JPS5836110Y2 - sealed relay - Google Patents

sealed relay

Info

Publication number
JPS5836110Y2
JPS5836110Y2 JP7020778U JP7020778U JPS5836110Y2 JP S5836110 Y2 JPS5836110 Y2 JP S5836110Y2 JP 7020778 U JP7020778 U JP 7020778U JP 7020778 U JP7020778 U JP 7020778U JP S5836110 Y2 JPS5836110 Y2 JP S5836110Y2
Authority
JP
Japan
Prior art keywords
relay
base
case
sealed
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7020778U
Other languages
Japanese (ja)
Other versions
JPS54171148U (en
Inventor
秀行 奥村
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP7020778U priority Critical patent/JPS5836110Y2/en
Publication of JPS54171148U publication Critical patent/JPS54171148U/ja
Application granted granted Critical
Publication of JPS5836110Y2 publication Critical patent/JPS5836110Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、密封型リレー、特に、そのリレ一本体に所望
の電子部品を付加接続して、ケース内にそのリレ一本体
および電子部品を密封したものの改良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sealed relay, and particularly to an improvement in a sealed relay in which desired electronic components are additionally connected to the relay body and the relay body and electronic components are sealed within a case.

従来、前記密封型リレーは、たとえば、電気絶縁材製の
ベースを貫通して取付けた所望数の端子とリレ一本体と
を電気的に接続して、該ベースの一面上に該リレ一本体
を装着し、そのリレ一本体に、過電圧保護回路等を形成
する所望の電子部品、たとえば、半導体ダイオード、抵
抗、コンデンサ等を電気的に接続し、前記ベースの周面
とケースの開口部の内周面とを接合し、その接合部にシ
ール材、たとえば、接着性の合成樹脂材を充填して、そ
のケース内部に、前記リレ一本体および所望の電子部品
を密封するように構成していた。
Conventionally, in the sealed relay, the relay body is electrically connected to a desired number of terminals attached through a base made of an electrically insulating material, and the relay body is mounted on one surface of the base. A desired electronic component forming an overvoltage protection circuit, etc., such as a semiconductor diode, a resistor, a capacitor, etc., is electrically connected to the main body of the relay, and the periphery of the base and the inner periphery of the opening of the case are connected. The relay main body and desired electronic components are sealed inside the case by filling the joint with a sealing material, such as an adhesive synthetic resin material.

しかるに、前記密封型リレーは、通常、高温等の悪環境
の下で使用されることが多く、内部に蓄熱され易い。
However, the sealed relays are often used in adverse environments such as high temperatures, and are likely to accumulate heat inside them.

このため、リレ一本体に付加接続する電子部品、特に、
半導体部品等が劣化され易いという不具合があった。
For this reason, electronic components that are additionally connected to the relay body, especially
There was a problem that semiconductor parts etc. were easily deteriorated.

また、リレ一本体の作動およびその外部の機械装置の作
動にもとづいて振動を受けることが多く、電子部品が短
絡事故、接触不良を発生する危険性があり、信頼性に関
して不具合であった。
In addition, the relay body is often subjected to vibration due to the operation of the main body and the operation of external mechanical devices, and there is a risk that the electronic components may cause short-circuit accidents or poor contact, resulting in reliability problems.

本考案は、前記した不具合を解消するためになされたも
ので、特に、ケースとベースとの接合部に充填する密封
用のシール材を、リレ一本体に所望に付加接続する電子
部品のモールド用としても兼用するようにしたもので、
電子部品の長寿命化を図ることができ、かつその短絡事
故、接触不良事故等を防止して、高信頼性、かつ装置な
密封型リレーを提供することを目的とする。
The present invention has been developed to solve the above-mentioned problems, and is particularly applicable to molds of electronic components in which a sealing material filled in the joint between the case and the base is added to the main body of the relay as desired. It was designed to also be used as a
The purpose of the present invention is to provide a sealed relay that can prolong the life of electronic components, prevent short-circuit accidents, poor contact accidents, etc., and has high reliability and equipment.

つぎに、本考案を、一実施例である添付図面にしたがっ
て説明する。
Next, the present invention will be explained with reference to the accompanying drawings, which are one embodiment.

