JP6798182B2 - Film forming equipment, cages, and methods for manufacturing electronic components using these - Google Patents

Description

The present invention relates to a film forming apparatus, a holder, and a method for manufacturing an electronic component using these.

As a prior document that discloses a method for manufacturing an electronic component, there is Japanese Patent Application Laid-Open No. 10-12486 (Patent Document 1). In the method for manufacturing an electronic component described in Patent Document 1, the holder is tilted and the component body is placed on one side of the storage cavity so that the outer peripheral surface of the component body and the inner peripheral surface of the storage cavity are partially in contact with each other. Electrodes are formed at predetermined positions on both main surfaces of the component body by bringing them together and sputtering with the holder tilted.

Japanese Unexamined Patent Publication No. 10-12486

In the method for manufacturing an electronic component described in Patent Document 1, since the holder is tilted and then subjected to an electrode forming step by sputtering, the transport mechanism for transporting the holder is intermittently operated. Therefore, there is room for improvement from the viewpoint of film formation efficiency.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a film forming apparatus, a holder, and a method for manufacturing an electronic component using these, which can efficiently form a film with high accuracy. And.

In the film forming apparatus based on the first aspect of the present invention, the film forming chamber, the film forming source located inside the film forming chamber, and the film forming source in the film forming chamber above the film forming source. It has a transport unit that transports the film to be filmed so as to pass while facing the film, and a housing section that is attached to the transport section so as to be positioned at an angle with respect to the horizontal direction to accommodate and hold the film to be filmed. Equipped with a holder. The accommodating portion has a substantially rectangular inner peripheral wall. Due to the inclination of the holder, the film-deposited film is positioned unevenly at one corner of the inner peripheral wall in the accommodating portion and is in contact with the inner peripheral wall.

In one embodiment of the present invention, the holder includes a frame member constituting the inner peripheral wall and a masking member adjacent to the frame member.

In one embodiment of the present invention, the film forming apparatus further includes a first decompression chamber provided adjacent to the film forming chamber and a second decompression chamber provided adjacent to the film forming chamber. The transport unit passes through the first decompression chamber, the film forming chamber, and the second decompression chamber in this order.

In one embodiment of the present invention, the film formation source comprises a plurality of targets. A plurality of targets are arranged side by side in the transport direction of the transport unit.

The retainer based on the second aspect of the present invention is a retainer having an accommodating portion for accommodating and holding an object to be filmed. The holder includes a frame member and a masking member adjacent to the frame member. The accommodating portion has a substantially rectangular inner peripheral wall. The frame member constitutes the inner peripheral wall.

In one embodiment of the invention, the holder is tilted with respect to the horizontal direction. Due to the inclination of the holder, the film-deposited film is positioned unevenly at one corner of the inner peripheral wall in the accommodating portion and is in contact with the inner peripheral wall.

The method for manufacturing an electronic component based on the third aspect of the present invention is a method for manufacturing an electronic component to be a film to be formed by using two holders in any of the above-mentioned film forming apparatus. The method of manufacturing the electronic component is a step of accommodating the film to be formed in the accommodating portion of the first retainer of the two retainers, and the accommodating portion of the second retainer of the two retainers is the first. A step of superimposing the frame member of the second holder on the frame member of the first holder and a step of attaching the first holder and the second holder to the transport portion so as to communicate with the corresponding accommodating portion of the holder. And, the process of operating the transport unit to form a film on the lower side of the electronic component, the process of attaching the first holder and the second holder to the transport unit in an inverted state, and the process of operating the transport unit. The process includes a step of forming a film on the lower side of the electronic component in an inverted state.

According to the present invention, a film can be formed efficiently and with high accuracy.

It is a perspective view which shows the appearance of the 3-terminal type multilayer capacitor which is an example of a film-deposited object. It is sectional drawing which saw the laminated capacitor of FIG. 1 from the direction of the arrow of line II-II. It is sectional drawing which saw the multilayer capacitor of FIG. 1 from the direction of the arrow of line III-III. It is a flowchart which shows the manufacturing method of the 3 terminal type multilayer capacitor which is an example of a film-deposited object. It is an exploded perspective view which shows the mother sheet which constitutes the mother sheet group. It is a side view which shows the structure of the film forming apparatus which concerns on one Embodiment of this invention. FIG. 6 is a view of the film forming apparatus of FIG. 6 viewed from the direction of arrow VII. FIG. 6 is a view of the film forming apparatus of FIG. 6 viewed from the direction of arrow VIII. It is a top view which shows the shape of a part of the transport part of the film forming apparatus which concerns on one Embodiment of this invention. It is a top view which shows the shape of the tray of the film forming apparatus which concerns on one Embodiment of this invention. It is a top view which shows the shape of the holder of the film forming apparatus which concerns on one Embodiment of this invention. It is a perspective view which shows the XII part in FIG. 11 enlarged. It is sectional drawing which saw a part of the holder of FIG. 12 from the direction of the arrow of line XIII-XIII. It is a bottom view which saw a part of the holder of FIG. 13 from the direction of arrow XIV. It is a top view which shows the state in which the film-deposited object is housed in the house part of the holder which concerns on one Embodiment of this invention. FIG. 15 is a cross-sectional view of a state in which the film to be formed is contained in the accommodating portion of the holder shown in FIG. 15 as viewed from the direction of the arrow along the XVI-XVI line. It is sectional drawing which shows the state which the 1st holder and the 2nd holder are turned upside down in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is sectional drawing which shows the structure of the holder which concerns on the modification of one Embodiment of this invention. It is sectional drawing which shows the state which the 1st holder and the 2nd holder which concerns on the modification of one Embodiment of this invention are turned upside down.

