JPS5940764Y2 - solid electrolytic capacitor - Google Patents
solid electrolytic capacitorInfo
- Publication number
- JPS5940764Y2 JPS5940764Y2 JP5775178U JP5775178U JPS5940764Y2 JP S5940764 Y2 JPS5940764 Y2 JP S5940764Y2 JP 5775178 U JP5775178 U JP 5775178U JP 5775178 U JP5775178 U JP 5775178U JP S5940764 Y2 JPS5940764 Y2 JP S5940764Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capacitor element
- protruding lead
- anode terminal
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案はフェースボンディングタイプのチップ型固体電
解コンデンサに関するもので、詳しくは製造が容易でパ
ーツフィーダーによる自動供給、自動整列が可能な方形
状の固体電解コンデンサを提供するものである。[Detailed description of the invention] The present invention relates to a face bonding type chip type solid electrolytic capacitor, and more specifically, it provides a rectangular solid electrolytic capacitor that is easy to manufacture and can be automatically fed and automatically aligned using a parts feeder. It is.
従来、フェースボンディングタイプのチップ型固体電解
コンデンサとしては第1図に示す構造のものが一般に用
いられていた。Conventionally, as a face bonding type chip type solid electrolytic capacitor, one having the structure shown in FIG. 1 has been generally used.
すなわち、タンタル等の弁作用金属の金属粉末を成型し
焼結することにより構成されかつ一端面の中央部よりタ
ンタル線等の突出導入線1を引出した焼結体の表面に陽
極酸化により誘電体酸化皮膜を形成し、そしてその誘電
体酸化皮膜上に二酸化マンガン層を硝酸マンガン溶液の
熱分解により形成し、その二酸化マンガン層上に順次カ
ーボン層、銀塗料層、半田層を積層形成することにより
コンデンサ素子2を構成し、そのコンデンサ素子2の突
出導入線1に半田付は可能な陽極端子となる金属板3を
コンデンサ素子2の半田層2a表面と同一平面上に位置
するように溶接により接続することにより構成されてい
る。That is, a dielectric material is formed by anodizing on the surface of a sintered body, which is constructed by molding and sintering metal powder of a valve metal such as tantalum, and has a protruding lead-in wire 1 such as a tantalum wire drawn out from the center of one end face. By forming an oxide film, then forming a manganese dioxide layer on the dielectric oxide film by thermal decomposition of a manganese nitrate solution, and sequentially laminating a carbon layer, a silver paint layer, and a solder layer on the manganese dioxide layer. A metal plate 3, which constitutes a capacitor element 2 and serves as an anode terminal which can be soldered, is connected to the protruding lead-in wire 1 of the capacitor element 2 by welding so as to be located on the same plane as the surface of the solder layer 2a of the capacitor element 2. It consists of:
筐た、この第1図に示す構造の場合、陽極端子部の強度
が弱く、外部からのストレスを受は漏れ電流が増大する
という問題があるため、その陽極端子部の補強を行なう
ために第2図に示すようにコンデンサ素子2と金属板3
との間に樹脂4を盛った構造のものもある。In the case of the structure shown in Figure 1, the strength of the anode terminal is weak, and leakage current increases when exposed to external stress. As shown in Figure 2, capacitor element 2 and metal plate 3
There is also a structure in which resin 4 is placed between the two.
ところが、このような第1図、第2図に示す従来の固体
電解コンデンサの場合、構造が簡単であるため安価に製
造することができるという利点を有しているものの、前
述したように第1図に示すものは外部からのストレスに
対して非常に弱く、特性が不安定であるという欠点を有
しており、捷た第2図に示すものは外部からのストレス
に対しては樹脂4による陽極端子部の補強によりある程
度強いものとすることができるが、樹脂4が垂れ、製品
寸法のばらつきが大きいという欠点があった。However, although the conventional solid electrolytic capacitors shown in FIGS. 1 and 2 have the advantage of being simple in structure and can be manufactured at low cost, as mentioned above, The one shown in the figure is very weak against external stress and has the disadvantage of unstable characteristics. Although it is possible to make the anode terminal part strong to some extent by reinforcing the anode terminal part, there is a drawback that the resin 4 sags and the product dimensions vary widely.
一方、最近では電子部品の自動供給・自動整列が進み、
セラミックコンデンサ等ではその要求に応えることがで
きるチップ形状のものが開発されている。On the other hand, in recent years, automatic supply and automatic alignment of electronic components have progressed.
Chip-shaped ceramic capacitors and the like that can meet these demands have been developed.
しかしながら、電子回路に釦いて容量素子として重要な
位置を占める固体電解コンデンサでは、自動供給、自動
整列が可能なもので価格、大きさ等の面からも良好なも
のが開発されて釦らず、自動供給、自動整列が可能な方
形状とすることができても価格が高くなったり、形状が
大きくなったりしているのが現状であり、固体電解コン
デンサに釦いて、そのような要望に応えることができる
ものの開発が望捷れている。However, solid electrolytic capacitors, which play an important role as capacitive elements in electronic circuits, have been developed that are capable of automatic supply and automatic alignment, and are favorable in terms of price, size, etc. Even if it is possible to create a rectangular shape that can be automatically supplied and automatically aligned, the current situation is that the price is high and the shape is large, so solid electrolytic capacitors have been developed to meet these demands. I'm looking forward to the development of something that can be done.
本考案はこのような要求に応えるべく考案したものであ
り、以下本考案の実施例を示す第3図釦よび第4図の図
面を用いて説明する。The present invention was devised in response to such demands, and will be described below with reference to FIG. 3 and FIG. 4, which show embodiments of the present invention.
第3図a、bに本考案の一実施例による固体電解コンデ
ンサを示してkす、図において10はコンデンサ素子で
、このコンデンサ素子10はタンタル等の弁作用金属の
金属粉末を成型し焼結することにより構成した角柱状の
焼結体の表面にタンタル線等の突出導入線11を接続し
、そしてその焼結体の表面に従来と同様な方法により誘
電体酸化皮膜、二酸化マンガンのような固体電解質層、
カーボンのような陰極層、銀塗料のような陰極導電層を
順次積層形成することにより構成されている。Figures 3a and 3b show a solid electrolytic capacitor according to an embodiment of the present invention. In the figure, 10 is a capacitor element, and this capacitor element 10 is formed by molding and sintering metal powder of a valve metal such as tantalum. A protruding lead-in wire 11 such as a tantalum wire is connected to the surface of the prismatic sintered body constructed by this method, and a dielectric oxide film, such as manganese dioxide, is applied to the surface of the sintered body by a conventional method. solid electrolyte layer,
It is constructed by sequentially laminating a cathode layer made of carbon and a cathode conductive layer made of silver paint.
従って、突出導入線11Fiコンデンサ素子10の端面
の端より突出している。Therefore, the protruding lead-in wire 11 protrudes from the end of the end face of the Fi capacitor element 10.
12はコンデンサ素子10の突出導入線11の先端部に
溶接により接続固定した角柱状の陽極端子で、この陽極
端子12はコンデンサ素子10の端面から少し離れた位
置で接続固定されており、またこの陽極端子12はコン
デンサ素子10の厚みとほぼ等しい厚みの半田付は可能
な金属部材より構成されている。Reference numeral 12 denotes a prismatic anode terminal connected and fixed to the tip of the protruding lead-in wire 11 of the capacitor element 10 by welding. The anode terminal 12 is made of a metal member having a thickness approximately equal to the thickness of the capacitor element 10 and which can be soldered.
13//i前記コンデンサ素子10の突出導入線11を
引出した側とは反対側の端部に半田層、銀塗料層等を形
成することにより構成した陰極端子で、この陰極端子1
3と前記陽極端子12とは同一平面上に位置している。13//i A cathode terminal constructed by forming a solder layer, a silver paint layer, etc. on the end of the capacitor element 10 opposite to the side from which the protruding lead-in wire 11 is drawn out, and this cathode terminal 1
3 and the anode terminal 12 are located on the same plane.
14はエポキシ樹脂等の絶縁性樹脂層で、この絶縁性樹
脂層14は前記コンデンサ素子10の陰極端子13以外
の部分とコンデンサ素子10と陽極端子12との間に形
成してz−リ、この絶縁性樹脂層140表面も陽極端子
12、陰極端子13と同一平面上に位置している。14 is an insulating resin layer such as epoxy resin, and this insulating resin layer 14 is formed between the portion of the capacitor element 10 other than the cathode terminal 13 and between the capacitor element 10 and the anode terminal 12. The surface of the insulating resin layer 140 is also located on the same plane as the anode terminal 12 and the cathode terminal 13.
ここで、本考案で用いる焼結体は突出導入線11を焼結
体表面に配して釦す、焼結体を得る時に突出導入線11
を同時に埋設して成形することはできない。Here, in the sintered body used in the present invention, the protruding lead-in wire 11 is arranged on the surface of the sintered body and the button is pressed.
cannot be buried and molded at the same time.
