JPS5934123Y2 - solid electrolytic capacitor - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a solid electrolytic capacitor suitable for incorporation into an IC.

2. Description of the Related Art Conventionally, solid electrolytic capacitors, commonly referred to as chip type, used for incorporation into ICs have been constructed as shown in FIGS. 1 to 3.

First, in the case shown in FIGS. 1 and 2, an anode internal lead 1 is drawn out from an anode body made of a valve metal such as tantalum, niobium, or aluminum, and an anodized film as a dielectric is formed on this anode body. A semiconductor layer such as manganese dioxide is provided thereon, and a cathode layer made of a carbon layer or a silver paint layer is provided to form the capacitor element 2. A solder layer 3 is provided around the outer periphery of the capacitor element 2, and the cathode and the anode internal lead 1 are soldered to each other. It is configured by connecting a possible anode lead 4.

The capacitor shown in FIG. 1 is a rectangular solid electrolytic capacitor, and the capacitor shown in FIG. 2 is a round solid electrolytic capacitor.

Furthermore, in the case shown in FIG. 3, a small piece of anode lead body 4 is welded to the anode internal lead 1 of the structure shown in FIG. 1 so as to be flush with the cathode 3. In the case shown in FIG.

With this type of configuration, it is impossible to incorporate it into a board such as a hybrid IC, which requires manual labor and time, has low value as a product, is unstable in terms of dimensional accuracy, and is susceptible to mechanical and thermal stress. It also had the disadvantage of being weak against the enemy.

The present invention eliminates the above-mentioned drawbacks of the prior art.

Embodiments of the present invention will be described below with reference to FIGS. 4 to 7 of the drawings.

First, in FIGS. 4 and 5, 5 is a sintered anode body made of a valve metal such as tantalum, niobium, or aluminum, and the anode body 5 has an anode internal lead 6 made of a valve metal. It is buried.

Note that the anode body 5 and the anode internal lead 6 may be integrally formed using a valve metal plate.

An anodic oxide film 7 that becomes a dielectric is formed on the surface of the anode body 5 by anodic oxidation, and on this anodic oxide film 7 is impregnated with a manganese nitrate solution, which is then thermally decomposed to obtain carbon dioxide. A semiconductor layer 8 made of manganese or the like is formed, and a cathode layer 9 made of carbon or the like is provided on this semiconductor layer 8 to constitute a capacitor element 10 .

On the outer periphery of the cathode layer 9 of this capacitor element 10, a cathode terminal 11 is formed in a case shape from a solderable metal.
are bonded via a conductive adhesive 12.

Further, an anode intermediate terminal 14 having positioning protrusions 13 at both ends is coupled to the anode internal lead 6 by welding.
This anode intermediate terminal 14 is fitted into an anode terminal 15 formed in a case shape from the same solderable metal as the cathode terminal 11, and electrically connected between the anode intermediate terminal 14 and the anode terminal 15 using a conductive adhesive 16. , a mechanical connection is made.

Furthermore, the outer periphery of the capacitor element 10 between the cathode terminal 11 and the anode terminal 15 is filled with a heat-resistant resin 17 so as to be flush with both terminals 11.15, in order to fix the capacitor element 10. ing.

The anode intermediate terminal 14 may have a configuration in which positioning protrusions 13 protruding in opposite directions are formed at both ends as shown in FIG. 5, or may be H-shaped as shown in FIG. 6. As shown in FIG. 7, the shape may include L-shaped positioning protrusions 13 that protrude in opposite directions.

Since the solid electrolytic capacitor of the present invention is constructed in this way, the exposed surfaces of the case-shaped anode and cathode terminals are formed on the same plane, and since the exposed surfaces are flat, soldering during assembly is a labor-intensive task. Since the capacitor has a rectangular shape, it can be assembled by vacuum suction and automatically supplied.

Furthermore, since the anode internal lead is firmly fixed inside the anode terminal and there is no solder layer, the structure can be made resistant to mechanical stress and stress caused by soldering heat, and can be highly reliable.

Moreover, according to this configuration, since it can be assembled by the face bonding method, it is easy to integrate it into the hybrid IC board, and it has the advantage that there is no directionality for the integration.
It has great practical value.

[Brief explanation of the drawing]

1 to 3 are perspective views showing a conventional solid electrolytic capacitor, FIG. 4 is a sectional view showing an embodiment of the solid electrolytic capacitor of the present invention, FIG. 5 is an exploded perspective view of the same, and FIG. FIG. 7 is a perspective view of main parts showing another embodiment. 5... Anode body, 6... Anode internal lead, 7... Anodized film, 8... Semiconductor layer, 9... Cathode Layer, 10... Capacitor element, 11... Cathode terminal, 12...
Conductive adhesive, 13...Positioning protrusion, 14.
... Anode intermediate terminal, 15 ... Anode terminal,
16... Conductive adhesive.

Claims (1)

[Scope of utility model registration request] A case-shaped cathode terminal is placed over the cathode layer of a capacitor element, which is constructed by providing an anode body with an anode internal lead, an anodized film, a semiconductor layer, and a cathode layer, via a conductive adhesive, and the anode internal lead is attached to the anode internal lead. A case-shaped anode terminal having the same size as the cathode terminal is connected to the anode terminal so as to form the same plane as the cathode terminal, through an anode intermediate terminal having protrusions on both sides that fit into and position the anode terminal. and a solid electrolytic capacitor, which is connected with a conductive adhesive filled in the anode terminal, and a resin layer is provided on the outer periphery of the capacitor element between the cathode terminal and the anode terminal so as to form the same plane as each terminal. .