JP2000323356A - Electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a surface-mounting metallized film capacitor the characteristics of which are not deteriorated much by infiltrated moisture, etc., and which can be mounted on a printed board, etc., with a high mounting strength. SOLUTION: A surface-mounting metallized film capacitor is constituted in such a way that terminal fittings 17 each having a terminal section 17a which is nearly flushed with the upper surface of a plate-like terminal board 14 made of a resin, and an element connecting section 17d which comes down from the section 17a, are integrally molded with both ends of the terminal board 14 by insert molding, and a metallized film capacitor element 11 is connected between the connecting sections 17d and 17d. Then the element 11 is housed in a container 13 made of a resin and the opening of the container 13 is closed with the terminal board 14. In addition, a thermosetting resin filler 20 is packed in the container 13 to the height of the central window 15 of the terminal board 14 through the window 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suitable for surface mounting on a printed circuit board or the like, and more particularly to a leadless type capacitor having a relatively large capacity.

[0002]

2. Description of the Related Art Conventionally, for example, there has been a resin-coated metallized film capacitor of the type shown in FIG. That is, in this capacitor, a pair of metallized films are superposed and wound, and electrode lead portions 42 and 42 formed by metallicon metal spraying are provided at both winding ends thereof to obtain a capacitor element 41, and the electrode lead portions 42 and 42 The lead wires 43, 43 are attached by welding or soldering, are housed in a resin case 44, a thermosetting filler 45 is injected into the case 44, and this is cured.

[0003]

Generally, when mounting an electronic component having a lead wire on a printed circuit board, the lead wire is inserted into a through hole provided in the board and then soldered to a board conductor. However, in recent years, the automation of the work has been advanced, and there has been a demand for a metallized film capacitor to be a surface mount type that can cope with the automation.

[0004] The metallized film capacitor having the above-mentioned lead wire is provided with a lead wire 43, which extends vertically from its mounting surface 46.
The lead-out line 43 must be bent at right angles in the mounting surface 46 in order to use the lead-out line 43 in the surface mounting method. However, if the lead wires 43, 43 are strongly bent in the mounting surface in this way, the strength of the lead wire is reduced at the bent portion, and a crack is generated in the filler 45 near the bent portion. The moisture penetrates through the cracks and deteriorates the characteristics of the capacitor. In addition, since the connection to the board depends only on soldering with a thin lead with a circular cross section, there is a possibility that the soldering strength may vary and the lead may be broken, especially for capacitors. When the capacity is quite large and the weight is heavy, the reliability of the installation is not sufficient. An object of the present invention is to realize a surface-mount type electronic component which does not deteriorate the capacitor characteristics and the mounting strength as described above.

[0005]

An electronic component according to the present invention comprises a resin case having an open upper surface, a plate-shaped resin terminal plate attached to the upper surface of the case, and both ends of the terminal plate. It has a terminal fitting integrated into each part by insert molding, an electronic component element housed in the case, and an insulating filler filled in the case. The terminal plate has a window at a substantially central portion thereof, and the insulating filler is filled in the case up to the height of the window. Further, the terminal fitting has a plate-shaped terminal portion whose upper surface is located substantially in the same plane as the upper surface of the terminal plate, and an element connection portion hanging therefrom into the case. The part is connected to the electronic component element in the case.

[0006]

The above-mentioned electronic component does not need to bend the lead wire for surface mounting unlike the conventional electronic component having the lead wire, and therefore does not cause cracking of the insulating filler. No degradation of electrical characteristics due to intrusion occurs. In addition, since the terminal fitting is soldered to a conductor such as a printed circuit board over a wide area, unlike the lead wire, the reliability of soldering and the strength of attachment to the board and the like are remarkably improved.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS It is preferable that the terminal plate is provided with a low enclosing wall fitted on the outer or inner periphery of the opening edge of the case or a groove fitted on the opening edge of the case at the peripheral portion thereof. The fitting prevents the insulating filler from leaking out of the joint gap between the terminal plate and the case when the filler is filled, thereby contaminating the outer surface of the case, and preventing the terminal plate and the electronic component elements from floating due to buoyancy. Can be. In addition, it is preferable that the above-mentioned surrounding wall is provided with a ridge that abuts on the above-mentioned case over the entire circumference thereof. Can be prevented. Furthermore, on the case side,
It is also preferable to provide a groove into which the ridge on the surrounding wall is fitted, or to provide a ridge above and adjacent to the contact point of the ridge, and the ridge on the surrounding wall and the groove or ridge on the case side are preferably provided. , The connection between the case and the terminal plate can be made more reliable, and the overflow of the insulating filler from the gap can be further reduced.

