JPS6348119Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a chip-type solid electrolytic capacitor having an improved exterior shape and molded with insulating resin.

In general, this type of chip-type solid electrolytic capacitor has an anode terminal 1 and a cathode terminal 2 drawn out from opposing end faces of a capacitor body 3 molded with insulating resin, and then bent along the end faces and the bottom face, as shown in Fig. 1. The terminals are self-supporting in the same direction, making them smaller and lighter. However, the chip-type solid electrolytic capacitor thus constructed is used by soldering the bottom surfaces of the anode terminal 1 and cathode terminal 2 to a printed circuit board. However, since chip-type solid electrolytic capacitors are small and lightweight, they have the disadvantage that when soldered, they float up due to the solder and move from a predetermined position on the printed circuit board. Therefore, as shown in FIG. 2, a protrusion 7 with a flat surface that protrudes 0.1 to 0.5 mm from the bottom of both terminals 4 and 5 is integrated into the capacitor main body 6 located between the anode terminal 4 and the cathode terminal 5. When using the formed shape by soldering it to a printed circuit board, as shown in FIG.
A conceivable structure is such that it can be securely connected to a predetermined position on the printed circuit board 8 by fixing it with an adhesive 9 and then soldering it. However, since the protrusion 7 is flat and protrudes from the bottom of both the terminals 4 and 5, even if the adhesive 9 increases by a small amount from the specified amount, it overflows from the protrusion 7 and connects the bottom of the terminals 4 and 5 to the printed circuit board 8. The adhesive 9 flows out onto the soldering surface 10 and adheres to that part. Therefore, even if soldering is attempted in such a state, the soldering surface 10 and both terminals 4 and 5 will be damaged.
There was a risk that the wire would be blocked by the adhesive 9, resulting in a broken wire structure.

The present invention was developed in view of the above points, and by forming a recess at the end perpendicular to the terminal extraction surface on the bottom of the protrusion that constitutes the capacitor body, there is a risk of wire breakage when installing it on a printed circuit board. The object of the present invention is to provide a chip-type solid electrolytic capacitor that can be reliably and easily installed at a desired position without any problems.

An embodiment of the present invention will be described below with reference to the drawings. That is, as shown in FIG. 4, 11 is a solid electrolytic capacitor element molded with insulating resin to form the capacitor body, and 12 is connected to the capacitor element, pulled out from the end face of the capacitor body 11, and bent along the end face and bottom face. anode terminal, 1
Reference numeral 3 denotes a cathode terminal drawn out from the opposite end face of the anode terminal 12 extraction face of the capacitor main body 11 and bent along the end face and the bottom face; 14 is located between the opposed cathode terminal 13 and the anode terminal 12; A protrusion 15 integrally molded with the capacitor body 11 and protruding from the bottom of the anode terminal 12 and cathode terminal 13 is a recess formed at an end perpendicular to the terminal extraction surface of the bottom of the protrusion 14.

The chip-type solid electrolytic capacitor constructed as above has the anode terminal 12 and the cathode terminal 13.
When soldering the bottom surface to a printed circuit board,
Before soldering, the protrusion 14 is removed as shown in FIG.
The printed circuit board 16 is fixed in place with adhesive 17 to prevent the solder from floating up.
Since the bottom surface of the protrusion 14 has a recess 15, even if the amount of adhesive 17 increases, the recess 15 absorbs it. Furthermore, since the recess 15 is located at an end perpendicular to the terminal drawing surface of the bottom surface of the protrusion 14, the recess 15
The adhesive 17 that cannot be absorbed by the soldering means and flows out along the recessed portion 15 does not flow onto the soldered portion 18 of the printed circuit board 16, and the anode terminal 12 and the cathode terminal 13 are securely connected to the soldered portion 18 via the solder 19. This eliminates the risk of disconnection.

As described above, according to the present invention, a recess is formed at the end perpendicular to the terminal extraction surface of the bottom surface of the protrusion integrally formed on the capacitor body located between the anode terminal and the cathode terminal. Thus, it is possible to obtain a chip-type solid electrolytic capacitor that can be reliably and easily mounted at a desired position without the risk of wire breakage when mounted on a printed circuit board.

[Brief explanation of drawings]

Figures 1 to 3 relate to conventional examples; Figures 1 and 2 are perspective views showing respective chip-type solid electrolytic capacitors, and Figure 3 shows the capacitor shown in Figure 2 mounted on a printed circuit board. Front view shown, 4th
Figure 4 and Figure 5 relate to one embodiment of the present invention; Figure 4 is a perspective view showing a chip-type solid electrolytic capacitor, and Figure 5 is a front view showing the capacitor shown in Figure 4 attached to a printed circuit board. be. 11...Capacitor body, 12...Anode cathode, 13
... Cathode terminal, 14... Projection, 15... Notch.

Claims (1)

[Scope of utility model registration request] A capacitor body in which a solid electrolytic capacitor element is molded in an insulating resin, an anode terminal and a cathode terminal that are pulled out from both end faces of the capacitor body and bent along the end faces and the bottom face, and a position located between the anode terminal and the cathode terminal where they face each other. and a protrusion protruding from the bottom surface of the anode and cathode terminals integrally molded with the capacitor body, and a recess formed at an end of the bottom surface of the protrusion perpendicular to the terminal extraction surface of the capacitor body. A chip-type solid electrolytic capacitor featuring: