JP2022013096A - Film deposition mask jig and film deposition apparatus - Google Patents

Abstract

To suppress fall into an opening, of an object to be deposited.SOLUTION: A film deposition mask jig 270 includes a housing part 273 for housing an object to be deposited, a mask part 274 positioned under the object to be deposited at a deposition time, for preventing deposition on a non-film deposition region of the object to be deposited, and a fall suppression member 275 provided on a position out of contact with the object to be deposited in the state where the object to be deposited is housed in the housing part 273, in an opening where the mask part 274 is not provided, for suppressing fall of the object to be deposited.SELECTED DRAWING: Figure 13

Description

The present invention relates to a film forming mask jig and a film forming apparatus used when forming a film to be formed.

A film forming apparatus for forming a film on a film to be filmed is known.

As an example of such a film forming apparatus, Patent Document 1 describes a film forming chamber, a film forming source, and a film to be formed in the film forming chamber, passing above the film forming source while facing the film forming source. As described above, a film forming apparatus including a transporting portion for transporting a film to be filmed and a holder attached to the transporting portion and having an accommodating portion for accommodating and holding the film to be filmed is disclosed. The holder is provided with a mask portion for preventing the film to be formed on the non-deposited area of the film to be filmed. According to this film forming apparatus, the film-forming object accommodated in the accommodating portion of the holder is passed over the film-forming source by the transporting portion to form a film in a region not covered by the mask portion. Can be done.

Japanese Unexamined Patent Publication No. 2018-21220

Here, depending on the film to be filmed, the thickness may be thin. When such a thin film to be filmed is accommodated in the accommodating portion of the holder to form a film, the film to be filmed may fall into the opening not provided with the mask portion.

INDUSTRIAL APPLICABILITY The present invention solves the above-mentioned problems, and provides a film-forming mask jig capable of suppressing the falling of a film-forming object, and a film-forming apparatus provided with such a film-forming mask jig. The purpose is to do.

The film forming mask jig of the present invention is
An accommodating part for accommodating the film to be filmed and
A mask portion located below the film-deposited object at the time of film-forming to prevent film formation on the non-deposited area of the film-deposited object, and a mask portion.
In the opening where the mask portion is not provided, the film to be filmed is provided at a position where the film to be filmed is housed in the accommodating portion and does not come into contact with the film to be filmed, thereby suppressing the drop of the film to be filmed. Fall suppression member for
It is characterized by having.

The film forming apparatus of the present invention is
The film formation room and
The film formation source located inside the film formation chamber and
The above-mentioned film forming mask jig and
In the film forming chamber, the film to be filmed so that the film to be filmed housed in the accommodating portion of the mask jig for film forming passes above the film forming source while facing the film forming source. A transport unit that transports goods and
It is characterized by having.

According to the film-forming mask jig of the present invention, since the drop suppressing member is provided in the opening where the mask portion is not provided, the film-forming object is suppressed from falling downward from the opening. be able to.

According to the film forming apparatus of the present invention, since the film forming mask jig is provided with a drop suppressing member provided in the opening in which the mask portion is not provided, the film to be formed moves downward from the opening. It is possible to suppress the fall.

It is a perspective view which shows typically the appearance of the LW inversion laminated ceramic capacitor which is an example of a film-deposited object. FIG. 3 is a schematic cross-sectional view taken along line II-II of the LW inverting monolithic ceramic capacitor shown in FIG. 1. It is a flowchart for demonstrating an example of the manufacturing method of the LW inverting monolithic ceramic capacitor. It is a side view which shows typically the structure of the film forming apparatus in 1st Embodiment. FIG. 3 is a view of the film forming apparatus shown in FIG. 4 as viewed from the direction of arrow V. FIG. 3 is a view of the film forming apparatus shown in FIG. 4 as viewed from the direction of arrow VI. It is a top view which shows the shape of a part of the transport part of the film forming apparatus shown in FIG. It is a top view which shows the shape of the tray of a film forming apparatus. It is a top view which shows the shape of the film forming mask jig of the film forming apparatus. It is a perspective view which shows the X part in FIG. 9 enlarged. FIG. 10 is a schematic cross-sectional view taken along the line XI-XI of the film forming mask jig shown in FIG. FIG. 11 is a schematic bottom view of a part of the film forming mask jig shown in FIG. 11 as viewed from the direction of XII. It is a top view when the accommodating part is seen in the direction in which the film-deposited object and the mask part face each other when the film-deposited object is housed in the accommodating part. It is a top view which shows the state which the laminated body which is a film-depositing substance is accommodated in the accommodating part of the film-forming mask jig in 1st Embodiment of this invention. FIG. 14 is a cross-sectional view taken from the direction of the XV-XV line arrow in a state in which the laminated body to be film-deposited is housed in the housing portion of the film-forming mask jig shown in FIG. It is sectional drawing which shows the state which the 1st film-forming mask jig and the 2nd film-forming mask jig are turned upside down. In the film forming mask jig of the second embodiment, it is a plan view when the accommodating portion is viewed in the direction in which the film-deposited object and the mask portion face each other when the film-deposited object is accommodated in the accommodating portion. be. In the film forming mask jig according to the third embodiment, it is a plan view when the accommodating portion is viewed in the direction in which the film-deposited object and the mask portion face each other when the film-deposited object is accommodated in the accommodating portion. be. In the film forming mask jig according to the fourth embodiment, it is a plan view when the accommodating portion is viewed in the direction in which the film-deposited object and the mask portion face each other when the film-deposited object is accommodated in the accommodating portion. be.

Hereinafter, embodiments of the present invention will be shown, and the features of the present invention will be specifically described.

(Composition of multilayer ceramic capacitor)
First, the configuration of a multilayer ceramic capacitor manufactured by forming a film using the film forming mask jig and the film forming apparatus of the present invention will be described. However, the object produced by the film formation is not limited to the monolithic ceramic capacitor, and may be, for example, an electronic component other than the monolithic ceramic capacitor, or may be an electronic component other than the electronic component.

FIG. 1 is a perspective view schematically showing the appearance of the LW reversing laminated ceramic capacitor 10 which is an example of the film to be filmed. FIG. 2 is a schematic cross-sectional view taken along line II-II of the LW reversing laminated ceramic capacitor 10 shown in FIG. The LW inverting monolithic ceramic capacitor is a capacitor whose dimension L in the length direction is shorter than the dimension W in the width direction, as will be described later. In the following description, the LW inverting monolithic ceramic capacitor 10 is simply referred to as a monolithic ceramic capacitor 10.

As shown in FIGS. 1 and 2, the laminated ceramic capacitor 10 is an electronic component having a rectangular parallelepiped shape as a whole, and includes a laminated body 11 and a pair of external electrodes 14a and 14b provided on the surface of the laminated body 11. Be prepared. As shown in FIGS. 1 and 2, the pair of external electrodes 14a and 14b are provided so as to face each other.

Here, the direction in which the pair of external electrodes 14a and 14b face each other is defined as the length direction L of the laminated ceramic capacitor 10, and the direction in which the dielectric layer 12 and the internal electrodes 13a and 13b described later are laminated is the stacking direction. It is defined as T, and the direction orthogonal to both the length direction L and the stacking direction T is defined as the width direction W. Any two directions of the length direction L, the stacking direction T, and the width direction W are directions orthogonal to each other.

The size of the multilayer ceramic capacitor 10 is not particularly limited, but in the film forming mask jig and the film forming apparatus in the present embodiment, the ratio of the dimension in the lamination direction T to the dimension in the length direction L is 0.5 or less. It can be suitably used for the multilayer ceramic capacitor 10. As an example of the size of the multilayer ceramic capacitor 10, the dimension in the length direction L is 0.2 mm or more and 0.8 mm or less, the dimension in the width direction W is 0.4 mm or more and 1.6 mm or less, and the dimension in the lamination direction T is 0.05 mm. It is 0.4 mm or less. That is, in the present embodiment, the dimension of the monolithic ceramic capacitor 10 in the length direction L is shorter than the dimension in the width direction W. Further, the dimensions of the pair of external electrodes 14a and 14b in the length direction L are 0.02 mm or more and 0.4 mm or less, respectively.

When the dimension of the laminated ceramic capacitor 10 in the length direction L is longer than the dimension of the width direction W, the ratio of the dimension of the laminated direction T to the dimension of the length direction W is 0.5 or less with respect to the laminated ceramic capacitor. However, it can be preferably used. As an example of the size of such a laminated ceramic capacitor, the dimension in the length direction L is 0.2 mm or more and 1.6 mm or less, the dimension in the width direction W is 0.125 mm or more and 0.8 mm or less, and the dimension in the lamination direction T is 0. It is 0.05 mm or more and 0.4 mm or less. Further, the dimensions of the pair of external electrodes 14a and 14b in the length direction L are 0.05 mm or more and 0.5 mm or less, respectively.

The laminated body 11 has a first end surface 15a and a second end surface 15b facing the length direction L, a first main surface 16a and a second main surface 16b facing the stacking direction T, and a width direction W. It has a first side surface 17a and a second side surface 17b that face each other.

The laminated body 11 preferably has rounded corners and ridges. Here, the corner portion is a portion where the three surfaces of the laminated body 11 intersect, and the ridgeline portion is a portion where the two surfaces of the laminated body 11 intersect.

As shown in FIG. 2, the laminated body 11 includes a plurality of laminated dielectric layers 12 and a plurality of internal electrodes 13a and 13b. The internal electrodes 13a and 13b include a first internal electrode 13a and a second internal electrode 13b. More specifically, the laminated body 11 has a structure in which a plurality of first internal electrodes 13a and second internal electrodes 13b are alternately laminated via the dielectric layer 12 in the stacking direction T.

The first internal electrode 13a is drawn out to the first end surface 15a of the laminated body 11, but is not drawn out to the second end face 15b, the first side surface 17a, and the second side surface 17b. The second internal electrode 13b is drawn out to the second end surface 15b of the laminated body 11, but is not drawn out to the first end face 15a, the first side surface 17a, and the second side surface 17b. In addition to the first internal electrode 13a and the second internal electrode 13b, the laminated body 11 may include an internal electrode that is not exposed on the surface.

The first external electrode 14a is formed on the entire first end surface 15a of the laminated body 11, and from the first end surface 15a, the first main surface 16a, the second main surface 16b, and the first first surface. It is formed so as to wrap around the side surface 17a and the second side surface 17b. Specifically, the first external electrode 14a is a first base layer 141a formed on the first end surface 15a, and a second main surface 16a and a second main surface 16b formed on the first main surface 16a. A base layer 142a and a plating layer 143a covering the first base layer 141a and the second base layer 142a are provided. The first external electrode 14a may be formed so as not to wrap around the first side surface 17a and the second side surface 17b. The first external electrode 14a is electrically connected to the first internal electrode 13a.

The second external electrode 14b is formed on the entire second end surface 15b of the laminated body 11, and from the second end surface 15b, the first main surface 16a, the second main surface 16b, and the first first surface. It is formed so as to wrap around the side surface 17a and the second side surface 17b. Specifically, the second external electrode 14b is a first base layer 141b formed on the second end surface 15b, and a second main surface 16a and a second main surface 16b formed on the first main surface 16a. It includes a base layer 142b and a plating layer 143b that covers the first base layer 141b and the second base layer 142b. The second external electrode 14b may be formed so as not to wrap around the first side surface 17a and the second side surface 17b. The second external electrode 14b is electrically connected to the second internal electrode 13b.

