JPH0227558Y2 - - Google Patents

Info

Publication number
JPH0227558Y2
JPH0227558Y2 JP11461184U JP11461184U JPH0227558Y2 JP H0227558 Y2 JPH0227558 Y2 JP H0227558Y2 JP 11461184 U JP11461184 U JP 11461184U JP 11461184 U JP11461184 U JP 11461184U JP H0227558 Y2 JPH0227558 Y2 JP H0227558Y2
Authority
JP
Japan
Prior art keywords
electrolytic capacitor
aluminum electrolytic
base
case
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11461184U
Other languages
Japanese (ja)
Other versions
JPS6130230U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11461184U priority Critical patent/JPS6130230U/en
Publication of JPS6130230U publication Critical patent/JPS6130230U/en
Application granted granted Critical
Publication of JPH0227558Y2 publication Critical patent/JPH0227558Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【考案の詳細な説明】 [考案の技術分野] 本考案はチツプ型アルミ電解コンデンサに係
る。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.

[考案の技術的背景とその問題点] 従来のチツプ型アルミ電解コンデンサの構成は
つぎの如くである。
[Technical background of the invention and its problems] The structure of a conventional chip-type aluminum electrolytic capacitor is as follows.

第2図に示したのは、2つのリード線21,2
2がケース23の同一端面に設けられた円筒形コ
ンデンサを使用して構成したものであり、半田付
可能な金属板により構成されたフレーム24,2
5にそれぞれリード線21,22を電気または超
音波溶接し、全体を熱硬化性樹脂でモールドして
ある。図中26はモールドを示す。
FIG. 2 shows two lead wires 21, 2.
2 is constructed using a cylindrical capacitor provided on the same end surface of the case 23, and frames 24 and 2 are constructed of solderable metal plates.
Lead wires 21 and 22 are electrically or ultrasonically welded to 5, respectively, and the whole is molded with thermosetting resin. In the figure, 26 indicates a mold.

第2図と同一部分には同一符号を付した第3図
はリード線端子反対方向型コンデンサを使用して
構成したものを示す。このチツプ型アルミ電解コ
ンデンサも前図のものとほぼ同様の構造である
が、フレーム25の形状、寸法が前図のものと若
干異なる。
FIG. 3, in which the same parts as in FIG. 2 are denoted by the same reference numerals, shows a structure using a capacitor with lead wire terminals in opposite directions. This chip type aluminum electrolytic capacitor has almost the same structure as the one in the previous figure, but the shape and dimensions of the frame 25 are slightly different from those in the previous figure.

第4図はコンデンサの内部素子を使用して構成
したチツプ型アルミ電解コンデンサを示す。駆動
用電解液を含浸しない状態の内部素子27に微細
な連通孔を有するモールド28を施し、減圧下で
内部素子に駆動用電解液を含浸させ、連通孔を熱
等により封口し、内部素子27の内部端子29,
30をフレーム24,25に溶接し、全体にモー
ルド26を施して構成されている。
FIG. 4 shows a chip-type aluminum electrolytic capacitor constructed using internal elements of a capacitor. A mold 28 having fine communication holes is applied to the internal element 27 which is not impregnated with the driving electrolyte, the internal element is impregnated with the driving electrolyte under reduced pressure, and the communication holes are sealed by heat or the like. internal terminal 29,
30 is welded to frames 24 and 25, and a mold 26 is applied to the entire structure.

第5図に示したのは、駆動用電解液を含浸した
内部素子を使用したチツプ型アルミ電解コンデン
サを示す。内部素子31にその内部端子32を露
出させて紫外線硬化樹脂を塗布し、紫外線を照射
して速やかに硬化させて密封層33を形成し、こ
れを使用してチツプ型アルミ電解コンデンサを構
成している。
FIG. 5 shows a chip-type aluminum electrolytic capacitor using internal elements impregnated with a driving electrolyte. An ultraviolet curable resin is applied to the internal element 31 with its internal terminals 32 exposed, and is rapidly cured by irradiating ultraviolet rays to form a sealing layer 33, which is used to construct a chip-type aluminum electrolytic capacitor. There is.