Hereinafter, a film forming apparatus, a holder, and a method for manufacturing an electronic component using these according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings are designated by the same reference numerals, and the description will not be repeated.

First, a 3-terminal multilayer capacitor which is an example of a film-deposited object to which each of a film-forming apparatus, a holder, and a method for manufacturing an electronic component using these according to an embodiment of the present invention is applied. explain. However, the film to be filmed is not limited to the 3-terminal type laminated capacitor, and may be a 2-terminal type laminated capacitor as long as it is formed by a dry plating method such as sputtering.

FIG. 1 is a perspective view showing the appearance of a 3-terminal multilayer capacitor which is an example of a film to be filmed. FIG. 2 is a cross-sectional view of the multilayer capacitor of FIG. 1 as viewed from the direction of the arrow along line II-II. FIG. 3 is a cross-sectional view of the multilayer capacitor of FIG. 1 as viewed from the direction of the arrow along line III-III. In FIGS. 1 to 3, the length direction of the laminated body described later is shown by L, the width direction of the laminated body is shown by W, and the height direction of the laminated body is shown by H.

As shown in FIGS. 1 to 3, the 3-terminal type multilayer capacitor 100, which is an example of the film to be filmed, includes a laminate 110 and three external electrodes provided on a part of the surface of the laminate 110. .. The laminated body 110 includes a plurality of laminated dielectric layers 140 and a plurality of conductor layers 150. The dielectric layer 140 and the conductor layer 150 are alternately laminated. The laminated body 110 has a rectangular parallelepiped shape. The stacking direction of the dielectric layer 140 and the conductor layer 150 is orthogonal to the length direction L of the laminate 110 and the width direction W of the laminate 110. That is, the stacking direction of the dielectric layer 140 and the conductor layer 150 is parallel to the height direction H of the laminated body 110.

The laminated body 110 connects the first main surface 111 and the second main surface 112, and the first main surface 111 and the second main surface 112 facing each other in the laminating direction of the laminated body 110, and faces each other in the length direction L of the rectangular parallelepiped shape. It has two end faces and two side surfaces facing each other in the width direction W of the rectangular parallelepiped shape connecting the first main surface 111 and the second main surface 112. Of the two end faces, one is the first end face 113 and the other is the second end face 114. Of the two sides, one is the first side 115 and the other is the second side 116.

The shortest distance between the first side surface 115 and the second side surface 116 is less than the shortest distance between the first end surface 113 and the second end surface 114. Although the laminated body 110 has a rectangular parallelepiped shape, it may have a rounded shape at at least one of a corner portion and a ridgeline portion. Further, the surface of the laminated body 110 may have irregularities.

The three external electrodes include a pair of through electrodes 120 provided on both sides of the laminated body 110 in the length direction L, and a ground electrode 130 provided in an annular shape at the center of the laminated body 110 in the length direction L. Consists of.

Specifically, one of the pair of through electrodes 120 is provided on the first end surface 113 side of the laminated body 110, and the other of the pair of through electrodes 120 is provided on the second end surface 114 side.

One of the pair of through electrodes 120 is provided from the first end surface 113 to a part of each of the first main surface 111, the second main surface 112, the first side surface 115, and the second side surface 116. One of the pair of through electrodes 120 is a first base layer 121 provided on each of the first end surface 113, the first side surface 115, and the second side surface 116, and each of the first main surface 111 and the second main surface 112. The second base layer 122 provided in the above, and the plating layer 123 covering the first base layer 121 and the second base layer 122 are included.

The other side of the pair of through electrodes 120 is provided from the second end surface 114 to a part of each of the first main surface 111, the second main surface 112, the first side surface 115, and the second side surface 116. The other side of the pair of through electrodes 120 is a first base layer 121 provided on each of the second end surface 114, the first side surface 115, and the second side surface 116, and each of the first main surface 111 and the second main surface 112. The second base layer 122 provided in the above, and the plating layer 123 covering the first base layer 121 and the second base layer 122 are included.

