JP2002110121A - Battery pack - Google Patents
Battery packInfo
- Publication number
- JP2002110121A JP2002110121A JP2000292974A JP2000292974A JP2002110121A JP 2002110121 A JP2002110121 A JP 2002110121A JP 2000292974 A JP2000292974 A JP 2000292974A JP 2000292974 A JP2000292974 A JP 2000292974A JP 2002110121 A JP2002110121 A JP 2002110121A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- battery
- circuit board
- protection circuit
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Battery Mounting, Suspending (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電池本体と保護回路
とを一体に電池ケースに収容した電池パックに関する。The present invention relates to a battery pack in which a battery body and a protection circuit are integrally housed in a battery case.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】この種
の電池パックとして、図５及び図６に示す構造が知られ
ている。これは、薄い箱形をなす２つ割状の電池ケース
１内に、発電要素を収容した電池本体２と、回路基板３
に複数の電子部品４を実装して構成した保護回路５とを
収容して構成されている。保護回路５は電池本体２の端
面に沿うように設けられてできるだけ薄型でコンパクト
な形状となるように配置されている。2. Description of the Related Art The structure shown in FIGS. 5 and 6 is known as this type of battery pack. This is because a battery case 2 containing a power generation element and a circuit board 3
And a protection circuit 5 configured by mounting a plurality of electronic components 4 therein. The protection circuit 5 is provided along the end face of the battery body 2 and is arranged so as to be as thin and compact as possible.
【０００３】ここで、保護回路５の回路基板３に実装さ
れている電子部品４は様々な高さを有している。このた
め、仮に、これを電池本体２の端面に直接に接触させる
とすると、組み立て時や保護回路５に外力が作用したと
きに、最も背が高い電子部品４だけが電池本体２の端面
に接触してしまうため回路基板３に無用な応力が作用し
て破損のおそれがある。このため、従来は、図６に示す
ように、電池ケース１に回路基板３を支持するためのリ
ブ６を設け、このリブ６にて回路基板３を受けて電子部
品４が電池本体２に接触しないように浮かせて支持する
ようにしている。なお、電池本体２と保護回路５との間
には、万一、回路基板３が撓んでも電子部品４が電池本
体２に接触しないように、絶縁シート７を配置してい
る。Here, the electronic components 4 mounted on the circuit board 3 of the protection circuit 5 have various heights. For this reason, if this is to be brought into direct contact with the end face of the battery body 2, only the tallest electronic component 4 contacts the end face of the battery body 2 at the time of assembly or when an external force acts on the protection circuit 5. As a result, unnecessary stress acts on the circuit board 3, and there is a risk of breakage. For this reason, conventionally, as shown in FIG. 6, a rib 6 for supporting the circuit board 3 is provided on the battery case 1, and the electronic component 4 contacts the battery body 2 by receiving the circuit board 3 with the rib 6. I try not to float it and support it. An insulating sheet 7 is arranged between the battery body 2 and the protection circuit 5 so that the electronic component 4 does not contact the battery body 2 even if the circuit board 3 is bent.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記構
成では、仮に回路基板３に大きな力が作用し、これがリ
ブ６から外れてしまうと回路基板３に応力が作用して部
品の破損に至ることがあり、組み立て工程を極めて慎重
に行わねばならないという問題があった。また、電池ケ
ース１にリブ６を成型しなくてはならないから、そのリ
ブ６の厚さ分だけ電池ケース１の寸法が大きくなり、ま
た、電池ケース１の外面にいわゆるヒケが生じて外面の
見栄えが悪くなるという問題があった。However, in the above configuration, if a large force acts on the circuit board 3 and the circuit board 3 comes off the ribs 6, a stress acts on the circuit board 3 and the components may be damaged. There was a problem that the assembly process had to be performed very carefully. In addition, since the ribs 6 must be formed on the battery case 1, the dimensions of the battery case 1 are increased by the thickness of the ribs 6, and so-called sink marks are formed on the outer surface of the battery case 1 to improve the appearance of the outer surface. There was a problem that became worse.
【０００５】そこで、本発明は、回路基板に応力が作用
して保護回路の破損に至ることを防止でき、しかも、全
体を小型化することもできる電池パックを提供すること
を目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a battery pack which can prevent the protection circuit from being damaged due to the stress acting on the circuit board, and which can be downsized as a whole.
