed.

This improved structure, as shown in Figure 3,
The anode terminal 6 is U-shaped in cross section and has a slit portion 8 in the thickness direction of the capacitor element 2, and the anode lead wire 1 and the anode terminal 6 are connected to the slit portion 8.
They are connected and fixed by means such as welding.

Generally, in the manufacturing process of solid electrolytic capacitors, as shown in Fig. 4, a plurality of capacitor elements 2 are connected and fixed at regular intervals to a strip-shaped metal plate 9, and many elements are processed at once. . Therefore, if the anode terminals 6 of the improved structure shown in FIG. Since the anode terminals 6 can be connected and fixed on a frame-by-frame basis, there is an advantage that the number of steps for connecting the anode terminals 6 can be significantly reduced.

However, the work of filling and applying the insulating resin 5 into the gap between the anode terminal 6 and the capacitor element 2 requires careful attention to prevent the insulating resin 5 from adhering to the mounting surface of the anode terminal 6.
Since the insulating resin 5 is filled and applied from the sides of the capacitor element 2 that are not the mounting surface, that is, from both the left and right sides of the capacitor element 2 connected to the metal plate 9, this work is carried out individually.

Furthermore, products have become extremely miniaturized, and as a result, the terminal area on the mounting surface with the slit portion 8 has become extremely small. It becomes easier to leak. For this reason, when the mounting surface having the slit portion 8 is used for mounting on a printed wiring board, etc., the connection strength after mounting may be extremely weak, and in reality, it is necessary to distinguish between the front and back sides of the product, and the slit portion Only one side without 8 is used as the mounting surface.

The object of the present invention is to provide a chip-type solid electrolytic capacitor that overcomes these conventional drawbacks.

The present invention is characterized by the use of an anode terminal having a U-shaped cross section and a slit in the longitudinal direction of the bottom surface perpendicular to the mounting surface and in a direction parallel to the mounting surface.

The chip type solid electrolytic capacitor of the present invention will be explained below with reference to FIGS. 5 to 8 a and b.

First, an anode lead wire 1 having a valve action is embedded in a metal powder having a valve action such as tantalum, niobium, aluminum, etc., and after forming it into a rectangular shape with a certain size, vacuum sintering at a temperature of 1500 to 2100 ° C. A square sintered body 10 is formed. This square sintered body 10 is
As shown in the figure, a plurality of pieces are connected and fixed at regular intervals by means such as welding so as to be perpendicular to the band-shaped metal plate 9, and in this state, the surface of the square sintered body 10 is anodized. A dielectric oxide film (not shown) is formed on this surface, and a manganese dioxide layer (not shown), which is an electrolyte, is formed by thermally decomposing manganese nitrate.A carbon layer and a silver paint layer (( (not shown), etc.

An anode terminal 4 is connected and fixed to the cathode portion of the capacitor element 2 configured in this manner via a conductive adhesive 3, and an insulating resin 5 such as epoxy resin or silicone resin is applied with a brush to the outer surface of the capacitor element 2. Alternatively, apply using Jiyabozuke etc. Next, as shown in FIG. 6, an anode terminal 16 having a U-shaped cross section and a slit portion 18 cut out in the longitudinal direction of the bottom surface is formed to protrude from the band-shaped metal plate 11, and is connected to the connecting portion 11a in a frame state. Form. Then, it is connected and fixed to the anode lead wire 1 at the slit portion 18 by welding. Anode terminal 1 in this continuously formed frame state
The interval 6 is set to be the same as the interval between the capacitor elements 12 connected and fixed to the metal plate 9.

Next, connect the anode terminal 16 in the frame state to
Detach from −X′. A cutting machine such as a shear may be used as a means for separating, but if a notch is made in advance at the place to be separated, the film can be easily separated by a bending operation. After the capacitor element 2 and the anode terminal 16 are separated, in the step of filling and applying the insulating resin 5 into the gap between the capacitor element 2 and the anode terminal 16, the capacitor element 2 and the anode terminal 16 are connected perpendicularly to the metal plate 9 as shown in FIG. Therefore, the side surface 5 that is not the mounting surface of the anode terminal 16
Since it is sufficient to fill and apply the insulating resin 5 from a,
With the capacitor element 2 connected and fixed to the metal plate 9, it is possible to process each metal plate 9 at a time.

Next, if the anode lead wire 1 protruding from the slit portion 18 in the direction parallel to the mounting surface 16b perpendicular to the bottom surface 16a of the anode terminal 16 is cut from the outer surface of the anode terminal 16, as shown in FIGS. 8a and 8b. You will get a finished product like this.

Although the shape of the cathode terminal has been described above using a metal terminal having a U-shaped cross section, a rectangular metal case, solder, or the like may also be used as the cathode terminal.

As described above, according to the present invention, (i) the work of filling and applying insulating resin into the gap between the capacitor element and the anode terminal is not done individually, but can be done all at once with the capacitor element connected and fixed to the metal plate, which greatly reduces the work time. The number of man-hours can be reduced.

(ii) In the above work, even if a small amount of insulating resin flows out from the slit part of the anode terminal, it will not affect the mounting surface, so there is no need to distinguish between the front and back of the capacitor, and automatic alignment and automatic supply using a parts feeder etc. becomes very easy.

(iii) Even if the product is extremely miniaturized, the area on the mounting side of the anode terminal can be increased, so the reliability of the connection strength after mounting is increased.

It is possible to obtain chip-type solid electrolytic capacitors with high practical value such as.

[Brief explanation of the drawing]

FIGS. 1a and 1b and 2a and 2b are a perspective view and a sectional view, respectively, of a conventional chip-type solid electrolytic capacitor. FIG. 3 is a perspective view of an anode terminal used in a conventional chip-type solid electrolytic capacitor. Fourth
The figure is a perspective view showing the state of capacitor elements attached to a metal plate at regular intervals during a conventional manufacturing process. FIG. 5 is a perspective view showing the state of capacitor elements attached to a metal plate at regular intervals during the manufacturing process of the present invention. FIG. 6 is a perspective view of a frame-shaped anode terminal used in the present invention. FIG. 7 is a perspective view showing the state after the anode terminal is connected in the middle of the manufacturing process of the present invention. 8a and 8b are a perspective view and a sectional view of a chip-type solid electrolytic capacitor according to the present invention. 1... Anode lead wire, 2... Capacitor element,
3... Conductive adhesive, 4... Cathode terminal, 5... Insulating resin, 6, 16... Anode terminal, 7... Hole,
8, 18...Slit part, 9, 11...Metal plate,
10... Square sintered body.

Claims (1)

[Scope of utility model registration request] A chip type configured by electrically connecting the bottom part of an anode terminal having a U-shaped cross section to a leader wire led out from a capacitor element, and filling the gap between the anode terminal and the capacitor element with an insulating resin. A chip-type solid electrolytic capacitor, wherein a slit is provided in the bottom portion in a direction parallel to a mounting surface perpendicular to the bottom portion, and the lead wire is located within the slit.