The ground electrode 130 is provided in an annular shape over each of the first main surface 111, the second main surface 112, the first side surface 115, and the second side surface 116. The ground electrode 130 includes a first base layer 131 provided on each of the first side surface 115 and the second side surface 116, and a second base layer 132 provided on each of the first main surface 111 and the second main surface 112. , A plating layer 133 covering the first base layer 131 and the second base layer 132.

However, the arrangement of the three external electrodes is not limited to the above, and is a part of the surface of the laminated body 110 so that it can be electrically connected to each of the plurality of conductor layers 150 and the laminated capacitor 100 can be mounted. It may be provided in.

The plurality of conductor layers 150 include a first conductor layer 151 extending in the length direction L of the laminated body 110 and connected to each of the pair of through electrodes 120, and the first side surface 115 and the second side surface 116. Each of the above is composed of a second conductor layer 152 connected to the ground electrode 130. The first conductor layer 151 is not connected to the ground electrode 130. The second conductor layer 152 is not connected to the pair of through electrodes 120. The first conductor layer 151 and the second conductor layer 152 are alternately located in the stacking direction of the laminated body 110.

As described above, the pair of through electrodes 120 are conducting inside the multilayer capacitor 100, and no capacitor element is interposed between them. On the other hand, a capacitor element is interposed between the pair of through electrodes 120 and the ground electrode 130, and they are connected in parallel to each other. As described above, the multilayer capacitor 100 is a through-type multilayer capacitor.

Hereinafter, a method for manufacturing the 3-terminal multilayer capacitor 100 will be described.
FIG. 4 is a flowchart showing a method of manufacturing a 3-terminal multilayer capacitor, which is an example of a film to be filmed. In the method of manufacturing a multilayer capacitor shown below, a mother laminate is manufactured by collectively processing until the middle stage of the manufacturing process, and then the mother laminate is divided into individual pieces and individualized. This is a method of simultaneously mass-producing a plurality of multilayer capacitors 100 by further processing the soft laminate afterwards.

As shown in FIG. 4, when manufacturing the multilayer capacitor 100, first, a ceramic slurry is prepared (step S11). Specifically, ceramic powder, a binder, a solvent, and the like are mixed in a predetermined blending ratio, whereby a ceramic slurry is formed.

Next, a ceramic green sheet is formed (step S12). Specifically, the ceramic green sheet is formed by forming the ceramic slurry into a sheet on the carrier film using a die coater, a gravure coater, a microgravure coater, or the like.

Next, a mother sheet is formed (step S13). Specifically, a predetermined conductive pattern is provided on the ceramic green sheet by printing the conductive paste on the ceramic green sheet by using a screen printing method, a gravure printing method, or the like so as to have a predetermined pattern. A mother sheet is formed. The conductive paste contains a Ni component.

Here, the formed mother sheet will be described. FIG. 5 is an exploded perspective view showing the mother sheets constituting the mother sheet group. As shown in FIG. 5, the mother sheet group 110a is composed of a plurality of mother sheets 10, 11 and 12 having different configurations from each other.

The mother sheet 10 is composed of only the ceramic base material 140a on which no conductive pattern is formed on the surface thereof. As described above, as the mother sheet, a ceramic green sheet produced without going through the step S13 is also prepared. The mother sheets 11 and 12 have conductive patterns 151a and 152a having a predetermined shape formed on the surface of the ceramic base material 140a.

As shown in FIG. 5, the mother sheets are laminated (step S14). Specifically, a predetermined number of mother sheets 10 on which no conductive pattern is formed are laminated, and a plurality of mother sheets 11 on which the conductive pattern 151a is formed and a plurality of mother sheets 12 on which the conductive pattern 152a is formed are formed. The mother sheet group 110a is formed by alternately laminating one sheet at a time and stacking a predetermined number of mother sheets 10 on which the conductive pattern is not formed.

Next, the mother sheet group is crimped (step S15). A mother laminated body is formed by pressurizing and crimping the mother sheet group 110a along the laminating direction by a hydrostatic pressure press or a rigid body press.

Next, the mother laminate is divided (step S16). Specifically, the mother laminate is divided into a matrix by push-cutting or dicing, and is individualized into a plurality of soft laminates.

Next, the soft laminate is barrel-polished (step S17). Specifically, the soft laminate is enclosed in a small box called a barrel together with a media ball having a hardness higher than that of the ceramic material, and by rotating the barrel, the corners and ridges of the outer surface of the soft laminate are formed. Has a curved roundness.

Next, a conductive paste to be the first base layer is applied to the surface of the soft laminate (step S18). Specifically, a conductive paste to be the first base layer 121 of each of the pair of through electrodes 120 is applied to both ends of the soft laminate by various printing methods or dipping methods. Further, the conductive paste serving as the first base layer 131 of the ground electrode 130 is applied to both side surfaces of the soft laminate by various printing methods. This conductive paste contains an organic solvent, metal particles and ceramic. The metal particles contain a Ni component.

