JP2008169414A - Jig for film deposition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for film deposition where a film deposition pattern in which all the periphery is connected such as a frame shape and a ring shape can be formed. <P>SOLUTION: The jig for film deposition is provided with: a base member 20 capable of being mounted with a crystal wafer 10; a guide member 30 mounted on the base member 20 and having an opening part 31 from which at least a part of the crystal wafer 10 can be exposed; a mask member 40 whose profile is smaller than that of the opening part 31 and arranged so as to be provided with a gap over all the periphery from the edge of the opening part 31 within the opening part 31 viewed from the above; and a bridge member 50 joining the guide member 30 and the mask member 40. In the bridge member 50, the part arranged on the gap viewed from the side face is arranged at the part upper than the lower face 41 confronted with the base member 20 in the mask member 40 at prescribed intervals. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a film forming jig for forming a film forming pattern on a film forming body.

Conventionally, a photolithography method has been generally used when processing a shape of a thin piezoelectric element plate. That is, a metal film is formed on the entire piezoelectric element plate by vapor deposition or the like, and a resist film is formed on the entire metal film. Next, the resist film is exposed and developed with a desired pattern to form a resist mask. Thereafter, the piezoelectric element plate is processed into the desired pattern by an etching process. Finally, the metal film and the resist film remaining on the piezoelectric element plate are peeled and removed. However, when the photolithography method as described above is employed, there is a problem that the number of devices used increases and the manufacturing process becomes complicated. Therefore, a method has been devised in which the piezoelectric element plate is simply processed by vapor deposition or sputtering instead of the photolithography method. For example, in Patent Document 1, in a method of manufacturing a piezoelectric element plate used for a piezoelectric vibrator, a piezoelectric element plate having a reinforcing portion having a plate thickness larger than the vibrating portion is processed around a vibrating portion having a thin plate thickness. A method is disclosed. In this etching process of the piezoelectric element plate, a method is described in which a metal film is formed on the piezoelectric element plate by vapor deposition, and a portion of the piezoelectric element plate that is not covered with the metal film is etched. In Patent Document 1, a film forming jig is used when forming the metal film.
Specifically, the film forming jig of Patent Document 1 has a spacer for housing a plurality of piezoelectric element plates, and a pattern that is disposed on both the front and back surfaces of the spacer and covers the vibrating portion of the piezoelectric element plate. Provide a mask. The mask includes a circular hole portion that is slightly larger than the piezoelectric element plate, a covering portion that covers the vibrating portion of the piezoelectric element plate, and a bridge portion that connects the outer edge of the circular hole portion and the covering portion.

Japanese Patent Laid-Open No. 10-12944

The film-forming jig covers the vibrating part of the film-forming body with the covering part and is connected to the covering part in a state where the spacer and the mask are attached to the piezoelectric base plate (hereinafter referred to as the film-forming body). The bridge portion covers a part of the film formation target.
Thereby, the film-forming jig can form a film-forming pattern of the metal film on the film-formed body by vapor deposition, except for the portions covered with the covering portion and the bridge portion.

  However, since the film-forming jig has a bridge portion that holds the covering portion, a metal film is not formed under the bridge portion. Therefore, the entire circumference of the film-forming body is in a frame shape or a ring shape. The connected film formation pattern cannot be formed.

  An object of the present invention is to provide a film forming jig capable of forming a film forming pattern in which the entire circumference is connected in a frame shape or a ring shape, paying attention to the above-mentioned problems.

  In order to solve the above-mentioned problems, a film forming jig according to the present invention is a film forming jig for forming a film forming pattern on at least a part of a film forming object. A base member that can be mounted, a guide member that is placed on the base member and has an opening that can expose at least a part of the deposition target, and an outer shape that is smaller than the opening and has a plan view. And a bridge member for connecting the guide member and the mask member to each other, and a mask member disposed in the opening and having a gap from the edge of the opening to the entire circumference. The portion of the member that is disposed on the gap as viewed from the side is disposed above the surface of the mask member that faces the base member with a predetermined interval.