【０００６】[0006]
【課題を解決するための手段】請求項１に係る発明は、
発電要素を収容した電池本体と、回路基板に電子部品を
実装して構成した保護回路とを電池ケースに収容してな
るものにおいて、前記保護回路に、表面に平坦面を形成
して電子部品をモールドするモールド樹脂層を形成し、
そのモールド樹脂層の平坦面を電池本体の平坦面に接触
させた状態で電池ケースに収容する構成に特徴を有す
る。The invention according to claim 1 is
A battery body containing a power generation element and a protection circuit configured by mounting electronic components on a circuit board are stored in a battery case. In the protection circuit, a flat surface is formed on the surface to form an electronic component. Form a mold resin layer to mold,
It is characterized in that the mold resin layer is housed in the battery case in a state where the flat surface of the mold resin layer is in contact with the flat surface of the battery body.
【０００７】請求項２に係る発明は、集積回路のベアチ
ップを回路基板に実装したところに特徴を有する。ま
た、請求項３の発明は、回路基板の端部にモールド樹脂
層を形成しない樹脂層非形成部を設け、その樹脂層非形
成部の回路基板に電池本体からのリードを接続するため
の電池端子を設けたところに特徴を有する。請求項４の
発明は、請求項１〜３の発明において、モールド樹脂層
を、回路基板上に電子部品を埋め込むように熱硬化性樹
脂を流し込み、その熱硬化性樹脂の上面に成形型を宛が
った状態で硬化させて平坦面を形成したところに特徴を
有するものである。The invention according to claim 2 is characterized in that a bare chip of an integrated circuit is mounted on a circuit board. According to a third aspect of the present invention, there is provided a battery for providing a non-resin layer-free portion on which no mold resin layer is formed at an end of a circuit board, and connecting a lead from a battery body to the circuit board on the non-resin layer-forming portion. The feature is that the terminal is provided. According to a fourth aspect of the present invention, in the first to third aspects of the present invention, a thermosetting resin is poured into the mold resin layer so as to embed an electronic component on a circuit board, and a molding die is applied to an upper surface of the thermosetting resin. It is characterized in that it is cured in a crooked state to form a flat surface.
【０００８】[0008]
【発明の作用及び効果】請求項１の発明によれば、保護
回路の回路基板に表面を平坦面としたモールド樹脂層を
形成し、その平坦面を電池本体に接触させている。この
ため、保護回路の回路基板に外力が作用して保護回路が
電池本体に押し付けられると、モールド樹脂層の平坦面
が電池本体の平坦面に押し付けられるようになる。この
結果、保護回路に作用した外力はモールド樹脂層の平坦
面全域で受け止められることになり、回路基板に無用な
応力が作用することがなく、そこに実装した電子部品が
破損することはない。また、モールド樹脂層によって回
路が絶縁されるから、従来、電池本体との間に必要とし
ていた絶縁紙も不要となり、一層、小型化を図ることが
できる。According to the first aspect of the present invention, a mold resin layer having a flat surface is formed on the circuit board of the protection circuit, and the flat surface is brought into contact with the battery body. Therefore, when an external force acts on the circuit board of the protection circuit and the protection circuit is pressed against the battery body, the flat surface of the mold resin layer is pressed against the flat surface of the battery body. As a result, the external force acting on the protection circuit is received over the entire flat surface of the mold resin layer, so that unnecessary stress does not act on the circuit board, and the electronic components mounted thereon are not damaged. Further, since the circuit is insulated by the mold resin layer, insulating paper conventionally required between the circuit and the battery body is not required, and the size can be further reduced.
【０００９】請求項２の発明によれば、回路基板には集
積回路のベアチップを実装しているから保護回路を一層
小型化することができ、しかもモールド樹脂層によって
ベアチップの保護を確実に行うことができる。そして、
請求項３の発明によれば、回路基板の端部に樹脂層非形
成部を設け、ここに電池本体からのリードを接続するた
めの端子を設けているから、モールド樹脂層の厚さ分に
相当する空間が回路基板の端部に形成され、ここを利用
して電池本体との接続を行うことができ、一層の小型化
が可能となる。なお、この樹脂層非形成部は、回路基板
の両端部のうちの少なくとも一方の端部のみに形成して
もよい。According to the second aspect of the present invention, since the bare chip of the integrated circuit is mounted on the circuit board, the size of the protection circuit can be further reduced, and the bare chip can be reliably protected by the mold resin layer. Can be. And
According to the third aspect of the present invention, the resin layer non-formed portion is provided at the end of the circuit board, and the terminal for connecting the lead from the battery body is provided here. A corresponding space is formed at the end of the circuit board, which can be used for connection with the battery body, and further downsizing can be achieved. Note that the resin layer non-formed portion may be formed only on at least one end of both ends of the circuit board.
