CN109136874A - A kind of ultra-thin quartz wafer film coating jig frame - Google Patents
A kind of ultra-thin quartz wafer film coating jig frame Download PDFInfo
- Publication number
- CN109136874A CN109136874A CN201811320604.9A CN201811320604A CN109136874A CN 109136874 A CN109136874 A CN 109136874A CN 201811320604 A CN201811320604 A CN 201811320604A CN 109136874 A CN109136874 A CN 109136874A
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- China
- Prior art keywords
- electrode plate
- station
- substrate
- quartz wafer
- upper substrate
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Abstract
The invention discloses a kind of ultra-thin quartz wafer plated film novel jig frames, it include: fixed substrate, the upper substrate is identical with the lower substrate shape, it is respectively corresponded on the upper substrate and the lower substrate and is provided with multiple chip station slots, multiple magnet station slots, each first positioning hole in left and right and two rectangular windows, multiple first station slots are provided on the first electrode plate, multiple second station slots are provided on the second electrode plate, each second station slot includes a boss, the station slot on the second station slot and the upper substrate and the lower substrate on the second electrode plate corresponds.The present invention is goed deep into Spacer station slot using its protrusion part, contacts quartz wafer surface, to increase wafer clamp holding force, is effectively prevented chip and is shaken shifting phenomena.So far it solves the problems such as chip shaking occurred after wafer-load because Spacer is blocked up, the electrode deviation occurred after chip plated film, diplopia, and jig buckling deformation can be effectively prevent, and electrode metallizations jig easy to operate.
Description
Technical field
The present invention relates to quartz wafer coating technique field more particularly to a kind of ultra-thin quartz wafer film coating jig frames.
Background technique
Globalization will enter a new era, and one is transmitted the new era of information, thought and innovation by data and connection,
5G gives birth to seasonable.Big data, magnanimity connection and scene experience meet the following widely data and connection business needs, mention
Rise user experience.Communication network speed-raising is also extremely urgent, and the high-frequency reference clock of high quality is always in research and development.
The frequency of quartz crystal device and the thickness of quartz wafer are inversely proportional, such as the frequency of 100MHz, basic wave quartz
The thickness of chip about 16um, and the diameter of the hairline of human body about 80um are thin to the 1/5 of hairline, it is envisaged that processing and manufacturing
The difficulty of the quartz crystal of such high frequency.Therefore, it is higher than 100MHz or more quartz frequency device in the market, nearly all uses base
3 higher harmonics of this wave realize that 3 times of processing easy to produce can be improved in the thickness of quartz wafer, but to low jitter low noise
On the application direction of pitch stability, harmonic wave product is clearly inferior to basic wave product；In addition basic wave product has biggish lead
Gravitation, the voltage controlled oscillator VCXO with frequency tuning function selects basic wave product all the time.
Previous complete quartz crystal coated tool frame, comprising 1 wafer fixed frame Spacer, 2 plate electrode MASK and
Two panels fixture cover board Holder, wherein the thickness of chip fixed frame Spacer is the thickness design according to quartz wafer, with
For the quartz wafer of 10um thickness, most direct scheme: exactly manufacturing the fixed frame Spacer of 10um thickness, but super in this way
Thin jig is easy to warpage, bending, deformation, no matter manufactures processing or subsequent using operational not strong.
Our company 80MHz basic wave quartz crystal is researched and developed before, for the thickness about 20um of quartz wafer, for enhancing jig
Manufacturability and use operability, our company using superposition jig thickness thinking, by Spacer and MASK design at one piece
On 40um substrate front and back sides, the thickness effect of Spacer layers He MASK layers of each 20um is reached by two-sided half-etching technology.If opening
150MHz basic wave voltage controlled oscillator is sent out, the quartz wafer of about 10um thickness also needs to consider its reasonability using this design,
20um substrate to be selected is calculated, the thickness limit more than Spacer jig used at present is 40um, because excessively thin, therefore this
Kind mentality of designing is also unreasonable.
Therefore, developing has good prospect higher than 100MHz basic wave product, according to previous experiences, quartz wafer electricity
The design of pole film coating jig frame directly determines the success or failure of the research and development of products.Still it takes charge of and first designs this ultra-thin about 10um quartz wafer
Novel film-coated tool frame.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of ultra-thin quartz wafer film coating jig frames.