According to the above, in the film forming jig, the portion of the bridge member that is disposed on the gap is disposed above the surface of the mask member that faces the base member with a predetermined interval.
From this, the film-forming jig can cause the material of the film-forming pattern to go around between the bridge member and the film-forming body when forming the film-forming pattern on the film-forming body.
Thereby, the film-forming jig of the present invention can form a film-forming pattern in which the entire circumference is connected in a frame shape.

  In the film forming jig according to the present invention, the predetermined interval is such that when the film forming pattern is formed, the material of the film forming pattern wraps around below the bridge member. Features.

According to the above, the film forming jig has a predetermined size so that when the film forming pattern is formed, the material of the film forming pattern wraps around below the bridge member. When the film formation pattern is formed on the film body, the material of the film formation pattern can be interposed between the bridge member and the film formation target.
Thereby, the film-forming jig of the present invention can form a film-forming pattern in which the entire circumference is connected in a frame shape.

  In the film forming jig according to the present invention, the bridge member has elasticity, and the mask member is formed so as to be able to press the film forming body.

According to the above, the film-forming jig can prevent the mask member from being lifted from the film-forming body by the mask member pressing the film-forming body by the elasticity of the bridge member.
Thereby, the film-forming jig can form a film-forming pattern having no outline blur on the film-forming body.

  The film forming jig according to the present invention is characterized in that the mask member, the guide member, and the bridge member are integrally formed in a plate shape.

Thereby, the film-forming jig can reduce the number of manufacturing steps by, for example, integrally forming the outer shape and the plate thickness by etching the plate material.
In addition, since the above-mentioned members are integrally formed in the film-forming jig, a step of assembling the members while aligning them becomes unnecessary, so that the positional accuracy of each member is improved.

  Hereinafter, an embodiment of a film forming jig according to the present invention will be described with reference to a film forming jig for forming a film forming pattern such as a metal film on a crystal wafer as a film forming body by vapor deposition or sputtering. To do.

(First embodiment)
"Constitution"
FIG. 1 is a configuration diagram showing a schematic configuration of a film forming jig according to the first embodiment. FIG. 1A is a developed perspective view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 1B shows a state in which a crystal wafer is mounted on a film forming jig for easy understanding of the configuration.

As shown in FIG. 1, the film forming jig 1 includes a base member 20, a guide member 30, a mask member 40, and a bridge member 50.
The base member 20 is made of a metal plate such as stainless steel, and a concave portion 21 slightly larger than the quartz wafer 10 as a film forming body is formed in the vicinity of the center. The crystal wafer 10 is placed in the recess 21.

  The base member 20 may be formed of a laminated structure of a flat plate and a thin plate having a through hole slightly larger than the quartz wafer 10 in the vicinity of the center.

  The guide member 30 is made of a metal plate such as stainless steel and is placed on the base member 20. In the vicinity of the center of the guide member 30, an opening 31 is formed slightly larger than the outer shape of the crystal wafer 10. When the crystal wafer 10 is mounted on the film forming jig 1, at least one of the crystal wafer 10 is formed. The part can be exposed.

The mask member 40 is made of a metal plate such as stainless steel, and has an outer shape smaller than the opening 31 of the guide member 30. The mask member 40 is disposed in the opening 31 in a plan view with a gap from the edge of the opening 31.
As will be described later, the outer shape of the mask member 40 is determined by the shape of the film forming pattern 11 formed on the quartz wafer 10.

The bridge member 50 is made of a metal wire such as stainless steel. The bridge member 50 joins the guide member 30 and the mask member 40 by joining one end to the guide member 30 and joining the other end to the mask member 40 by means such as welding.
As shown in FIG. 1B, a portion of the bridge member 50 that is disposed on the gap between the guide member 30 and the mask member 40 in a side view is a lower surface facing the base member 20 of the mask member 40. It is formed in an arch shape above 41.