In the case where the above-mentioned groove or surrounding wall does not exist in the terminal plate, a tongue piece hanging down into the case from an appropriate position of a peripheral portion of the terminal plate is integrally formed on the terminal plate, and this is attached to the case. It is desirable to provide a projection on the inner surface and, if necessary, a contact portion of the tongue piece with the inner surface of the case, so that the terminal plate and the electronic component element can be prevented from floating when the insulating filler is injected. . Further, on the case side, a protrusion is provided adjacent to and above the recess where the protrusion fits or the contact point of the protrusion, and if the protrusion on the tongue side is engaged with this, the case and the terminal plate can be connected. The connection is more secure.

It is desirable that the edge of the window of the terminal board be extended upward in a funnel shape or in a stepped manner, so that the height of the upper surface is within the window when the insulating filler is injected, and upward from the window. It becomes easy to regulate the injection amount so as not to overflow. Further, on the upper surface of the terminal board, a projection for engaging with a mounting hole formed in a printed circuit board or the like may be provided at an appropriate position if necessary. The electronic component can be prevented from moving, and the mounting strength of the electronic component on a substrate or the like can be further increased.

In the terminal fitting, it is preferable that an edge bent along an edge of the terminal plate is connected to the terminal. In other words, if the soldering of the terminal portion and the board conductor is performed well, the solder flows to the edge, so that the quality of the soldering can be visually determined. The terminal fittings may be provided with protrusions or tongues at appropriate locations and bite them into the resin material forming the terminal plate, or may be provided with recesses or through holes to form the terminal plate therein. If the resin material is used, the bonding strength between the terminal fitting and the terminal plate can be increased, and the mounting strength of the electronic component to the substrate can be increased.

[0011]

Embodiment 1 In FIG. 1, reference numeral 11 denotes a metallized film capacitor element, and reference numerals 12 and 12 denote electrode lead portions formed by metallikon metal spraying. Reference numeral 13 denotes a case housing the element 11, and a lid-like insulating terminal plate 14 is attached to an opening on the upper surface thereof. The terminal plate 14 has a funnel-shaped window 15 in the center at the center, and small projections 16, 16 protruding at appropriate places on the upper surface.

At both ends of the terminal plate 14, there are terminal fittings 17, 17 united by insert molding. The terminal fittings 17, 17 are formed by bending a blade-shaped metal plate as shown in FIG. 1C, and a terminal portion 17a extending to the edge 14a along the upper surface of the terminal plate 14; An end portion 17b bent downward in FIG. 1A along the edge 14a, a bent portion 17c bent again along the lower surface of the terminal plate 14, and further bent downward. Connecting portion 17d of the folded portion 17c.
A rectangular hole 18 exists in a portion adjacent to d. At the time of insert molding of the terminal plate 14, a tongue piece 19 hanging down through the through hole 18 is formed integrally with the terminal plate 14, and the tongue piece 1 is formed.
9 has a projection 19 a that comes into contact with the inner wall of the case 13.

The capacitor element 11 includes terminal fittings 17, 1
7 are connected to the connection portions 17d, 17d by soldering or welding and then housed in the case 13, the uncured resinous filler 20 is filled into the case 13 through the window 15, and the capacitor is completed by curing. .

