JPH08325705A - Film forming mask device - Google Patents

Abstract

PURPOSE: To provide a film forming mask device which allows the easy work to assemble the film forming mask device and does not degrade the film forming sate by the next vacuum vapor deposition method by residual materials. CONSTITUTION: A mask press plate 6 and an upper mask 5 are superposed on each other and the circumferences of the apertures of this mask press plate 6 are welded and joined with ion beams by using an electron beam welding device in the state of exposing the mask patterns of the upper mask from each aperture, by which weld zones W are formed to a circumferential shape. These two structures are integrated by subjecting each aperture to such welding and joining. The lower mask press plate 1, the lower mask 3 formed with the prescribed mask patterns and a spacer 4 are also integrated by executing the similar work. Quartz crystal plates B which are the bodies to be formed with films are mounted within the apertures of the spacer of the integrated matter on the lower side and the integrated matter on the upper side is superposed thereon and is screwed thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming mask device for forming an electrode material on a crystal plate, a ceramic plate or the like.

[0002]

2. Description of the Related Art For example, when physical vapor deposition of a metal material for an electrode is performed in an electrode forming step of a crystal oscillator, a mechanical mask device is used to form an electrode on a necessary portion of a crystal plate by a vacuum vapor deposition method or a sputtering method. Had formed. The vapor deposition method using this mechanical mask device is to stack plate bodies such as spacers for accommodating crystal plates, upper and lower mask plates, and other auxiliary jigs, and to integrate them by screwing or magnetic force. It has been common to use or integrate necessary mask constituent parts by spot welding and assemble two or more integrated parts by screwing or the like. As an example of a method of integrating the mask plate and the like by magnetic force, for example,
There is JP-A-4-13858.

The reason why the mask plate or the like is used in such a dividable state is that it is necessary to peel off the vapor deposition electrode material (silver, gold, aluminum, etc.) attached to the mask plate or the like. This peeling and removing work is performed by immersing in a specific cleaning liquid. The screwing method that does not use spot welding and the magnetic integration method have the advantages that this peeling and removing work can be performed easily and that the cleaning liquid or the rinse liquid used after cleaning can be completely removed. In the case of the configuration, there is a problem in manufacturing work such that the number of man-hours required for integration is increased. In addition, in the case of a magnetically joined structure, the magnets may be attracted by the magnetic force,
There are problems that the magnet part may not be cleaned sufficiently, that the magnet itself is fragile, and it is easily chipped, impurities are likely to adhere due to the increase in surface area, and impure gas adsorption is likely to occur. . Furthermore, in the configuration in which the necessary mask constituent parts are integrated by spot welding and two or more integrated parts are assembled by screwing or the like, the cleaning liquid and the rinse liquid used during the peeling removal work of the vapor deposition electrode material adhering to the mask plate etc. It remains between the mask and the mask holding plate, and when used in a vacuum deposition operation as a film forming mask device in this state, this residue is vaporized and released as an impurity harmful to the film forming, resulting in deterioration of film forming quality. There was a problem.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and facilitates the assembly work of the film forming mask device, and at the time of cleaning the film forming mask device, there is no residue. It is an object of the present invention to provide a film formation mask device that hardly remains and does not deteriorate the film formation state by the next vacuum vapor deposition method.

[0005]

In order to solve the above-mentioned problems, the film formation mask apparatus according to the present invention has a storage hole for storing a plurality of film formation targets as described in claim 1. , A spacer made of a magnetic material in which the film formation target is housed in the housing hole, an upper mask closely arranged on the upper surface of the spacer and having an upper mask pattern for film formation, and a lower surface of the spacer. A lower mask closely arranged and having a lower mask pattern for film formation and an upper and lower surfaces of these upper and lower masks closely arranged and having openings for exposing the mask patterns formed on the respective masks. Upper and lower mask pressing plates are provided, the upper mask pressing plate and the upper mask are integrated by welding, and the lower mask pressing plate and the lower mask are integrated by welding. , In the deposition mask device with a welded joint to either of the spacer upper mask or lower mask, it is characterized in that the welded joint around at least the opening of the mask holding plate. Of course, the welded joint may be formed not only around the opening but also around the entire circumference of the film forming mask device. Ion beam welding, laser welding, or the like may be used as the welding method.

[0006]

According to the first aspect of the present invention, since at least the periphery of the opening of the mask pressing plate is welded and joined, a cleaning liquid is used in the work of peeling and removing the vapor deposition electrode material (silver, gold, aluminum, etc.) adhering to the mask plate and the like. As a result, it becomes difficult for the rinsing liquid to enter between the constituent elements of the film forming mask device through the openings, and the amount of impurities remaining becomes extremely small. In addition, since the necessary assembly is performed by welding in advance, the workability of the mask assembly becomes extremely good.

[0007]

【Example】

First Embodiment An embodiment according to the present invention will be described with reference to the drawings, taking electrode formation of a monolithic crystal filter as an example. FIG. 1 is an exploded perspective view showing a film forming mask device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing a configuration in which the respective constituent parts of FIG. 1 are welded and joined, and FIG. 3 is an opening. FIG. 4 is a partially enlarged cross-sectional view showing a state in which the periphery of the portion is welded and joined, and FIG. 4 is a cross-sectional view taken along the line AA of FIG.