Next, the soft laminate to which the conductive paste is applied to the surface is fired (step S19). Specifically, the soft laminate with the conductive paste applied to the surface is heated to a predetermined temperature, whereby the ceramic dielectric material and the conductive material are fired. The firing temperature is appropriately set according to the types of the ceramic dielectric material and the conductor material, and is set, for example, in the range of 900 ° C. or higher and 1300 ° C. or lower. The conductor material to be the conductor layer 150 and the conductive paste to be the first base layer 121 and the first base layer 131 are fired at the same time, so that each of the first base layer 121 and the first base layer 131 is fired. At the connection portion between the conductor layer 150 and the conductor layer 150, the Ni component of the first base layer 121 and the first base layer 131 and the Ni component of the conductor layer 150 are integrated.

Next, the laminate provided with the first base layer 121 and the first base layer 131 is barrel-polished (step S20).

Next, the second base layer 122 and the second base layer 132 are provided on the first main surface 111 of the laminated body by a dry plating method such as sputtering (step S21). Each of the second base layer 122 and the second base layer 132 is made of a pure metal or alloy such as nichrome (NiCr), monel (NiCu), titanium (Ti), copper (Cu) or silver (Ag).

Next, the second base layer 122 and the second base layer 132 are provided on the second main surface 112 of the laminated body by a dry plating method such as sputtering (step S22).

Next, by the plating treatment, the plating layer 123 is formed so as to cover the first base layer 121 and the second base layer 122, and the plating layer 133 is formed so as to cover the first base layer 131 and the second base layer 132. (Step S23). By forming the plating layers 123 and 133, a pair of through electrodes 120 and a ground electrode 130 are formed. The plating layers 123 and 133 contain a Cu component.

The multilayer capacitor 100 is manufactured by going through the above series of steps.
Hereinafter, the configuration of the film forming apparatus according to the embodiment of the present invention will be described with reference to the drawings. The film forming apparatus 200 according to the present embodiment is a sputtering apparatus, but the film forming apparatus 200 may be another apparatus for performing dry plating.

FIG. 6 is a side view showing the configuration of the film forming apparatus according to the embodiment of the present invention. FIG. 7 is a view of the film forming apparatus of FIG. 6 as viewed from the direction of arrow VII. FIG. 8 is a view of the film forming apparatus of FIG. 6 as viewed from the direction of arrow VIII. FIG. 9 is a plan view showing a part of the shape of the transport portion of the film forming apparatus according to the embodiment of the present invention. FIG. 10 is a plan view showing the shape of the tray of the film forming apparatus according to the embodiment of the present invention. FIG. 11 is a plan view showing the shape of the holder of the film forming apparatus according to the embodiment of the present invention. FIG. 12 is an enlarged perspective view showing the XII portion in FIG. 11. FIG. 13 is a cross-sectional view of a part of the holder of FIG. 12 as viewed from the direction of the arrow along the line XIII-XIII. FIG. 14 is a bottom view of a part of the holder of FIG. 13 as viewed from the direction of arrow XIV. In FIG. 11, only the frame member of the holder is shown for ease of understanding.

As shown in FIGS. 6 to 14, the film forming apparatus 200 according to the embodiment of the present invention includes a film forming chamber 220, a first decompression chamber 210 provided adjacent to the film forming chamber 220, and a film forming chamber. A second decompression chamber 230 provided adjacent to the 220 is provided. The first decompression chamber 210 and the second decompression chamber 230 do not necessarily have to be provided. The first decompression chamber 210 is provided with a vacuum pump 211 that depressurizes the inside of the first decompression chamber 210. The film forming chamber 220 is provided with a vacuum pump 221 that reduces the pressure inside the film forming chamber 220. The second decompression chamber 230 is provided with a vacuum pump 231 for depressurizing the inside of the second decompression chamber 230. The air pressure inside the film forming chamber 220 is lower than that inside each of the first decompression chamber 210 and the second decompression chamber 230, and the inside is in a substantially vacuum state.

The film forming apparatus 200 further includes a transport unit 250 that passes through the first decompression chamber 210, the film forming chamber 220, and the second decompression chamber 230 in this order. A plurality of rollers 280 that support the transport unit 250 are arranged at intervals from each other along the transport direction 20 of the transport unit 250. In the present embodiment, the transport unit 250 is composed of a belt conveyor, but the configuration of the transport unit 250 is not limited to the belt conveyor, and may be a trolley or the like traveling on rails.

As shown in FIG. 8, the transport portion 250 is supported by the rollers 280 so as to be positioned at an angle α with respect to the horizontal direction. The angle α is greater than 0 °, for example 5 °. As shown in FIG. 9, the transport portion 250 is provided with a rectangular opening 251 in a plan view and a counterbore portion 252 having a rectangular shape in a plan view on the outer periphery of the opening 251. The openings 251 and counterbore 252 are provided at equal intervals in the longitudinal direction of the belt conveyor.