(Manufacturing method of multilayer ceramic capacitors)
FIG. 3 is a flowchart for explaining an example of a method for manufacturing the monolithic ceramic capacitor 10. In the method of manufacturing the laminated ceramic capacitor 10 shown below, a mother laminated body is manufactured by collectively processing up to the middle stage of the manufacturing process, and then the mother laminated body is divided into individual pieces and individualized. This is a method of simultaneously mass-producing a plurality of multilayer ceramic capacitors 10 by further processing the unfired laminate after disintegration.

In step S1 of FIG. 3, a ceramic slurry is prepared. Specifically, a ceramic slurry is prepared by mixing ceramic powder, a binder, a solvent, and the like in a predetermined blending ratio.

In step S2 following step S1, a ceramic green sheet is formed. Specifically, a ceramic green sheet is formed by molding a ceramic slurry into a sheet on a carrier film using a die coater, a gravure coater, a microgravure coater, or the like.

In step S3 following step S2, a mother sheet is produced. Specifically, a mother sheet having a predetermined conductive pattern formed on the ceramic green sheet is produced by applying the conductive paste on the ceramic green sheet so as to form a predetermined pattern. The coating of the conductive paste can be performed, for example, by printing using a screen printing method, a gravure printing method, or the like. The conductive paste contains, for example, a Ni component.

In step S4 following step S3, a predetermined number of mother sheets on which the conductive pattern is not formed are laminated, and a plurality of mother sheets on which the conductive pattern is formed are laminated, and the conductive pattern is formed on the plurality of mother sheets. A mother sheet group is produced by laminating a predetermined number of unfinished mother sheets.

In step S5 following step S4, a mother laminated body is produced by crimping the mother sheet group. For example, a hydrostatic press or a rigid body press is used to press the mother sheets in the stacking direction for crimping.

In step S6 following step S5, the mother laminated body is cut off by a cutting method such as dicing, laser, or the like to be individualized into a plurality of unfired laminated bodies.

In step S7 following step S6, the unfired laminate is barrel-polished. Specifically, the unfired laminate is enclosed in a small box called a barrel together with a media ball having a hardness higher than that of the ceramic material, and the barrel is rotated. As a result, the corners and ridges of the outer surface of the unfired laminate are rounded in a curved surface.

In step S8 following step S7, a conductive paste serving as a first base layer 141a and 141b of the first external electrode 14a and the second external electrode 14b is applied to the surface of the unfired laminate. Specifically, the conductive pastes to be the first base layers 141a and 141b are applied to both end faces of the unfired laminate by various printing methods or dipping methods. This conductive paste contains, for example, an organic solvent, metal particles and ceramic. The metal particles include, for example, a Ni component.

In step S9 following step S8, the unfired laminate having the conductive paste applied to the surface is fired. By firing the unfired laminate, the ceramic dielectric material and the conductor material are fired. The firing temperature is appropriately set according to the type of the ceramic dielectric material and the conductor material, and is, for example, a temperature in the range of 900 ° C. or higher and 1300 ° C. or lower. By firing the unfired laminate, the laminate 11 is obtained.

In step S10 following step S9, the laminate 11 obtained by firing is barrel-polished.

In step S11 following step S10, the second base layers 142a and 142b are formed on the first main surface 16a of the laminated body 11 by a dry plating method such as sputtering. The formation of the second base layers 142a and 142b can be performed by using the film forming apparatus of the present invention described later. The second base layers 142a and 142b are made of, for example, a pure metal or alloy such as nichrome (NiCr), monel (NiCu), titanium (Ti), copper (Cu), or silver (Ag).

In step S12 following step S11, the second base layers 142a and 142b are formed on the second main surface 16b of the laminated body 11 by a dry plating method such as sputtering. The formation of the second base layers 142a and 142b can be performed by using the film forming apparatus of the present invention described later.

In step S13 following step S12, the plating layer 143a is formed so as to cover the first base layer 141a and the second base layer 142a by the plating treatment. Similarly, the plating layer 143b is formed so as to cover the first base layer 141b and the second base layer 142b. By forming the plating layers 143a and 143b, the first external electrode 14a and the second external electrode 14b are configured. The plating layers 143a and 143b contain, for example, a Cu component.

The monolithic ceramic capacitor 10 is manufactured by the above-mentioned process.

(Film formation device)
<First Embodiment>
Hereinafter, the configurations of the film forming apparatus 200 and the film forming mask jig 270 according to the first embodiment of the present invention will be described. The film forming apparatus 200 is a sputtering apparatus. However, the film forming apparatus 200 is not limited to the sputtering apparatus, and may be an apparatus for performing other dry plating such as thin film deposition and ion plating.

FIG. 4 is a side view schematically showing the configuration of the film forming apparatus 200 according to the first embodiment. FIG. 5 is a view of the film forming apparatus 200 shown in FIG. 4 as viewed from the direction of arrow V. FIG. 6 is a view of the film forming apparatus 200 shown in FIG. 4 as viewed from the direction of arrow VI. FIG. 7 is a plan view showing a part of the shape of the transport portion 250 of the film forming apparatus 200 shown in FIG. FIG. 8 is a plan view showing the shape of the tray 260 of the film forming apparatus 200. FIG. 9 is a plan view showing the shape of the film forming mask jig 270 of the film forming apparatus 200. FIG. 10 is an enlarged perspective view showing a portion X in FIG. 9. FIG. 11 is a schematic cross-sectional view taken along the line XI-XI of the film forming mask jig 270 shown in FIG. FIG. 12 is a schematic cross-sectional view taken along the line XII-XII of the film forming mask jig 270 shown in FIG. FIG. 13 is a schematic bottom view of a part of the film forming mask jig 270 shown in FIG. 11 as viewed from the direction of XIII. In FIG. 9, the mask portion 274 and the drop suppressing member 275, which will be described later, are omitted from the film forming mask jig 270 for easy understanding.