The film forming mask device is provided with a mask pressing lower plate 1, a lower mask 3, a spacer 4, an upper mask 5, from the bottom.
It consists of a mask pressing plate 6. The lowermost mask pressing lower plate 1 has a thickness of, for example, 1.5 mm and is made of a metal plate such as SUS-430. The mask retainer lower plate 1 is provided with female screw portions 13 and 14 for positioning and fixing each integrated product, which will be described later, at both ends in the longitudinal direction, and openings 11 to expose the lower mask pattern of the lower mask described above. Are formed in plural. On the upper surface of the lower pressing plate 1, a lower mask 3 made of a metal plate such as SUS-403 and having a thickness of 0.05 mm is closely arranged. A plurality of lower mask patterns 31, ... Corresponding to predetermined positions of a plurality of crystal plates B, which will be described later, are formed on the lower mask 3 for each crystal plate. A spacer 4 is arranged in close contact with the upper surface of the lower mask 3. The spacer 4 has, for example, a thickness of 0.05 mm, is made of a metal plate such as SUS-430, and is provided with openings 41, ... For positioning and storing a plurality of crystal plates B at predetermined intervals. On the upper surface of the spacer 4, an upper mask 5 made of a metal plate and having a thickness of 0.05 mm is closely arranged. On the upper mask 5, a plurality of upper mask patterns 51, ... Corresponding to predetermined positions on the crystal plate B are formed corresponding to each crystal plate. A mask holding plate 6 made of a metal plate and having a thickness of 1.0 mm is arranged at the uppermost portion. The mask holder 6 has a plurality of openings 61, ... That expose the upper mask pattern of the upper mask.

As shown in FIG. 2, the mask pressing plate 6 and the upper mask 5 are overlapped with each other, and the mask pattern of the upper mask is exposed from each opening of the mask pressing plate 6,
As shown in FIG. 3, an electron beam welding apparatus 7 is used to form a welded portion W circumferentially around the opening with an ion beam EB, and welded. Welded portions are shown by dotted lines around the openings in FIGS. 2 and 3. By applying this welded joint to each opening, the two components are united. The mask holding lower plate 1, the lower mask 3, and the spacer 4 are also integrated by performing the same work.

As shown in FIG. 4, a crystal plate B, which is a film formation target, is mounted in the opening of the spacer of the lower integrated product, and the upper integrated product is formed into the upper mask pattern 5 of the upper mask. The upper side so as to correspond to the upper surface of the crystal plate B,
Put the lower side on top of each other and connect the male screws 2 and 2 to the screw through holes 3
Masking can be performed by penetrating and tightening 4,44,54,64. By performing physical vapor deposition on such a film forming mask device by a vacuum vapor deposition method, a sputtering method, or the like, a film formation body (crystal plate) having a desired film formation pattern can be obtained.

Second Embodiment A second embodiment according to the present invention will be described with reference to the drawings.
FIG. 5 is a perspective view showing an upper mask and a mask pressing plate of the film forming mask device. The same structural parts as those of the first embodiment will be described with the same numbers, and a part of the description will be omitted.

The mask pressing plate 6 and the upper mask 5 are overlapped with each other, and the periphery of each opening 61 is welded to form a welded portion W, and the periphery of the mask pressing plate is also welded to form a welded portion W. It is integrated by that. With this configuration, it is possible to suppress the intrusion of impurities from the outer peripheral portion. In these examples, the circumferential welded joint provided in the opening or the like is provided as close to the opening as possible so that there is no room for impurities to accumulate, so that the effect of the present invention can be easily obtained.

In each of the above-described embodiments, a crystal plate is used as the film formation target and a crystal filter is taken as an example. However, other piezoelectric vibrators may be used, and a wide range of film formation such as electrode formation of electronic parts is possible. It can be applied to a formed body.

[0014]

According to the first aspect of the present invention, since at least the periphery of the opening of the mask pressing plate is welded and joined, the vapor deposition electrode material (silver, gold, aluminum, etc.) adhering to the mask plate or the like is peeled and removed. In the work, the cleaning liquid and the rinse liquid are less likely to enter between the film forming mask device constituent elements through the openings, and the residual impurities are extremely reduced. Therefore, in the next vacuum vapor deposition method, a gas that is harmful to film formation due to a residue is not generated, and a film formation mask device that obtains a good film formation state can be obtained. In addition, since the necessary assembly is performed by welding in advance, the workability of the mask assembly becomes extremely good.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment.

FIG. 2 is a perspective view showing a first embodiment.

FIG. 3 is a view showing a manufacturing state.

4 is a cross-sectional view taken along the line AA when the respective components of the film formation mask of FIG. 1 are assembled.

FIG. 5 is a perspective view showing a second embodiment.

[Explanation of symbols]

 1 Mask holding lower plate 2 Male screw 3 Lower mask 4 Spacer 5 Upper mask 6 Mask holding plate

Claims (1)

[Claims] 1. A spacer made of a magnetic material in which a storage hole for storing a plurality of film formation targets is formed and the film formation target is stored in the storage hole, and the spacer is closely arranged on the upper surface of the spacer. An upper mask on which an upper mask pattern for film formation is formed, and a lower mask on which a lower mask pattern for film formation is formed, which is closely arranged on the lower surface of the spacer,
The upper and lower mask holding plates are closely arranged on the upper and lower surfaces of the upper and lower masks and have upper and lower mask holding plates having openings for exposing the mask patterns formed on the respective masks. In the film forming mask device, the lower mask holding plate and the lower mask are integrated by welding, and the spacer is welded to either one of the upper mask and the lower mask. A film forming mask device, wherein at least the periphery of the opening is welded and joined.