JPS642436Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a face bonding type chip-shaped capacitor, and particularly to its terminal structure. Hereinafter, a description will be given using a solid electrolytic capacitor as an example.

Recently, with the progress of miniaturization and automatic insertion of electronic circuits, there has been a demand for electronic components to be chipped. and so on. Since these chip parts have no polarity and use ceramic substrates, they can be easily manufactured with high dimensional accuracy into rectangular shapes suitable for automatic alignment and automatic supply.

By the way, the conditions for facilitating automatic alignment and automatic feeding are that the chip parts have a rectangular shape, have good dimensional accuracy, have no "burrs" or protrusions, have a smooth surface, and cannot be stacked. In addition, the mounting requirements include small dimensions, conductive parts of the electrical circuit on the bottom of the component, so the distance between each terminal is narrow, and there must be insulation between them. It is required to have heat resistance and sufficient terminal strength.

However, in the case of a solid electrolytic capacitor, it has to have an asymmetrical shape because it is polar and has a protruding lead-in wire on the anode body.

Therefore, in the past, the resin exterior was formed by transfer molding in order to satisfy the above-mentioned requirements.

As a face bonding type chip-shaped solid electrolytic capacitor having a resin exterior formed by transfer molding, a structure as shown in FIGS. 1 and 2 has been devised.

The one shown in FIG. 1 has a structure in which plate-shaped anode terminals 2 and cathode terminals 3 are drawn out from the bottom surface on both sides in the longitudinal direction of the main body part 1, and the one shown in FIG. It has a structure in which an L-shaped anode terminal 4 and a cathode terminal 5 are drawn out from both end faces in the direction.

However, in the case of the capacitor shown in FIG. 1, the anode terminal 2 and cathode terminal 3 protrude significantly from the main body portion 1, so the overall size becomes large.
This increases the installation area on the printed circuit board, and has the disadvantage that each capacitor becomes entangled when supplied by a parts feeder or the like. In addition, in capacitors in which the anode terminal 2 and cathode terminal 3 do not protrude from the main body portion 1, if preliminary soldering is not done in advance to the conductive pattern on the printed circuit board, the anode terminal 2 and cathode terminal 3 and the conductive pattern must be pre-soldered. Since there is no gap between them, the solder cannot penetrate between them, making it impossible to perform soldering.

In the case of the capacitor shown in FIG. 2, the L-shaped anode terminal 4 and cathode terminal 5 are drawn out from both end faces of the main body portion 1, and the anode terminal 4 and cathode terminal 5 are
Since the tip of the is bent parallel to the bottom of the main body part 1, a large space is created between the bottom of the main body part 1 and the printed circuit board, making it difficult to attach with adhesive and reducing the overall It was getting taller. Furthermore, when the capacitors are supplied using a parts feeder or the like as shown in FIG. 1, the capacitors become entangled.

The present invention has been developed in view of these conventional problems, and will be described below with reference to FIGS. 3 to 8, which show embodiments of the present invention.

Figures 3a and 3b show a chip-shaped solid electrolytic capacitor according to an embodiment of the present invention. The structure is used as an anode base, and a dielectric anodic oxide film, a semiconducting metal oxide layer such as manganese dioxide, a cathode layer such as carbon, a silver paint, and a cathode conductive layer such as solder are sequentially laminated on the surface. By doing so, a capacitor element is constructed, and from this capacitor element an anode terminal 11 and a cathode terminal 1 are connected.
2 is pulled out, and the periphery of the capacitor element is covered with a resin layer formed by transfer molding. The anode terminal 11 is connected by welding to a protruding lead-in wire drawn out from the anode body,
The cathode terminal 12 is connected to the outermost cathode conductive layer of the capacitor element.

In the embodiment shown in FIGS. 3a and 3b, an inverted L-shaped anode terminal 11 and a cathode terminal 12 made of a cylindrical lead wire are drawn out from one end surface in the longitudinal direction of the capacitor body 10, and the anode terminal 11 and the cathode terminal The tip surfaces 11a and 12a of the cathode terminal 12 are located on the same plane as the bottom surface 10a of the capacitor body 10. In addition, an anode terminal 11 and a cathode terminal 12
A rectangular protrusion 10c that is long in the vertical direction is provided in the center between the anode terminal 11 and the cathode terminal 12.
It is bent along the end surface so that it does not protrude beyond e.

Incidentally, the anode terminal 11 and the cathode terminal are bent along the end surface, but if the protrusion 10d is not present, the anode terminal 11 and the cathode terminal 12 are bent from the end surface by the diameter of the lead wire or the thickness of the metal plate. Anode terminal 11 and cathode terminal 12 protrude. Therefore, if the anode terminal 11 and the cathode terminal 12 are not located on the same plane in the longitudinal direction, it will become unstable when the capacitor body 10 is stood up. It is difficult to bend well and may cause slight variations.