As shown in FIG. 4, the film forming apparatus 200 includes a film forming chamber 220, a first decompression chamber 210 provided adjacent to the film forming chamber 220, and a second film forming chamber 220 provided adjacent to the film forming chamber 220. It is provided with the decompression chamber 230 of 2. The first decompression chamber 210 and the second decompression chamber 230 may be omitted.

The first decompression chamber 210 is provided with a first vacuum pump 211 that depressurizes the inside of the first decompression chamber 210. The film forming chamber 220 is provided with a second vacuum pump 221 that reduces the pressure inside the film forming chamber 220. The second vacuum chamber 230 is provided with a third vacuum pump 231 for depressurizing the inside of the second vacuum chamber 230. The air pressure inside the film forming chamber 220 is lower than that inside each of the first decompression chamber 210 and the second decompression chamber 230, and the inside is in a substantially vacuum state.

The film forming apparatus 200 further includes a conveying unit 250 for passing the object to be conveyed in the order of the first decompression chamber 210, the film forming chamber 220, and the second decompression chamber 230. A plurality of rollers 280 that support the transport unit 250 are arranged at intervals from each other along the transport direction Y1 of the transport unit 250. In the present embodiment, the transport unit 250 is composed of a belt conveyor. However, the transport unit 250 is not limited to the belt conveyor, and may be a trolley or the like traveling on the rail.

As shown in FIG. 6, the transport portion 250 is supported by the rollers 280 so as to be positioned at an angle α with respect to the horizontal direction. The angle α is greater than 0 °, for example 5 °. As shown in FIG. 7, the transport portion 250 is provided with a rectangular opening 251 in a plan view and a rectangular counterbore portion 252 located on the outer periphery of the opening 251 in a plan view. The openings 251 and counterbore 252 are provided at equal intervals in the longitudinal direction of the belt conveyor.

As shown in FIG. 4, in the transport direction Y1 of the object to be transported by the transport unit 250, a first shutter 240 that opens and closes in the vertical direction is provided at the inlet of the first decompression chamber 210. A second shutter 241 that opens and closes in the vertical direction is provided at the boundary between the first decompression chamber 210 and the film forming chamber 220. A third shutter 242 that opens and closes in the vertical direction is provided at the boundary between the film forming chamber 220 and the second decompression chamber 230. A fourth shutter 243 that opens and closes in the vertical direction is provided at the outlet of the second decompression chamber 230. Each of the shutters 240 to 243 is in an open state only when the object to be transported by the transport unit 250 passes, and is in a closed state at other times.

A film forming source is arranged inside the film forming chamber 220. In the present embodiment, the first target 222, the second target 223, and the third target 224 are arranged as the film forming source. The first target 222, the second target 223, and the third target 224 are located vertically below the transport unit 250 in the film forming chamber 220, and the transport direction of the object to be transported by the transport unit 250. They are arranged in a row along Y1. In the film forming chamber 220, the transport unit 250 faces the target 222, 223, and 224 above the first target 222, the second target 223, and the third target 224. The film to be filmed is conveyed so as to pass through. The number of targets to be arranged is not limited to three, and may be one or more.

Each of the first target 222, the second target 223, and the third target 224 has a plate-like outer shape when viewed in the direction of the arrow V in FIG. The first target 222, the second target 223, and the third target 224 are parallel to the film forming mask jig 270 attached to the transport portion 250 in an inclined state as shown in FIG. 6, respectively. It is tilted like.

From the first target 222, the second target 223, and the third target 224, a raw material for forming a film on a film to be formed is sprayed. As an example, the raw material to be sprayed is metal particles made of a pure metal or alloy such as nichrome (NiCr), monel (NiCu), titanium (Ti), copper (Cu) or silver (Ag).

In the present embodiment, the tray 260 shown in FIG. 8 is arranged in the countersunk portion 252 of the transport portion 250. The tray 260 has a rectangular outer shape slightly smaller than the countersunk portion 252 of the transport portion 250 in a plan view. The tray 260 is provided with a rectangular opening 261 in a plan view and a rectangular counterbore portion 262 located on the outer periphery of the opening 261 in a plan view. In the present embodiment, the tray 260 is provided with six openings 261 and counterbore portions 262 in a matrix. In the state where the tray 260 is arranged in the countersunk portion 252 of the transport portion 250, each of the six openings 261 of the tray 260 is located on the opening 251 of the transport portion 250.

As shown in FIG. 5, the film forming mask jig 270 is arranged in the countersunk portion 262 of the tray 260. The film forming mask jig 270 has a rectangular outer shape slightly smaller than the countersunk portion 262 of the tray 260 in a plan view. As shown in FIG. 9, in a plan view, the outer periphery of the film forming mask jig 270 is composed of a pair of first sides 272a parallel to each other and a pair of second sides 272b parallel to each other. The tray 260 may not necessarily be provided, and the film forming mask jig 270 may be directly arranged in the countersunk portion 252 of the transport portion 250.

As shown in FIGS. 9 to 13, the film forming mask jig 270 is located in the accommodating portion 273 for accommodating the film to be filmed and below the film to be filmed at the time of film formation, and the film to be filmed is not formed. A mask portion 274 for preventing film formation on the film region and a drop suppressing member 275 for suppressing the drop of the film to be filmed are provided. In order to realize such a configuration, the film forming mask jig 270 includes a frame member 272 constituting the inner wall of the accommodating portion 273 and a masking member 271 adjacent to the frame member 272, as shown in FIG. include.

As shown in FIG. 9, the frame member 272 has a rectangular plate-like outer shape in a plan view. The outer shape of the frame member 272 is composed of a pair of first sides 272a parallel to each other and a second side 272b parallel to each other in a plan view. That is, in a plan view, the outer shape of the frame member 272 and the outer shape of the film forming mask jig 270 are the same.