従って、本考案では、1ずタンタル粉末等の弁作用金属
粉末をプレスにより成型し、一般的な方法で真空焼結を
行なって角柱状の焼結体を得、その後その焼結体表面に
タンタル線等の突出導入線11を焼結体表面とほぼ同一
平面上に位置するように突合せ溶接法等によって溶接す
るか、または予め焼結体に突出導入線11が嵌合する凹
部を設けて釦き、その凹部に突出導入線11を嵌め込ん
で重ね合せ溶接を行なって焼結体表面に接続固定して突
出導入線11を有する焼結体を得ている。Therefore, in the present invention, first, valve metal powder such as tantalum powder is molded using a press, vacuum sintered using a general method to obtain a prismatic sintered body, and then tantalum is applied to the surface of the sintered body. The protruding lead-in wire 11, such as a wire, is welded by a butt welding method or the like so that it is located almost on the same plane as the surface of the sintered body, or a recess into which the protruding lead-in wire 11 fits is provided in advance in the sintered body, and the button is pressed. Then, the protruding lead-in wire 11 is fitted into the recessed portion, and overlap welding is performed to connect and fix it to the surface of the sintered body, thereby obtaining a sintered body having the protruding lead-in wire 11.
また、陽極端子12としては半田付は可能でタンタル線
等の弁作用金属線と溶接可能な鉄、−ツケル等の金属を
用い、しかもその金属部材を突出導入線11に溶接した
時に外周面がコンデンサ素子10とほぼ同一平面となる
ような厚さの角形状、丸形状のものを用いる。In addition, the anode terminal 12 is made of a metal such as iron or steel that can be soldered and welded to a valve metal wire such as a tantalum wire, and when the metal member is welded to the protruding lead-in wire 11, the outer peripheral surface is A rectangular or round shape with a thickness that is approximately flush with the capacitor element 10 is used.
さらに、全体の長さをより小さくするためにはできるだ
け陽極端子12をコンデンサ素子10に近い位置で溶接
する必要があるが、この場合には陽極端子12を突出導
入線11に溶接する前にコンデンサ素子10の突出導入
線11を引出している端面に樹脂を盛り、その樹脂によ
り突出導入線11を補強して溶接時に加わるストレスを
少なくするとともに、コンデンサ素子10と陽極端子1
2との絶縁を行なうようにすればよい。Furthermore, in order to reduce the overall length, it is necessary to weld the anode terminal 12 as close to the capacitor element 10 as possible, but in this case, before welding the anode terminal 12 to the protruding lead-in wire 11, Resin is applied to the end surface of the element 10 from which the protruding lead-in wire 11 is drawn out, and the resin reinforces the protruding lead-in wire 11 to reduce the stress applied during welding, and also to reduce the stress applied during welding.
What is necessary is to insulate it from 2.
なお、陽極端子12を突出導入線11に溶接する場合、
陽極端子12の位置合せを容易にし、溶接を行ないやす
くするために陽極端子12に溝を設けておいてもよい。Note that when welding the anode terminal 12 to the protruding lead-in wire 11,
Grooves may be provided in the anode terminal 12 to facilitate alignment of the anode terminal 12 and facilitate welding.
第4図a、bに本考案の他の実施例による固体電解コン
デンサを示しているが、この実施例では絶縁性樹脂層1
4を陽極端子12の突出導入線11との接続部分1で覆
うように形成したものであり、上記実施例による効果以
外に陽極と陰極との判別を容易に行なうことができると
いう利点を有している。4a and 4b show a solid electrolytic capacitor according to another embodiment of the present invention, in which the insulating resin layer 1
4 is formed so as to be covered by the connecting portion 1 of the anode terminal 12 with the protruding lead-in wire 11. In addition to the effect of the above embodiment, it has the advantage that the anode and cathode can be easily distinguished. ing.
以上の説明から明らかなように本考案による固体電解コ
ンデンサによれば、次のような効果を得ることができる
。As is clear from the above description, the solid electrolytic capacitor according to the present invention can provide the following effects.
(1)突出導入線を焼結体の表面に接続し、コンデンサ
素子の厚みとほぼ同じ厚みの陽極端子をその突出導入線
に接続しているため、形状の整った方形状とすることが
でき、パーツフィーダーによる自動整列、自動移送が可
能となり、回路基板への取付けが容易となり、商品価値
を高めることができる。(1) Since the protruding lead-in wire is connected to the surface of the sintered body, and the anode terminal, which has approximately the same thickness as the capacitor element, is connected to the protruding lead-in wire, it is possible to form a well-shaped rectangular shape. This enables automatic alignment and automatic transfer using a parts feeder, which facilitates attachment to circuit boards and increases product value.
(2)大きさも従来の単に突出導入線に金属板を溶接し
たものと変らなく、特に形状が大きくなるということも
ない。(2) The size is the same as the conventional one in which a metal plate is simply welded to a protruding lead-in wire, and the shape is not particularly large.