When mounting on a printed circuit board, the capacitor is turned upside down and small projections 1 are inserted into the coupling holes of the board.
6 and 16 are inserted, and the terminal portions 17 of the terminal fittings 17 and 17 are inserted.
a and 17a are placed on the substrate conductor and soldering is performed.
At this time, when the soldering is performed well, the solder is removed from the conductor surface of the substrate to the edge portions 17 of the terminal fittings 17, 17.
b, 17b, it can be easily confirmed, and the mechanical connection with the substrate is small projections 16, 17b.
The height is increased by fitting the 16 into the board connecting hole.

[0015]

Embodiment 2 In FIG. 2, reference numeral 21 denotes a metallized film capacitor element, reference numerals 22 and 22 denote electrode lead portions formed by metallized metal spraying, reference numeral 23 denotes a case, and reference numeral 24 denotes an insulator attached to an opening on the upper surface of the case 23. It is a terminal board made of. Terminal board 2
Reference numeral 4 has a window 25 at the center, a short cylindrical wall 26 hangs down from the edge of the window into the case 23, and a ridge 26 a projecting from the outer periphery of the wall 26 is in contact with the inner wall of the case 23. .

At both ends of the terminal plate 24, there are terminal fittings 27, 27 which are united by insert molding. The terminal fitting 27 is formed by bending a metal plate.
4, a terminal 27a extending from the edge of the window 25 to the edge 24a along the upper surface of the window 4, an edge 27b bent downward along the edge of the terminal plate 24, and an inner surface of the surrounding wall 26. Connecting part 2 bent downward into case 23
7c. The capacitor element 21 has a connection 27c,
27c and housed in the case 23.

In this embodiment, since the space between the case 23 and the terminal plate 24 is closed by the surrounding wall 26, it is possible to prevent the insulating filler 30 from leaking from a gap when the insulating filler 30 is filled. Other effects are the same as those of the first embodiment shown in FIG. In this embodiment, the cylindrical surrounding wall 26 is provided inside the case 23, but may be provided outside the case 23.

[0018]

Embodiment 3 In FIG. 3, reference numeral 31 denotes a metallized film capacitor element, and reference numerals 32 and 32 denote electrode lead portions. 3
Reference numeral 3 denotes a case, and reference numeral 34 denotes a terminal plate made of an insulating material attached to an opening on the upper surface of the case 33. The terminal plate 34 has a window 35 in the center, the upper part of which expands stepwise, and a groove 36 is formed on the lower surface along the periphery.

At both ends of the terminal plate 34, there are terminal fittings 37, 37 united by insert molding. The terminal fitting 37 is formed by bending a metal plate, and the terminal portion 3 placed substantially in the same plane as the upper surface of the terminal plate 34.
7a, an edge portion 37b bent along the edge 34a of the terminal plate 34, and a connecting portion 37c penetrating through the terminal plate 34 and hanging down from the inside of the groove 36 into the case 33. Reference numeral 31 is connected between the connecting portions 37c and 37c and is accommodated in the case 33.

In the present embodiment, since the opening edge of the case 33 is fitted into the groove 36 on the peripheral edge of the terminal plate 34, when the insulating filler 40 is filled, the gap between the case 33 and the terminal plate 34 Can be prevented from leaking. Other effects are the same as those of the first embodiment shown in FIG.

[0021]

As is clear from the above embodiments, according to the present invention, it is possible to realize a surface mount type electronic component having a metal terminal having a large area on the mounting surface. Since cracks do not occur, moisture and the like do not enter, and thus an electronic circuit having high reliability and high mechanical strength can be obtained.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention, wherein (a) is a sectional view,
(B) is a plan view, and (c) is a developed plan view of the terminal fitting.

FIGS. 2A and 2B show a second embodiment of the present invention, wherein FIG.
(B) is a plan view, and (c) is a front view of a terminal plate.

3A and 3B show a third embodiment of the present invention, in which FIG.
(B) is a plan view.

4 (a) is a plan view, FIG. 4 (b) is a cross-sectional view taken along line AA in FIG. 4 (a), and FIG. 4 (c) is a view (a). B-
It is sectional drawing which follows the B line.