In a plan view, the inner wall constituting the accommodating portion 273 includes a pair of first side 272ha facing each other and a pair of second sides 272hb facing each other, and has a substantially rectangular shape as a whole. However, the four corners of the inner wall are subjected to a slimming process, and a semicircular notch 272hc is provided.

The fall suppressing member 275 is provided at a position in the opening where the mask portion 274 is not provided, at a position where the film to be filmed is housed in the accommodating portion 273 and does not come into contact with the film to be filmed (FIGS. 10 and 10). 11). In addition, in FIGS. 11 and 12, the broken line 120 represents the position of the lower surface when the film-deposited object is accommodated in the accommodating portion 273. Since the drop suppressing member 275 is provided in the opening, even if the film to be filmed is about to fall into the opening, it is supported by the fall suppressing member 275, so that it can be prevented from falling as it is. can. Further, when the drop suppressing member 275 is in contact with the film to be filmed, the film is not formed in the contacted region, but the fall suppressing member 275 is provided at a position where the film is not in contact with the film to be filmed. It is possible to prevent the film formation from being hindered by the drop suppressing member 275.

At the time of manufacturing the film forming mask jig 270, the fall suppressing member 275 may be integrally formed with the mask portion 274, or the separately manufactured fall suppressing member 275 may be attached to the mask portion 274. ..

As shown in FIG. 13, in the present embodiment, when the film to be filmed is housed in the accommodating portion 273, the film to be filmed and the mask portion 274 are viewed in a direction facing each other (direction of XIII in FIG. 11). Occasionally, the fall restraint member 275 has a shape that extends with a predetermined width W1. The distance L1 between the film to be filmed and the drop suppressing member 275 when it is accommodated in the accommodating portion 273 is equal to or larger than the width W1 of the drop suppressing member 275 (see FIG. 12). When the distance L1 between the film to be filmed and the fall suppressing member 275 when it is accommodated in the accommodating portion 273 is equal to or larger than the width W1 of the fall suppressing member 275, the film forming is hindered by the drop suppressing member 275. It is possible to form a film on the entire film formation region of the object to be filmed.

As shown in FIG. 13, when the film-deposited object is accommodated in the accommodating portion 273, when the film-deposited object and the mask portion 274 are viewed in the opposite directions, they are orthogonal to the stretching direction of the drop suppressing member 275. In the direction Y2, the longest distance between the inner wall constituting the accommodating portion 273 and the fall suppressing member 275 and the distance between the fall suppressing members 275 when a plurality of fall suppressing members 275 are provided is , It is shorter than the dimension W11 of the accommodating portion 273 in the stretching direction of the fall suppressing member 275. When this distance relationship is established, the film-deposited object is transferred into the accommodating portion 273, or when the film-forming mask jig 270 accommodating the film-deposited object is attached to the transport section 250. Can be suppressed from falling. The direction Y2 orthogonal to the stretching direction of the drop suppressing member 275 corresponds to the width direction W of the laminated ceramic capacitor 10. Further, the dimension W11 of the accommodating portion 273 is slightly larger than the dimension W in the length direction L of the multilayer ceramic capacitor 10.

In the present embodiment, as shown in FIG. 13, the mask portion 274 is provided near the center in the direction in which the pair of second sides 272hb constituting the inner wall of the accommodating portion 273 face each other. A total of four fall restraint members 275 are provided, two each so as to extend from the mask portion 274 provided near the center toward the pair of second sides 272hb side located on both sides thereof. .. The above-mentioned "distance between the inner wall constituting the accommodating portion 273 and the fall suppressing member 275 in the direction Y2 orthogonal to the stretching direction of the fall suppressing member 275" is the distance L11 and the distance L13 shown in FIG. The "distance between the fall restraining members 275 when a plurality of fall restraining members 275 are provided" is the distance L12 shown in FIG. In the example shown in FIG. 13, the longest distance among the distances L11 to L13 is the distance L12. Therefore, the relationship L12 <W11 is established between the distance L12 and the dimension W11 of the accommodating portion 273 in the stretching direction of the fall suppressing member 275. As described above, by establishing the relationship of L12 <W11, it is possible to suppress the falling of the film to be filmed.

The position of the mask portion 274 does not have to be near the center in the direction in which the pair of second sides 272hb constituting the inner wall of the accommodating portion 273 face each other.

In the present embodiment, as shown in FIG. 13, when the film-deposited object is accommodated in the accommodating portion 273, when the film-deposited object and the mask portion 274 are viewed in the opposite direction, the film-deposited object is accommodated from the mask portion 274. There is a gap SP between the fall suppressing member 275 extending toward the inner wall constituting the portion 273 and the inner wall. The dimension Wh1 of the gap SP is ½ or less of the depth D1 (see FIG. 12) of the accommodating portion 273. Since the dimension Wh1 of the gap SP is ½ of the depth D1 of the accommodating portion 273, it is possible to prevent the film to be formed from falling from the gap SP. The depth D1 of the accommodating portion 273 is preferably 0.8 times or more and 1.5 times or less the dimension in the stacking direction T of the film to be filmed.

The width W1 of the fall suppressing member 275 is 0.1 mm or less. As an example, the width W1 of the fall suppressing member 275 is 0.04 mm.

As described above, in the present embodiment, a plurality of drop suppressing members 275, specifically, two from the mask portion 274, two on each side thereof, for a total of four are provided. By providing a plurality of drop suppressing members 275, it is possible to more effectively suppress the fall of the film to be filmed.