【００１０】また、請求項４の発明によれば、回路基板
の上に流し込んだ熱硬化性樹脂を成形型を宛がった状態
で硬化させるから、成形型の平坦面を利用してモールド
樹脂層の表面に高精度な平坦面を形成することができ
る。According to the fourth aspect of the present invention, the thermosetting resin poured onto the circuit board is cured in a state in which the molding die is addressed. A highly accurate flat surface can be formed on the surface of the layer.
【００１１】[0011]
【発明の実施の形態】本発明を携帯電話用の電池パック
に適用した一実施形態について図面を参照して説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment in which the present invention is applied to a battery pack for a portable telephone will be described with reference to the drawings.
【００１２】図１は本実施形態に係る電池パック１０の
外観を示すものであり、扁平な直方体形状をなす電池ケ
ース１１内に電池本体２０と保護回路３０とを収容した
構成である（図２参照）。この電池ケース１１はプラス
チック製であって厚さ方向に２分割されており、上面に
外部接続のための３つの端子窓１２が並んで形成されて
いる。その内部に収容された電池本体２０は、やはり平
坦面から構成された扁平な直方体形状をなしており、例
えばリチウムイオンタイプの発電要素をアルミニウム製
の電池缶内に密閉して構成されている。FIG. 1 shows the external appearance of a battery pack 10 according to the present embodiment, in which a battery main body 20 and a protection circuit 30 are housed in a flat rectangular parallelepiped battery case 11 (FIG. 2). reference). The battery case 11 is made of plastic and is divided into two parts in the thickness direction. Three terminal windows 12 for external connection are formed side by side on the upper surface. The battery body 20 accommodated therein has a flat rectangular parallelepiped shape also formed of a flat surface. For example, a lithium ion type power generating element is hermetically sealed in an aluminum battery can.
【００１３】保護回路３０は、図２に示すように、回路
基板３１の一方の面に複数個の電子部品３２を実装して
なり、その反対側の面に外部接続用の例えば３個の外部
端子３３が形成されている。この外部端子３３は前記電
池ケース１１の端子窓１２から外部に露出し、この電池
パック１０が携帯電話機に装着されたときに、携帯電話
機側の端子が上記外部端子３３に接触する。なお、電子
部品３２のうちの一部は集積回路のベアチップ３２Ａが
含まれ、これが回路基板３１に直接に接続されている。As shown in FIG. 2, the protection circuit 30 has a plurality of electronic components 32 mounted on one surface of a circuit board 31 and, for example, three external components for external connection on the opposite surface. A terminal 33 is formed. The external terminal 33 is exposed to the outside from the terminal window 12 of the battery case 11, and when the battery pack 10 is mounted on the mobile phone, the terminal on the mobile phone contacts the external terminal 33. A part of the electronic component 32 includes a bare chip 32A of an integrated circuit, which is directly connected to the circuit board 31.
【００１４】さて、上記回路基板３１のうち外部端子と
反対側の面には、電子部品３２群を埋め込むモールド樹
脂層３４が形成されている。これは次のようにして形成
されたものである。電子部品３２群を実装して上記回路
基板３１を多数個取りできるようにしたプリント基板４
０を電子部品３２群を上にして設置し、図４（Ａ）に示
すように、その上にプリント基板４０の周縁を囲む枠状
の成形型４１を配置する。そして、成形型４１内に例え
ば熱硬化性樹脂であるエポキシ樹脂４２を流し込み（同
図（Ｂ））、次いで成形型４１の開放上面を下面が平坦
になっている押さえ型４３により閉じる（同図
（Ｃ））。これによりエポキシ樹脂４２の上面を押さえ
型４３によって密着して押さえ込んだ形になり、その状
態でエポキシ樹脂４２が硬化してモールド樹脂層３４が
形成される。そこで、両型４１，４３を開放すれば（同
図（Ｄ））、モールド樹脂層３４の上面は押さえ型４３
の下面によって平坦面３４Ａとされる。次に、例えばダ
イシングソーによりモールド樹脂層３４を回路基板３１
と共に分断すれば（同図（Ｅ））、多数の保護回路３０
が得られる。なお、上記保護回路３０の回路基板３１の
左右両端部にはモールド樹脂層３４を形成しない樹脂層
非形成部３５が設けられ、その一方の樹脂層非形成部３
５（図２中、右側端部）の回路基板３１にはモールド樹
脂層３４を形成した側の面（下面）に電池端子３６が形
成され、他方の樹脂層非形成部３５（同図中、左側端
部）の回路基板３１にはモールド樹脂層３４を形成した
側とは反対側の面（上面）に他方の電池端子（図示せ
ず）が形成されている。On the surface of the circuit board 31 opposite to the external terminals, a mold resin layer 34 for embedding the electronic components 32 is formed. This is formed as follows. Printed circuit board 4 on which a plurality of circuit boards 31 are mounted by mounting electronic components 32
0 is placed with the electronic component 32 group facing upward, and a frame-shaped forming die 41 surrounding the periphery of the printed circuit board 40 is disposed thereon as shown in FIG. Then, for example, an epoxy resin 42, which is a thermosetting resin, is poured into the molding die 41 ((B) in the figure), and then the open upper surface of the molding die 41 is closed by a pressing die 43 having a flat lower surface (FIG. 3B). (C)). As a result, the upper surface of the epoxy resin 42 is brought into close contact with the pressing die 43 and pressed down. In this state, the epoxy resin 42 is cured to form the mold resin layer 34. Therefore, if both dies 41 and 43 are opened (FIG. 3D), the upper surface of the mold resin layer 34 is
Is a flat surface 34A. Next, the mold resin layer 34 is formed on the circuit board 31 by, for example, a dicing saw.
