JPS6136921A - Chip-type solid electrolytic condenser and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention provides a chip-type solid electrolytic capacitor with a terminal structure suitable for face bonding (surface connection) for incorporation into a thick film IC circuit board, etc. This type of chip-type capacitor can be roughly divided into those with resin-dipped leads in the same direction and those with resin-molded leads in opposite directions. The former resin-dipped type is
Although it is inexpensive and can easily be used for face bonding by bending the end of the lead wire into an L shape, its external shape makes it unsuitable for automatic attachment by mounting handling. On the other hand, the latter resin mold type is suitable for automatic mounting, but has the problem of high cost. In other words, an expensive mold is required to form the exterior body around the capacitor element using transfer molding, and an external terminal called a frame is fixed to both the anode and cathode, and the terminal is attached after the exterior body is molded. This is because the member must be bent to be suitable for face bonding. Furthermore, since the above-mentioned exterior body is usually formed to have a thickness of about 0.1 to 0.2 mm, it also has the disadvantage that it is likely to have poor external shape.

[Purpose of the Invention] Therefore, the purpose of the present invention is to provide a low-cost chip-type solid electrolytic capacitor that can be automatically attached to a thick film IC circuit board, etc. by mounting handling, and to provide a method for efficiently manufacturing the capacitor. The purpose is to provide a manufacturing method.

[Structure of the Invention] Hereinafter, the present invention will be described in detail with reference to embodiments shown in the accompanying drawings.

FIG. 1 shows a perspective view of the appearance of a chip-type solid electrolytic capacitor 1 according to the present invention, and FIGS. 2 to 5 show the manufacturing process thereof.

First, we will explain the manufacturing process of this capacitor, and then clarify the structural features of the product.

In FIG. 2, 2 is a capacitor element, and this capacitor element 2 is made by sintering metal powder having a valve action such as tantalum or aluminum, and forming an oxide film on the surface of the sintered body by anodic oxidation. This chemically formed sintered body is impregnated with manganese nitrate and fired in an electric furnace to form a solid electrolyte layer made of manganese dioxide.Furthermore, a graphite layer and a silver paste layer are formed on the surface of the solid electrolyte layer. Consists of sequentially laminated layers. The capacitor element 2 is manufactured through the above-mentioned steps, but the processing after sintering is carried out all at once by attaching the hoop material 4 through the anode lead 3 as shown in the figure.

The hoop material 4 is made of, for example, a strip of conductive plated iron material. In this case, the hoop material 4 has a plurality of holding plates 5 arranged in series at predetermined intervals, and each holding plate 5 has a A projecting piece 6 for welding and fixing the anode lead 3 is provided protruding from the center of the free end side. In addition, in this example.

Each holding plate 5 has a rectangular window 7 to facilitate cutting from the hoop material 4 as described later, and a rectangular window 7 along the extension line of both side edges to facilitate bending of the protruding piece 6. A pair of slits 8, 8 are provided.

According to this invention, a rectangular cylindrical sleeve 9 made of synthetic resin is fitted around the capacitor element 2 held on the holding plate 5 of the hoop material 4, and then a conductive electrode serving as a cathode terminal is attached to the bottom of the sleeve 9. The sleeve 9 and the cap member 10 are covered with a conductive, e.g., silver adhesive 1 which is filled in advance in the cap member.
1 is fixed to the bottom of the capacitor element 2 as shown in FIG. Note that, unlike this embodiment, the sleeve 9 and the cap member 10 may be assembled in advance and then the sleeve 9 may be fitted around the capacitor element 2, or in some cases, the sleeve 9 and the cap member 10 may be assembled together. may be integrally molded with a conductive metal plate.

Next, as shown in FIG.
Then, the holding plate 5 is cut, for example, along the lower edge of the window 7 at the location indicated by the chain line in FIG. 12. Then, one end of this anode terminal 12 is bent so as to be distributed within an imaginary plane substantially parallel to the side surface of the sleeve 9 to form a leg piece 13 for soldering (see FIG. 5), and then, A reinforcing member 14 for reinforcing the gap between the capacitor element 2 and the anode terminal plate 12 is formed by filling and solidifying preferably a thixotropic synthetic resin between the anode terminal 12 and the capacitor element 2 and sleeve 9. Form. Note that this reinforcing member 14 may be made of a synthetic resin that hardens at room temperature. According to this embodiment, by bending the projecting piece 6 from the base end of the slits 8 as shown in FIG. Since the tongue pieces 12b and 12c are formed, resin can be filled between the anode terminal 12 and the capacitor element 2 from the notch groove 12a while the capacitor is erected as shown in FIG. . Furthermore, the tongue pieces 12b and 12c serve to hold the filled resin.

