JPS6214673Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a chip-type solid electrolytic capacitor.

Conventional chip type solid electrolytic capacitors are shown in Figure 1~
The one shown in FIG. 5 is generally known.

The chip-type solid electrolytic capacitor shown in Fig. 1 has an anode terminal 3 connected to the protruding lead-in wire 2 of a capacitor element 1, and a cathode terminal 4 connected to the solder layer of the outermost shell, and then transferred to a resin 5.
It is coated with However, the products formed in this manner have the drawbacks of being large in size and shape and being expensive.

In addition, the chip-type solid electrolytic capacitors shown in FIGS. 2, 3, and 4 have a part of the protruding lead-in wire 2 drawn out from the capacitor element 1 that is at least 1.5 mm away from the capacitor element 1, which has a height higher than that of the capacitor element. A tall cylindrical anode terminal 6 is connected, a plate-shaped anode terminal 7 is connected, or a V-shaped anode terminal 8 is connected, and the solder layer on the outermost shell of the capacitor element is used as the cathode terminal. be.

However, in the case of such a structure, attachment to the circuit board can only be achieved on one side, and if the length becomes long, the element must first be temporarily fixed with adhesive before being attached to the anode terminal. However, it was difficult to connect the cathode terminals, and furthermore, the terminals became entangled with each other when they were automatically supplied by a parts feeder or the like.

Furthermore, in the chip-type solid electrolytic capacitor shown in FIG. 5, a metal cap 9 connected to the protruding lead-in wire is placed over the end of the capacitor element 1 on the protruding lead-in wire 2 side to form an anode terminal, and the outermost end of the capacitor element 1 is placed on the opposite end. A metal cap 10 connected to the solder layer of the shell serves as a cathode terminal.

However, such a structure requires high precision when covering the minute capacitor elements with the metal caps 9, 10, which has the drawback of poor mass production and high cost.

In order to improve the above-mentioned shortcomings,
Technical improvements have been made in publications such as No. 53412 and Japanese Patent Application Laid-open No. 56-40231, but they are still not sufficient.

The present invention aims to improve the above-mentioned drawbacks, provide a chip-type solid electrolytic capacitor that can clearly display polarity, enable automatic supply by a parts feeder, etc., and can be made at low cost.

Hereinafter, the present invention will be explained in detail based on the embodiment shown in FIG.

In addition, 11 is an anode element made of metal powder having a valve action, 12 is a metal lead wire for the anode, 13 is a dielectric oxide film, 14 is a manganese dioxide layer, 17 is a cathode electrode layer, 15 is an exterior resin, and 16 is an anode. electrode layer,
18 and 19 are plating electrode layers, and 20 and 21 are solder electrode layers.

In the present invention, a dielectric oxide film 13 is formed on the surface of an anode body having an anode element 11 formed by molding and sintering a valve metal powder such as tantalum into a prismatic or cylindrical shape and an anode metal lead wire made of the same metal. forming a semiconductor layer 14 such as manganese dioxide on the film 13;
A cathode conductor layer 22 is formed, and a resin exterior 15 is formed.
At least the exterior 15 of the element 11 on the surface facing the anode metal lead-out wire 12 is removed to expose the cathode conductor layer 22, and the exterior of the metal lead-out wire 22 and the oxide film layer 13 are sandblasted. Silver or a paste containing a mixture of silver and a conductive metal material is applied at least once to form an anode electrode 16 or a cathode electrode layer 17, and electroless plating is applied thereon and on the metal lead wire 12. A chip-type solid electrolytic capacitor is constructed by composing a conductive layer such as a strainer or solder.

In addition, in the example, the exterior resin 15 to be removed
In addition to the cathode part, the anode electrode part may be removed, and although the resin was removed, this part may be removed and packaged. Electroless plating may be performed on the non-dielectric oxide film portion of the metal lead wire.

In the chip-type solid electrolytic capacitor constructed as described above, the anode metal lead wire made of the same metal as the anode element is cut to leave a length that allows the polarity to be determined, and the protruding portion is further coated with a colored insulating material. ,
Its polarity becomes clear.

Therefore, by providing a metal lead-out wire on the anode part of a chip-type solid electrolytic capacitor, it is possible to stabilize the direction of automatic supply related to the automation trend in recent years, and its application is extremely wide-ranging, and it has industrial value. It is a big thing.

[Brief explanation of drawings]

Figure 1 is a sectional view of a conventional chip-type solid electrolytic capacitor, Figures 2 to 5 are side views of other conventional chip-type solid electrolytic capacitors, and Figure 6 is a cross-sectional view of a chip-type solid electrolytic capacitor of the present invention. FIG. 2 is a cross-sectional view of one embodiment. 11...Anode element, 12...Metal lead wire for anode, 13...Dielectric oxide film, 14...Manganese dioxide layer, 15...Exterior resin layer, 16...Anode electrode layer, 17...Cathode electrode layer , 18, 19... Plated electrode layer, 20, 21... Solder electrode layer, 22...
Cathode conductor layer.

Claims (1)

[Scope of utility model registration request] A metal powder having a valve action, such as tantalum, is molded and sintered together with the same type of anode metal lead-out wire 12 that is to become an anode, or a shaped sintered body of the metal powder and the anode metal lead-out wire 12 are welded. Anode element 11
A dielectric oxide film 13 is formed on the surface of the dielectric, a manganese dioxide layer 14 and a cathode conductor layer 22 of graphite, silver, etc. are formed thereon, the element is packaged 15, and the cathode conductor layer A part of the exterior of the upper part of 22 is removed to form a cathode electrode layer 17 and an anode electrode layer 16 coated with a conductive metal material on the exposed cathode conductor layer 22 and anode metal lead-out wire 12, and then plated thereon. Electrode layers 18 and 19 and solder electrode layers 20 and 21 are formed, and the metal lead wire 12 for the anode is formed.
A chip-type solid electrolytic capacitor characterized by having a protruding anode display electrode.