以上のように、従来のチツプ型アルミ電解コン
デンサは、内部素子に含浸される駆動用電解液が
あるためアルミケースに内部素子を封入したもの
を使用するか、内部素子をいつたんモールド等に
よつておおつた後、さらにモールドするかして構
成されている。そのため、外形寸法がコンデンサ
の容量の割には大きくなる欠点があつた。またリ
ード線とフレームとを溶接する等製造工程が複雑
になり時間を要するのでコスト高となつている。
As mentioned above, in conventional chip-type aluminum electrolytic capacitors, the internal elements are impregnated with a driving electrolyte, so the internal elements are either sealed in an aluminum case or the internal elements are simply molded. After being wrapped and covered, it is further molded. Therefore, there was a drawback that the external dimensions were large compared to the capacitance of the capacitor. Furthermore, the manufacturing process is complicated and time consuming, such as welding the lead wires and the frame, resulting in high costs.

[考案の目的] 本考案は上記の事情に基づきなされたもので、
構造が簡単でしかも製造の容易なチツプ型アルミ
電解コンデンサを得ることを目的としている。
[Purpose of the invention] The invention was created based on the above circumstances.
The object of the present invention is to obtain a chip-type aluminum electrolytic capacitor that has a simple structure and is easy to manufacture.

[考案の概要] 本考案のチツプ型アルミ電解コンデンサは、一
方の面に円筒型アルミ電解コンデンサのケース底
部を係合させる円型凹入部およびこの凹入部周面
に設けられケース下端周面の加締くびれに係合す
るロツク爪を有し凹入部底面にはリード線挿通用
の透孔を有するセラミツク製ベースと、前記透孔
にリード線を挿通し前記凹入部にケース底部を係
合させロツク爪により係止された円筒型アルミ電
解コンデンサと、前記ベースの他方の面に前記透
孔間を連ねる線上に各透孔から最寄りのセラミツ
ク製ベース縁部まで設けられ折曲げられたリード
線を収容する溝とを有することを特徴とする。
[Summary of the invention] The chip-type aluminum electrolytic capacitor of the present invention has a circular recess that engages the bottom of the case of a cylindrical aluminum electrolytic capacitor on one surface, and a cylindrical recess that is provided on the circumferential surface of the recess and that forms a contour on the lower end of the case. A ceramic base has a locking claw that engages with the constriction and a through hole for inserting the lead wire in the bottom of the recess, and the lead wire is inserted into the through hole and the bottom of the case is engaged with the recess and locked. A cylindrical aluminum electrolytic capacitor held by a claw, and a bent lead wire provided on the line connecting the through holes on the other side of the base from each through hole to the nearest edge of the ceramic base are accommodated. It is characterized in that it has a groove.

[考案の実施例] 第1図Aは本考案一実施例を分解状態で示す斜
視図である。この図において1はリード線2,3
を同一端面に有する円筒型アルミ電解コンデンサ
であり、そのケース下端周面には封口用のゴム栓
を加締する際に生じた加締くびれ4が存在する。
ベース5はセラミツク成形体であり、上面に円筒
型アルミ電解コンデンサ1のケース下端を係合さ
せる円型凹入部6と、その周面に設けられ前記加
締くびれ4に係合するロツク爪7とを有する。ま
た凹入部底面にはリード線挿通用の透孔8,9が
設けられている(第1図B,C)。さらにベース
5の下面には透孔8,9を連ねる線上に位置して
各透孔から最寄りのベース縁部におよぶ溝10,
11が設けられている(第1図B,C)。
[Embodiment of the invention] FIG. 1A is a perspective view showing an embodiment of the invention in an exploded state. In this figure, 1 is the lead wire 2, 3
This is a cylindrical aluminum electrolytic capacitor which has a cylindrical aluminum electrolytic capacitor on the same end surface, and there is a tightening constriction 4 on the lower end circumferential surface of the case, which is created when tightening a rubber plug for sealing.
The base 5 is a ceramic molded body, and has a circular recess 6 on its upper surface that engages the lower end of the case of the cylindrical aluminum electrolytic capacitor 1, and a lock pawl 7 provided on its circumferential surface that engages with the caulking constriction 4. has. Further, through holes 8 and 9 for inserting lead wires are provided at the bottom of the recess (FIGS. 1B and 1C). Further, on the lower surface of the base 5, there is a groove 10 located on a line connecting the through holes 8 and 9 and extending from each through hole to the nearest edge of the base.
11 (Fig. 1 B, C).