[Effects of the Invention] As is clear from the description of the above-mentioned embodiments, according to the present invention, a rectangular cylindrical sleeve made of synthetic resin or the like is fitted around the capacitor element 2, and this sleeve is attached to the exterior body. Since it is used as a method, it can be manufactured at a lower cost than that using a 1-transform mold. Furthermore, since the hoop material used in manufacturing capacitor elements is used as the anode terminal, material costs can be reduced. Furthermore, since it uses a pre-formed square sleeve, there is almost no occurrence of external defects, and
It can also fully support automatic mounting by mounting handling. In addition, according to the manufacturing method according to the present invention =7-, most of the steps are performed while a large number of capacitor elements are held in the hoop material, so that inexpensive chip-type solid electrolytic capacitors can be mass-produced. be able to.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of a chip-type solid electrolytic capacitor according to the present invention, and FIGS. 2 to 5 are drawings showing the manufacturing process of the capacitor, in which FIG. FIG. 3 is an exploded perspective view illustrating the state in which the sleeve and cap member are attached to the capacitor element, FIG. 3 is a sectional view showing the state in which the sleeve and cap member are attached to the capacitor element, and FIG. 4 is the anode terminal. FIG. 5 is a sectional view showing a bent state, and FIG. 5 is a sectional view showing a reinforcing member formed by filling a synthetic resin between an anode terminal and a capacitor element. In the figure, ■ is a chip type solid electrolytic capacitor, 2 is a capacitor element, 3 is an anode lead, and 4 is a hoop material. 5 is a holding plate, 6 is a projecting piece, 9 is a sleeve, 10 is a cap member (cathode terminal), 11 is a conductive adhesive, 12 is an anode terminal, 13 is a leg piece, and 14 is a reinforcing member. Figure 1: Figure 2

Claims (5)

[Claims] (1) A chip-type solid electrolytic capacitor in which an anode terminal plate is fixed to the anode lead of a capacitor element, a cathode terminal plate is connected to the cathode side of the capacitor element, and an exterior body is provided around the capacitor element. In the above, the exterior body consists of a rectangular cylindrical sleeve fitted around the capacitor element, and the cathode terminal plate is
It consists of a cap member formed to cover the bottom of the capacitor element and the bottom of the sleeve, and the sleeve and cap member are fixed to the bottom side of the capacitor element via a conductive adhesive, and the anode terminal plate The leg pieces are bent so as to be distributed in an imaginary plane substantially parallel to the side surface of the sleeve, and a synthetic resin is filled and solidified between the anode terminal plate, the capacitor element, and the sleeve. A chip-type solid electrolytic capacitor characterized by being provided with a reinforcing member. (2) The chip-type solid electrolytic capacitor according to claim (1), wherein the sleeve and the cap member are integrally molded from a conductive metal plate. (3) The chip-type solid electrolytic capacitor according to claim (1), wherein the reinforcing member is made of thixotropic synthetic resin. (4) The chip-type solid electrolytic capacitor according to claim (1), wherein the anode terminal plate is made of a small piece cut from a hoop material. (5) A rectangular cylindrical sleeve whose bottom part is closed with a cap member is fitted around the capacitor element held by the hoop material via the anode lead to form an exterior body, and the sleeve and a cap member is fixed to the bottom of the capacitor element with a conductive adhesive to make the cap member a cathode terminal plate, the hoop material is cut into a predetermined shape to make an anode terminal plate, and a part of the anode terminal plate is A leg piece for soldering is formed by bending the sleeve along an imaginary plane substantially parallel to the side surface thereof, and a thixotropic synthetic resin is filled between the anode terminal plate, the capacitor element, and the sleeve. 1. A method for manufacturing a chip-type solid electrolytic capacitor, characterized by solidifying the solid electrolytic capacitor to form a reinforcing member.