In order to achieve the above objectives, solution of the invention is:
A kind of ultra-thin quartz wafer film coating jig frame, comprising:
Fixed substrate, the fixed substrate include upper substrate and lower substrate, the upper substrate and the lower substrate shape phase
Together, it is respectively corresponded on the upper substrate and the lower substrate and is provided with multiple chip station slots, multiple magnet station slots, left and right is each
One first positioning hole and two rectangular windows；
First electrode plate is provided with multiple first station slots, the institute on the first electrode plate on the first electrode plate
The multiple chip station slots stated on the first station slot and the upper substrate and the lower substrate correspond, first electricity
The top of the lower substrate is arranged in pole plate；
Second electrode plate is provided with multiple second station slots on the second electrode plate, and each second station slot is set
There is boss, the second station slot on the second electrode plate and multiple crystalline substances on the upper substrate and the lower substrate
Piece station slot corresponds, and the second electrode plate is arranged below the upper substrate, and the boss is for fixing quartz-crystal
Piece；
Middle fixing plate, the middle fixing plate are provided with multiple 3rd station slots, multiple 3rd station slot difference
It is corresponded with multiple chip station slots, the middle fixing plate is arranged in the first electrode plate and the second electrode
Between plate
The upper substrate, the first electrode plate, the middle fixing plate, the second electrode plate and the lower substrate according to
It is secondary to be arranged from top to bottom.
Preferably, multiple magnet station slots are separately positioned on the upper substrate and the lower substrate surrounding and with described
The geometric center of chip station slot is symmetrical, so that the magnetic picture radiated around each station is worked as, finally to install
Quartz wafer position accurate stable and will not shake.
Preferably, the first electrode plate, the middle fixing plate, the second electrode plate relative to the upper substrate and
The position of multiple magnet station slots of the lower substrate, which extends through, is provided with multiple corresponding magnet station slots, for reinforcing
Magnetic adsorptive power.
It preferably, further include two positioning pins, activity is arranged on the lower substrate accordingly two positioning pins respectively
In two first positioning holes, two positioning pins are each passed through the first electrode plate, the second electrode plate and institute
State the location hole to match with the positioning pin being arranged on upper substrate.
It preferably, further include two second location holes, two second location holes, which extend through, to be arranged in the upper base
The middle part of plate, the lower substrate, the first electrode plate and the second electrode plate upper and lower sides.
It preferably, further include multiple magnet, multiple magnet are separately mounted to set on the upper substrate and the lower base
That sets matches in multiple magnet station slots with the magnet.
Preferably, the boss on the second station slot includes front boss and reverse side boss.
Preferably, two rectangular windows are separately positioned on the side of the upper substrate and the lower substrate, the upper base
The rectangular window on plate is corresponding with the rectangular window on the lower substrate.
The present invention has the advantages that
The present invention do not change it is existing control fixture substrate, station on the basis of size, carries out existing upper MASK
Transformation is corroded out with projection shape, the MASK under cooperation, and when Spacer tool frame assembles, it is deep to protrude part using it
Enter in Spacer station slot, contact quartz wafer surface, to increase wafer clamp holding force, effectively prevents chip and shake displacement now
As.So far it solves the chip occurred after wafer-load because Spacer is blocked up to shake, the electrode deviation occurred after chip plated film,
The problems such as diplopia, and it can be effectively prevent jig buckling deformation, and electrode metallizations jig easy to operate.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of ultra-thin quartz wafer film coating jig frame embodiment Holder plan view of the present invention；
Scheming (1A) is a kind of ultra-thin quartz wafer film coating jig frame embodiment Holder underlying substrate figure of the present invention；
Scheming (1B) is a kind of ultra-thin quartz wafer film coating jig frame embodiment Holder top substrate layer figure of the present invention；
Fig. 2 is MASK plan view under a kind of ultra-thin quartz wafer film coating jig frame embodiment of the present invention；
Scheming (2A) is a kind of ultra-thin quartz wafer film coating jig frame embodiment plated film MASK partial enlarged view of the present invention；
Fig. 3 is a kind of ultra-thin quartz wafer film coating jig frame embodiment plated film Spacer plan view of the present invention；
Fig. 4 is MASK plan view on a kind of ultra-thin quartz wafer film coating jig frame embodiment plated film of the present invention；
Scheming (4A) is a kind of ultra-thin quartz wafer film coating jig frame embodiment plated film MASK partial enlarged view of the present invention.