円筒型アルミ電解コンデンサ1のリード線2,
3をベース5の透孔8,9に挿通し、コンデンサ
1をベース5の凹入部6に押込めば、ロツク爪7
が加締くびれ4に係合し、両者間は結合される。
なおこのときケースのゴム栓部に樹脂を塗布して
おき、結合後硬化させれば前記の両者間は完全に
固着される。
Lead wire 2 of cylindrical aluminum electrolytic capacitor 1,
3 into the through holes 8 and 9 of the base 5, and push the capacitor 1 into the recess 6 of the base 5, the lock claw 7
engages with the caulking constriction 4, and the two are connected.
At this time, if a resin is applied to the rubber plug part of the case and cured after bonding, the two parts will be completely fixed.

その後、各リード線2,3を溝10,11の幅
と深さに対応する幅と厚さに押しつぶし、これを
溝10,11に沿つて折曲げ、ベース5からはみ
出した部分を切断する。
Thereafter, each lead wire 2, 3 is crushed to a width and thickness corresponding to the width and depth of the grooves 10, 11, bent along the grooves 10, 11, and the portion protruding from the base 5 is cut.

なお、リード線2,3の陽、陰極判別のために
は、第1図Aに示すようにケース頂面に印刷等に
よりマーク付するか、ベース5の隅角をセラミツ
ク焼結する前に切り落した後焼結しマーク付す
る。
In order to distinguish between the positive and negative electrodes of the lead wires 2 and 3, mark them by printing on the top of the case as shown in Figure 1A, or cut off the corners of the base 5 before sintering the ceramic. After that, it is sintered and marked.

上記構成の本考案チツプ型アルミ電解コンデン
サは、従来のそれの如く二重構造をとつていない
ので、外形寸法が大きくならない。またリード線
の溶接の必要もなく、モールドの手数もないの
で、製造が簡単であり、コストも低い。
The chip-type aluminum electrolytic capacitor of the present invention having the above structure does not have a double structure unlike conventional capacitors, so its external dimensions do not increase. Furthermore, there is no need to weld lead wires and there is no need for molding, so manufacturing is simple and costs are low.

[考案の効果] 本考案のチツプ型アルミ電解コンデンサは、小
型に構成し得るのみでなく、低価格で供給し得
る。またケース頂面の印刷によるマークまたはベ
ース隅角の切り落しによるマークのいずれか一方
または双方により極性判別が容易になし得るの
で、実装の自動化をはかることができる。
[Effects of the Invention] The chip-type aluminum electrolytic capacitor of the present invention not only can be constructed in a small size, but also can be supplied at a low price. In addition, since the polarity can be easily determined by either or both of the marks printed on the top surface of the case and the marks cut off at the corners of the base, the mounting can be automated.

