JPH0317211B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a chip-type solid electrolytic capacitor with a terminal structure suitable for face bonding (surface connection) for incorporation into a thick film IC circuit board, etc. Related to Manufacturing Method [Prior Art] Chip-type capacitors of this type can be broadly classified into those with resin dips in which the leads run in the same direction, and those with resin molds in which the leads run in opposite directions. The former resin dip type is inexpensive and can easily be used for face bonding by bending the end of the lead wire into an L shape, but due to its external shape, it cannot be attached automatically during mounting handling. It is not suitable for On the other hand, the latter resin mold type is suitable for automatic mounting, but has the problem of high cost. In other words, an expensive mold is required to form the exterior body around the capacitor element using transfer molding, and
This is because an external terminal called a frame must be fixed to both the anode and the cathode, and after the exterior body is molded, the terminal member must be bent so as to be suitable for face bonding. Furthermore, since the above-mentioned exterior body is usually formed to have a thickness of about 0.1 to 0.2 mm, it also has the disadvantage that it is susceptible to external defects.

[Object of the Invention] Therefore, the object of the present invention is to provide a low-cost chip-type solid electrolytic capacitor that can be automatically attached to a thick film IC circuit board, etc. by mounting handling, and to efficiently manufacture the capacitor. The purpose is to provide a manufacturing method for.

[Structure of the Invention] Hereinafter, the present invention will be described in detail with reference to embodiments shown in the accompanying drawings.

FIG. 1 illustrates an external perspective view of a chip-type solid electrolytic capacitor 1 according to the present invention, and FIG.
The manufacturing process is shown in the figures. First, we will explain the manufacturing process of this capacitor, and then clarify its structural features.

In Fig. 2, 2 is a capacitor element, and this capacitor element 2 is made by sintering metal powder having a valve action such as tantalum or aluminum, and forming an oxide film on the surface of the sintered body by anodic oxidation. This chemically formed sintered body is impregnated with manganese nitrate and fired in an electric furnace to form a solid electrolyte layer made of manganese dioxide.
It consists of a graphite layer and a silver paste layer laminated in sequence on its surface. The capacitor element 2 is manufactured through the above-mentioned steps, but the processing after sintering is carried out all at once, with the capacitor element 2 being attached side by side to the hoop material 4 via the anode lead 3 as shown in the figure.

The hoop material 4 is made of, for example, a strip of dielectric plated iron material; in this case, the hoop material 4
A plurality of holding plates 5 are arranged in series at predetermined intervals, and a protruding piece 6 for welding and fixing the anode lead 3 is protruded from the center of the free end side of each holding plate 5. It is set up. In this embodiment, each holding plate 5 is provided with a hoop material 4 as described later.
a rectangular window 7 to facilitate cutting from the
In order to facilitate bending of the projecting piece 6, a pair of slits 8, 8 are cut along the extension line of both side edges of the projecting piece 6.
is provided.

According to this invention, a rectangular tube-shaped sleeve 9 made of synthetic resin is fitted around the capacitor element 2 held on the holding plate 5 of the hoop material 4, and then,
A cap member 10 made of a conductive metal plate serving as a cathode terminal is placed on the bottom surface of the cap member 10, and the sleeve 9 and the cap member 10 are bonded with a conductive adhesive 11, for example, a silver adhesive, which is filled in the cap member 10 in advance. It is fixed to the bottom of the capacitor element 2 as shown in FIG. Note that, unlike this example,
The sleeve 9 and the cap member 10 may be assembled in advance and then the sleeve 9 may be fitted around the capacitor element 2.
The cap member 10 and the cap member 10 may be integrally molded from a conductive metal plate.

Next, as shown in FIG.
Bend it so that it is almost perpendicular to the protruding piece 6,
Thereafter, the holding plate 5 is cut, for example, along the lower edge of the window 7 at a location indicated by the chain line in FIG. 2, and this is used as the anode terminal 12 connected to the anode lead 3. Then, one end of this anode terminal 12 is connected to the sleeve 9.
The leg pieces 13 for soldering are bent so as to be distributed in an imaginary plane substantially parallel to the side surfaces of the anode terminal 12 and the sleeve 9. A reinforcing member 14 for reinforcing the gap between the capacitor element 2 and the anode terminal plate 12 is formed by preferably filling and solidifying a thixotropic synthetic resin.
Note that this reinforcing member 14 may be made of a synthetic resin that hardens at room temperature. Further, according to this embodiment, the protruding piece 6
By bending the base ends of the slits 8, 8 as shown in FIG.
Therefore, the resin can be filled between the anode terminal 12 and the capacitor element 2 from the cutout groove 12a with the capacitor erected as shown in FIG. In addition, the tongue pieces 12b, 12c
helps to hold the filled resin.

[Effects of the Invention] As is clear from the description of the embodiments described above, according to the present invention, a rectangular cylindrical sleeve made of synthetic resin or the like is fitted around the capacitor element 2,
Since this sleeve is used as an exterior body, it can be manufactured at a lower cost than one using transfer molding. Furthermore, since the hoop material used in manufacturing capacitor elements is used as the anode terminal, material costs can be reduced. Furthermore, since a pre-formed square sleeve is used, there is almost no occurrence of external defects, and it can be fully adapted to automatic mounting by mounting handling. In addition, according to the manufacturing method according to the present invention, most of the steps are performed while a large number of capacitor elements are held in the hoop material, making it possible to mass-produce inexpensive chip-type solid electrolytic capacitors. .

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of a chip-type solid electrolytic capacitor according to the present invention, and FIGS. 2 to 5 are drawings showing the manufacturing process of the capacitor, in which FIG. FIG. 3 is an exploded perspective view illustrating the state in which the sleeve and cap member are attached to the capacitor element, FIG. 3 is a sectional view showing the state in which the sleeve and cap member are attached to the capacitor element, and FIG. 4 is the anode terminal. FIG. 5 is a sectional view showing a bent state, and FIG. 5 is a sectional view showing a reinforcing member formed by filling a synthetic resin between an anode terminal and a capacitor element. In the figure, 1 is a chip type solid electrolytic capacitor, 2 is a capacitor element, 3 is an anode lead, 4 is a hoop material, 5 is a holding plate, 6 is a protrusion, 9 is a sleeve, 10
1 is a cap member (cathode terminal), 11 is a conductive adhesive, 12 is an anode terminal, 13 is a leg piece, and 14 is a reinforcing member.

Claims (1)

[Claims] 1. A rectangular cylindrical sleeve whose bottom part is closed with a cap member is fitted around the capacitor element held by the hoop material via the anode lead to form an exterior body, and the sleeve and the cap are The cap member is fixed to the bottom of the capacitor element with a conductive adhesive, and the cap member is used as a cathode terminal plate. The hoop material is cut into a predetermined shape to form an anode terminal plate, and a part of the anode terminal plate is attached to the sleeve. A leg piece for soldering is formed by bending it along an imaginary plane approximately parallel to the side surface of the plate, and a thixotropic synthetic resin is filled between the anode terminal plate and the capacitor element and sleeve, and this is solidified. 1. A method for manufacturing a chip-type solid electrolytic capacitor, characterized in that the solid electrolytic capacitor is used as a reinforcing member.