A shutter 240 that opens and closes in the vertical direction is provided at the entrance of the first decompression chamber 210. A shutter 241 that opens and closes in the vertical direction is provided at the boundary between the first decompression chamber 210 and the film forming chamber 220. A shutter 242 that opens and closes in the vertical direction is provided at the boundary between the film forming chamber 220 and the second decompression chamber 230. A shutter 243 that opens and closes in the vertical direction is provided at the outlet of the second decompression chamber 230. Each of the shutters 240 to 243 is in an open state only when the object to be transported is passed by the transport unit 250, and is in a closed state at other times.

A film forming source is arranged inside the film forming chamber 220. In the present embodiment, three targets 222, 223, and 224 are arranged in a row in a line in the transport direction 20 of the transport unit 250 as the film forming source. The targets 222, 223, and 224 are arranged so as to be located directly below the transport portion 250 in the film forming chamber 220. The transport unit 250 transports the film to be formed so that the film to be formed passes above the target 222, 223, 224 in the film forming chamber 220 while facing the target 222, 223, 224. The number of targets to be arranged is not limited to three, and may be one or more.

Each of the targets 222, 223, and 224 has a plate-like outer shape. Each of the targets 222, 223, and 224 is tilted so as to be parallel to the holder 270 attached to the transport portion 250 in a tilted state as shown in FIG.

Each constituent material of the target 222, 223, 224 is a pure metal or alloy such as nichrome (NiCr), monel (NiCu), titanium (Ti), copper (Cu) or silver (Ag).

In the present embodiment, the tray 260 shown in FIG. 10 is arranged in the counterbore portion 252 of the transport portion 250. The tray 260 has a rectangular outer shape slightly smaller than the counterbore portion 252 of the transport portion 250 in a plan view. The tray 260 is provided with a rectangular opening 261 in a plan view and a counterbore portion 262 having a rectangular shape in a plan view on the outer periphery of the opening 261. In the present embodiment, six openings 261 and counterbore 262 are provided on the tray 260 in a matrix. Each of the six openings 261 of the tray 260 is located above the opening 251 of the transport section 250.

As shown in FIG. 7, the holder 270 according to the present embodiment is arranged in the counterbore portion 262 of the tray 260. The holder 270 has a rectangular outer shape slightly smaller than the counterbore portion 262 of the tray 260 in a plan view. As shown in FIG. 11, the outer shape of the holder 270 is composed of a pair of first side 272a parallel to each other and a second side 272b parallel to each other in a plan view. The tray 260 may not necessarily be provided, and the holder 270 may be directly arranged in the counterbore portion 252 of the transport portion 250.

As shown in FIGS. 11 to 14, the holder 270 has an accommodating portion 273 for accommodating and holding the film to be filmed. The accommodating portion 273 has a substantially rectangular inner peripheral wall. Specifically, the holder 270 includes a frame member 272 forming an inner peripheral wall and a masking member 271 adjacent to the frame member 272.

The frame member 272 has a rectangular plate-like outer shape in a plan view. The outer shape of the frame member 272 is composed of a pair of first side 272a parallel to each other and a second side 272b parallel to each other in a plan view. That is, in a plan view, the outer shape of the frame member 272 and the outer shape of the holder 270 are the same.

The inner peripheral wall of the accommodating portion 273 is substantially rectangular including a pair of first side 272ha facing each other and a pair of second side 272hb facing each other. The four corners of the inner peripheral wall are slimmed and provided with semicircular notches.

In the present embodiment, the accommodating portion 273 is provided so that the second side 272hb of the inner peripheral wall forms an angle θ with respect to the second side 272b of the outer shape of the frame member 272. Therefore, the plurality of accommodating portions 273 are arranged at intervals from each other on a plurality of virtual straight lines 272d forming an angle θ with respect to the second side 272b of the outer shape of the frame member 272.

The angle θ is greater than 0 °, for example 31 °. The angle θ is preferably larger than the angle α. Specifically, the angle θ is preferably 20 ° or more and 40 ° or less. In this case, as will be described later, when the film-deposited object is accommodated in the accommodating portion 273, the side surface and the end surface of the film-deposited object are brought into contact with each other by contacting the first side 272ha and the second side 272hb, respectively. The film to be filmed can be stably held.

In the present embodiment, a plurality of accommodating portions 273 so that the diagonal line 272c of one of the two diagonal lines of the inner peripheral wall of the accommodating portion 273 is parallel to the second side 272b of the outer shape of the frame member 272. Is provided.

In the present embodiment, the masking member 271 includes two mask portions 274 facing each other. Each of the two mask portions 274 has a flat portion 274t located directly below the accommodating portion 273 and in contact with the film to be filmed. The number of mask portions 274 is not limited to two, and may be one or more.

In the present embodiment, the masking member 271 is joined to the lower surface of the frame member 272. Two mask portions 274 are provided inside the masking member 271. However, the masking member 271 and the frame member 272 may be formed from one member.

