JPS638108Y2 - - Google Patents
Info
- Publication number
- JPS638108Y2 JPS638108Y2 JP16280682U JP16280682U JPS638108Y2 JP S638108 Y2 JPS638108 Y2 JP S638108Y2 JP 16280682 U JP16280682 U JP 16280682U JP 16280682 U JP16280682 U JP 16280682U JP S638108 Y2 JPS638108 Y2 JP S638108Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- chip
- frame
- electrical component
- type electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案は、チツプ型電気部品の電極構造に関す
るものである。[Detailed Description of the Invention] The present invention relates to an electrode structure for a chip-type electrical component.
従来のチツプ型電気部品は第１図に示すように
電気部品本体１１の両側にキヤツプ状の電極１２
を設けたもの（従来例１）、または第２図に示す
ように電気部品２１の両側にＬ字型の電極２２を
設けたもの（従来例２）がある。 As shown in FIG. 1, a conventional chip-type electric component has cap-shaped electrodes 12 on both sides of an electric component body 11.
(Conventional Example 1), or as shown in FIG. 2, there are L-shaped electrodes 22 on both sides of the electrical component 21 (Conventional Example 2).
従来例１のチツプ型電気部品においては、両電
極１２のプリント配線基板の導体箔への半田付性
は好ましいが、同部品の製造にあたつては両電極
１２の本体１１部分を個々に樹脂外装しなければ
ならず作業性が好ましくないという欠点がある。 In the chip-type electric component of Conventional Example 1, the solderability of both electrodes 12 to the conductor foil of the printed wiring board is favorable, but when manufacturing the component, the body 11 of each electrode 12 is individually molded with resin. It has the disadvantage that it must be packaged externally, making workability unfavorable.
一方、従来例２のチツプ型電気部品においては
図示省略の電極フレームを使用してトランスフア
モールドや注型によつて大量の生産ができる点で
は好ましいが、ハンダデイツプ時にいずれか一方
の電極２２に「カゲ」が生じ、半田付性が悪化す
るという欠点がある。 On the other hand, the chip-type electrical component of Conventional Example 2 is preferable in that it can be produced in large quantities by transfer molding or casting using an electrode frame (not shown), but when soldering, one of the electrodes 22 is There is a disadvantage that "shading" occurs and solderability deteriorates.
しかるに、本考案はいかなる半田方式において
も良好な半田付性が得られ、量産性の優れた電極
構造を有するチツプ型電気部品を提供するもので
あり、以下第３図乃至第５図にもとづいて本考案
の実施例を示す。 However, the present invention provides a chip-type electrical component that can obtain good solderability using any soldering method and has an electrode structure that is suitable for mass production. An example of the present invention will be shown.
第３図に示すように、本考案に係るチツプ型電
気部品３０は角型である。電極３１は同部品３０
の相対向する両隅部に設けられ、Ｌ字状板３１ａ
と、Ｌ字状板３１ａの両側開放端を封口する側板
３１ｂとからなる。このようなチツプ型電気部品
３０は第４図または第５図に示すような電極フレ
ーム４０，５０を使用することによつて容易に大
量生産することができる。 As shown in FIG. 3, the chip-type electric component 30 according to the present invention has a square shape. Electrode 31 is the same part 30
L-shaped plates 31a are provided at opposite corners of the
and side plates 31b that seal both open ends of the L-shaped plate 31a. Such a chip-type electric component 30 can be easily mass-produced by using electrode frames 40, 50 as shown in FIG. 4 or 5.
第４図の電極フレーム４０は相対向するフレー
ム枠４１に対して十字型の電極３１を一体に形成
したものであり、また第５図の電極フレーム５０
はフレーム枠５１に対してＴ字型の電極３１を一
体に形成したものである。電極フレーム４０，５
０は銅板または、鉄板などに半田メツキしたもの
からなる。このような電極フレーム４０，５０を
使用し、コンデンサ素子、半導体素子などのチツ
プ素子を両電極３１，３１間に実装し、チツプ素
子を樹脂外装４２，５２し、電極３１をフレーム
枠体４１，５１から切断し、折曲げることによ
り、チツプ型電気部品３０を得ることができる。 The electrode frame 40 in FIG. 4 has a cross-shaped electrode 31 integrally formed with a frame 41 facing oppositely, and the electrode frame 50 in FIG.
In this example, a T-shaped electrode 31 is integrally formed with a frame 51. Electrode frame 40,5
0 is made of a copper plate or iron plate soldered. Using such electrode frames 40, 50, a chip element such as a capacitor element or a semiconductor element is mounted between both electrodes 31, 31, the chip element is covered with resin 42, 52, and the electrode 31 is mounted on the frame body 41, By cutting from 51 and bending it, the chip-type electrical component 30 can be obtained.
以上にて述べた本考案によると、電極構造をＬ
字状板と、Ｌ字状板の両側開放端を封口する側板
とから構成したため、チツプ型電気部品の量産性
を損うことなく、電極に対する半田付性の向上を
はかることができるものである。 According to the present invention described above, the electrode structure is
Since it is composed of a L-shaped plate and side plates that seal both open ends of the L-shaped plate, it is possible to improve the solderability to electrodes without impairing the mass production of chip-type electrical components. .
第１図および第２図は従来のチツプ型電気部品
を示す図、第３図は本考案に係るチツプ型電気部
品を示す図、第４図および第５図は本考案におい
て使用される電極フレームを示す図である。
図中、３０……チツプ型電気部品、３１……電
極、３１ａ……Ｌ字状板、３１ｂ……側板、４
０，５０……電極フレーム、４１，５１……フレ
ーム枠体。
1 and 2 are diagrams showing a conventional chip-type electrical component, FIG. 3 is a diagram showing a chip-type electrical component according to the present invention, and FIGS. 4 and 5 are diagrams showing an electrode frame used in the present invention. FIG. In the figure, 30... Chip type electrical component, 31... Electrode, 31a... L-shaped plate, 31b... Side plate, 4
0, 50... electrode frame, 41, 51... frame frame body.
Claims (1)
隅部にＬ字状板とＬ字状板の両側開放端を封口す
る側板とからなる電極を形成してなるチツプ型電
気部品。 A square chip-type electrical component, in which electrodes are formed at opposing corners, each consisting of an L-shaped plate and side plates sealing both open ends of the L-shaped plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16280682U JPS5967921U (en) | 1982-10-27 | 1982-10-27 | Chip type electrical parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16280682U JPS5967921U (en) | 1982-10-27 | 1982-10-27 | Chip type electrical parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5967921U JPS5967921U (en) | 1984-05-08 |
| JPS638108Y2 true JPS638108Y2 (en) | 1988-03-10 |
Family
ID=30357410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16280682U Granted JPS5967921U (en) | 1982-10-27 | 1982-10-27 | Chip type electrical parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5967921U (en) |
-
1982
- 1982-10-27 JP JP16280682U patent/JPS5967921U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5967921U (en) | 1984-05-08 |
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