Here, in the present embodiment, as shown in FIG. 9, the second side 272hb constituting the inner wall of the accommodating portion 273 is accommodated so as to form an angle θ with respect to the second side 272b of the outer shape of the frame member 272. A portion 273 is provided. That is, the plurality of accommodating portions 273 are arranged at intervals from each other on a plurality of virtual straight lines 272d forming an angle θ with respect to the second side 272b of the outer shape of the frame member 272. The virtual straight line 272d and the second side 272hb constituting the inner wall of the accommodating portion 273 are parallel to each other.

The angle θ is preferably larger than the tilt angle α of the transport unit 250 (see FIG. 6). Specifically, the angle θ is preferably 20 ° or more and 40 ° or less, for example, 31 °. In this case, as will be described later, when the film-deposited object is accommodated in the accommodating portion 273, the end face of the film-deposited object and the second side 272hb, and the side surface of the film-forming object and the first side 272ha are formed. The film can be stably held by contacting each of them.

In the present embodiment, a plurality of accommodating portions 273 are provided so that one of the two diagonal lines of the inner wall of the accommodating portion 273 is parallel to the second side 272b of the outer shape of the frame member 272. Has been done.

In the present embodiment, the masking member 271 includes one mask portion 274. The mask portion 274 has a flat portion 274t located vertically below the accommodating portion 273 and in contact with the film to be filmed. However, the number of mask portions 274 is not limited to one, and the number may be set according to the non-deposited region of the film to be filmed.

The masking member 271 is joined to the lower surface of the frame member 272. However, the masking member 271 and the frame member 272 may be integrally formed.

By arranging the film forming mask jig 270 in the counterbore portion 262 of the tray 260, the film forming mask jig 270 is positioned at an angle with respect to the horizontal direction as shown in FIG. It is attached to the transport unit 250.

Here, the film forming method by the film forming apparatus 200 in the first embodiment will be described. In step S11 of the flowchart shown in FIG. 3 described above, the second base layers 142a and 142b are formed on the first main surface 16a of the laminated body, and in step S12, the second main surface 16b of the laminated body is formed. The base layers 142a and 142b of the above are formed. Here, an example of forming the second base layers 142a and 142b by the film forming apparatus 200 will be described.

In order to accommodate the laminated body 11 which is a film to be filmed in the accommodating portion 273 of the first film forming mask jig 270a, a large number of laminated bodies are placed on the frame member 272 of the first film forming mask jig 270a. With the 11 placed, the first film forming mask jig 270a is vibrated by the shaker. As a result, the plurality of laminated bodies 11 are each accommodated in the plurality of accommodating portions 273. The first film forming mask jig 270a has the same structure as the film forming mask jig 270.

In the conventional mask jig for film formation not provided with the fall suppressing member 275, when the laminated body 11 is accommodated in the accommodating portion, the laminated body 11 may fall from the opening in which the mask portion is not provided. On the other hand, when the film forming mask jig 270 in the present embodiment is used, the fall suppressing member 275 is provided, so that the laminated body 11 is supported by the fall suppressing member 275 and falls downward. Can be suppressed.

Next, the first film forming mask jig 270a is connected so that the accommodating portion 273 of the second film forming mask jig 270b communicates with the corresponding accommodating portion 273 of the first film forming mask jig 270a. The frame member 272 of the second film forming mask jig 270b is superposed on the frame member 272 of the above. In this state, the first film forming mask jig 270a and the second film forming mask jig 270b are connected by a screw or the like. The second film forming mask jig 270b has the same structure as the film forming mask jig 270.

By inserting the first film forming mask jig 270a and the second film forming mask jig 270b connected to each other into the plasma apparatus and performing Ar etching, the first film forming mask jig 270a, The second film forming mask jig 270b and the laminated body 11 are cleaned.

Next, the cleaned first film-forming mask jig 270a and the second film-forming mask jig 270b are attached to the transport unit 250 via the tray 260 as shown in FIGS. 4 to 6.

FIG. 14 is a plan view showing a state in which the laminated body 11 as a film-deposited object is accommodated in the accommodating portion 273 of the film-forming mask jig 270 according to the first embodiment of the present invention. FIG. 15 is a cross-sectional view of a state in which the laminated body 11 is accommodated in the accommodating portion of the film forming mask jig shown in FIG. 14 as viewed from the direction of the XV-XV line arrow. FIG. 15 illustrates a state in which the second film forming mask jig 270b is superposed on the first film forming mask jig 270a.

As shown in FIGS. 14 and 15, as shown by the arrow 30, the laminated body 11 has an accommodating portion 273 of the first film forming mask jig 270a due to the inclination of the first film forming mask jig 270a. Inside, it is biased toward one corner of the inner wall and is in contact with the inner wall. Specifically, the second end surface 15b of the laminated body 11 is in contact with the second side 272hb of the first film forming mask jig 270a, and the second side surface 17b of the laminated body 11 is the first film forming mask. It is in contact with the first side 272ha of the jig 270a.

As a result, the plurality of laminated bodies 11 accommodated in the plurality of accommodating portions 273 are arranged at substantially the same position in each of the plurality of accommodating portions 273.

Further, since the corners of the laminated body 11 are accommodated in the cutout 272hc by providing the semicircular cutouts 272hc at the four corners of the inner wall, the second end surface 15b of the laminated body 11 and the laminated body 11 are accommodated. The second side 272hb can be stably contacted, and the second side surface 17b of the laminated body 11 and the first side 272ha can be stably contacted.

Sputtering is started when the first film forming mask jig 270a and the second film forming mask jig 270b are carried into the film forming chamber 220 by the transport unit 250. The transport unit 250 continuously operates, and the first film forming mask jig 270a and the second film forming mask jig 270b sequentially pass vertically above the target 222, 223, 224, whereby the laminated body 11 Of the first main surface 16a of the above, a region not in contact with the mask portion 274 is formed. As a result, the second base layers 142a and 142b are formed on the first main surface 16a of the laminated body 11. The thickness of the second base layers 142a and 142b is, for example, 0.01 um or more and 5 um or less.

