JPH0319219Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a chip-type solid electrolytic capacitor.

[Prior Art] As shown in FIG. 4, a conventional chip-type solid electrolytic capacitor 1 has an oxide film formed by anodic oxidation on the surface of an anode body 2 made of sintered metal having a valve action, such as tantalum. , the anode terminal 5 is welded to the anode lead wire 4 of the capacitor element 3 on which a semiconductor layer such as manganese dioxide, a cathode layer made of graphite and conductive silver paste are sequentially formed;
Further, an anode terminal 6 is fixed to the main body of the capacitor element 3 with solder or conductive adhesive silver 7 to form an exterior resin 8, and then both terminals 5 and 6 are bent in a predetermined direction along the surface of the exterior resin 8. It is configured as follows.

[Problems to be solved by the invention] In such a chip-type solid electrolytic capacitor 1, the exterior resin 8 is formed by the transfer molding method, which requires a large number of man-hours and requires less use of the resin. It was becoming inefficient and expensive.

[Means for solving the problem] However, the present invention was devised to provide an inexpensive chip-type solid electrolytic capacitor, and specifically, a capacitor element is built into a metal case, and a part of the metal case is The present invention provides a chip-type solid electrolytic capacitor with a cathode terminal of .

[Example] Hereinafter, a chip type solid electrolytic capacitor according to the present invention will be explained.

First, as shown in FIG. 1, a bottomed cylindrical metal case 10 with one side open is prepared. Although a rectangular cylindrical metal case 10 is shown here, a cylindrical one may also be used. A projecting piece 11 extending outward is integrally formed on a part of the opening edge of the metal case 10.

On the other hand, as shown in FIG. 2, the capacitor element 12 is made by sequentially forming an oxide film, a semiconductor layer, a cathode layer, etc. on the surface of an anode body 14 on which an anode lead wire 13 is implanted, as in the conventional case. In particular, a plate-shaped anode terminal 15 is fixed to the anode lead wire 13 by welding.

Next, as shown in FIG. 3, the main body of the capacitor element 12 is fixed within the metal case 10 with a conductive adhesive 16 such as solder or conductive adhesive silver. Furthermore, by filling the insulating interior resin 17, it is more firmly fixed. Then, the protruding piece 11 of the metal case 10 is bent so as to be flush with the anode terminal 15, and becomes a cathode terminal. In this way, the chip-type solid electrolytic capacitor 18 according to the present invention can be obtained.

Note that it is preferable that the surfaces of the protruding piece 11 of the metal case 10 and the anode terminal 15 be subjected to solder plating treatment.

[Effect] As described above, in the present invention, a capacitor element with an anode terminal is built into a metal case with a part of the cathode terminal, and the main body of the capacitor element is fixed with a conductive adhesive. Furthermore, since the capacitor is configured to be filled with the required amount of interior resin, it is possible to provide a chip-type solid electrolytic capacitor that is easy to manufacture and inexpensive.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a metal case according to the present invention, FIG. 2 is a perspective view showing a capacitor element according to the present invention, FIG. 3 is a sectional view showing a chip-type solid electrolytic capacitor according to the present invention, and FIG. FIG. 4 is a sectional view showing a conventional chip-type solid electrolytic capacitor. In the figure, 10...Metal case, 11...Protrusion piece, 1
2... Capacitor element, 13... Anode leader wire, 1
4... Anode body, 15... Anode terminal, 16... Conductive adhesive, 17... Interior resin, 18... Chip type solid electrolytic capacitor.

Claims (1)

[Scope of utility model registration request] A capacitor element 12 in which an oxide film, a semiconductor layer, a cathode layer, etc. are sequentially formed is placed on an anode body 14 in which an anode lead wire 13 is implanted in a metal case 10 having an opening on one side and a protruding piece 11 on the edge of the opening. , the metal case 10 and the capacitor element 12 are bonded together using a conductive adhesive 16 such as solder or conductive adhesive silver.
The interior resin 17 is filled in the metal case 10, and a plate-shaped anode terminal 15 is attached to the anode lead wire 13.
A chip-type solid electrolytic capacitor characterized in that the protruding piece 11 is bent to be flush with the anode terminal 15 by welding and fixing.