Appended drawing reference indicates explanation in description above:
1, fixed substrate；2, magnet station slot；3, chip station slot；4 positioning pins, 5, second location hole；6, rectangular window.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in the embodiment of the present invention can be combined with each other.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
As shown in Figs 1-4, it in preferred embodiments of the present invention, according to problem of the existing technology, now provides a kind of super
Thin quartz wafer film coating jig frame, comprising:
Fixed substrate, fixed substrate 1 include upper substrate and lower substrate, upper substrate is identical with lower substrate shape, upper substrate and
Respectively corresponded on lower substrate and be provided with multiple chip station slots 3, multiple magnet station slots 2, each first positioning hole in left and right and
Two rectangular windows 6；
First electrode plate is provided with multiple first station slots, the first station slot on first electrode plate on first electrode plate
It is corresponded with multiple chip station slots on upper substrate and lower substrate, the top of lower substrate is arranged in first electrode plate；
Second electrode plate is provided with multiple second station slots on second electrode plate, and each second station slot is equipped with boss, the
Multiple chip station slots on second station slot and upper substrate and the lower substrate on two electrode plates correspond, second electrode
Plate is arranged below upper substrate, and boss is for fixing quartz wafer；
Middle fixing plate, middle fixing plate are provided with multiple 3rd station slots, multiple 3rd station slots respectively with multiple crystalline substances
Piece station slot corresponds, and middle fixing plate is arranged between first electrode plate and second electrode plate；
Upper substrate, first electrode plate, middle fixing plate, second electrode plate and lower substrate are successively arranged from top to bottom.
In preferred embodiments of the present invention, multiple magnet stations are separately positioned on upper substrate and lower substrate surrounding and with chips
The geometric center of station slot 3 is symmetrical.
In preferred embodiments of the present invention, first electrode plate, second electrode plate are multiple relative to upper substrate and lower substrate
The position of magnet station slot, which extends through, is provided with multiple corresponding magnet station slots.
It further include two positioning pins in preferred embodiments of the present invention, two positioning pins are respectively set on lower substrate accordingly
Two first positioning holes in, two positioning pins 4, which are each passed through on first electrode plate, second electrode plate and upper substrate, to be arranged
The location hole to match with positioning pin 4.
It further include two second location holes in preferred embodiments of the present invention, two second location holes 5 extend through setting
At the middle part of upper substrate, lower substrate, first electrode plate and second electrode plate upper and lower sides.
It further include multiple magnet in preferred embodiments of the present invention, multiple magnet are separately mounted on upper substrate and lower base
What is be arranged matches in multiple magnet station slots with the magnet.
In preferred embodiments of the present invention, the boss on second station slot includes front boss and reverse side boss.
In preferred embodiments of the present invention, two rectangular windows 6 are separately positioned on the side of upper substrate and lower substrate, upper substrate
On rectangular window it is corresponding with rectangular window 6 on lower substrate.
Specifically, as shown in Figure 1, being plated film Holder plan view of the present invention, plated film Holder, which rises, clamps intermediate MASK,
Spacer effect, it is desirable that sturdy and durable, accurate positioning, it is uniform to grip strength, is used for a long time easy to disassemble, therefore chooses alloy
Material designs magnet automatic absorbing type.The design of Holder plate has magnet station slot 2, chip station slot 3, two positioning pins in left and right
Nail 4, two rectangular windows 6.Wherein magnet station slot 2 is equably distributed in as shown in Figure 1A to reinforce magnetic absorption into hollow design
Jig plate surrounding and on the symmetrical peripheral location of 3 geometric center of chip station, so that the magnetic radiated around each station
Power is suitable, finally makes the quartz wafer position accurate stable of installation and will not shake.Rectangular window 6, if in MASK/Spacer
Same position makes a check mark, and can pass through Holder after assembling and checks its mark, can easily check in quartz crystal coated process
It is confirmed whether to select correct jig.