[Explanation of symbols]

 11, 21, 31 Metallized film capacitor element 12, 22, 32 Electrode lead-out part 13, 23, 33 Case 14, 24, 34 Terminal plate 15, 25, 35 Window 16 Projection 26 Surrounding wall 36 Groove 17, 27, 37 Terminal fitting 17a, 27a, 37a Terminal 17b, 27b, 37b Edge 17d, 27c, 37c Connection 18 Through hole 19 Tongue piece 20, 30, 40 Filling material

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yu Nakaizumi 4th floor of Uehara Bldg. 3F, 191 Nakasari-cho, Oike-dori Karasuma-Higashi-iri, Nakagyo-ku, Kyoto-shi F-term in Nichicon Corporation 5E082 AA02 AA11 AB04 BC19 BC31 EE07 FG06 FG34 GG08 HH03 HH06 HH28 HH47 JJ04 JJ22 JJ25 JJ27

Claims (17)

[Claims] 1. A resin case having an open upper surface, a plate-shaped resin terminal plate attached to the upper surface of the case and having a window at a substantially central portion, and insert molding at both ends of the terminal plate. A terminal having a plate-shaped terminal portion integrated with an upper surface located substantially in the same plane as the upper surface of the terminal plate and a device connection portion hanging therefrom in the case; and the terminal in the case. An electronic component comprising: an electronic component element connected between element connection portions of a metal fitting; and an insulating filler filled in the case up to the height of the window of the terminal plate. 2. The electronic component element is a metallized film capacitor element in which a pair of metallized films are superposed and wound, and electrode winding portions formed by metallicon metal spraying are formed at both winding ends. The electronic component according to claim 1, wherein: 3. The electronic component according to claim 1, wherein a tongue piece formed integrally with the terminal plate and in contact with an inner surface of the case hangs from an appropriate position on a peripheral portion of the terminal plate. . 4. The electronic component according to claim 3, wherein said tongue has a projection which abuts on an inner wall of said case. 5. The electronic component according to claim 4, wherein a recess or a projection that engages with the projection is provided at a position corresponding to the projection on the inner wall of the case. 6. The electronic component according to claim 1, wherein an enclosing wall that contacts an inner surface of an opening edge of the case hangs from a peripheral edge of the terminal plate. 7. The electronic component according to claim 6, wherein a ridge is provided on the outer surface of the surrounding wall over the entire periphery thereof so as to contact the inner wall of the case. 8. The electronic component according to claim 7, wherein a groove or a ridge engaging with the ridge is provided at a position corresponding to the ridge on the inner wall of the case. 9. The electronic component according to claim 1, wherein an enclosing wall that contacts an outer surface of an opening edge of the case hangs from a peripheral edge of the terminal plate. 10. The electronic component according to claim 9, wherein a ridge is provided on the inner surface of the surrounding wall over the entire periphery thereof so as to contact the outer wall of the case. 11. The electronic component according to claim 10, wherein a groove or a ridge engaging with the ridge is provided at a position corresponding to the ridge on the outer wall of the case. 12. The electronic component according to claim 1, wherein a groove that fits into an opening edge of the case is formed in a peripheral portion of the terminal plate. 13. The electronic component according to claim 1, wherein a small protrusion is provided at an appropriate position on the upper surface of the terminal board so as to fit into a mounting hole formed in a printed circuit board or the like. 14. The electronic component according to claim 1, wherein an upper portion of the edge of the window of the terminal plate expands in a funnel shape or a step shape. 15. The electronic component according to claim 1, wherein the terminal fitting has an edge bent along an edge of the terminal plate following the terminal. 16. The electronic component according to claim 1, wherein a protrusion or a claw is provided at a proper position of the terminal fitting so as to be inserted into a resin forming the terminal plate. 17. The electronic component according to claim 1, wherein a through-hole or a recess is provided at an appropriate position of the terminal fitting so that a resin forming the terminal plate enters.