As a result, in a state where the crystal wafer 10 is mounted on the film forming jig 1, there is an interval between the bridge member 50 and the crystal wafer 10 so that a film formation pattern is also formed below the bridge member 50. Vacant.
Further, since the bridge member 50 is made of metal wire and has elasticity, the mask member 40 can press the crystal wafer 10 when the crystal wafer 10 is mounted on the film forming jig 1. Is formed.

《Action ・ Effect》
Here, the operation and effect of the film forming jig 1 will be described along the forming process of the film forming pattern 11 in the processing method of the crystal wafer 10.

FIG. 2 is a cross-sectional view for explaining a film forming pattern forming process on a quartz wafer using a film forming jig. FIG. 3 is a perspective view of a crystal wafer on which a film formation pattern is formed.
In FIG. 2A, first, the crystal wafer 10 is placed in the recess 21 of the base member 20. The quartz wafer 10 is previously formed in a predetermined shape, thickness, and surface state. In this embodiment, the thickness of the quartz wafer 10 is about 100 μm, and the surface is mirror-finished. In addition, the thickness and surface state of the quartz wafer 10 are not limited to this, and are appropriately set according to the application.

Next, in FIG. 2B, the guide member 30 is placed on the base member 20 by being aligned by an alignment unit (not shown) so that at least a part of the crystal wafer 10 is exposed from the opening 31. To do.
In this state, the mask member 40 presses the crystal wafer 10 by the elasticity of the bridge member 50. Therefore, the lower surface 41 of the mask member 40 is in close contact with the crystal wafer 10.
In this state, a sufficient interval is formed between the bridge member 50 and the quartz wafer 10.

Next, a metal film such as Cr / Au is formed on the film formation jig 1 by a vapor deposition apparatus or a sputtering apparatus (not shown) to form a film formation pattern 11.
Since there is a gap between the bridge member 50 and the quartz wafer 10, for example, when forming the film formation pattern 11 using a vapor deposition apparatus, the film formation material can be obtained by tilting or rotating the vapor deposition jig. Goes around the bridge member 50 from both sides.
Therefore, by changing the vapor deposition direction as described above, the film formation pattern 11 is also formed in the lower part of the bridge member 50 on the crystal wafer 10.

  Further, since the mask member 40 is in close contact with the crystal wafer 10, the mask member 40 is not lifted from the crystal wafer 10, and the film forming pattern 11 is in a state in which the outline of the boundary portion between the mask member 40 and the opening 31 is not blurred. Formed with.

Next, after removing the guide member 30 from the base member 20, the crystal wafer 10 on which the film formation pattern 11 is formed is taken out.
As shown in FIG. 3, in the crystal wafer 10, a film formation pattern 11 is formed on the outer periphery of the central portion 12 covered with the mask member 40 so that the entire periphery is connected in a frame shape.

As described above, the conventional film-forming jig cannot form a film-forming pattern in the portion covered with the bridge portion. However, the film-forming jig 1 of the first embodiment is a bridge. A film forming pattern can be formed also in the lower part of the part, and a frame-shaped film forming pattern 11 can be formed on the crystal wafer 10.
In addition, the film forming jig 1 of the first embodiment can form a film forming pattern 11 having no outline blur on a crystal wafer 10.

For example, the following crystal wafer 10 can be etched using the film forming pattern 11 formed on the crystal wafer 10 by the film forming jig 1 described above.
4A and 4B are cross-sectional views of the crystal wafer in a state before and after performing etching, FIG. 4A is a cross-sectional view before etching, and FIG. 4B is a cross-sectional view after etching.

As shown in FIG. 4A, first, a film formation pattern 11 is formed on the crystal wafer 10 using the above-described method. Thereafter, a corrosion resistant film 13 such as a Cr / Au film is formed on each surface of the quartz wafer 10 other than the surface on which the film formation pattern 11 is formed.
As a result, the crystal wafer 10 is masked by the film formation pattern 11 and the corrosion-resistant film 13 except for the central portion 12 of the crystal wafer 10.