As described above, the metal particles sprayed from the targets 222, 223, and 224 are applied to the lower surface of the laminate 11 not covered by the mask portion 274 of the first film forming mask jig 270a. Adhere to. As described above, since the plurality of laminated bodies 11 accommodated in the plurality of accommodating portions 273 are arranged at substantially the same positions in each of the plurality of accommodating portions 273, the film can be formed with high positional accuracy. At the same time, a film can be uniformly formed on a plurality of laminated bodies 11.

When the first film forming mask jig 270a and the second film forming mask jig 270b are carried out of the film forming chamber 220 by the transport unit 250, the sputtering process is stopped.

Next, the first film-forming mask jig 270a and the second film-forming mask jig 270b are attached to the transport unit 250 via the tray 260 in a state of being turned upside down. FIG. 16 is a cross-sectional view showing a state in which the first film forming mask jig 270a and the second film forming mask jig 270b are turned upside down.

By inverting the first film forming mask jig 270a and the second film forming mask jig 270b upside down, as shown in FIG. 16, the laminated body 11 has a second layer as shown by an arrow 30. Due to the inclination of the film forming mask jig 270b, the film forming mask jig 270b is biased toward one corner of the inner wall in the accommodating portion 273 and is in contact with the inner wall. Specifically, the second end surface 15b of the laminated body 11 is in contact with the second side 272hb of the second film forming mask jig 270b, and the second side surface 17b of the laminated body 11 is the second film forming mask. It is in contact with the first side 272ha of the jig 270b. Further, the laminated body 11 is supported by the mask portion 274 of the second film forming mask jig 270b. Specifically, the second main surface 16b of the laminated body 11 is in contact with the flat portion 274t of the mask portion 274 of the second film forming mask jig 270b.

As described above, when the first film forming mask jig 270a and the second film forming mask jig 270b are turned upside down, the laminated body located below the inclined film forming mask jig 270. Make sure that the end faces of 11 are not swapped. In the present embodiment, both before and after the second end face 15b is turned upside down with respect to the first end face 15a and the first film forming mask jig 270a and the second film forming mask jig 270b. It is located below the diagonally inclined film forming mask jig 270.

Sputtering is started when the first film-forming mask jig 270a and the second film-forming mask jig 270b, which are upside down by the transport unit 250, are carried into the film forming chamber 220. The transport unit 250 continuously operates, and the first film forming mask jig 270a and the second film forming mask jig 270b sequentially pass vertically above the targets 222, 223, and 224, so that they are turned upside down. The lower side of the laminated body 11 in the state is formed into a film. As a result, the second base layers 142a and 142b are formed in the region of the second main surface 16b of the laminated body 11 that is not in contact with the mask portion 274. The thickness of the second base layers 142a and 142b is, for example, 0.01 um or more and 5 um or less.

Next, the first film forming mask jig 270a and the second film forming mask jig 270b are removed from the transport unit 250. The connection between the first film forming mask jig 270a and the second film forming mask jig 270b is released, and the laminate 11 on which the second base layers 142a and 142b are formed is taken out from the accommodating portion 273. .. After that, the laminated body 11 on which the second base layers 142a and 142b are formed is subjected to a plating treatment.

<Second embodiment>
In the first embodiment, the drop suppressing member 275 of the film forming mask jig 270 extends from the mask portion 274 toward the inner wall constituting the accommodating portion 273, but is between the fall suppressing member 275 and the inner wall. There is a gap SP in (see FIG. 13).

On the other hand, in the film forming mask jig 270 of the second embodiment, there is no gap between the fall suppressing member 275 and the inner wall constituting the accommodating portion 273.

FIG. 17 shows the film forming mask jig 270 in the second embodiment in the accommodating portion 273 in the direction in which the film to be filmed and the mask portion 274 face each other when the film to be filmed is accommodated in the accommodating portion 273. It is a plan view when looking at. As shown in FIG. 17, the fall suppressing member 275 extends in a direction in which the mask portion 274 and the inner wall on the second side 272hb side of the accommodating portion 273 face each other, and constitutes the fall suppressing member 275 and the accommodating portion 273. There is no gap between the inner wall and the inner wall. Since there is no gap between the fall suppressing member 275 and the inner wall constituting the accommodating portion 273, it is possible to more effectively suppress the falling of the film to be filmed.

<Third embodiment>
In the first embodiment, the drop suppressing member 275 of the film forming mask jig 270 extends from the mask portion 274 toward the inner wall constituting the accommodating portion 273.

On the other hand, in the film forming mask jig 270 in the third embodiment, the film forming mask jig 270 extends from the inner wall constituting the accommodating portion 273 toward the mask portion 274.

FIG. 18 shows the film forming mask jig 270 in the third embodiment in the accommodating portion 273 in the direction in which the film to be filmed and the mask portion 274 face each other when the film to be filmed is accommodated in the accommodating portion 273. It is a plan view when looking at. The fall suppressing member 275 extends from the inner wall on the second side 272hb side of the accommodating portion 273 toward the mask portion 274, and there is a gap SP between the falling suppressing member 275 and the mask portion 274. Even with such a configuration, it is possible to suppress the falling of the film to be filmed.

Further, as in the first embodiment, the dimension Wh1 of the gap SP is preferably ½ or less of the depth D1 (see FIG. 12) of the accommodating portion 273. Since the dimension Wh1 of the gap SP is ½ of the depth D1 of the accommodating portion 273, it is possible to prevent the film to be formed from falling from the gap SP.

<Fourth Embodiment>
The monolithic ceramic capacitor 10 shown in FIGS. 1 and 2 has a dimension in the length direction L shorter than a dimension in the width direction W, but a dimension in the length direction L may be longer than a dimension in the width direction W. The configuration of the film forming mask jig 270 when the dimension in the length direction L is longer than the dimension in the width direction W will be described below.

