JPS6244521Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a face bonding type chip-shaped solid electrolytic capacitor, and particularly to its terminal structure.

Recently, as the miniaturization and automatic insertion of electronic circuits have progressed, there has been a demand for electronic components to be made into chips.Ceramic chip capacitors, chip resistors, and so on. Since these chip parts have no polarity and use ceramic substrates, they can be easily manufactured with high dimensional accuracy into rectangular shapes suitable for automatic alignment and automatic supply.

By the way, the conditions for facilitating automatic alignment and automatic feeding are that the chip parts have a rectangular shape, have good dimensional accuracy, have no "burrs" or protrusions, have a smooth surface, and cannot be stacked. In addition, the mounting requirements include small dimensions, conductive parts of the electrical circuit on the bottom of the component, so the distance between each terminal is narrow, and there must be insulation between them. It is required to have heat resistance and sufficient terminal strength.

However, in the case of a solid electrolytic capacitor, it has to have an asymmetrical shape because it is polar and has a protruding lead-in wire on the anode body.

Therefore, in the past, the resin exterior was formed by transfer molding in order to satisfy the above-mentioned requirements.

As a face bonding type chip-shaped solid electrolytic capacitor having a resin exterior formed by transfer molding, a structure as shown in FIGS. 1 and 2 has been devised.

The one shown in FIG. 1 has a structure in which plate-shaped anode terminals 2 and cathode terminals 3 are drawn out from the bottom surface on both sides in the longitudinal direction of the main body part 1, and the one shown in FIG. It has a structure in which an L-shaped anode terminal 4 and a cathode terminal 5 are drawn out from both end faces in the direction.

However, in the case of the capacitor shown in FIG. 1, the anode terminal 2 and cathode terminal 3 protrude significantly from the main body portion 1, so the overall size becomes large.
This increases the installation area on the printed circuit board, and has the disadvantage that each capacitor becomes entangled when supplied by a parts feeder or the like. In addition, in capacitors in which the anode terminal 2 and cathode terminal 3 do not protrude from the main body portion 1, if preliminary soldering is not done in advance to the conductive pattern on the printed circuit board, the anode terminal 2 and cathode terminal 3 and the conductive pattern must be pre-soldered. Since there is no gap between them, the solder cannot penetrate between them, making it impossible to perform soldering.

In the case of the capacitor shown in FIG. 2, the L-shaped anode terminal 4 and cathode terminal 5 are drawn out from both end faces of the main body portion 1, and the anode terminal 4 and cathode terminal 5 are
Since the tip of the is bent parallel to the bottom of the main body part 1, a large space is created between the bottom of the main body part 1 and the printed circuit board, making it difficult to attach with adhesive and reducing the overall It was getting taller. Furthermore, when the capacitors are supplied using a parts feeder or the like as shown in FIG. 1, the capacitors become entangled.

The present invention has been developed in view of these conventional problems, and will be described below with reference to FIGS. 3 to 5, which show embodiments of the present invention.

3 and 4a and 4b show a chip-shaped solid electrolytic capacitor according to an embodiment of the present invention. In the figures, 10 is a rectangular parallelepiped-shaped capacitor body, and this capacitor body 10 is made of a tantalum-like valve. A sintered body of a working metal is used as an anode substrate, and a dielectric anodic oxide film, a semiconductor metal oxide layer such as manganese dioxide, a cathode layer such as carbon, and a cathode conductive layer such as silver paint and solder are coated on the surface of the anode base. A capacitor element is constructed by sequentially laminating the capacitor elements, a φ-shaped anode lead wire 11 and a cathode lead wire 12 are drawn out from the capacitor element, and the periphery of the capacitor element is covered with a resin layer 13 formed by transfer molding. has been done. The anode lead wire 11 is connected by welding to a protruding introduction wire drawn out from the anode body, and the cathode lead wire 12 is connected to the cathode conductive layer of the outermost shell of the capacitor element.

Further, the anode lead wire 11 and the cathode lead wire 12 protrude from both sides of a protrusion 10a provided at approximately the center of one end surface in the longitudinal direction of the capacitor body 10, are bent along the end surface, and are bent along the end surface of the capacitor body. The portions of the anode lead wires 11 and cathode lead wires 12 located at the end faces serving as connection points with the outside of the capacitor body 10 from which the anode lead wires 11 and cathode lead wires 12 of No. 10 are drawn out are rolled to form flat parts. 11a and 12a. Note that the flat portions 11a and 12a of the anode lead wire 11 and the cathode lead wire 12 are flush with the surface of the protruding portion 10a, or are located inside the surface.

Figures 5a and 5b show the state in which the chip-shaped solid electrolytic capacitor of the present invention shown in Figures 3 and 4a and b is mounted on a printed circuit board. 1 is this conductive pattern, 16 is an adhesive, and 17 is a solder. In the case of this embodiment, since the protrusion 10a is used as a connection surface, it can be used only when the capacitor main body 10 is mounted in an upright position.

In the present invention, the capacitor main body 10 is not limited to a rectangular shape, but may have a circular shape, and furthermore, the anode lead wire 11 and the cathode lead wire 12 may be drawn out from the same end surface or from opposite end surfaces. Good too.

As is clear from the above description, in the chip-shaped solid electrolytic capacitor according to the present invention, the anode lead wire and the cathode lead wire are bent along the precise end surface of the capacitor body, which is coated with resin by transfer molding. There are no lead wires protruding from the capacitor body, and the overall dimensional accuracy is good, so even when automatically supplied using a parts feeder, there is no entanglement between each capacitor, which facilitates automatic alignment. In addition, it becomes possible to automate polarity discrimination, front/back discrimination, etc., and improve work efficiency. In addition, in connection with this, the overall size is also reduced, and the installation area when attached to a printed circuit board can be reduced. moreover,
The parts of the anode lead wire and cathode lead wire located on the connection surface of the capacitor body are made into flat parts by rolling, and when attached to a printed circuit board, they can be stably installed on the board. It becomes possible to automate the installation, and also allows temporary fixing with adhesive, making the soldering work easier. In addition, the normal lead wires are rolled to make them flat and the connection area of the anode and cathode lead wires is appropriately widened, which reduces material costs and processing work compared to using a punched metal frame from the beginning. It is effective because it can be used in common, and it is possible to obtain inexpensive products.

[Brief explanation of drawings]

Figures 1 and 2 are perspective views showing conventional chip-shaped solid electrolytic capacitors, Figure 3 is an external perspective view of a chip-shaped solid electrolytic capacitor according to an embodiment of the present invention, and Figures 4a and 4b are the same. A front view and a side view of the capacitor, FIGS. 5a and 5b are a front view and a side view showing the state in which the chip-shaped solid electrolytic capacitor shown in FIGS. 3 and 4a and b is attached to a printed circuit board. . 10...Capacitor body, 10a...Protrusion part,
11... Anode lead wire, 12... Cathode lead wire,
11a, 12a...Flat portion, 13...Resin layer.

Claims (1)

[Scope of utility model registration request] A capacitor element is covered with a resin layer formed by molding, and an anode lead wire and a cathode lead wire connected to the anode and cathode of the capacitor element are drawn out of the resin layer, and an end face from which the anode lead wire and the cathode lead wire are drawn out. The anode lead wire has a capacitor body provided with a protruding part, and the anode lead wire and the cathode lead wire are bent along the end face of the capacitor body from which they are drawn out and so as not to protrude beyond the protruding part. and a chip-shaped solid electrolytic capacitor formed by rolling a portion of the cathode lead wire that is connected to the outside of the capacitor body.