In this embodiment, in order to eliminate such a problem, a protrusion 10d is provided on the end face of the capacitor body 10 from which the anode terminal 11 and the cathode terminal 12 are drawn out, and the plane of the protrusion 10d is set such that the protrusion 10d is the maximum. By bending it so that it does not protrude beyond 10e, the anode terminal 11 and the cathode terminal 1
Due to the bending accuracy in step 2, the stability during installation is not affected, and the overall dimensional accuracy can be improved. This is because the resin exterior is formed by transfer molding, and it is possible to achieve an accuracy of about 5/1000.

4 and 5 show the state in which the chip-shaped solid electrolytic capacitor according to this embodiment is mounted on a printed circuit board 13, and as is clear from FIGS. 4 and 5, the capacitor body 10 is If the capacitor body 10 is mounted horizontally, it is similar to the above embodiment, but as shown in FIG.
When the capacitor body 10 is installed vertically, the capacitor main body 10 can be stably installed on the printed circuit board 13 by the protrusion 10d.

Here, as a modification of the chip-shaped solid electrolytic capacitor according to the present embodiment, even if it has a four-terminal structure as shown in FIG. 6, it is sufficient to similarly provide the projection 10d. The shape of 12 may also be plate-like.

Further, a protrusion 10 provided on the capacitor body 10
d is not only provided between the anode terminal 11 and the cathode terminal 12, but also an anode terminal 1 drawn out from both longitudinal end faces of the capacitor body 10 as shown in FIG.
Projections 10d may be provided on both sides of the cathode terminal 1 and the cathode terminal 12, and in this case, the mounting structure will be as shown in FIG. Furthermore, in FIGS. 7a and 7b, the anode terminal 11 and the cathode terminal 12 may be drawn out from the same end face.

As is clear from the above description, the chip-shaped solid electrolytic capacitor according to the present invention has at least two terminals, an anode and a cathode, bent along the precise end surface of the capacitor body, which is covered with resin by transfer molding. Therefore, there is little protrusion of the terminals from the capacitor body, and the overall dimensional accuracy is good, so there is no entanglement between each capacitor even when automatically supplied using a parts feeder, etc., making automatic alignment easy. Not only this, but it also becomes possible to automate polarity discrimination, front/back discrimination, etc., and improve work efficiency. In addition, in connection with this, the overall size is also reduced, and the installation area when attached to a printed circuit board can be reduced.

Furthermore, since the tip surfaces of at least two terminals, the anode and cathode, are located on the same plane as the bottom surface of the capacitor body, when mounted on a printed circuit board, it can be stably installed on that board, and Therefore, it becomes possible to automate the attachment to the printed circuit board, and it also becomes possible to temporarily fix it with adhesive, making the soldering work easier.

In addition, by adopting the structure according to the embodiment of the present invention, it is possible to install the capacitor body more stably during installation, and according to another embodiment, the degree of freedom in the mounting state during installation can be increased. You can have it.

Moreover, in the present invention, a protrusion is provided on the surface from which at least two terminals, the anode and cathode, of the capacitor body are drawn out, and the terminals are bent so that they do not protrude from the protrusion, so that the surface from which the terminals are drawn out faces down. It can be mounted stably even when mounted on a printed circuit board.

As described above, according to the present invention, it is possible to obtain a chip-shaped capacitor of high practical value that can fully meet the requirements for a chip component.

[Brief explanation of the drawing]

Figures 1 and 2 are perspective views showing conventional chip-shaped solid electrolytic capacitors, and Figures 3a and b
1 is a perspective view and a front view showing a chip-shaped solid electrolytic capacitor according to an embodiment of the present invention, FIGS. 4 and 5 are front views showing the mounting structure of the capacitor, and FIGS. 6 a, b, and 7, respectively. FIGS. 8A and 8B are a perspective view and a front view showing a chip-shaped solid electrolytic capacitor according to another embodiment of the present invention, and FIG. 8 is a front view showing the mounting structure of the capacitor shown in FIGS. 7A and 7B. 10...Capacitor body, 10a...Bottom surface, 1
0d... protrusion, 11... anode terminal, 12... cathode terminal.

Claims (1)

[Scope of utility model registration request] A capacitor body in which a capacitor element is covered with a resin layer formed by molding, and at least two terminals connected to the electrodes of the capacitor element are drawn out of the resin layer, and a surface of the capacitor body from which the terminals are drawn out. A chip-shaped capacitor comprising a protrusion provided on the surface of the capacitor, the terminal bent so as not to protrude beyond the protrusion, and a tip end surface of the terminal located on the same plane as the bottom surface of the capacitor body.