FIG. 19 shows the film forming mask jig 270 in the fourth embodiment in the accommodating portion 273 in the direction in which the film to be filmed and the mask portion 274 face each other when the film to be filmed is accommodated in the accommodating portion 273. It is a plan view when looking at. As shown in FIG. 19, the mask portion 274 is provided near the center in the direction in which the pair of first sides 272ha constituting the inner wall of the accommodating portion 273 face each other. Two fall suppressing members 275 are provided, one for each, so as to extend from the mask portion 274 provided near the center toward the pair of first sides 272ha located on both sides thereof. The position of the mask portion 274 does not have to be near the center in the direction in which the pair of first sides 272ha constituting the inner wall of the accommodating portion 273 face each other.

When the film-deposited object is accommodated in the accommodating portion 273, when the film-deposited object and the mask portion 274 are viewed in the opposite directions, the accommodating portion 273 is in the direction Y2 orthogonal to the stretching direction of the drop suppressing member 275. The longest distance between the inner wall constituting the structure and the fall suppressing member 275 and the distance between the fall suppressing members 275 when a plurality of fall suppressing members 275 are provided is the extension of the fall suppressing member 275. It is shorter than the size of the accommodating portion 273 in the direction. In the example shown in FIG. 19, only one drop suppressing member 275 is provided in the direction Y2 orthogonal to the stretching direction of the fall suppressing member 275. Therefore, L11 (= L13) < The relationship of W11 is established.

Further, as shown in FIG. 19, when the film-deposited object is accommodated in the accommodating portion 273, the mask portion 274 to the accommodating portion 273 are viewed in the direction in which the film-deposited object and the mask portion 274 face each other. There is a gap SP between the fall suppressing member 275 extending toward the constituent inner wall and the inner wall. The dimension Wh1 of this gap SP is ½ or less of the depth D1 of the accommodating portion 273.

As in the other embodiments, the distance between the film to be filmed and the drop suppressing member 275 when the film is accommodated in the accommodating portion 273 is the width W1 or more of the drop suppressing member 275.

The present invention is not limited to the above embodiment, and various applications and modifications can be added within the scope of the present invention. For example, in the above-described embodiment, the film forming mask jig 270 has been described as being attached to the transport unit 250 in a state of being tilted at an angle (see FIG. 6), but it can also be used in a state of not being tilted.

The shape and placement location of the fall suppression member 275 are not limited to the shape and placement location described in the above-described embodiment. That is, the drop suppressing member 275 is provided at a position in the opening where the mask portion 274 is not provided, in a state where the film to be filmed is housed in the accommodating portion 273 and does not come into contact with the film to be filmed. Anything that can suppress the fall of the

10 Multilayer ceramic capacitor 11 Laminated body 12 Dioxide layer 13a First internal electrode 13b Second internal electrode 14a First external electrode 14b Second external electrodes 141a, 141b First base layer 142a, 142b Under the second Formation 143a, 143b Plating layer 200 Film forming apparatus 210 First decompression chamber 211 First vacuum pump 221 Second vacuum pump 222 First target 223 Second target 224 Third target 230 Second decompression chamber 231 3rd vacuum pump 240 1st shutter 241 2nd shutter 242 3rd shutter 243 4th shutter 250 Conveying part 260 Tray 270 Film forming mask jig 270a First film forming mask jig 270b Second Mask jig for film formation 271 Masking member 272 Frame member 273 Accommodating part 274 Mask part 275 Fall suppression member 280 Roller

Claims (7)

An accommodating part for accommodating the film to be filmed and
A mask portion located below the film-deposited object at the time of film-forming to prevent film formation on the non-deposited area of the film-deposited object, and a mask portion.
In the opening where the mask portion is not provided, the film to be filmed is provided at a position where the film to be filmed is housed in the accommodating portion and does not come into contact with the film to be filmed, thereby suppressing the drop of the film to be filmed. Fall suppression member for
A mask jig for film formation, which is characterized by being provided with. When the film-deposited object is accommodated in the accommodating portion, the fall-suppressing member has a shape that extends by a predetermined width when the film-deposited object and the mask portion are viewed in a direction facing each other. And
The film forming apparatus according to claim 1, wherein the distance between the film-deposited object and the drop-suppressing member when the film is accommodated in the accommodating portion is equal to or larger than the width of the drop-suppressing member. Mask jig. When the film-deposited object is accommodated in the accommodating portion, when the film-deposited object and the mask portion are viewed in a direction facing each other, the accommodation is performed in a direction orthogonal to the stretching direction of the fall suppressing member. The longest distance between the inner wall constituting the portion and the fall suppressing member and the distance between the fall suppressing members when a plurality of the fall suppressing members are provided is the fall suppressing member. The film forming mask jig according to claim 2, wherein the film forming portion is shorter than the size of the accommodating portion in the stretching direction. When the film-deposited object is accommodated in the accommodating portion, when the film-deposited object and the mask portion are viewed in a direction facing each other, the film-deposited object extends from the mask portion toward the inner wall constituting the accommodating portion. There is a gap between the fall suppressing member and the inner wall.
The film forming mask jig according to claim 2 or 3, wherein the size of the gap is ½ or less of the depth of the accommodating portion. The film forming mask jig according to any one of claims 2 to 4, wherein the width of the drop suppressing member is 0.1 mm or less. The film forming mask jig according to any one of claims 1 to 5, wherein a plurality of the drop suppressing members are provided. The film formation room and
The film formation source located inside the film formation chamber and
The film forming mask jig according to any one of claims 1 to 6.
In the film forming chamber, the film to be filmed so that the film to be filmed housed in the accommodating portion of the mask jig for film forming passes above the film forming source while facing the film forming source. A transport unit that transports goods and
A film forming apparatus characterized by being provided with.

Images