さらにセラミツクは、熱伝導がよく半田リフロ
ー方式の場合、周囲のセラミツクの温度上昇が早
いのでリード線の半田付着が早く、終了したとき
の冷却が早い。また半田デイツプもベース部分の
みの浸漬なら可能である。
Furthermore, ceramic has good heat conductivity, and in the case of a solder reflow method, the temperature of the surrounding ceramic rises quickly, so the solder adheres to the lead wire quickly and cools down quickly when finished. It is also possible to dip only the base portion of the solder dip.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aは本考案一実施例の分解状態で示す斜
視図、Bは前記実施例を下方より見て示す斜視
図、Cは前記実施例の一部を断面で示した正面
図、第2図〜第5図は従来のチツプ型アルミ電解
コンデンサ4種の模式的斜視図である。 1……円筒型アルミ電解コンデンサ、2,3…
…リード線、4……加締くびれ、5……セラミツ
ク焼結体ベース、6……円型凹入部、7……ロツ
ク爪、8,9……透孔、10,11……溝。
1A is a perspective view showing an exploded state of one embodiment of the present invention; FIG. 1B is a perspective view of the embodiment seen from below; FIG. 1C is a front view showing a part of the embodiment in cross section; 5 are schematic perspective views of four types of conventional chip-type aluminum electrolytic capacitors. 1... Cylindrical aluminum electrolytic capacitor, 2, 3...
... Lead wire, 4 ... Caulking constriction, 5 ... Ceramic sintered body base, 6 ... Circular recess, 7 ... Lock pawl, 8, 9 ... Through hole, 10, 11 ... Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に円筒型アルミ電解コンデンサのケー
ス底部を係合させる円型凹入部およびこの凹入部
周面に設けられケース下端周面の加締くびれに係
合するロツク爪を有し凹入部底面にはリード線挿
通用の透孔を有するセラミツク焼結体からなるベ
ースと、前記透孔にリード線を挿通し前記凹入部
にケース底部を係合させロツク爪により係止され
た円筒型アルミ電解コンデンサと、前記ベースの
他方の面に前記透孔間を連ねる線上に各透孔から
最寄りのベース縁部まで設けられ折曲げられたリ
ード線を収容する溝とを有することを特徴とする
チツプ型アルミ電解コンデンサ。
One side has a circular recess that engages the bottom of the case of a cylindrical aluminum electrolytic capacitor, and a locking claw that is provided on the circumference of this recess and engages with the caulking constriction on the lower end of the case. The cylindrical aluminum electrolytic capacitor includes a base made of a ceramic sintered body having a through hole for inserting a lead wire, and a cylindrical aluminum electrolytic capacitor in which the lead wire is inserted into the through hole, the bottom of the case is engaged with the recessed part, and the capacitor is locked by a locking claw. and a groove for accommodating a bent lead wire, which is provided on the other surface of the base on a line connecting the through holes from each through hole to the nearest edge of the base. Electrolytic capacitor.
JP11461184U 1984-07-26 1984-07-26 Chip type aluminum electrolytic capacitor Granted JPS6130230U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11461184U JPS6130230U (en) 1984-07-26 1984-07-26 Chip type aluminum electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11461184U JPS6130230U (en) 1984-07-26 1984-07-26 Chip type aluminum electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPS6130230U JPS6130230U (en) 1986-02-24
JPH0227558Y2 true JPH0227558Y2 (en) 1990-07-25

Family

ID=30673623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11461184U Granted JPS6130230U (en) 1984-07-26 1984-07-26 Chip type aluminum electrolytic capacitor

Country Status (1)

Country Link
JP (1) JPS6130230U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202888A (en) * 1987-02-13 1988-08-22 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Electric source circuit for el panel
CN103779085B (en) * 2012-10-19 2017-03-01 尼吉康株式会社 Solid electrolytic capacitor

Also Published As

Publication number Publication date
JPS6130230U (en) 1986-02-24

Similar Documents

Publication Publication Date Title
JPH0214196Y2 (en)
JPH0227558Y2 (en)
JPH0310663Y2 (en)
JPS6183025U (en)
JPS6183024U (en)
JPH0220820Y2 (en)
JPH0115166Y2 (en)
JPS5934123Y2 (en) solid electrolytic capacitor
JPS593571Y2 (en) chip type capacitor
JPH0220822Y2 (en)
JPS5943723Y2 (en) Chip solid electrolytic capacitor
JPH0230828Y2 (en)
JPH0244510Y2 (en)
JPH0316274Y2 (en)
JPS6350844Y2 (en)
JPS6225879Y2 (en)
JPH0227559Y2 (en)
JPS5832260Y2 (en) solid electrolytic capacitor
JPH0751791Y2 (en) Electric double layer capacitor
JPH0220821Y2 (en)
JPS607469Y2 (en) Chip solid electrolytic capacitor
JPH0113414Y2 (en)
JPS5927054Y2 (en) Chip type solid electrolytic capacitor
JPH0314039Y2 (en)
JPS638108Y2 (en)