The masking member 271 has a pair of projecting portions 271c protruding inward at an end portion on the side opposite to the frame member 272 side. As shown in FIG. 14, each tip surface of the pair of protrusions 271c is located parallel to each of the pair of first side 272ha. When viewed in the thickness direction of the masking member 271, the opening 271h of the masking member 271 on the side opposite to the frame member 272 side is located inside the inner peripheral wall of the accommodating portion 273.

By arranging the holder 270 in the counterbore portion 262 of the tray 260, the holder 270 is attached to the transport portion 250 so as to be positioned at an angle with respect to the horizontal direction, as shown in FIG.

Here, a method for manufacturing an electronic component according to an embodiment of the present invention will be described. In the method for manufacturing an electronic component according to an embodiment of the present invention, the multilayer capacitor 100, which is an electronic component, is manufactured by using the first holder 270a and the second holder 270b, both of which have the same configuration as the holder 270.

When the laminate 110, which is a film to be formed, is accommodated in the accommodating portion 273 of the first holder 270a, a large number of laminates 110 are placed on the frame member 272 of the first retainer 270a. The first holder 270a is vibrated by the shaker. As a result, the plurality of laminated bodies 110 are each accommodated in the plurality of accommodating portions 273.

Next, the frame member 272 of the second holder 270b is placed on the frame member 272 of the first holder 270a so that the housing portion 273 of the second holder 270b communicates with the corresponding housing portion 273 of the first holder 270a. Overlay. In this state, the first holder 270a and the second holder 270b are connected by a screw or the like.

The first retainer 270a, the second retainer 270b, and the laminate 110 are cleaned by inserting the first retainer 270a and the second retainer 270b connected to each other into the plasma apparatus and performing Ar etching.

Next, the cleaned first holder 270a and second holder 270b are attached to the transport portion 250 via the tray 260 as shown in FIGS. 6 to 8.

FIG. 15 is a plan view showing a state in which the film to be formed is housed in the housing part of the holder according to the embodiment of the present invention. FIG. 16 is a cross-sectional view of a state in which the film to be formed is contained in the accommodating portion of the holder shown in FIG. 15 as viewed from the direction of the XVI-XVI line arrow. In FIG. 16, a state in which the second holder 270b is superposed on the first holder 270a is shown.

As shown in FIGS. 15 and 16, as shown by the arrow 30, the laminate 110 is biased to one corner of the inner peripheral wall in the accommodating portion 273 of the first holder 270a due to the inclination of the first holder 270a. It is located and is in contact with the inner peripheral wall. Specifically, the second end surface 114 of the laminated body 110 is in contact with the first side 272ha of the first holder 270a, and the first side surface 115 of the laminated body 110 is in contact with the second side 272hb of the first holder 270a. ..

As a result, the plurality of laminated bodies 110 each housed in the plurality of accommodating portions 273 are arranged at substantially the same position in each of the plurality of accommodating portions 273.

Further, since the four corners of the inner peripheral wall are provided with semicircular cutouts, the corners of the laminated body 110 are accommodated in the cutouts, so that the second end faces 114 and the first of the laminated body 110 The side 272ha can be stably contacted, and the first side surface 115 of the laminated body 110 and the second side 272hb can be stably contacted.

The sputtering process is started when the first holder 270a and the second holder 270b are carried into the film forming chamber 220 by the transport unit 250. The transport unit 250 continuously operates, and the first holder 270a and the second holder 270b sequentially pass directly above the targets 222, 223, and 224, whereby the lower side of the laminate 110 is formed. As a result, the second base layer 122 and the second base layer 132 are provided on the first main surface 111 of the laminated body (step S21).

The metal atoms 1 scattered from the surfaces of the targets 222, 223, and 224 adhere to the portion of the lower surface of the laminate 110 that is not covered by the masking member 271 of the first holder 270a. As described above, since the plurality of laminated bodies 110 accommodated in the plurality of accommodating portions 273 are arranged at substantially the same positions in each of the plurality of accommodating portions 273, the film can be formed with high positional accuracy. At the same time, the film can be uniformly formed on the plurality of laminated bodies 110.

Further, the protruding portion 271c of the masking member 271 can prevent the formation of the second base layer 122 on both end faces of the laminated body 110.

When the first holder 270a and the second holder 270b are carried out of the film forming chamber 220 by the transport unit 250, the sputtering process is stopped.

Next, the first holder 270a and the second holder 270b are attached to the transport unit 250 via the tray 260 in a state of being turned upside down. FIG. 17 is a cross-sectional view showing a state in which the first holder and the second holder are turned upside down in the method for manufacturing an electronic component according to an embodiment of the present invention.