(E in the figure), a large number of protection circuits 30
Is obtained. In addition, a resin layer non-forming portion 35 on which the mold resin layer 34 is not formed is provided at both left and right end portions of the circuit board 31 of the protection circuit 30, and one of the resin layer non-forming portions 3 is provided.
5 (the right end in FIG. 2), the battery terminal 36 is formed on the surface (lower surface) on the side on which the mold resin layer 34 is formed, and the other resin layer non-formed portion 35 (in FIG. The other battery terminal (not shown) is formed on the surface (upper surface) of the circuit board 31 on the left side (left end) opposite to the side on which the mold resin layer 34 is formed.
【００１５】このような構成の保護回路３０は、そのモ
ールド樹脂層３４の平坦面３４Ａを電池本体２０の端面
に接触させて重ねられ、その状態で電池ケース１１内に
収容されている。また、回路基板３１の電池端子３６に
は電池本体２０の下面側から延設されたリード線２１が
溶接され、他方の電池端子には電池本体２０の上面側か
ら延設されたリード線２２が溶接されている。The protection circuit 30 having such a configuration is stacked with the flat surface 34A of the molding resin layer 34 in contact with the end surface of the battery body 20, and is housed in the battery case 11 in that state. A lead wire 21 extending from the lower surface of the battery body 20 is welded to the battery terminal 36 of the circuit board 31, and a lead wire 22 extending from the upper surface of the battery body 20 is welded to the other battery terminal. Welded.
【００１６】上記構成の本実施形態によれば、携帯電話
機に電池パック１０を装着すると、電池パック１０の外
部端子３３に携帯電話機の端子が押し当てられ、外部端
子３３を介して保護回路３０に局部的な外力が作用する
ことがある。また、電池パック１０の組み立て時に、保
護回路３０を電池本体２０の端面に押し付けて電池ケー
ス１１内に収容するから、保護回路３０に局部的な外力
が作用することがある。本実施形態では、このような外
力が作用しても保護回路３０のモールド樹脂層３４の平
坦面３４Ａが電池本体２０の端面に全域が接触している
から、その平坦面３４Ａ全域が電池本体２０の端面に押
し付けられる。この結果、保護回路３０に作用した外力
は電池本体２０の端面全域で受け止められることにな
り、回路基板３１に局部的な応力が作用することがな
く、そこに実装した電子部品３２が破損することを確実
に防止できる。According to the present embodiment having the above structure, when the battery pack 10 is mounted on the mobile phone, the terminal of the mobile phone is pressed against the external terminal 33 of the battery pack 10 and the protection circuit 30 is connected to the protection circuit 30 via the external terminal 33. Local external forces may act. In addition, when assembling the battery pack 10, the protection circuit 30 is pressed against the end face of the battery body 20 and housed in the battery case 11, so that a local external force may act on the protection circuit 30. In the present embodiment, even if such an external force acts, the entire surface of the flat surface 34A of the mold resin layer 34 of the protection circuit 30 is in contact with the end surface of the battery body 20. Pressed against the end face of. As a result, the external force applied to the protection circuit 30 is received over the entire end face of the battery body 20, and no local stress acts on the circuit board 31, and the electronic components 32 mounted thereon are damaged. Can be reliably prevented.
