JPS6011650Y2 - electronic circuit equipment - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to high power electronic circuit devices.

In conventional electronic circuit devices that handle high power, a hermetic high power device is generally used as the high power device, and this is mounted on a printed board together with other circuit components, such as a hybrid integrated circuit, to form an electronic circuit. Ta.

However, in such a structure, the output terminal is located on the side opposite to the metal cap of the hermetic type electronic element, so the output terminal is located on the side opposite to the printed board on which the high power element is mounted. In addition, an envelope was required to protect the hermetic high-power elements, making it difficult to make electronic circuit devices smaller, thinner, and lighter. .

An object of the present invention is to provide an electronic circuit device that is small and lightweight and handles large amounts of power.

In the present invention, a resin-sealed high-power semiconductor element is attached to the bottom of a metal envelope having an opening, with its connecting terminals facing the opening of the metal envelope, and together with the high-power element. Similarly, the hybrid integrated circuit constituting the power circuit is attached with its connection terminal facing the opening, the hybrid integrated circuit is covered and protected with an elastic resin, and then an injection resin is injected through the opening. At least a portion of the high power device and the hybrid integrated circuit are covered and sealed within the metal envelope.

□Examples of the present invention will be described below with reference to the drawings.

In FIGS. 1 and 2, reference numeral 1 denotes a high-power resin-sealed semiconductor element having metal output terminals 1a to 1c and fixed with resin 1d.

Reference numeral 12 denotes a metal envelope in the shape of a box having an opening 12a, and a bottom portion 12b containing the shape of the high-power semiconductor element and hybrid integrated circuit to be attached thereto. Steps are provided as appropriate depending on size, size, etc.

The high-power resin-sealed semiconductor device 1 is electrically insulated and fixed to the high step of the bottom 12b with an adhesive or screws via a heat conductive insulator 2 such as a ceramic substrate or a mica plate, and the output terminal 1a 1c is arranged to face the opening 12a.

3 is a hybrid integrated circuit in which a conductor 4 and a resistor 5 are formed on a substrate 3a by printing or other means, and semiconductor elements 6, 3 are formed by soldering or the like.
Capacitor 7 etc. are installed and connected.

In the hybrid integrated circuit 3, a substrate 3a is attached to a metal envelope 1 with an adhesive or the like.
It is fixed to the low step part of the bottom part 12b of 2.

The hybrid integrated circuit 3 is further entirely or partially covered with a gel-like elastic resin 10 to particularly protect the circuit elements 6 and 7.

The output terminals 8a to 8d of the hybrid integrated circuit 3 are also high power semiconductors 1.
It extends so as to face the opening 12a on the same side as the output terminals 1a to 1c.

Next, injection resin 11 is inserted into the envelope/12 through the opening 12a so as to cover part or all of the resin-sealed high-power semiconductor element 1 and further cover the hybrid integrated circuit 3 via the elastic resin 10. Inject it inside and harden.

Note that the resin 11 does not need to completely cover the sealing resin 1d of the high-power semiconductor element 1, and the head of the sealing resin 1d may be exposed; The resin 1d and the output terminals 1a to IC
It is necessary to completely cover the boundary with the injected resin 11.

After the injected resin 11 has hardened, the output terminals 1a to 1c of the high power semiconductor device 1 and the output terminals 8a to 8 of the hybrid integrated circuit 3 are connected.
c are respectively connected by printed board wiring 9 or the like.

Further, the connections between these output terminals 1a to 1c and 8a to 8c may be made before the resin 11 is injected, and the connection portions may be buried in the resin 11.

Note that the unconnected output terminal 8d is for connection to an external circuit.

The injection resin 11 has better adhesion to other materials with which it comes into contact than the molding resin used for resin sealing.

Therefore, even if the adhesion and airtightness between the resin 1d and the output terminals 1a to 1c are insufficient, the injection resin 1
1 can compensate for insufficient airtightness.

Furthermore, the injection resin 11 also maintains the airtightness of the hybrid integrated circuit 3.

In the present invention, as described above, one metal envelope 1
The resin-sealed high-power semiconductor element 1 and the hybrid integrated circuit 3 are fixed to the bottom 12b of the high-power semiconductor element 1, and particularly covers the boundary between the output terminals 1a to 1c of the high-power semiconductor element 1 and the resin 1d, and also covers the hybrid integrated circuit 3. As shown in FIG.
Since the injection is injected through the opening 12a and the opening 12a is completely sealed, it has excellent airtightness between the electronic circuit containing the high-power semiconductor element 1 sealed inside and the outside, and is free from the effects of changes in environmental conditions. can be prevented.

Furthermore, since the high power semiconductor device 1 and the mixed power collecting circuit 3 are mounted so that their respective connection terminals face the opening 12a of the metal envelope 12, wiring between them is simple and easy. Therefore, it is possible to create a small and compact electronic circuit device.

Furthermore, since the high power semiconductor element 1 is in contact with the metal envelope 12 without using the injection resin, the heat dissipation effect of the high power semiconductor element 1 can be increased.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of the electronic circuit device of the present invention, and FIG. 2 is a horizontal sectional view. 1... High power semiconductor element, 3... Hybrid integrated circuit, 10... Elastic resin, 11...
- Injection resin, 12...Metal envelope.

Claims (1)

[Scope of utility model registration request] A hybrid integrated circuit composed of a resin-sealed high-power semiconductor and a wiring board is attached to the bottom of a metal envelope having an opening, with each connection terminal number facing the opening, and the hybrid integrated circuit is sealed with an elastic resin. an electronic circuit device in which at least a part of the resin-sealed high-power semiconductor and the hybrid integrated circuit are sealed, and a resin is injected through the opening and sealed;