By turning the first holder 270a and the second holder 270b upside down, as shown in FIG. 17, the laminated body 110 is held by the second holder 270b due to the inclination of the second holder 270b, as shown by the arrow 30. In the accommodating portion 273 of the tool 270b, the position is biased toward one corner of the inner peripheral wall and is in contact with the inner peripheral wall. Specifically, the second end surface 114 of the laminated body 110 is in contact with the first side 272ha of the second holder 270b, and the second side surface 116 of the laminated body 110 is in contact with the second side 272hb of the second holder 270b. .. Further, the laminated body 110 is supported by the masking member 271 of the second holder 270b. Specifically, the second main surface 112 of the laminated body 110 is in contact with the flat portion 274t of the mask portion 274 of the second holder 270b.

In this way, when the first holder 270a and the second holder 270b are turned upside down, the end faces of the laminated body 110 located below the tilted holder 270 are prevented from being exchanged. In the present embodiment, the second end surface 114 is located below the tilted holder 270 both before and after the first holder 270a and the second holder 270b are turned upside down.

Sputtering is started when the first holder 270a and the second holder 270b, which are upside down by the transport unit 250, are carried into the film forming chamber 220. The transport unit 250 continuously operates, and the first holder 270a and the second holder 270b sequentially pass directly above the targets 222, 223, and 224, whereby the lower side of the laminated body 110 in an upside down state is formed. To. As a result, the second base layer 122 and the second base layer 132 are provided on the second main surface 112 of the laminated body (step S22).

Next, the first holder 270a and the second holder 270b are removed from the transport unit 250. The connection between the first holder 270a and the second holder 270b is released, and the laminate 110 on which the second base layer 122 and the second base layer 132 are formed is taken out from the accommodating portion 273. After that, the laminated body 110 on which the second base layer 122 and the second base layer 132 are formed is subjected to a plating treatment (step S23).

As described above, the transport unit 250 to which the holder 270 is attached is continuously operated so as to be positioned at an angle with respect to the horizontal direction, and the second base layer 122 and the second base layer 132 are provided on the laminated body 110. , It is possible to form a film on the laminated body 110 efficiently and with high accuracy.

In addition, in order to more reliably suppress the formation of the second base layer 122 on both end faces of the laminated body 110, a protrusion may be further provided on the frame member 272 side of the masking member 271.

FIG. 18 is a cross-sectional view showing a configuration of a holder according to a modified example of the embodiment of the present invention. In FIG. 18, it is shown in the same cross-sectional view as in FIG.

As shown in FIG. 18, in the holder according to the modified example of the embodiment of the present invention, a protruding portion 271d is further provided on the frame member 272 side of the masking member 271. By covering the lower sides of both end faces of the laminate 110 with the projecting portions 271d, it is possible to more reliably suppress the formation of the second base layer 122 on both end faces of the laminate 110.

FIG. 19 is a cross-sectional view showing a state in which the first holder and the second holder according to the modified example of the embodiment of the present invention are turned upside down. In FIG. 19, it is shown in the same cross-sectional view as in FIG.

As shown in FIG. 19, by turning the first holder 270a and the second holder 270b upside down, the protruding portions 271d of the second holder 270b cover the lower sides of both end faces of the laminated body 110. As a result, it is possible to more reliably suppress the formation of the second base layer 122 on both end faces of the laminated body 110 in the upside down state.

In this embodiment, the first holder 270a and the second holder 270b are used, but when the laminated body 110 is turned upside down by another method, the second holder 270b may not be used. ..

(Experimental example)
Hereinafter, an experimental example in which the position accuracy of the film formation is verified by changing the inclination angle α of the transport unit 250 with respect to the horizontal direction will be described.

When the inclination angle α is set to 0 °, 5 °, and 10 °, the positional deviation between the center position of the laminated body 110 in the length direction L and the center position of the ground electrode 130 in the length direction L of the laminated body 110 The amount was measured. 100 pieces of each sample were prepared. In the laminated body 110 of each sample, the length was 1.0 mm, the width was 0.5 mm, and the thickness was 0.5 mm. The above amount of misalignment is determined by imaging the surface of the laminated capacitor with an electron microscope such as a SEM (Scanning Electron Microscope), and from the image taken, the position at the center of the ground electrode 130 and the length direction L of the laminated body 110. The amount of misalignment with the center position was measured.

When the inclination angle α = 0 °, the maximum value of the misalignment amount was 76 μm, and the average value of the misalignment amount was 35 μm. When the inclination angle α = 5 °, the maximum value of the misalignment amount was 38 μm, and the average value of the misalignment amount was 9 μm. When the inclination angle α = 10 °, the maximum value of the misalignment amount was 19 μm, and the average value of the misalignment amount was 8 μm.

From the above experimental results, it was confirmed that the inclination angle α is preferably 5 ° or more, and more preferably 10 ° or more. That is, it was confirmed that the film can be formed with higher position accuracy as the inclination of the holder increases.