Next, the quartz crystal wafer 10 is immersed in an etching solution such as hydrofluoric acid or a mixed solution of hydrofluoric acid and ammonium fluoride, and the central portion 12 is etched to a predetermined thickness.
Thereby, as shown in FIG.4 (b), the center part 12 of the crystal wafer 10 can be etched to thickness of several tens of micrometers-several micrometers. In the present embodiment, the crystal wafer 10 is etched so that the thickness of the central portion 12 is 4 μm to 8 μm.
Further, as described above, the wall surface 15 of the quartz wafer 10 is etched substantially smoothly because the film formation pattern 11 is not blurred and its contour 14 is sharply formed.

Next, the quartz wafer 10 is immersed in a strip solution to peel off the film forming pattern 11 and the corrosion-resistant film 13, and after peeling, the quartz wafer 10 is washed with pure water and dried.
Thereby, it is possible to obtain the crystal wafer 10 in which the central portion 12 is thin.

(Second Embodiment)
Next, a film forming jig of the second embodiment will be described with reference to FIG.
FIG. 5 is a configuration diagram showing a schematic configuration of the film forming jig of the second embodiment. FIG. 5A is a developed perspective view, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. FIG. 5 shows a state in which a crystal wafer is set for easy understanding of the configuration. Also, the same reference numerals are given to common parts with the first embodiment.

  The film forming jig 101 according to the second embodiment is different from the film forming jig 1 according to the first embodiment in the configuration of the guide member 130, the mask member 140, and the bridge member 150. It is common. For this reason, here, it demonstrates centering on the effect | action and effect peculiar to said structure and said structure.

"Constitution"
As shown in FIG. 5, the film forming jig 101 includes a base member 20, a guide member 130, a mask member 140, and a bridge member 150. The guide member 130, the mask member 140, and the bridge member 150 are integrally formed in a plate shape as will be described later by processing the outer shape and thickness by etching or the like using a metal plate such as stainless steel. ing.

  The guide member 130 has an opening 131 formed in the vicinity of the center by etching or the like, and is placed on the base member 20. The opening 131 of the guide member 130 is formed slightly larger than the outer shape of the crystal wafer 10, and at least a part of the crystal wafer 10 can be exposed in a state where the crystal wafer 10 is set on the film forming jig 101. It has become.

The mask member 140 has an outer shape smaller than the opening 131 of the guide member 130 by etching or the like. The mask member 140 is disposed in the opening 131 in a plan view with a gap from the edge of the opening 131.
The size of the outer shape of the mask member 140 is determined by the shape of the film forming pattern 11 formed on the quartz wafer 10.

The bridge member 150 is disposed between the guide member 130 and the mask member 140, and is formed integrally with the guide member 130 and the mask member 140 by etching or the like.
The bridge member 150 is formed at a distance from the lower surface 141 above the lower surface 141 of the mask member 140 facing the base member 20 by half-etching from the base member 20 side in the thickness direction.

As a result, in a state where the crystal wafer 10 is set on the film forming jig 101, there is a gap between the bridge member 150 and the crystal wafer 10.
Further, the bridge member 150 has elasticity by being thinly formed by half etching, and the mask member 140 presses the crystal wafer 10 in a state where the crystal wafer 10 is set on the film forming jig 101. It is formed so that it can be.

《Action ・ Effect》
Here, the operation and effect of the film forming jig 101 of the second embodiment will be described with reference to FIGS.
Using the film-forming jig 101 of the second embodiment, the same processing method as that of the first embodiment is applied to the crystal wafer 10 on the film-forming jig 101 by a vapor deposition apparatus, a sputtering apparatus, or the like (not shown). Then, a metal film such as Cr / Au is formed to form a film formation pattern 11 as shown in FIG.

