JPS6350844Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a chip-type solid electrolytic capacitor that is used by being soldered onto a printed circuit board.

Conventionally, the above-mentioned chip-type solid electrolytic capacitor has a capacitor element that is approximately rectangular parallelepiped, has a cathode layer on its outer surface, and has an anode lead wire drawn out from one end face, and an anode terminal at the tip of the anode lead wire. A cathode terminal was soldered to the end face opposite to the anode lead wire's lead-out side, and finally molded with resin. However, in such chip-type solid electrolytic capacitors, when welding the tip of the anode lead wire to the anode terminal, the length of the anode lead wire is adjusted so as not to adversely affect the manganese dioxide layer inside the capacitor element and the anode lead wire. As a result, the gap between the drawing surface of the anode lead wire and the anode terminal becomes large, and when resin is injected, the problem arises that the resin flows out from the gap. In addition, in order to facilitate welding of the anode lead wire to the anode terminal, it is necessary to drill holes or form tongues in the anode terminal, resulting in an increase in the number of work steps.

The object of this invention is to provide a chip-type solid electrolytic capacitor that solves the above problems.

This invention will be explained in detail below based on two illustrated embodiments. A first embodiment is shown in FIGS. 1 and 2. In both figures, 1 is a capacitor element, which is formed into a roughly rectangular parallelepiped shape with length l, width w, and height h of about 2.0, 2.6, and 1.2 mm, respectively, and a cathode is formed on the outer surface of the capacitor element. Layer 2 is formed. An anode lead wire 3 having a length l1 of approximately 1.3 mm is led out from one side surface 1a of this capacitor element 1. Reference numeral 4 denotes a resin layer that covers the central portion of the cathode layer 1.

End surface portion 2 of the cathode layer 2 on the opposite side to the end surface 1a
A cathode terminal 5 is soldered to a. This cathode terminal 5 has a generally U-shaped planar shape and is in contact with the bottom, end, and side surfaces of the cathode layer portion 2a, and its internal width matches the width w of the capacitor element 1. .

A metal piece 6 is welded to the tip of the anode lead wire 3. This metal piece 6 has a generally U-shaped planar shape, and the anode lead wire 3 is welded to its base 6a. The width dimension of this base portion 6a is formed to be equal to the width dimension of the capacitor element 1.
Leg portions 6b, 6b extend from both sides of the capacitor element 1 toward the lead-out side surface 1a of the anode lead wire 3, and the tips of these leg portions 6b, 6b and the side surface 1a
There is a small gap between them. That is, the length _l2 of the base 6a is approximately 0.6 cm, the length _l3 of the legs 6b, 6b is approximately 0.4 mm, and there is a distance of approximately 0.3 mm between the tips of the legs 6b, 6b and the side surface 1a. There are minute intervals.

An anode terminal 7 is soldered to the metal piece 6. The anode terminal 7 has a generally U-shaped planar shape,
Its inner surface is in contact with the bottom, end, and side surfaces of the base 6a of the metal piece 6, and the internal width of the anode terminal 7 matches the width of the metal piece 6. Although not shown in the figure, resin is injected into the space existing between the anode terminal 7 and the cathode terminal 5 to fill it, and before the resin hardens, a second As shown in the figure, a heat-resistant plastic plate 8 is placed on the resin, and the plastic plate 8 is fixed by the resin.

The second embodiment is constructed in the same manner as the first embodiment, except that a bottom plate 9 made of heat-resistant plastic is inserted between the bottom surfaces of the anode terminal 7 and the cathode terminal 5, as shown in FIG. . Equivalent parts are given the same reference numerals and their explanation will be omitted. By providing the bottom plate 9 in this way, when this capacitor is mounted on a printed circuit board, it is possible to more completely insulate the capacitor from the copper foil conductive path that exists on the bottom surface of this mounting position, and to When resin is injected into the space between the anode terminal 7 and the cathode terminal 5, the resin does not flow downward, and since the bottom plate 9 is flat, an insulating adhesive is applied to the bottom surface of the bottom plate 9. By applying it, temporary fixing to a printed circuit board can be easily performed.

In the chip-type solid electrolytic capacitors configured as in both of these embodiments, the metal piece 6 has a roughly U-shape, and the base 6a has its legs 6b, 6b facing the anode lead-out surface 1a of the capacitor element 1. Since the tip of the anode lead wire 3 is welded to the front end of the anode lead wire 3, even if the length of the anode lead wire 3 is increased, the distance between the tips of the legs 6b, 6b and the anode lead surface 1a of the capacitor element 1a can be kept very small. It can be done. Therefore, the anode lead wire 3
Welding the metal piece 6 and the anode lead wire 3 and the manganese dioxide layer inside the capacitor element 1 will not be adversely affected, and when resin is injected, the leg 6
The resin is held by surface tension in the minute gap between the tips of legs 6b and 6b and the anode extraction surface 1a, and the resin is held by the surface tension.
b, 6b will not flow out. Furthermore, since the width of the metal piece 6 matches the internal width of the anode terminal 7, the metal piece 6 can be easily positioned when soldering the metal piece 6 to the anode terminal 7.

In the above embodiment, the length dimension l ₂ + l ₃ of the metal piece 6
was made longer than the length dimension _l of anode terminal 7, but on the contrary
l ₄ may be longer than l ₂ + l ₃ .

[Brief explanation of the drawing]

Fig. 1 is a plan view of the first embodiment of the chip type solid electrolytic capacitor according to this invention, and Fig. 2 is a plan view of the first embodiment of the chip type solid electrolytic capacitor according to the invention.
FIG. 3 is a vertical side view of the second embodiment. DESCRIPTION OF SYMBOLS 1... Capacitor element, 1a... Anode lead-out side, 2... Cathode layer, 3... Anode lead wire, 5... Cathode terminal, 6... Metal piece, 6a... Base, 6b...
Legs, 7... Anode terminal.

Claims (1)

[Scope of utility model registration request] a capacitor element formed into a generally rectangular parallelepiped shape, having a cathode layer on its outer surface and having an anode lead wire drawn out from one side; a cathode terminal soldered to the side surface of the capacitor element opposite to the anode lead wire; A base part to which the tip of the anode lead wire is welded, and leg parts extending from both ends of the base toward the lead-out surface of the anode lead-out wire so as to form a minute gap between the base part and the lead-out surface of the anode lead-out wire. and an anode terminal soldered to the base of the metal piece and having an internal width approximately equal to the width of the metal piece.