The film forming apparatus, the holder, and the method for manufacturing an electronic component using these according to an embodiment of the present invention can be effectively applied to a 3-terminal multilayer capacitor as an electronic component. However, it is also effective to apply these to a two-terminal type multilayer capacitor.

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1 Metal atom, 10, 11, 12 Mother sheet, 20 Conducting direction, 100 Multilayer capacitor, 110 Laminate, 110a Mother sheet group, 111 1st main surface, 112 2nd main surface, 113 1st end surface, 114 2nd end surface , 115 1st side surface, 116 2nd side surface, 120 through electrode, 121, 131 1st base layer, 122, 132 2nd base layer, 123, 133 plating layer, 130 ground electrode, 140 dielectric layer, 140a ceramic base material , 150 Conductor layer, 151 1st conductor layer, 151a, 152a Conductive pattern, 152 2nd conductor layer, 200 film forming apparatus, 210 1st decompression chamber, 211,221,231 vacuum pump, 220 film forming chamber, 222,223,224 Target, 230 Second Decompression Chamber, 240,241,242,243 Shutter, 250 Conductor, 251,261 Opening, 252,262 Counterbore, 260 Tray, 270 Holder, 270a First Hold Tool, 270b 2nd holder, 271 masking member, 271c, 271d projecting part, 271h opening, 272 frame member, 272a, 272ha 1st side, 272b, 272hb 2nd side, 272c diagonal line, 272d virtual straight line, 273 housing part, 274 mask part, 274t flat part, 280 rollers.

Claims (5)

The film formation room and
The film formation source located inside the film formation chamber and
A transport unit that conveys the film-deposited object so that the film-deposited object passes above the film-forming source while facing the film-forming source in the film-forming chamber.
It is provided with a holder which is attached to the transport portion so as to be positioned at an angle α with respect to the horizontal direction and has a plurality of accommodating portions for accommodating and holding the film to be filmed.
Each of the plurality of accommodating portions has a substantially rectangular inner peripheral wall.
Deposition was, by the slope of the holder, in contact with the inner peripheral wall positioned biased to one corner of the inner wall at the inner portion of each of the plurality of accommodating portions,
The inner peripheral wall includes a pair of first sides facing each other and a pair of second sides facing each other.
The holder is
The frame member constituting the inner peripheral wall and
Including the frame member and an adjacent masking member
The frame member has a rectangular outer shape in a plan view, and has a rectangular outer shape.
The outer shape of the frame member is composed of a pair of first sides parallel to each other and a pair of second sides parallel to each other.
The first side of the frame member extends along the transport direction of the transport portion.
The plurality of accommodating portions are provided so that the second side of the inner peripheral wall forms an angle θ with respect to the second side of the frame member.
A film forming apparatus in which the angle θ is larger than the angle α . A first decompression chamber provided adjacent to the film forming chamber and
A second decompression chamber provided adjacent to the film forming chamber is further provided.
The film forming apparatus according to claim 1, wherein the transport section passes through the first decompression chamber, the film forming chamber, and the second decompression chamber in this order. The film formation source consists of a plurality of targets.
The film forming apparatus according to claim 1 or 2, wherein the plurality of targets are arranged side by side in the transport direction of the transport unit. A holder having a plurality of accommodating portions for accommodating and holding an object to be film-formed.
Frame member and
A masking member adjacent to the frame member is provided.
Each of the plurality of accommodating portions has a substantially rectangular inner peripheral wall.
The frame member constitutes the inner peripheral wall .
The inner peripheral wall includes a pair of first sides facing each other and a pair of second sides facing each other.

The holder is conveyed in a state of being tilted by an angle α with respect to the horizontal direction.
Due to the inclination of the holder, the film-deposited film is positioned unevenly at one corner of the inner peripheral wall in the accommodating portion and is in contact with the inner peripheral wall.
The frame member has a rectangular outer shape in a plan view, and has a rectangular outer shape.
The outer shape of the frame member is composed of a pair of first sides parallel to each other and a pair of second sides parallel to each other.
The first side of the frame member extends along the transport direction of the holder.
The plurality of accommodating portions are provided so that the second side of the inner peripheral wall forms an angle θ with respect to the second side of the frame member.
A holder in which the angle θ is larger than the angle α . A method of manufacturing an electronic component to be a film to be formed by using the two holders in the film forming apparatus according to claim 1 .
A step of accommodating the film to be formed in the accommodating portion of the first retainer of the two retainers, and
The second holder is placed on the frame member of the first holder so that the storage portion of the second holder of the two holders communicates with the corresponding storage portion of the first holder. And the process of superimposing the frame members
A step of attaching the first holder and the second holder to the transport portion, and
The process of operating the transport unit to form a film on the lower side of the electronic component,
A step of attaching the first holder and the second holder to the transport unit in a state of being turned upside down,
A method for manufacturing an electronic component, comprising a step of operating the transport unit to form a film on the lower side of the electronic component in an upside down state.

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