Specifically, in the present embodiment, as shown in Fig. 2, being provided for MASK plan view under plated film of the present invention for quartz wafer humorous
Vibration electrical circuit parameter, their shape, size can use proprietary MASK design theory board design, and it is specifically designed according to tool
Body quartz wafer designs, separately the installation electrode machinable provided with contact conductor and subsequent dispensing for extraction electrode spy
PAD7a, present invention diagram are only used as a kind of drawing reference, in addition consider assembling design, therefore set with Holder with the place of position
Hollow out magnet position, positioning hole location are counted, the position MASK7 and chip station slot 3 correspond.
Such as Fig. 3, it is shown plated film Spacer plan view of the present invention, Spacer 8 is also that quartz crystal vibration is mostly important
One of design, provided for quartz wafer and place station slot 3, be related to the reliability and stability of the sub- electrical parameter of quartz oscillation,
Its specific design is designed according to specific quartz wafer shape and size, and present invention diagram is only used as a kind of drawing reference, is in addition considered
Assembling design, therefore electrode PAD7a, hollow out magnet position are installed with the place design of position with MASK, position hole location, Spacer 8
It sets and is corresponded with chip station slot 3.
Specifically, in the present embodiment, as shown in figure 4, for MASK plan view on the invention patent plated film, first is that as quartz
Mask when chip plated film provides resonant tank parameter for quartz wafer, another, play fixed quartz wafer, benefit
It is designed with its distinctive boss, gos deep into 8 station slot of Spacer contact quartz wafer surface, therefore realized using double-sided design, such as schemed
4A includes positive electrode MASK7 boss, and contact conductor and dispensing PAD, specific shape, size can use proprietary
MASK design theory board design；The size design of the boss of reverse side is less than the size of Spacer, designs the invention patent figure
Show that, only as a kind of drawing reference, dash area corrodes by single side half-etching into MASK platform；Blank parts pass through two-sided erosion
It is carved into through hole and forms MASK shape, MASK lead, dispensing PAD, and design hollow out magnet with the place of position with Holder
Position, positioning hole location；Entity fill part is not corroded, self-assembling formation boss.
Specifically, in the present embodiment, the stainless steel substrate of 80um thickness is selected, substrate passes through appearance/size detection, after qualified
Cleaning, baking pretreatment are to be used；Subsequently into two-sided half-etching critical process, as PCB circuit production process, need through
Pad pasting/mistake modeling drawing/photosensitive/development/etching/demoulding link is crossed, finally after dimensional gaughing is qualified, laser typewriting is carried out and does
Mark.But because being two-sided drawing such as Fig. 4, the place-centric positioning accuracy request on two sides is high, therefore needs when plate-making attaches drawing
It keeps under strict control positioning accuracy；Again because two-sided etch simultaneously, strict control etching time is needed, avoids MASK etching ladder too deep, surpasses
Cross the depth of 40um.
The beneficial effects of the present invention are:
The present invention do not change it is existing control fixture substrate, station on the basis of size, carries out existing upper MASK
Transformation is corroded out with projection shape, the MASK under cooperation, and when Spacer tool frame assembles, it is deep to protrude part using it
Enter in Spacer station slot, contact quartz wafer surface, to increase wafer clamp holding force, effectively prevents chip and shake displacement now
As.So far it solves the chip occurred after wafer-load because Spacer is blocked up to shake, the electrode deviation occurred after chip plated film,
The problems such as diplopia, and it can be effectively prevent jig buckling deformation, and electrode metallizations jig easy to operate.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (8)
1. a kind of ultra-thin quartz wafer film coating jig frame characterized by comprising
Fixed substrate, the fixed substrate include upper substrate and lower substrate, and the upper substrate is identical with the lower substrate shape, institute
It states to respectively correspond on upper substrate and the lower substrate and is provided with multiple chip station slots, multiple magnet station slots, each one of left and right
First positioning hole and two rectangular windows；
First electrode plate is provided with multiple first station slots on the first electrode plate, and described on the first electrode plate
Multiple chip station slots on one station slot and the upper substrate and the lower substrate correspond, the first electrode plate
The top of the lower substrate is set；
Second electrode plate, multiple second station slots are provided on the second electrode plate, and each second station slot is equipped with convex
Platform, multiple chip works on the second station slot and the upper substrate and the lower substrate on the second electrode plate
Position slot corresponds, and the second electrode plate is arranged below the upper substrate, and the boss is for fixing quartz wafer；
Middle fixing plate, the middle fixing plate are provided with multiple 3rd station slots, multiple 3rd station slots respectively with it is more
A chip station slot corresponds, the middle fixing plate setting the first electrode plate and the second electrode plate it
Between；
The upper substrate, the first electrode plate, the middle fixing plate, the second electrode plate and the lower substrate successively from
Upper and lower setting.
2. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that multiple magnet works
Position slot is separately positioned on the upper substrate and the lower substrate surrounding and symmetrical with the geometric center of the chip station slot,
Work as the magnetic picture radiated around each station, make the quartz wafer position accurate stable of installation and will not shake.
3. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that the first electrode
The multiple magnet station slots of plate, the middle fixing plate, the second electrode plate relative to the upper substrate and the lower substrate
Position extend through and be provided with multiple corresponding magnet station slots, for reinforcing magnetic adsorptive power.
4. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that further include two positioning
Pin, two positioning pins are movably arranged on respectively on the lower substrate in corresponding two first positioning holes, two institutes
State positioning pin be each passed through it is being arranged with the positioning pin on the first electrode plate, the second electrode plate and the upper substrate
The first positioning hole to match.
5. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that further include two second
Location hole, two second location holes extend through setting the upper substrate, the lower substrate, the first electrode plate and
The middle part of the second electrode plate upper and lower sides.
6. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that further include multiple magnetic
Iron, what multiple magnet were separately mounted to be arranged on the upper substrate and the lower base matches multiple magnet with the magnet
In station slot.
7. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that the second station slot
On the boss include front boss and reverse side boss.
8. a kind of ultra-thin quartz wafer film coating jig frame according to claim 1, which is characterized in that two rectangular windows
It is separately positioned on the side of the upper substrate and the lower substrate, on the rectangular window on the upper substrate and the lower substrate
The rectangular window it is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811320604.9A CN109136874A (en) | 2018-11-07 | 2018-11-07 | A kind of ultra-thin quartz wafer film coating jig frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811320604.9A CN109136874A (en) | 2018-11-07 | 2018-11-07 | A kind of ultra-thin quartz wafer film coating jig frame |
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| Publication Number | Publication Date |
|---|---|
| CN109136874A true CN109136874A (en) | 2019-01-04 |
Family
ID=64807874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811320604.9A Pending CN109136874A (en) | 2018-11-07 | 2018-11-07 | A kind of ultra-thin quartz wafer film coating jig frame |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109680245A (en) * | 2019-02-20 | 2019-04-26 | 湖畔光电科技（江苏）有限公司 | A kind of novel vapor deposition metal mask plate and evaporation coating device |
| CN110699671A (en) * | 2019-10-21 | 2020-01-17 | 江苏菲沃泰纳米科技有限公司 | Coating clamp and application thereof |
| CN110699662A (en) * | 2019-10-21 | 2020-01-17 | 江苏菲沃泰纳米科技有限公司 | Film coating method and film layer thereof |
| CN112547667A (en) * | 2020-12-28 | 2021-03-26 | 成都晶宝时频技术股份有限公司 | Wafer clamp and cleaning method thereof |
| CN113997129A (en) * | 2021-11-01 | 2022-02-01 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
| CN114714268A (en) * | 2020-12-22 | 2022-07-08 | 浙江蓝晶芯微电子有限公司 | Ultrahigh frequency ultrathin quartz wafer mask positioning tool and positioning method |
| CN114807863A (en) * | 2022-03-23 | 2022-07-29 | 福建省宝山机械有限公司 | Vacuum coating machine for casting |
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| CN112547667A (en) * | 2020-12-28 | 2021-03-26 | 成都晶宝时频技术股份有限公司 | Wafer clamp and cleaning method thereof |
| CN113997129A (en) * | 2021-11-01 | 2022-02-01 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
| CN113997129B (en) * | 2021-11-01 | 2022-05-17 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
| CN114807863A (en) * | 2022-03-23 | 2022-07-29 | 福建省宝山机械有限公司 | Vacuum coating machine for casting |
| CN114807863B (en) * | 2022-03-23 | 2023-12-01 | 福建省宝山机械有限公司 | Vacuum coating machine for casting |
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