第1図において、1は四角形のケースで、その開口部近
傍の側壁内周面2に、電気絶縁材製の四角板状のベース
3の周面4が接合されて、ベース3の外面3aとケース
の内周面2とにより所望深さの凹所5を形成している。
In FIG. 1, reference numeral 1 denotes a rectangular case, and the peripheral surface 4 of a rectangular plate-shaped base 3 made of electrically insulating material is joined to the inner peripheral surface 2 of the side wall near the opening of the case 1, and the outer surface 3a of the base 3 and A recess 5 having a desired depth is formed by the inner circumferential surface 2 of the case.

6は、電気接続用端子で、前記ベース3を貫通して垂設
されており(図中、9本示す)、そのベース3の一方面
に取付けたル一本体7(図中、破線で示す)の端子と電
気接続されている。
Reference numeral 6 denotes electrical connection terminals that extend vertically through the base 3 (nine terminals are shown in the figure). ) is electrically connected to the terminal.

8は所望の電子部品10、たとえば、前記リレ一本体7
の過電圧保護用の電子回路等を形成した、半導体ダイオ
ード、抵抗体、コンデンサ等が、回路パターン8a(導
電性金属膜面)に半田付けにより取付けられているプリ
ント配植基板であり、前記ベース3に取付けた端子6を
挿通して、そのベース3端面に密着できるように挿通孔
9が設けられている。
8 is a desired electronic component 10, for example, the relay main body 7
The base 3 is a printed circuit board in which semiconductor diodes, resistors, capacitors, etc. forming electronic circuits for overvoltage protection are attached to the circuit pattern 8a (conductive metal film surface) by soldering. An insertion hole 9 is provided so that the terminal 6 attached to the base 3 can be inserted therethrough and brought into close contact with the end surface of the base 3.

また、前記プリント配線基板8は、その回路パターン8
aを外向きにして、その周面8bが前記ケース1の内周
面2とほぼ密着して、該ケース1の凹所5に収納可能に
成形されている。
Further, the printed wiring board 8 has a circuit pattern 8
It is shaped so that it can be stored in the recess 5 of the case 1, with its circumferential surface 8b substantially in close contact with the inner circumferential surface 2 of the case 1, with the side a facing outward.

前記プリント配線基板8は、第2図に示すように、前記
したようにしてケース1の凹所5に収納した後、その回
路パターン8aが、各挿通孔9を挿通した端子6のうち
、所望の端子6と半田付けにより電気接続して固定され
る。
As shown in FIG. 2, after the printed wiring board 8 is housed in the recess 5 of the case 1 as described above, the circuit pattern 8a is aligned with a desired one of the terminals 6 inserted through each insertion hole 9. The terminal 6 is electrically connected and fixed by soldering.

その後、そのケース1の凹所5に、シール材11.たと
えば、エポキシ樹脂等の接着性を有する合成樹脂、合成
ゴム等を充填して、ケース1の開口部の内周面2とベー
ス3の周側面4との接合部を密封し、かつ、電子部品1
0をモールドしている。
Thereafter, the sealing material 11. For example, the joint between the inner circumferential surface 2 of the opening of the case 1 and the circumferential surface 4 of the base 3 is sealed by filling with adhesive synthetic resin such as epoxy resin, synthetic rubber, etc. 1
0 is molded.

なお、前記電子部品10は、前記リレ一本体7と所望に
電気接続するように、ベース4の外側部(凹所5)にお
いて所定の端子6と半田付けし、その後、その凹所5に
前記シール材11を充填するようにして、前記プリント
配線基板8を省略してもよい。
Note that the electronic component 10 is soldered to a predetermined terminal 6 on the outer side (recess 5) of the base 4 so as to be electrically connected to the relay main body 7 as desired, and then the aforementioned The printed wiring board 8 may be omitted by filling the sealing material 11.