As shown in FIG. 5B, since the film-forming material goes under the bridge member 150 due to the space between the bridge member 150 and the crystal wafer 10, the film-forming pattern 11 has a crystal pattern. Also formed on the lower portion of the bridge member 150 of the wafer 10.
Further, since the mask member 140 does not float from the crystal wafer 10 because the bridge member 150 has elasticity, the film forming pattern 11 is formed without blurring the outline of the boundary portion between the mask member 140 and the opening 131.

  From these things, the film-forming jig 101 of the second embodiment can form the film-forming pattern 11 that is connected to the crystal wafer 10 in a frame shape without any blurring of the outline. .

As described above, the film forming jig 101 of the second embodiment uses a metal plate such as stainless steel, and the guide member 130, the mask member 140, and the bridge member 150 are integrally formed in a plate shape. Yes.
Therefore, the number of manufacturing steps can be reduced by integrally forming the film forming jig 101 by a general processing method such as etching.

  Further, the film forming jig 101 of the second embodiment is a process of assembling while aligning the above three members because the guide member 130, the mask member 140, and the bridge member 150 are integrally formed in a plate shape. Therefore, the positional accuracy between the members can be improved.

The preferred embodiments of the present invention have been described in detail above. However, as will be apparent to those skilled in the art, the present invention can be implemented by adding various changes and modifications to the above embodiments within the technical scope thereof.
For example, in the first and second embodiments, the bridge members 50 and 150 are elastic. However, the present invention is not limited to this and may not have elasticity.
In the first and second embodiments, the external shapes of the crystal wafer 10 and the mask members 40 and 140 are illustrated as squares. However, the present invention is not limited to this, and may be circular or elliptical depending on the manufacturing method or application. It may be an external shape such as a shape or a polygon.

  In the first and second embodiments, the deposition target is the quartz wafer 10, but the present invention is not limited to this. For example, lithium tantalate, lithium niobate, quartz, silicon, borosilicate glass, etc. Good.

A thin quartz wafer manufactured by the film-forming jig of the present invention can be processed into an optical component. For example, it can be applied to a liquid crystal projector and used as a high viewing angle film.
The thin quartz wafer manufactured by the film-forming jig of the present invention can be used for a quartz crystal resonator. For example, it can be processed into a vibrating piece that vibrates in a thickness-slip mode.

The block diagram which shows schematic structure of the jig | tool for film-forming in the 1st Embodiment of this invention. Sectional drawing which shows the formation process of the film-forming pattern using the jig | tool for film-forming in the 1st Embodiment of this invention. The perspective view which shows the film-forming pattern which concerns on the 1st, 2nd embodiment of this invention. Sectional drawing which shows the state before and behind the etching of a crystal wafer. The block diagram which shows schematic structure of the jig | tool for film-forming in the 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Film-forming jig | tool, 10 ... Crystal wafer as a to-be-deposited body, 20 ... Base member, 30 ... Guide member, 31 ... Opening part of guide member, 40 ... Mask member, 41 ... Base member of mask member Opposing lower surface, 50... Bridge member.

Claims (4)

In a film-forming jig for forming a film-forming pattern on at least a part of a film-forming body,
A base member on which a film-forming body can be placed;
A guide member mounted on the base member and having an opening capable of exposing at least a part of the deposition target;
A mask member having an outer shape smaller than the opening, in the opening in plan view, and provided with a gap from the edge of the opening over the entire circumference; and
A bridge member that couples the guide member and the mask member,
A portion of the bridge member that is disposed on the gap in a side view is disposed above the surface of the mask member that faces the base member with a predetermined interval. Deposition jig.   2. The film forming pattern according to claim 1, wherein the predetermined interval has a size that allows a material of the film forming pattern to wrap around the bridge member when the film forming pattern is formed. jig.   The film-forming jig according to claim 1, wherein the bridge member has elasticity, and the mask member is formed so as to press the film-forming target.   The film-forming jig according to claim 1, wherein the mask member, the guide member, and the bridge member are integrally formed in a plate shape.

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