(3)従来の製造工程に比較して絶縁性樹脂層を設ける
工程が増えるだけで価格もそれほど高くならない。(3) Compared to the conventional manufacturing process, the cost is not so high because the process of providing the insulating resin layer is increased.
(4)陰極端子、絶縁性樹脂層、陽極端子がほぼ同一平
面となるため、回路基板への取付は時に、1ず絶縁性樹
脂層を接着剤により回路基板に接着してから陽極、陰極
の接続を行なうことができ、取付けがきわめて容易とな
る。(4) Because the cathode terminal, insulating resin layer, and anode terminal are on almost the same plane, sometimes when installing the anode and cathode to the circuit board, first, the insulating resin layer is bonded to the circuit board with adhesive, and then the anode and cathode are attached. Connections can be made and installation is extremely easy.
このように本考案による固体電解コンデンサは、フェー
スボンディングタイプとして現在要求されている要望に
充分に応えることができるものである。As described above, the solid electrolytic capacitor according to the present invention can fully meet the current demands for a face bonding type capacitor.
第1図ち・よび第2図はそれぞれ従来の固体電解コンデ
ンサを示す斜視図、第3図a)bはそれぞれ本考案の一
実施例による固体電解コンデンサを示す斜視図および断
面図、第4図a、bばそれぞれ本考案の他の実施例によ
る固体電解コンデンサを示す斜視図1よび断面図である
。
10・・・・・・コンデンサ素子、11・・・・・・突
出導入線、12・・・・・・陽極端子、13・・・・・
・陰極端子、14・・・・・・絶縁性樹脂層。Figures 1 and 2 are perspective views showing a conventional solid electrolytic capacitor, Figures 3a and 3b are a perspective view and a sectional view, respectively, showing a solid electrolytic capacitor according to an embodiment of the present invention, and Figure 4. FIGS. 1A and 1B are a perspective view and a cross-sectional view, respectively, of solid electrolytic capacitors according to other embodiments of the present invention. 10...Capacitor element, 11...Protruding lead-in wire, 12...Anode terminal, 13...
- Cathode terminal, 14... Insulating resin layer.
Claims (1)
した角柱状の焼結体の表面に突出導入線を接続し、かつ
前記焼結体表面に誘電体酸化皮膜、固体電解質層、陰極
層、陰極導電層を順次積層してコンデンサ素子を構成し
、そのコンデンサ素子の突出導入線を引出した側とは反
対側の端部に導電層を設けて陰極端子とするとともに、
前記突出導入線の先端部に陰極端子と同一平面上に位置
するように前記コンデンサ素子の厚みとほぼ等しい厚み
の半田付は可能な陽極端子を接続固定し、かつ前記コン
デンサ素子の陰極端子以外の部分を絶縁性樹脂で被覆す
るとともに、前記コンデンサ素子の端面と陽極端子との
間に絶縁性樹脂を充填してなる固体電解コンデンサ。A protruding lead-in wire is connected to the surface of a prismatic sintered body formed by molding and sintering metal powder of a valve metal, and a dielectric oxide film, a solid electrolyte layer, and a cathode layer are provided on the surface of the sintered body. A capacitor element is constructed by sequentially laminating cathode conductive layers, and a conductive layer is provided at the end of the capacitor element opposite to the side from which the protruding lead-in wire is drawn out to serve as a cathode terminal.
Connect and fix the anode terminal to the tip of the protruding lead-in wire so that it is located on the same plane as the cathode terminal, and whose thickness is approximately equal to the thickness of the capacitor element. A solid electrolytic capacitor comprising a portion covered with an insulating resin and an insulating resin filled between the end face of the capacitor element and the anode terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5775178U JPS5940764Y2 (en) | 1978-04-27 | 1978-04-27 | solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5775178U JPS5940764Y2 (en) | 1978-04-27 | 1978-04-27 | solid electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54159060U JPS54159060U (en) | 1979-11-06 |
JPS5940764Y2 true JPS5940764Y2 (en) | 1984-11-20 |
Family
ID=28955927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5775178U Expired JPS5940764Y2 (en) | 1978-04-27 | 1978-04-27 | solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5940764Y2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4637702B2 (en) * | 2005-09-26 | 2011-02-23 | ニチコン株式会社 | Solid electrolytic capacitor |
US8441777B2 (en) * | 2009-05-29 | 2013-05-14 | Avx Corporation | Solid electrolytic capacitor with facedown terminations |
JP5796194B2 (en) * | 2010-12-13 | 2015-10-21 | パナソニックIpマネジメント株式会社 | Solid electrolytic capacitor |
-
1978
- 1978-04-27 JP JP5775178U patent/JPS5940764Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS54159060U (en) | 1979-11-06 |
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