【００１７】また、本実施形態ではモールド樹脂層３４
によって電気的に絶縁されるから、従来、電池本体２０
との間に必要としていた絶縁紙が不要となり、その分、
小型化を図ることができる。しかも、この実施形態で
は、電子部品３２の一部に集積回路のベアチップを実装
しているから保護回路３０を一層小型化することがで
き、しかもモールド樹脂層３４によってベアチップの保
護を確実に行うことができる。In this embodiment, the mold resin layer 34
Is electrically insulated by the
Insulating paper that was needed between is no longer necessary,
The size can be reduced. Moreover, in this embodiment, since the bare chip of the integrated circuit is mounted on a part of the electronic component 32, the protection circuit 30 can be further miniaturized, and the protection of the bare chip by the mold resin layer 34 is ensured. Can be.
【００１８】なお、本発明は上記記述及び図面によって
説明した実施の形態に限定されるものではなく、要旨を
逸脱しない範囲内で種々変更して実施することができ
る。The present invention is not limited to the embodiment described above with reference to the drawings and drawings, and can be implemented with various modifications without departing from the scope of the invention.
【図１】 本発明の一実施例を示す電池パックの斜視図FIG. 1 is a perspective view of a battery pack showing one embodiment of the present invention.
【図２】 電池パックの上部を図１中Ａ−Ａ線で切断し
た断面図FIG. 2 is a cross-sectional view of the upper part of the battery pack taken along line AA in FIG.
【図３】 電池パックの上部を図１中Ｂ−Ｂ線で切断し
た断面図FIG. 3 is a cross-sectional view of the upper part of the battery pack taken along line BB in FIG.
【図４】 モールド樹脂層の形成工程を示す断面図FIG. 4 is a cross-sectional view showing a step of forming a mold resin layer.
【図５】 従来の電池パックを示す断面図FIG. 5 is a sectional view showing a conventional battery pack.
【図６】 従来の電池パックを示す断面図FIG. 6 is a sectional view showing a conventional battery pack.
【符号の説明】 １０……電池パック １１……電池ケース ２０……電池本体 ２１，２２……リード線 ３０……保護回路 ３１……回路基板 ３２……電子部品 ３４……モールド樹脂層 ３４Ａ……平坦面 ３５……樹脂層非形成部 ４３……押さえ型[Description of Signs] 10 Battery pack 11 Battery case 20 Battery body 21 22 Lead wire 30 Protection circuit 31 Circuit board 32 Electronic component 34 Mold resin layer 34A … Flat surface 35… Resin layer non-formed part 43… Holding type
Claims (4)
板に電子部品を実装して構成した保護回路とを電池ケー
スに収容してなるものにおいて、 前記保護回路には、表面に平坦面を形成して前記電子部
品をモールドするモールド樹脂層が形成され、そのモー
ルド樹脂層の前記平坦面を前記電池本体の平坦面に接触
させた状態で前記電池ケースに収容されていることを特
徴とする電池パック。1. A battery case in which a battery body containing a power generation element and a protection circuit configured by mounting electronic components on a circuit board are housed in a battery case, wherein the protection circuit has a flat surface on its surface. A mold resin layer for forming and molding the electronic component is formed, and is housed in the battery case in a state where the flat surface of the mold resin layer is in contact with the flat surface of the battery body. Battery pack.
プを前記保護回路の回路基板に実装したことを特徴とす
る請求項１記載の電池パック。2. The battery pack according to claim 1, wherein a bare chip of an integrated circuit is mounted on the circuit board of the protection circuit as the electronic component.
脂層を形成しない樹脂層非形成部が設けられ、その樹脂
層非形成部の回路基板に前記電池本体からのリードを接
続するための電池端子が設けられていることを特徴とす
る請求項１又は２記載の電池パック。3. An end portion of the circuit board is provided with a non-resin layer-free portion on which the mold resin layer is not formed, and a lead for connecting a lead from the battery body to the circuit board on the non-resin layer-forming portion. The battery pack according to claim 1, further comprising a battery terminal.
に前記電子部品を埋め込むようにして熱硬化性樹脂を流
し込み、その熱硬化性樹脂の上面に成形型を宛がった状
態で硬化させて前記平坦面を形成してあることを特徴と
する請求項１ないし請求項３のいずれかに記載の電池パ
ック。4. The mold resin layer is formed by pouring a thermosetting resin so as to embed the electronic component on the circuit board, and curing the thermosetting resin in a state where a molding die is addressed to the upper surface of the thermosetting resin. The battery pack according to any one of claims 1 to 3, wherein the flat surface is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000292974A JP2002110121A (en) | 2000-09-26 | 2000-09-26 | Battery pack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000292974A JP2002110121A (en) | 2000-09-26 | 2000-09-26 | Battery pack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002110121A true JP2002110121A (en) | 2002-04-12 |
Family
ID=18775826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000292974A Pending JP2002110121A (en) | 2000-09-26 | 2000-09-26 | Battery pack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002110121A (en) |
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