以上、説明したように構成した密封型リレーにおいては
、リレ一本体に付加接続した電子部品は、ケースとベー
スとの接合部を密封したシール材でモールドされ、かつ
ケース内部とはベースで遮断されており、たとえ、高温
等の悪環境下で使用されても、従来のものにおけるより
も、その影響、特に熱的な悪影響がシール材、ベースに
より緩和されるので、その劣化が極めて小さく信頼性が
良好なものである。
In the sealed relay configured as described above, the electronic components additionally connected to the relay body are molded with a sealant that seals the joint between the case and the base, and are isolated from the inside of the case by the base. Even if it is used in harsh environments such as high temperatures, the effects, especially the adverse effects of heat, are alleviated by the sealing material and base, so deterioration is extremely small and reliability is achieved. is in good condition.

また、前記電子部品は、シール材により確実に固定され
ているので、たとえ、リレー等自体の作動にもとづく振
動および、その他外部から振動を受けようとも、短絡事
故、接触不良等の発生を確実に防止することもでき、密
閉型リレーの信頼性をさらに良好なものとすることがで
きる。
In addition, since the electronic components are securely fixed with a sealing material, even if they are subjected to vibrations due to the operation of relays, etc., or other external vibrations, short circuit accidents, poor connections, etc. will be prevented. This can also be prevented, and the reliability of the sealed relay can be further improved.

なお、前記電子部品は、プリント配線基板にプリント配
線するようにすれば、リレ一本体との電気接続作業が容
易におこなえ、その製作手間が大巾に減少できる。
Note that if the electronic component is printed and wired on a printed wiring board, electrical connection to the main body of the relay can be easily performed, and the manufacturing effort can be greatly reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の密封型リレーの一実施例の分解斜視
図、第2図はその組立て状態説明図である。 1・・・・・・ケース、2・・・・・・ケースの側壁内
周面、3・・・・・・ベース、3a・・・・・・ベース
外面、5・・・・・・凹所、6・・・・・・端子、7・
・・・・・リレ一本体、8・・・・・・プリント配線基
板、10・・・・・・電子部品、11・・・・・・シー
ル材。
FIG. 1 is an exploded perspective view of an embodiment of the sealed relay of the present invention, and FIG. 2 is an explanatory diagram of the assembled state. 1...Case, 2...Inner peripheral surface of side wall of case, 3...Base, 3a...Base outer surface, 5...Concave Location, 6...Terminal, 7.
... Relay body, 8 ... Printed wiring board, 10 ... Electronic components, 11 ... Sealing material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)ベースに装着したリレ一本体に所望の電子部品を
電気接続し、ケースと前記ベースとの接合部にシール材
を充填した密封型リレーにおいて、前記ベースの外面と
前記ケースの開口部近傍内周面とにより凹所を形成し、
該凹所に、前記電子部品を収納するとともに前記シール
材を充填して電子部品をモールドしたことを特徴とする
密封型リレ(2)前記電子部品は、前記凹所に収納可能
なプリント配線基板に取付けたことを特徴とする実用新
案登録請求の範囲第1項に記載の密封型リレー
(1) In a sealed relay in which a desired electronic component is electrically connected to a relay body mounted on a base, and a sealing material is filled in the joint between the case and the base, the outer surface of the base and the vicinity of the opening of the case A recess is formed by the inner peripheral surface,
A sealed relay characterized in that the electronic component is housed in the recess and the electronic component is molded by filling the sealing material (2) The electronic component is a printed wiring board that can be stored in the recess. The sealed relay according to claim 1 of the utility model registration claim, characterized in that the relay is attached to a
JP7020778U 1978-05-23 1978-05-23 sealed relay Expired JPS5836110Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7020778U JPS5836110Y2 (en) 1978-05-23 1978-05-23 sealed relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7020778U JPS5836110Y2 (en) 1978-05-23 1978-05-23 sealed relay

Publications (2)

Publication Number Publication Date
JPS54171148U JPS54171148U (en) 1979-12-03
JPS5836110Y2 true JPS5836110Y2 (en) 1983-08-15

Family

ID=28979784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7020778U Expired JPS5836110Y2 (en) 1978-05-23 1978-05-23 sealed relay

Country Status (1)

Country Link
JP (1) JPS5836110Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4748727B2 (en) * 2006-09-07 2011-08-17 Necトーキン株式会社 Electromagnetic relay

Also Published As

Publication number Publication date
JPS54171148U (en) 1979-12-03

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